JP2845161B2 - Collet and die bonder using the same - Google Patents

Abstract

PURPOSE: To mount a semiconductor pellet at high rate while picking up the semiconductor pellet correctly. CONSTITUTION: In the vicinity of lower end of the vertical part 15 of an L- shaped arm member 12 having the vertical part 15 secured to the bonder body 11 and a horizontal part 16 being bent from the lower end of the vertical part 15, a spring means comprising two leaf springs 13 arranged vertically in parallel while being spaced apart from each other is secured to stretch in the horizontal direction and a collet 14 is supported at the forward end part of the leaf spring 13 while directing vertically downward. A collet holder 17 is secured to the forward end part of the leaf spring 13 and the collet 14 is fitted to the lower part of the collet holder 17.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a collet and a die bonder using the same, for example, a collet for picking up a semiconductor pellet as an electronic component and a die bonder mounted on a lead frame using the same.

[0002]

2. Description of the Related Art For example, a semiconductor device is generally manufactured collectively from a semiconductor wafer on which a large number of semiconductor elements are formed. There are various steps in the manufacture of this semiconductor device, one of which is a pellet mounting step. In the pellet mounting step, mounting of the semiconductor pellet is performed in the following manner.

[0003] First, a semiconductor wafer on which a large number of semiconductor elements are formed is attached on an adhesive sheet, and a large number of semiconductor pellets obtained by dividing the semiconductor wafer for each element are sequentially picked up from the adhesive sheet. The semiconductor pellet is picked up by using a die bonder equipped with a special jig called a collet. The semiconductor pellet is vacuum-adsorbed by the collet of the die bonder, peeled off from the adhesive sheet, and transferred. The semiconductor pellet is mounted. At the time of this pick-up, the semiconductor pellet is pushed up from below the pressure-sensitive adhesive sheet by a pin through the pressure-sensitive adhesive sheet so that the semiconductor pellet is easily separated from the pressure-sensitive adhesive sheet.

[0004] The die bonder used in this pellet mounting step has the following schematic structure as shown in FIGS.

The die bonder includes an inverted conical collet 1 having a suction hole (not shown) opened downward.
The collet 1 is supported and extends upward,
A suction passage (not shown) communicating with the suction hole is formed,
A collet holder 2 whose suction passage is connected to a vacuum suction source (not shown), and a guide roller 3 that supports the collet holder 2 at two locations above and below the collet holder 2 and holds the collet holder 2 so that the collet holder 2 can move slightly in the vertical direction. And an arm 4 for vertically supporting the collet holder 2 via the guide roller 3 by rotatably supporting the guide roller 3 in a predetermined arrangement relationship.
A compression spring 6 is stretched between the frame 5 and the arm 4 projecting from the upper side, thereby urging the collet holder 2 with a vertically downward elastic force. Note that a stopper 7 for positioning the collet holder 2 at a predetermined position is arranged between the frame 5 and the arm 4.

In the die bonder having the above structure, the semiconductor pellet a disposed at the pickup position is sucked and held by the collet 1 as shown in FIG. That is, the collet 1 is arranged above the semiconductor pellet a at the pickup position, the arm 4 is lowered, the collet 1 is pressed against the semiconductor pellet a, and the semiconductor pellet a is vacuum-adsorbed by the collet 1. At this time, when the collet 1 is pressed against the semiconductor pellet a, the collet holder 2 retreats against the lowering of the arm 4 against the elastic force of the compression spring 6 so that the collet 1 A state is set in which the semiconductor pellet a is pressed with an initial load determined by the force.

After the semiconductor pellet a is adsorbed, the push-up pins 8 movably arranged vertically below the adhesive sheet n are raised, the arm 4 is raised, and then the semiconductor pellet a is moved in the horizontal direction. a is arranged at the mount position. Although not shown, in this mounting position, the lead frame is positioned and arranged, and the semiconductor pellet a sucked and held by the collet 1 is mounted on the island of the lead frame by lowering the arm 4 again. .

