JP2845221B2 - Latent heat type heat sink - Google Patents
Latent heat type heat sinkInfo
- Publication number
- JP2845221B2 JP2845221B2 JP28401696A JP28401696A JP2845221B2 JP 2845221 B2 JP2845221 B2 JP 2845221B2 JP 28401696 A JP28401696 A JP 28401696A JP 28401696 A JP28401696 A JP 28401696A JP 2845221 B2 JP2845221 B2 JP 2845221B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- storage material
- heat storage
- circuit board
- heating element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005338 heat storage Methods 0.000 claims description 68
- 239000011232 storage material Substances 0.000 claims description 68
- 238000010438 heat treatment Methods 0.000 claims description 38
- 238000002844 melting Methods 0.000 claims description 23
- 230000008018 melting Effects 0.000 claims description 23
- 239000011810 insulating material Substances 0.000 claims description 5
- 230000004927 fusion Effects 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 238000001816 cooling Methods 0.000 description 10
- 239000000758 substrate Substances 0.000 description 10
- 239000007788 liquid Substances 0.000 description 7
- CNQCVBJFEGMYDW-UHFFFAOYSA-N lawrencium atom Chemical compound [Lr] CNQCVBJFEGMYDW-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 238000012856 packing Methods 0.000 description 5
- 230000005855 radiation Effects 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000000110 cooling liquid Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 239000013256 coordination polymer Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION
【０００１】[0001]
【発明の属する技術分野】本発明は、潜熱を利用したヒ
ートシンクに関し、電子機器の筺体や基板、その他発熱
体が周期性を持つ場合（例えば、通信器の加入者側基地
局では１日のうち昼間は通話量が多いため発熱するが、
夜はほとんど発熱しない。）の冷却に用いられるヒート
シンクに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat sink utilizing latent heat, and relates to a case where a housing, a substrate, and other heating elements of an electronic device have a periodicity (for example, a base station on a subscriber side of a communication device has a period of one day). In the daytime, there is a lot of traffic and it generates heat,
Little fever at night. )).
【０００２】[0002]
【従来の技術】従来、この種のヒートシンクは特開平３
−５８４９９号公報に示されているように、発熱体から
の放熱を筺体外部へ発散させるため、発熱体と筺体外壁
間が伝熱性の高い媒体（間隙の空気は除く）で接続され
る必要があった。2. Description of the Related Art Conventionally, this kind of heat sink is disclosed in
As disclosed in JP-A-58499, in order to dissipate the heat radiation from the heating element to the outside of the housing, it is necessary to connect the heating element and the housing outer wall with a medium having high heat conductivity (excluding air in the gap). there were.
【０００３】この特開平３−５８４９９号公報に記載の
従来のヒートシンクを含む電子機器の斜視図を図５に示
す。また、図６は図５中のＡ部の拡大図、図７は対流式
ヒートシンクを備えた場合の電子機器内の冷却構造を示
す図である。FIG. 5 is a perspective view of an electronic apparatus including a conventional heat sink described in Japanese Patent Application Laid-Open No. 3-58499. 6 is an enlarged view of a portion A in FIG. 5, and FIG. 7 is a diagram showing a cooling structure in an electronic device provided with a convection heat sink.
【０００４】図５に示される電子機器は、ヒートシンク
１０４を筺体１０１と基板１０２の間または、基板１０
２と基板１０２の間に挟み込むことにより、各基板１０
２に搭載されている発熱体１０３を冷却する構造を持
つ。このヒートシンク１０４の発熱体１０３側の面には
凹凸が設けられており、このうち凸部は発熱体１０３と
直接接触し、凹部は冷却するための空気流路１０５にな
っている。また、ヒートシンク１０４は、伝導式の場合
は熱伝導性の高い絶縁性固体材料からなり、対流式の場
合は絶縁性フィルムを袋状にし冷却液を封入してなる。In the electronic apparatus shown in FIG. 5, a heat sink 104 is provided between the housing 101 and the substrate 102 or the substrate 10.
2 and the substrate 102, each substrate 10
2 has a structure for cooling the heating element 103 mounted thereon. Irregularities are provided on the surface of the heat sink 104 on the side of the heating element 103, of which the projections are in direct contact with the heating element 103, and the depressions are air passages 105 for cooling. In the case of the conduction type, the heat sink 104 is made of an insulating solid material having high thermal conductivity. In the case of the convection type, the heat sink 104 is made of an insulating film in a bag shape and filled with a cooling liquid.
