JP2849040B2 - Chip-shaped circuit component mounting method and device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention distributes chip-shaped circuit components stored in bulk in a plurality of hopper containers on a template according to a predetermined position pattern, and uses the component-holding head from the template to distribute the chip-shaped circuit components. The present invention relates to a device for picking up components, moving them on a circuit board while being arranged in a predetermined position pattern, and mounting the components.

[0002]

2. Description of the Related Art Conventionally, when mounting a chip-shaped circuit component at a predetermined position on a circuit board, an automatic mounting apparatus has been used as follows. That is,
The chip-shaped circuit components housed in bulk in a plurality of hopper containers are taken out one by one into a plurality of guide tubes piped to a distributor, and each is taken out to a storage portion formed at a predetermined position of a template. Send and receive there. The storage section is arranged in accordance with a position pattern for mounting each of the chip-shaped circuit components on the circuit board. Then, after inspecting whether or not the chip-shaped circuit component is stored in each of the storage portions of the template, the chip-shaped circuit component stored in the storage portion is stored by the component moving means having the component holding head. The circuit board is moved and mounted on the circuit board while maintaining the relative position. Thereby, each of the chip-shaped circuit components is mounted at a predetermined position on the circuit board.

[0003] The tenn plate used in such a mounting device for a chip-shaped circuit component is provided with a box-shaped container-shaped storage portion for accommodating the chip-shaped circuit component on a flat base plate in accordance with a predetermined position pattern. Alternatively, a concave storage portion is provided on the upper surface of the base plate in accordance with a predetermined position pattern. The chip-like circuit components sent from the distributor are stored in this storage section, and these circuit components are arranged according to a predetermined position pattern.

A component holding head used in a mounting device for a chip-shaped circuit component has a component chuck, such as a vacuum suction nozzle, which grips the chip-shaped circuit component, protruding downward. These component chucks are protruded in accordance with a position pattern for mounting the chip-shaped circuit component on the circuit board, similarly to the storage portion of the template, and the chip-shaped circuit component stored in the storage portion of the template is provided at the tip thereof. It holds and thereby moves and mounts the chip-shaped circuit component on the circuit board.

[0005]

The receiving portion arranged on the template is made somewhat larger than the size of the chip-like circuit component to be stored therein. This is because the chip-shaped circuit components sent from the distributor side can be easily stored in the storage section, and a component chuck for taking out the stored chip-shaped circuit components can be easily inserted therein. Further, after storing the chip-shaped circuit component in the storage portion and holding the chip-shaped circuit component at the tip of the component chuck of the component holding head, the component holding head and the template are relatively moved in the plane direction, and the chip-shaped circuit component is moved. In order to correct the holding position of the chip-shaped circuit component by contacting the end face and the side surface of the chip with the inner wall of the accommodating portion, it is necessary that the dimension is somewhat larger than the size of the chip-shaped circuit component.

For this reason, it is necessary to arrange the storage sections on the template at a certain interval. The vacuum suction head attached to the component holding head as a component chuck is a protruding nozzle, is attached below the component holding head, and protrudes downward from the lower surface of the head. The component chucks of this component holding head also need to be arranged at some distance from each other.

[0007] Today, with the progress of miniaturization of chip-shaped circuit components, the mounting density of chip-shaped circuit components on circuit boards has been increasing. However, even if there is some space between the chip-shaped circuit components mounted on the circuit board and the chip-shaped circuit components can be mounted at a higher density on the circuit board, these chip-shaped circuit components can be mounted. The arrangement intervals of the components are naturally limited by the intervals between the storage section of the template and the component chucks of the component holding head. In other words, for the above-described reason, the accommodating portion on the template and the component holding chuck of the component holding head need to be arranged at a certain interval. It cannot be mounted on a circuit board.