By performing a series of operations of pickup, transfer and mounting by suction of the semiconductor pellet a with the collet 1 as described above, the semiconductor pellet a is transferred from the adhesive sheet n to the lead frame. .

[0009]

However, the above-described conventional die bonder has the following problems.

In recent years, high-speed mounting has been demanded also in the pellet mounting process, and high-speed processing of the die bonder has been required. In order to respond to this demand, when the collet 1 of the die bonder is operated at a high speed, the arm 4 has a complicated structure in which the collet holder 2 is supported via the guide roller 3, so that mechanical vibrations are reduced. Easy to occur. When such a vibration is generated, the collet 1 is pressed against the semiconductor pellet a while being vibrated when the semiconductor pellet a is picked up, causing a problem that the semiconductor pellet a is damaged.

Further, as described above, the die bonder has a structure in which the collet holder 2 is supported by the upper and lower guide rollers 3 so as to be finely movable in the vertical direction. The vertical length of the holder 3 is required to some extent. As a result, the weight of the collet holder 3 increases, and it is difficult to perform high-speed processing as described above.

Further, if the collet holder 2 is supported on the arm 4 via the guide roller 3 like the die bonder, it is very difficult to properly set the assembled state of these components, so that skill is required. It costs. By the way, if the assembly state of the component parts is loose, rattling occurs between the component parts, causing mechanical vibration as described above, and conversely, if the assembly state of the component parts is rigid, ,
The components of the moving part become immobile. For example, if the collet holder 2 which is a movable part is excessively tightened by the guide roller 3, the collet holder 2 becomes difficult to move up and down, and when the semiconductor pellet a is picked up, the collet 1 is moved to the semiconductor pellet a when the arm 4 is lowered. As a result, the semiconductor pellet a may be damaged.

Further, in the conventional die bonder, as described above, the guide rollers 3 for supporting the collet holder 2 require a total of six upper and lower guide rollers 3.
There is also a problem that the occupied installation space increases.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has as its object to provide a high-speed mounting of a semiconductor pellet, a collet capable of properly picking up the semiconductor pellet, and a die bonder using the same. Is to provide.

[0015]

As a technical means for achieving the above-mentioned object, a collet of the present invention is used for picking up an electronic component mounted on an arm member through a spring means which can move minutely vertically. A collet, wherein the spring means is composed of two leaf springs arranged in parallel in a vertical direction and separated from each other, and the base of each leaf spring is fixed to the arm member, and is attached to a tip end which is horizontally extended. It is characterized by being supported vertically downward via a holder.

Further, the die bonder of the present invention is a die bonder in which a collet for picking up and picking up a large number of semiconductor pellets obtained by dividing a semiconductor wafer as an electronic component for each element by vacuum is mounted on an arm member. It is supported on the arm member by a spring means that can move slightly in the direction.

The spring means has a base end fixed to an arm member such that two leaf springs are horizontally arranged in a state of being vertically separated and separated from each other, and is attached to a distal end of the leaf spring. It is desirable to support the collet vertically downward via the collet holder.

Further, the present invention further comprises an initial load adjusting means for adjusting an initial load of the collet for pressing the semiconductor pellet by using the elastic force of a leaf spring when picking up the semiconductor pellet. The means has an L-shape including a vertical portion and a horizontal portion bent from a lower end of the vertical portion, and allows a collet supported by the vertical portion of the arm via the leaf spring to pass through the horizontal portion of the arm member. By interposing a spacer plate having an arbitrary thickness at the insertion portion, a structure in which the upper and lower positions of the collet are regulated to elastically deform the leaf spring can be provided.