【０００５】このような構造では、伝導式の場合、発熱
体１０３で発生した熱はヒートシンク１０４から筺体１
０１の外壁に伝わり、筺体１０１の外部へ放熱される。
対流式の場合では、発熱体１０３で発生した熱はヒート
シンク１０４へ熱伝導し、ヒートシンク１０４内での冷
却液の対流によって筺体１０１の外壁へ伝わり、筺体１
０１の外部へ放熱される。In such a structure, in the case of the conduction type, heat generated by the heating element 103 is transferred from the heat sink 104 to the housing 1.
01, and is radiated to the outside of the housing 101.
In the case of the convection type, the heat generated by the heating element 103 is conducted to the heat sink 104, transmitted to the outer wall of the casing 101 by convection of the cooling liquid in the heat sink 104, and
01 is radiated to the outside.
【０００６】特にヒートシンク１０４が対流式の場合
は、図７に示すようにヒートシンク１０４が並列もしく
は直列に接続ホース１０６にて接続され、ヒートシンク
１０４内の冷却液が循環ポンプ１０７で流れる。ヒート
シンク１０４と循環ポンプ１０７の間には、冷却液の冷
却に使用する熱交換器１０８が配設され、この熱交換器
１０８はファン１０９で冷却される。In particular, when the heat sink 104 is of a convection type, the heat sinks 104 are connected in parallel or in series by a connection hose 106 as shown in FIG. Between the heat sink 104 and the circulation pump 107, a heat exchanger 108 used for cooling the cooling liquid is provided, and the heat exchanger 108 is cooled by a fan 109.
【０００７】[0007]
【発明が解決しようとする課題】しかしながら上述した
従来のヒートシンクは、基板と筺体または、基板と基板
の間に配置した発熱体１０３で発生した熱を筺体外部へ
放熱しているため、図５に示したように筺体の外壁と対
面する位置にある発熱体に対しては冷却効率が良いが、
図７に示すように発熱体が筺体の内部に位置する場合は
ヒートシンクが複雑な形状となる。そのため対流式の場
合は、十分な対流が発生せず、筺体外部への放熱効果は
低減するので、図７に示すようなファンによる強制冷却
方式が必要となる場合もある。However, the above-described conventional heat sink radiates heat generated by the substrate and the housing or the heating element 103 disposed between the substrate and the substrate to the outside of the housing. As shown, the cooling efficiency is good for the heating element at the position facing the outer wall of the housing,
When the heat generating element is located inside the housing as shown in FIG. 7, the heat sink has a complicated shape. Therefore, in the case of the convection type, sufficient convection does not occur, and the effect of radiating heat to the outside of the housing is reduced, so that a forced cooling method using a fan as shown in FIG. 7 may be required.
【０００８】本発明の目的は、上述した従来技術の問題
点に鑑み、内部発熱に周期性がある場合、その放熱を筺
体内部にて行ない、放熱構造の単純化を達成させること
ができる潜熱利用型ヒートシンクを提供することにあ
る。SUMMARY OF THE INVENTION In view of the above-mentioned problems of the prior art, it is an object of the present invention to use a latent heat for simplification of a heat dissipation structure by radiating the heat inside the housing when the internal heat generation has periodicity. It is to provide a mold heat sink.
【０００９】[0009]
【課題を解決するための手段】上記目的を達成するため
に本発明の潜熱利用型ヒートシンクは、高熱伝導性のプ
レートが一つの面を構成するように、断熱材で形成され
た収容部の開口を該プレートにより密封してなる密閉容
器と、前記密閉容器内に収容された蓄熱材と、回路基板
に実装された発熱体が前記プレートと接触するように、
該回路基板と前記密閉容器を固定するための固定手段
と、を備え、前記固定手段により前記発熱体と前記プレ
ートが接触するように固定した状態で前記発熱体からの
熱を前記プレートを通じて前記蓄熱材に伝え、前記蓄熱
材の対流を利用して前記蓄熱材の融解を進行させること
により、前記発熱体からの熱を前記蓄熱材に吸熱させ、
前記蓄熱材の融点を利用して前記発熱体の温度を一定値
以下に保つように構成したを特徴とするものや、また、
断熱材で形成された収容部の開口を、発熱体が実装され
ていない側の面で密封する高熱伝導性の回路基板と、前
記回路基板に前記収容部を固定するための固定手段と、
前記回路基板と前記収容部とで囲われた内部空間に収容
された蓄熱材と、を備え、前記固定手段により前記収容
部に前記回路基板を固定した状態で前記発熱体からの熱
を前記回路基板を通じて前記蓄熱材に伝え、前記蓄熱材
の対流を利用して前記蓄熱材の融解を進行させることに
より、前記発熱体からの熱を前記蓄熱材に吸熱させ、前
記蓄熱材の融点を利用して前記発熱体の温度を一定値以
下に保つように構成したことを特徴とするものである。In order to achieve the above object, a latent heat utilizing type heat sink according to the present invention has an opening of an accommodation portion formed of a heat insulating material so that a plate having high thermal conductivity forms one surface. A sealed container sealed by the plate, and a heat storage material accommodated in the sealed container, so that the heating element mounted on the circuit board contacts the plate,
Fixing means for fixing the circuit board and the airtight container, wherein the heat from the heat generating element is stored through the plate in a state where the heat generating element and the plate are fixed to be in contact with each other by the fixing means. To the material, by utilizing the convection of the heat storage material to promote the melting of the heat storage material, to absorb the heat from the heating element to the heat storage material,