The present invention has been made in view of such conventional problems,
It is an object of the present invention to provide a method and an apparatus for mounting a chip-shaped circuit component which can mount a chip-shaped circuit component on a circuit board at a higher density without being restricted by a space between a template storage portion and a component chuck of a component holding head. And

[0009]

According to the present invention, in order to achieve the above object, a chip-shaped circuit component a is provided on a same region of the same circuit board b with different position patterns a plurality of times.
Is mounted, the mounting density of the chip-shaped circuit component a can be increased. further,
In order to perform this mounting efficiently and in a short cycle, the template 6 is divided into a plurality of regions 6a, 6b,... Parts holding head 8
a, 8b..., the chip-shaped circuit component a is picked up from the storage portion of these regions 6a, 6b.

More specifically, in the method for mounting a chip-shaped circuit component according to the present invention, first, a plurality of hopper containers 1, 1 each containing a chip-shaped circuit component a in a bulk shape.
, One chip-shaped circuit component a is sent out one by one, and the chip-shaped circuit component a sent out from each hopper container 1, 1,... Is distributed and supplied by the distributor 2 according to a position pattern to be mounted on the circuit board b. Then, it is received in a storage unit arranged on the template 6 according to the co-located pattern. The template 6 has a plurality of areas 6a, 6b,. Then, each area 6a, 6b of this template 6
... are held by the component holding heads 8a, 8b,... In the stored relative arrangement, and are moved onto the same area of the same circuit board a.
Mount one after another.

In the mounting apparatus for a chip-like circuit component according to the present invention, a table 7 for holding a circuit board b;
A plurality of hopper containers 1, 1... To which the chip-shaped circuit components a are stored in a bulk shape and the chip-shaped circuit components a are sent out one by one, and the chip-shaped circuit components sent from each hopper container 1, 1,. a, which distributes and supplies a in accordance with the position pattern, a template 6 in which storage portions for receiving the chip-shaped circuit components a supplied from the distributor 2 are arranged in accordance with the position pattern, and a storage portion of the template 6 , Which hold the chip-shaped circuit components a stored in the circuit board b in the stored relative arrangement, and move and mount the circuit components on the circuit board b. The template 6 has a plurality of regions 6a, 6b,... In which storage portions are arranged in different position patterns on the circuit board b, and the component chucks 83 respectively follow the position patterns of the storage portions on each region of the template 6. , 83 ... are arranged, and the component holding heads 8a, 8b ... are provided.

The component holding heads 8a, 8b...
Are preferably those that move up and down independently of each other and perform the suction operation independently. The table 7 holding the circuit board b can move the circuit board b held thereon in the X and Y directions and rotate it in the plane direction.
-Y-θ table 7 is preferable.

[0013]

In the mounting method of the chip-like circuit component according to the present invention, the chip-like circuit is mounted by the component holding heads 8a, 8b... From the storage portions arranged in the plurality of regions 6a, 6b. In order to pick up the component a and mount these chip-shaped circuit components a back and forth on the same area of the same circuit board a,
Another chip-shaped circuit component a can be mounted between the chip-shaped circuit components a mounted thereon. The chip-shaped circuit component a to be mounted first and the chip-shaped circuit component a to be mounted later are stored in storage portions arranged in different areas 6a, 6b,... Of the template 6, and these are shifted in time. Can be prevented from interfering with each other on the template 6 and the component chucks 83 of the component holding heads 8a, 8b.

Further, in the mounting device for a chip-like circuit component according to the present invention, the template 6 is mounted on the circuit board b.
Are divided into a plurality of regions 6a, 6b,... In which storage portions are arranged in different upper position patterns, so that one template 6 stores chip-shaped circuit components a which are mounted on the circuit board b a plurality of times. be able to. Also, since there are provided a plurality of component holding heads 8a, 8b... On which component chucks 83, 83. 8b, the chip-shaped circuit component a can be picked up from the storage portion of each of the regions 6a, 6b... Of the template 6 and mounted on the circuit board b.

The component holding heads 8a, 8b... Move up and down independently of each other and perform suction operations independently, so that a plurality of component holding heads 8a, 8b. The chip-shaped circuit component a can be mounted continuously, and the chip-shaped circuit component a can be efficiently and quickly mounted. Also, the circuit board b
In the case of using the XY-θ table 7 capable of moving the circuit board b held thereon in the X and Y directions and rotating the same in the plane direction, the component holding head When the chip-shaped circuit component a is mounted on the circuit board b from 8a, 8b, etc., the positioning can be performed by moving the circuit board b side. This makes it possible to simplify the operation of the component holding heads 8a, 8b...