[0019]

According to the collet of the present invention and the die bonder using the same, the collet for vacuum-sucking the semiconductor pellet is mounted on the arm member via a leaf spring, so that the collet is supported by spring means and the movable mechanism including the collet is provided. To support high speed by reducing weight. When the semiconductor pellet is picked up, the collet is pressed against the semiconductor pellet, and the leaf spring of the spring means is elastically deformed. The elastic deformation causes the collet to hold the semiconductor pellet by suction with an appropriate pressing force.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a collet of the present invention and a die bonder using the same will be described with reference to FIGS.

As shown in FIGS. 1 and 2, the collet of the present invention and the die bonder using the collet have two leaf springs 13 serving as spring means at the tip of an arm member 12 of a bonder body 11.
And has a structure in which the collet 14 is mounted via the, and specifically has the following configuration.

The arm member 12 of the bonder body 11 includes:
Vertical portion 15 fixed to bonder body 11 and vertical portion 1
5 has an L shape composed of a horizontal portion 16 bent from the lower end. At the portion near the lower end of the vertical portion 15 of the arm member 12, two SUS plate springs 13 are fixed so as to project horizontally in a state where they are vertically separated and separated from each other,
A collet 14 is supported on the tip of the leaf spring 13 vertically downward. A collet holder 17 is fixed to the tip of the leaf spring 13, and the collet 14 is provided below the collet holder 17.

The collet 14 has an inverted conical shape in which a suction hole (not shown) is opened downward, and a suction passage (not shown) communicating with the suction hole has a collet holder 1.
The opening of the collet holder 17 is connected to a vacuum suction source (not shown). The collet 14 is supported by the leaf spring 13 so as to be vertically movable through the horizontal portion 16 of the arm member 12. The collet 14 is formed by a step 18 formed between the collet holder 17 and the collet 14. Is collet holder 1
7 together with the horizontal portion 16 of the arm member 12.

At the part where the collet 14 is locked to the horizontal part 16 of the arm member 12, the following initial load adjusting means is provided. This initial load adjusting means has a structure in which the collet holder 17 is locked at the horizontal portion 16 by the step 18 formed between the collet 14 and the horizontal portion 16 of the arm member 12 as described above. , FIG.
As shown in (1), a spacer plate 19 having an arbitrary thickness is interposed at the collet insertion portion of the horizontal portion 16.

With such a structure, the collet holder 17 is locked by the spacer plate 19 of the horizontal portion 16 of the arm member 12 to regulate the vertical position of the collet 14. As a result, the leaf spring 13 is It is elastically deformed to bend slightly upward. As described later, when picking up the semiconductor pellet a, the initial load of the collet 14 pressing the semiconductor pellet a can be adjusted by utilizing the elastic force of the leaf spring 13. That is, by adjusting the thickness of the spacer plate 19 on the horizontal portion 16 of the arm member 12 to adjust the elastic deformation state of the leaf spring 13, the initial load of the collet 14 on the semiconductor pellet a can be easily reduced. Can be adjusted.

The pellet pick-up operation of the die bonder of the present invention having the above configuration will be described below.

First, as shown in FIG. 4, the semiconductor pellet a placed at the pickup position is sucked and held by the collet 14. That is, the collet 14 is arranged above the semiconductor pellet a at the pickup position, the arm member 12 is lowered, the collet 14 is pressed against the semiconductor pellet a, and the semiconductor pellet a is sucked by the collet 14 in vacuum. At this time, collet 14
Is pressed against the semiconductor pellet a, the arm member 1
When the collet holder 17 retreats against the elastic force of the leaf spring 13 with respect to the descent of 2, the leaf spring 13 is elastically deformed, and the collet 14 is set to an initial load determined by the elastic force of the leaf spring 13. Thus, the semiconductor pellet a is set to be pressed.

After the semiconductor pellet a is adsorbed, the push-up pins 20 movably arranged below the adhesive sheet n.
Is raised and the arm member 12 is raised,
The semiconductor pellet a is moved horizontally.
To the mount position. Although not shown, in the mount position, the lead frame is positioned and arranged, and by lowering the arm member 12 again, the semiconductor pellet a held by the collet 14 is held.
To the lead frame island.