By utilizing the melting point of the heat storage material, characterized in that the temperature of the heating element is configured to be maintained at a certain value or less,
A high heat conductive circuit board that seals the opening of the housing portion formed of a heat insulating material on the surface on which the heating element is not mounted, and fixing means for fixing the housing portion to the circuit board,
A heat storage material housed in an internal space surrounded by the circuit board and the housing section, wherein the heat from the heating element is transferred to the circuit while the circuit board is fixed to the housing section by the fixing means. By transmitting to the heat storage material through the substrate and utilizing the convection of the heat storage material to promote the melting of the heat storage material, heat from the heating element is absorbed by the heat storage material, and the melting point of the heat storage material is utilized. Thus, the temperature of the heating element is maintained at a certain value or less.
【００１０】上記のとおりの発明では、例えば電子デバ
イスなどの発熱体が発熱し始めた場合、その熱は熱伝導
性の高い材質のプレートもしくは回路基板を通じて、蓄
熱材に伝わる。そして、この蓄熱材への入熱により蓄熱
材と前記プレートもしくは回路基板との接合面が蓄熱材
の融点に達すると融解が始まる。その後、蓄熱材内では
自然対流により固体から液体へと相変化が生じる。その
間、蓄熱材における液体部分の温度は、発熱体から発生
する熱を蓄熱材が潜熱として吸収するため、一定の値と
なる。すなわち蓄熱材が融解している間、前記プレート
もしくは回路基板と接する発熱体の温度はほぼ蓄熱材の
融点近傍の温度になる。したがって、従来技術のような
筺体の外部への放熱や強制冷却の無い簡単な構造で、発
熱体の温度を一定値以下に保つことができる。In the invention described above, for example, when a heating element such as an electronic device starts to generate heat, the heat is transmitted to the heat storage material through a plate or a circuit board made of a material having high thermal conductivity. Then, when the heat input to the heat storage material causes the joining surface between the heat storage material and the plate or the circuit board to reach the melting point of the heat storage material, melting starts. Thereafter, a phase change occurs from solid to liquid in the heat storage material due to natural convection. During that time, the temperature of the liquid portion in the heat storage material becomes a constant value because the heat storage material absorbs heat generated from the heating element as latent heat. That is, while the heat storage material is being melted, the temperature of the heating element in contact with the plate or the circuit board is substantially equal to the temperature near the melting point of the heat storage material. Therefore, the temperature of the heating element can be kept at a certain value or less with a simple structure without heat radiation to the outside of the housing or forced cooling unlike the prior art.
【００１１】[0011]
【発明の実施の形態】次に、本発明の実施の形態につい
て図面を参照して説明する。Next, embodiments of the present invention will be described with reference to the drawings.
【００１２】図１は本発明のヒートシンクの一実施形態
を含む電子機器の分解斜視図、図２は図１に示したケー
スのＡ−Ａ線断面図で、本発明のヒートシンクの一実施
形態の構造を最もよく表したものである。FIG. 1 is an exploded perspective view of an electronic device including one embodiment of a heat sink of the present invention, and FIG. 2 is a sectional view taken along line AA of the case shown in FIG. It is the best representation of the structure.
【００１３】本実施形態のヒートシンクは図１に示すよ
うに、例えば電子機器の筺体１内の、発熱体であるＣＰ
Ｕなどの電子デバイス３を実装したプリント基板（回路
基板）２に固定されるもので、密閉容器であるケース４
と、ケース４をプリント基板２に固定するための固定手
段とからなる。As shown in FIG. 1, the heat sink according to the present embodiment is, for example, a heating element CP in a housing 1 of an electronic device.
A case 4 which is fixed to a printed circuit board (circuit board) 2 on which an electronic device 3 such as U is mounted and which is a closed container
And fixing means for fixing the case 4 to the printed circuit board 2.