[0016]

Next, embodiments of the present invention will be specifically described with reference to the drawings. FIG. 1 shows an outline of an entire mounting device for a chip-shaped circuit component according to an embodiment of the present invention. That is, a plurality of hopper containers 1 containing chip-shaped circuit components in a bulk shape are arranged,
The transmission unit 11 which is an escapement is connected via “0”. Further, the distributor 2 is arranged below the sending section 11.

The distributor 2 includes an upper frame 23 fixed below the sending section 11 and a lower frame 22 disposed parallel to and below the sending section 11 and to which the template 6 is detachably attached on the lower surface side. The upper frame 23 and the lower frame 22 are connected to each other at four corners by four columns. Further, flexible guide tubes 21, 21 for guiding and transporting the chip-shaped circuit components between the upper frame 23 and the lower frame 22 are provided.
... is plumbed. As will be described later, the lower ends of the guide tubes 21 fixed to the lower frame 22 are in a predetermined positional relationship with the guide case 61 on the template 6.

The template 6 is placed on the transport table 65, inserted under the lower frame 22, and fixed. This template 6 has a plurality of areas 6 above it.
a, 6b..., and the respective areas 6a, 6b.
A guide case 61 serving as a storage section in a predetermined position pattern is provided. In the case of the embodiment shown in FIG. 1, the template 6 is divided into four regions 6a to 6d, of which the regions 6a and 6c are about half of the position where the chip-shaped circuit component a is mounted on the circuit board b. The guide case 61 is arranged in accordance with the position of the other areas 6b and 6
d is a guide case 61 corresponding to the remaining half of the position where the chip-shaped circuit component a is mounted on the circuit board b.
Are arranged. That is, the guide cases 61 in the two areas of the areas 6a and 6b and the two areas 6c and 6d respectively.
Thus, all the position patterns for mounting the chip-shaped circuit component a on the circuit board b are configured.

Although the illustrated template 6 has four regions 6a to 6d, it may have only two regions 6a and 6b, and may have six or more regions. Good. Further, the chip-shaped circuit component a is placed on each of the four regions 6a to 6d of the template 6 on the circuit board b.
The guide case 61 may be provided so as to be aligned with each quarter of the mounting position. That is, in this case, the guide cases 61 in the four regions 6a to 6d constitute all the position patterns for mounting the chip-shaped circuit components a on the circuit board b.

When the template 6 is inserted directly below the distributor 2, the lower end of the guide tube 21 connected to the lower frame 22 is
Are located on the respective guide cases 61. At this time, the vacuum case 4 is applied below the template 6, and the lower surface of the template 6 is maintained at a negative pressure.

For example, the template 6 shown in FIG. 4 has a hole for mounting the guide case 61 on the base board 60 in accordance with the mounting position of the chip-shaped circuit component on the circuit board. By fitting a pin-shaped projection 62 projecting from the lower surface of the
Is mounted on the template 6. The pin-shaped protrusion 62 has an air passage 63 opened on the bottom surface of the guide case 61.

As shown in FIG.
Is moved by the moving mechanism 66.
It moves between immediately below the distributor 2 and immediately below the parts moving unit 8. FIG. 4 shows a state in which the template 6 has been moved directly below the component holding head 8.

As shown in FIG. 1 to FIG.
Has two component holding heads 8a, 8b arranged side by side, and these component holding heads 8a, 8b,... Are independently raised and lowered by lifting cylinders 82, 82, respectively.
Further, as shown in FIGS. 4 and 5, component chucks 83 project downward from the lower surfaces of the component holding heads 8a and 8b in accordance with the mounting position of the chip-shaped circuit component a on the circuit board. Have been. Here, the mounting position of the component chuck 83 of the component holding head 8a corresponds to the position pattern of the guide case 61 in the areas 6a and 6c of the template 6, and the mounting position of the component chuck 83 of the component holding head 8b is This corresponds to the position pattern of the regions 6b and 6d of the template 6. That is, one component holding head 8a is provided with a component chuck 83 at a position approximately half the position where the chip-shaped circuit component a is mounted on the circuit board b, and the other component head 8b
In order to mount the chip-shaped circuit component a on the circuit board b, the component chuck 8 is aligned with the remaining half position.
3 are provided.