By performing a series of operations of pickup, transfer and mounting by suction of the semiconductor pellet a with the collet 14 in this manner, the semiconductor pellet a is transferred from the adhesive sheet n to the lead frame. However, at this time, since the collet 14 and the collet holder 17 are supported by the arm member 12 with the leaf spring 13 to reduce the size and weight, high-speed operation is performed without generating mechanical vibration and without damaging the semiconductor pellet a. Can be implemented.

In the above embodiment, the semiconductor component is described as a semiconductor pellet. However, the present invention is not limited to this. For example, a chip type electronic component may be used. The present invention can be applied to the case of mounting.

[0031]

According to the present invention, the weight of the movable mechanism including the collet can be reduced by using a simple structure in which the collet for vacuum-sucking the semiconductor pellet as the electronic component is mounted on the arm member via the spring means. Conventionally, it was difficult to reduce the weight to 20 g or less. However, the weight can be set to 5 to 10 g, and the size and weight can be reduced. In addition, when the semiconductor pellet is picked up, the collet is elastically deformed by the spring means. Suction can be held with an appropriate pressing force.
As a result, the operation can be smoothly performed without generating mechanical vibration, and the semiconductor pellet can be mounted at a high speed without being damaged. In addition, the simple structure described above reduces the number of parts, provides a compact die-bonder that can be used effectively without occupying installation space, and does not require conventional guide adjustment, and can be easily operated. it can.

[Brief description of the drawings]

FIG. 1 is a front view showing an embodiment of a collet of the present invention and a die bonder using the collet.

FIG. 2 is a cross-sectional view taken along line AA of FIG.

FIG. 3 is an enlarged front view of a main part including a collet, a collet holder, and an arm member including a partial cross-sectional portion for explaining an example of an initial load adjusting unit.

FIG. 4 is an operation diagram for explaining a pickup operation of a semiconductor pellet by a collet;

FIG. 5 is a sectional view of a main part showing a conventional die bonder.

FIG. 6 is a plan view of the die bonder of FIG. 5;

FIG. 7 is an operation diagram for explaining a pickup operation of a semiconductor pellet by a collet;

[Explanation of symbols]

 Reference Signs List 11 Bonder body 12 Arm member 13 Spring means (leaf spring) 14 Collet 15 Vertical part 16 Horizontal part 17 Collet holder 19 Spacer plate a Electronic component (semiconductor pellet)

Claims (4)

(57) [Claims] 1. A collet for picking up an electronic component, which is mounted on an arm member via a spring means which can move minutely in the vertical direction, wherein the two springs are vertically spaced apart from each other. A base portion of each leaf spring is fixed to the arm member, and is supported vertically downward through a collet holder attached to a tip portion protruding horizontally. 2. A die bonder in which a collet for picking up a large number of semiconductor pellets obtained by dividing a semiconductor wafer for each element by vacuum suction is mounted on an arm member. A die bonder supported by a member. 3. The spring means has a base end fixed to an arm member such that two leaf springs extend horizontally in a state where the two leaf springs are vertically separated and separated from each other, and is attached to a distal end of the leaf spring. 3. The die bonder according to claim 2, wherein the collet is supported vertically downward via a collet holder. 4. An initial load adjusting means for adjusting an initial load of a collet pressing the semiconductor pellet at the time of picking up the semiconductor pellet by utilizing an elastic force of a leaf spring, wherein the initial load adjusting means comprises: The arm has an L shape including a vertical portion and a horizontal portion bent from the lower end of the vertical portion, and a collet supported through the leaf spring through the vertical portion of the arm is inserted through the horizontal portion of the arm member. 4. The die bonder according to claim 3, wherein a spacer plate having an arbitrary plate thickness is interposed to regulate a vertical position of the collet to elastically deform the leaf spring.