【００１４】具体的にケース４は図２に示すように、断
熱材からなる収容部６ｂと、収容部６ｂの開口を密封し
てケース４の一面を構成する熱伝導性の高い材質のプレ
ート６ａとから成る。固定手段はケース４を構成する収
容部６ｂの開口縁に設けられたタップ９と、プリント基
板２を貫通してタップ９にねじ合う固定用ねじ（不図
示）とから成り、プリント基板２にケース４を固定した
時に電子デバイス（発熱体）３とプレート６ｂが接触す
る。また、蓄熱材７は低温溶融塩などの化学的に安定し
た物質からなる。Specifically, as shown in FIG. 2, the case 4 has a housing 6b made of a heat insulating material and a plate 6a made of a material having high thermal conductivity, which seals the opening of the housing 6b and forms one surface of the case 4. Consisting of The fixing means includes a tap 9 provided at an opening edge of the housing portion 6b constituting the case 4 and a fixing screw (not shown) which penetrates the printed board 2 and is screwed to the tap 9. When the device 4 is fixed, the electronic device (heating element) 3 comes into contact with the plate 6b. The heat storage material 7 is made of a chemically stable substance such as a low-temperature molten salt.
【００１５】このような構成のヒートシンクは図１に示
すプリント基板２のみの設置に限らず、その他のプリン
ト基板（例えばプリント基板２と隣り合ったプリント基
板５）に各々配置されていても勿論構わない。また、固
定手段は、ケース４のプレート６ａと電子デバイス３の
表面とを接触させる固定方式を採るものであれば、タッ
プ９と固定用ねじによるものに限られない。The heat sink having such a configuration is not limited to the installation of only the printed circuit board 2 shown in FIG. 1, but may be of course disposed on other printed circuit boards (for example, the printed circuit board 5 adjacent to the printed circuit board 2). Absent. Further, the fixing means is not limited to the tap 9 and the fixing screw as long as the fixing means employs a fixing method of bringing the plate 6a of the case 4 into contact with the surface of the electronic device 3.
【００１６】蓄熱材７の物性面の条件としては、デバイ
ス３が発熱時にデバイス３のジャンクション温度が定格
（デバイスの正常動作を保証する値）以下になる融点を
持つことが必要である。つまり、蓄熱材７として、デバ
イス３における定格以下のジャンクション温度で融解す
る物質を選定する必要がある。As a condition of the physical properties of the heat storage material 7, it is necessary that the device 3 has a melting point at which the junction temperature of the device 3 becomes lower than a rating (a value that guarantees normal operation of the device) when the device 3 generates heat. That is, it is necessary to select a substance that melts at a junction temperature equal to or lower than the rating of the device 3 as the heat storage material 7.
【００１７】また、機器使用条件として、デバイス３の
連続発熱時間ｔは蓄熱材７が完全に融解するまでの時間
Ｔ以下であることが必要である。Further, as a condition for using the equipment, the continuous heat generation time t of the device 3 needs to be equal to or less than the time T until the heat storage material 7 is completely melted.
【００１８】次に、本実施形態によるヒートシンクの作
用について説明する。Next, the operation of the heat sink according to the present embodiment will be described.
【００１９】図３は本発明のヒートシンクの一実施形態
による作用を説明するための断面図である。この図に示
されるように、プリント基板２を通した固定用ねじ８を
収容部６ｂのタップ９にねじ込むことで、ケース４のプ
レート６ａはプリント基板２の電子デバイス（発熱体）
３の表面に接触し固定される。FIG. 3 is a cross-sectional view for explaining the operation of the heat sink according to the embodiment of the present invention. As shown in this figure, the fixing screw 8 passing through the printed circuit board 2 is screwed into the tap 9 of the housing portion 6b, so that the plate 6a of the case 4 becomes an electronic device (heating element) of the printed circuit board 2.
3 and is fixed in contact with the surface.
【００２０】このような状態で発熱体である電子デバイ
ス３が発熱し始めた場合、その熱はケース４の、熱伝導
性の高い材質からなるプレート６ａを通じて、ケース４
内の蓄熱材７に伝わる。そして、この蓄熱材７への入熱
により蓄熱材７とプレート６ａとの接合面が蓄熱材７の
融点に達すると融解が始まる。その後、蓄熱材７内では
自然対流により固体から液体へと相変化が生じる。その
間、蓄熱材７における液体部分の温度は、電子デバイス
３から発生する熱を蓄熱材７が潜熱として吸収するた
め、一定の値となる。すなわち蓄熱材７が融解している
間、ケース４のプレート６ａと接する発熱体３の表面温
度はほぼ蓄熱材７の融点近傍の温度になる。したがっ
て、筺体１の外部への放熱や強制冷却無しに、電子デバ
イス３のジャンクション温度を定格以下で運用すること
が可能となる。When the electronic device 3, which is a heating element, starts to generate heat in such a state, the heat is transmitted through the plate 6a of the case 4 made of a material having high thermal conductivity.
It is transmitted to the heat storage material 7 inside. Then, when the heat input to the heat storage material 7 causes the joining surface between the heat storage material 7 and the plate 6a to reach the melting point of the heat storage material 7, melting starts. Thereafter, a phase change occurs from solid to liquid in the heat storage material 7 due to natural convection. During that time, the temperature of the liquid portion in the heat storage material 7 has a constant value because the heat storage material 7 absorbs heat generated from the electronic device 3 as latent heat. That is, while the heat storage material 7 is being melted, the surface temperature of the heating element 3 in contact with the plate 6 a of the case 4 is substantially equal to the temperature near the melting point of the heat storage material 7. Therefore, it is possible to operate the electronic device 3 at a junction temperature or lower without being radiated to the outside of the housing 1 or forcedly cooled.
【００２１】（その他の実施形態）図４は本発明のヒー
トシンクの他の実施形態の構造を最もよく表す部分断面
図である。この図では、図１乃至３に示した実施形態と
同一の構成要素に同一符号を付してある。(Other Embodiments) FIG. 4 is a partial cross-sectional view best showing the structure of another embodiment of the heat sink of the present invention. In this figure, the same components as those in the embodiment shown in FIGS. 1 to 3 are denoted by the same reference numerals.
【００２２】本実施形態のヒートシンクは図４に示すよ
うに、図２に示したプレート６ａに代え、蓄熱材７を収
容する収容部６ｂの開口縁を直接、熱伝導性の高いメタ
ルコア基板からなるプリント基板１３に固定したもので
ある。収容部６ｂの開口縁には、プリント基板１３の電
子デバイス３が実装されていない側の面が固定されてい
る。また、収容部６ｂの開口縁には固定用ねじ８とねじ
合うタップ９と共に、パッキン１０を格納するパッキン
溝１１が形成されている。このパッキン１０は、プリン
ト基板１３を収容部６ｂの開口縁に固定用ねじ８の締結
力により固定した時、収容部６ｂとプリント基板１３と
で囲われた内部空間を密閉に保つ。As shown in FIG. 4, the heat sink of this embodiment is formed of a metal core substrate having a high thermal conductivity directly at the opening edge of the housing portion 6b for housing the heat storage material 7 instead of the plate 6a shown in FIG. It is fixed to the printed circuit board 13. A surface of the printed circuit board 13 on which the electronic device 3 is not mounted is fixed to an opening edge of the housing portion 6b. Further, a packing groove 11 for storing the packing 10 is formed on the opening edge of the housing portion 6b together with a tap 9 screwed with the fixing screw 8. When the printed circuit board 13 is fixed to the opening edge of the housing portion 6b by the fastening force of the fixing screw 8, the packing 10 keeps the internal space enclosed by the housing portion 6b and the printed circuit board 13 airtight.
【００２３】このような構成では、電子デバイス３の熱
はプリント基板１３を通じ、収容部６ｂとプリント板１
３で囲われた密閉空間内の蓄熱材７に伝わる。そして、
この蓄熱材７への入熱によりプリント基板１３と蓄熱材
７との接合面が蓄熱材７の融点に達すると融解が始ま
る。その後は上述の実施の形態の場合と同様である。簡
単に説明すると、蓄熱材７内では自然対流により固体か
ら液体へと相変化が生じる。その間、蓄熱材７における
液体部分の温度は、電子デバイス３から発生する熱を蓄
熱材７が潜熱として吸収するため、一定の値となる。In such a configuration, the heat of the electronic device 3 passes through the printed circuit board 13 and passes through the housing portion 6b and the printed board 1
The heat is transmitted to the heat storage material 7 in the closed space surrounded by 3. And
When the heat input to the heat storage material 7 causes the joining surface between the printed circuit board 13 and the heat storage material 7 to reach the melting point of the heat storage material 7, melting starts. After that, it is the same as in the above-described embodiment. In brief, in the heat storage material 7, a phase change occurs from solid to liquid due to natural convection. During that time, the temperature of the liquid portion in the heat storage material 7 has a constant value because the heat storage material 7 absorbs heat generated from the electronic device 3 as latent heat.
【００２４】[0024]
【実施例】次に、図１乃至図３で示した形態について実
施例を挙げて説明する。Next, the embodiment shown in FIGS. 1 to 3 will be described with reference to an embodiment.
【００２５】この実施例ではプリント基板２はガラス・
エポキシ製、電子デバイス３はＣＰＵ（最大発熱量Ｐ＝
２Ｗ）、ケースのプレート６ａは銅板、ケースの収容部
６ｂはテフロン製とした。また、蓄熱材７は低温溶融塩
ＮＨ4Ａｌ（ＳＯ4）2・１２Ｈ2Ｏ（融点Ｔｍ＝９３．５
℃、比熱（固体時）Ｃ＝１．８ｋＪ／（ｋｇ・Ｋ）、潜
熱ΔＨｍ＝２６９ｋＪ／ｋｇ）とした。In this embodiment, the printed circuit board 2 is made of glass
The electronic device 3 made of epoxy has a CPU (maximum heating value P =
2W) The case plate 6a was made of a copper plate, and the case housing 6b was made of Teflon. The heat storage material 7 is a low-temperature molten salt NH 4 Al (SO 4 ) 2 .12H 2 O (melting point Tm = 93.5)
° C, specific heat (solid) C = 1.8 kJ / (kg · K), latent heat ΔHm = 269 kJ / kg).
【００２６】次に、本実施例の材質を用いたヒートシン
クの作用について、図３を参照して説明する。Next, the operation of the heat sink using the material of this embodiment will be described with reference to FIG.
【００２７】筺体１の外壁内の空気１２は雰囲気温度で
ある。電子デバイス３はＣＰＵの作動によって２Ｗの熱
を発生する。ＣＰＵからの熱はプレート６ａである銅板
を介し蓄熱材７に伝わる。蓄熱材７はＣＰＵの熱により
雰囲気温度から融点になるまで時間Ｔ１をかけて上昇す
る。この間の蓄熱量をＱ１［Ｊ］とする。The air 12 in the outer wall of the housing 1 is at ambient temperature. The electronic device 3 generates 2 W of heat by the operation of the CPU. Heat from the CPU is transmitted to the heat storage material 7 via the copper plate serving as the plate 6a. The heat storage material 7 rises over the time T1 from the ambient temperature to the melting point due to the heat of the CPU. The amount of heat stored during this time is defined as Q1 [J].
【００２８】次に、蓄熱材７の、プレート６ａである銅
板に接する面は融点に達しているので、図３の（ｂ）に
示すように融解を始める。蓄熱材７が融解して液体にな
った部分は図３では白い部分で表してある。更に融解が
進むと図３の（ｃ）に示す状態になる。融解し始め、図
３の（ｃ）に示した状態を経て、蓄熱材７が完全に融解
するまでの時間をＴ２とする。その間に蓄熱材７はＱ２
［Ｊ］の熱を蓄熱する。Next, since the surface of the heat storage material 7 which is in contact with the copper plate as the plate 6a has reached the melting point, melting starts as shown in FIG. 3 (b). The portion in which the heat storage material 7 is melted to become a liquid is represented by a white portion in FIG. When the melting further proceeds, the state shown in FIG. The time from the start of melting until the heat storage material 7 completely melts through the state shown in FIG. 3C is defined as T2. Meanwhile, heat storage material 7 is Q2
The heat of [J] is stored.
【００２９】ここで、本実施例の効果を定量的に示す。Here, the effect of this embodiment will be quantitatively shown.
【００３０】初期条件として、蓄熱材７および空気１２
の温度をＴｉ＝６０℃とし、蓄熱材７の質量をｍ＝０．
１ｋｇとする。As the initial conditions, the heat storage material 7 and the air 12
Is set to Ti = 60 ° C., and the mass of the heat storage material 7 is set to m = 0.
1 kg.
【００３１】[0031]
【数１】Ｔ１は Ｔ１＝（Ｃ×１０００）×ｍ×（Ｔｍ−Ｔｉ）／Ｐ ＝１．８×１０００×０．１×（９３．５−６０）／２
／３６００ ＝０．８３［ｈ］ Ｔ２は Ｔ２＝（ΔＨｍ×１０００）×ｍ／Ｐ ＝２９６×１０００×０．１／２／３６００ ＝３．７［ｈ］ Ｔ１＋Ｔ２＝４．６［ｈ］となる。T1 = T1 = (C × 1000) × m × (Tm-Ti) /P=1.8×1000×0.1× (93.5-60) / 2
/3600=0.83[h] T2 is T2 = (ΔHm × 1000) × m / P = 296 × 1000 × 0.1 / 2/3600 = 3.7 [h] T1 + T2 = 4.6 [h] Become.
【００３２】すなわち、ＣＰＵが発熱してから蓄熱材７
が完全に融解するまでの時間は４．６［ｈ］である。That is, after the CPU generates heat, the heat storage material 7
Is 4.6 [h] until completely melted.
【００３３】また図３に示したように、発熱体である電
子デバイス３を熱伝導性の高いプレート６ａの下部に設
置することにより、蓄熱材７が融解している間、発熱体
３の表面温度はほぼ蓄熱材７の融点近傍の温度に接す
る。Also, as shown in FIG. 3, by disposing the electronic device 3, which is a heating element, under the plate 6a having high thermal conductivity, the surface of the heating element 3 can be maintained while the heat storage material 7 is melted. The temperature is almost in contact with the temperature near the melting point of the heat storage material 7.
【００３４】このようにして、電子デバイス３の最大稼
動状態（例えば、通信器の加入者側基地局における通話
量の多い昼間の時間帯）での表面温度を４．６時間一定
に保つことができる。すなわち、筺体１の外部への放熱
や強制冷却無しに、電子デバイス３のジャンクション温
度を定格以下で運用することが可能となる。In this way, the surface temperature in the maximum operating state of the electronic device 3 (for example, during the daytime when there is a lot of traffic at the subscriber base station of the communication device) can be kept constant for 4.6 hours. it can. That is, it is possible to operate the electronic device 3 at the junction temperature or lower without heat radiation to the outside of the housing 1 or forced cooling.
【００３５】[0035]
【発明の効果】以上説明したように本発明は、発熱体よ
り発生した熱を発熱体近傍で潜熱として蓄える構成にし
たことにより、従来技術のような筺体外部への伝熱や、
ファンによる強制冷却などの必要がなくなるので、放熱
構造が簡単化できる。As described above, according to the present invention, the heat generated from the heating element is stored as latent heat in the vicinity of the heating element.
Since the necessity of forced cooling by a fan is eliminated, the heat radiation structure can be simplified.
【図１】本発明のヒートシンクの一実施形態を含む電子
機器の分解斜視図である。FIG. 1 is an exploded perspective view of an electronic device including an embodiment of a heat sink according to the present invention.
【図２】図１に示したケースのＡ−Ａ線断面図で、本発
明のヒートシンクの一実施形態の構造を最もよく表した
ものである。FIG. 2 is a cross-sectional view taken along the line AA of the case shown in FIG. 1 and best illustrates a structure of an embodiment of a heat sink of the present invention.
【図３】本発明のヒートシンクの一実施形態による動作
を説明するための断面図である。FIG. 3 is a cross-sectional view illustrating an operation of the heat sink according to the embodiment of the present invention.
【図４】本発明のヒートシンクの他の実施形態の構造を
最もよく表す部分断面図である。FIG. 4 is a partial cross-sectional view that best illustrates the structure of another embodiment of the heat sink of the present invention.
【図５】特開平３−５８４９９号公報に記載の従来のヒ
ートシンクを含む電子機器を示す斜視図である。FIG. 5 is a perspective view showing an electronic apparatus including a conventional heat sink described in Japanese Patent Application Laid-Open No. 3-58499.
【図６】図５中のＡ部の拡大図である。FIG. 6 is an enlarged view of a portion A in FIG.
【図７】対流式ヒートシンクを備えた場合の従来の電子
機器内の冷却構造を示す図である。FIG. 7 is a diagram showing a cooling structure in a conventional electronic device provided with a convection heat sink.
１ 筺体 ２、５、１３ プリント基板（回路基板） ３ 電子デバイス（発熱体） ４ ケース ６ａ プレート ６ｂ 収容部 ７ 蓄熱材 ８ 固定用ねじ ９ タップ １０ パッキン １１ パッキン溝 １２ 空気 DESCRIPTION OF SYMBOLS 1 Housing 2, 5, 13 Printed circuit board (circuit board) 3 Electronic device (heating element) 4 Case 6a Plate 6b Housing part 7 Heat storage material 8 Fixing screw 9 Tap 10 Packing 11 Packing groove 12 Air
Claims (2)
するように、断熱材で形成された収容部の開口を該プレ
ートにより密封してなる密閉容器と、 前記密閉容器内に収容された蓄熱材と、 回路基板に実装された発熱体が前記プレートと接触する
ように、該回路基板と前記密閉容器を固定するための固
定手段と、を備え、 前記固定手段により前記発熱体と前記プレートが接触す
るように固定した状態で前記発熱体からの熱を前記プレ
ートを通じて前記蓄熱材に伝え、前記蓄熱材の対流を利
用して前記蓄熱材の融解を進行させることにより、前記
発熱体からの熱を前記蓄熱材に吸熱させ、前記蓄熱材の
融点を利用して前記発熱体の温度を一定値以下に保つよ
うに構成した潜熱利用型ヒートシンク。1. A closed container in which an opening of a housing portion formed of a heat insulating material is sealed by the plate so that a plate having high thermal conductivity constitutes one surface, and a closed container housed in the closed container. A heat storage material; and fixing means for fixing the circuit board and the closed container so that the heating element mounted on the circuit board comes into contact with the plate. The heat from the heating element is transmitted to the heat storage material through the plate in a state where the heat storage material is fixed so as to be in contact with the heat storage material, and the fusion of the heat storage material is advanced by using convection of the heat storage material. A latent heat utilizing heat sink configured to absorb heat into the heat storage material and maintain the temperature of the heating element at a certain value or less by using a melting point of the heat storage material.
熱体が実装されていない側の面で密封する高熱伝導性の
回路基板と、 前記回路基板に前記収容部を固定するための固定手段
と、 前記回路基板と前記収容部とで囲われた内部空間に収容
された蓄熱材と、を備え、 前記固定手段により前記収容部に前記回路基板を固定し
た状態で前記発熱体からの熱を前記回路基板を通じて前
記蓄熱材に伝え、前記蓄熱材の対流を利用して前記蓄熱
材の融解を進行させることにより、前記発熱体からの熱
を前記蓄熱材に吸熱させ、前記蓄熱材の融点を利用して
前記発熱体の温度を一定値以下に保つように構成した潜
熱利用型ヒートシンク。2. A high heat conductive circuit board for sealing an opening of a housing portion formed of a heat insulating material on a surface on which a heating element is not mounted, and for fixing the housing portion to the circuit board. Fixing means, and a heat storage material accommodated in an internal space surrounded by the circuit board and the accommodating portion, wherein the heat generating element is provided in a state where the circuit board is fixed to the accommodating portion by the fixing means. The heat is transmitted to the heat storage material through the circuit board, and the convection of the heat storage material is used to promote the melting of the heat storage material, so that the heat from the heating element is absorbed by the heat storage material, and the heat storage material A latent heat utilizing heat sink configured to maintain the temperature of the heating element at a certain value or less by utilizing a melting point.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28401696A JP2845221B2 (en) | 1996-10-25 | 1996-10-25 | Latent heat type heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28401696A JP2845221B2 (en) | 1996-10-25 | 1996-10-25 | Latent heat type heat sink |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10135381A JPH10135381A (en) | 1998-05-22 |
| JP2845221B2 true JP2845221B2 (en) | 1999-01-13 |
Family
ID=17673215
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28401696A Expired - Fee Related JP2845221B2 (en) | 1996-10-25 | 1996-10-25 | Latent heat type heat sink |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2845221B2 (en) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2572548C (en) * | 2004-07-02 | 2014-09-02 | Discus Dental Impressions, Inc. | Dental light devices having an improved heat sink |
| JP5353577B2 (en) * | 2009-09-04 | 2013-11-27 | 日本電気株式会社 | heatsink |
| JP5668347B2 (en) * | 2010-07-16 | 2015-02-12 | サンケン電気株式会社 | Heat absorption structure of outdoor equipment |
| CN103476222B (en) * | 2012-06-08 | 2017-03-15 | 富瑞精密组件（昆山）有限公司 | Electronic installation |
| TWI497656B (en) | 2012-06-08 | 2015-08-21 | 鴻準精密工業股份有限公司 | Electronic device |
| TWI492341B (en) * | 2012-06-08 | 2015-07-11 | 鴻準精密工業股份有限公司 | Phase change heat sink |
| JP6115264B2 (en) * | 2013-04-03 | 2017-04-19 | 三菱電機株式会社 | Cold plate |
| JP6361315B2 (en) * | 2014-06-25 | 2018-07-25 | 三菱電機株式会社 | Cold plate |
| JP6365370B2 (en) * | 2015-03-25 | 2018-08-01 | 三菱電機株式会社 | Cold plate |
| JP2016195202A (en) * | 2015-04-01 | 2016-11-17 | 住友電気工業株式会社 | Heat sink and electronic equipment |
| JP6694588B2 (en) * | 2016-06-01 | 2020-05-20 | 株式会社ジェイテクト | Semiconductor module |
| JPWO2020100769A1 (en) * | 2018-11-14 | 2021-10-14 | 昭和電工マテリアルズ株式会社 | Electronic device |
| CN113544842A (en) * | 2019-03-13 | 2021-10-22 | 索尼半导体解决方案公司 | Semiconductor device, imaging device, and method of manufacturing semiconductor device |
-
1996
- 1996-10-25 JP JP28401696A patent/JP2845221B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH10135381A (en) | 1998-05-22 |
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