As the component chuck 83, one that holds the chip-shaped circuit component a with a claw can be used. In the case of the illustrated embodiment, the component chuck 83 is formed by applying a negative pressure to its tip. By using a vacuum suction nozzle that sucks and holds the chip-shaped circuit component a at the tip, it is possible to reliably hold the small chip-shaped circuit component a. A hole for mounting the component chuck 83 is provided at a predetermined position on the lower surface of the component holding heads 8a and 8b, and a projection protruding from the base of the component chuck 83 is fitted into the hole. A vacuum chamber 84 is formed inside the component holding head 8.
An air passage communicating with the vacuum chamber is formed from the base end to the distal end, and the distal end of the component chuck 83 has a negative pressure when the vacuum chamber 84 is evacuated. Each component holding head 8a, 8b is independent of its component chuck 8
The suction of the chip-shaped circuit component a by the negative pressure at the tip of No. 3 and the release of the suction are performed.

As shown in FIGS. 1 and 3, a table 7 is arranged below the component holding head 8, and a circuit board b conveyed by a conveyor (not shown) is placed on the table 7. Will be retained. As table 7,
The X table 71 for moving the circuit board b held thereon in the horizontal direction in FIG. 3, that is, the direction in which the component holding heads 8a and 8b are arranged, and the circuit board b in the front and rear direction in FIG. 3, ie, the component holding head 8a , 8b are moved in a direction orthogonal to the direction in which the
XY-θ table is used, which is composed of a Y-θ table 72 which makes the 周 り around the center. A backup board 73 is mounted on the Y-θ table 72,
Backup pins 74, 74 project upward from the upper surface of the backup board 73. Circuit board b
Are supported by the upper ends of the backup pins 74, 74.

In the chip-shaped circuit component mounting apparatus having such a configuration, first, the chip-shaped circuit components a sent in a line from the plurality of hopper containers 1 shown in FIG. Each of them is sent out one by one to the guide tubes 21 of the distributor 2. Thereby, the chip-shaped circuit components a are guided through the guide tubes 21, 21, respectively, and are stored in the guide cases 61 arranged in the four regions 6 a to 6 d on the template 6. At this time, the vacuum case 4 is applied below the template 6, and the lower surface of the template 6 is set to a negative pressure. As a result, air is drawn from the guide tube 21 of the distributor 2 to the back side of the template 6 through the air passage 63 opened at the bottom of the guide case 61, and an air flow is formed. Due to this flow of air, the chip-shaped circuit component a sent from the sending section 11 to the guide tube 21 is reliably transported to the guide case 61 of the template 6.

Next, the moving mechanism 66 moves the template 6 from directly below the distributor 2 to directly below the component moving section 8, and the areas 6a and 6b of the template 6 are positioned directly below the component holding heads 8a and 8b, respectively. . FIGS. 2 and 4 show a state in which the template 6 has moved to a position immediately below the component moving unit 8. At this time, the component holding heads 8a, 8b are lowered by the lifting cylinders 82, 82, and the tips of the component chucks 83 projecting from the lower surfaces thereof are inserted into the guide case 61 of the template 6, and the component chucks 8
3 has a negative pressure at its tip and a chip-shaped circuit component a
Is absorbed and retained. Then, the component holding heads 8a, 8
b rises, whereby the chip-shaped circuit component a is picked up from the template 6. In the illustrated embodiment,
First, two of the four areas 6a to 6d of the template 6
Component holding heads 8a, 8b from the two regions 6a, 6b, respectively.
Picks up the circuit component a.

Next, the template 6 is temporarily retracted from under the component holding heads 8a and 8b, and the circuit board b on the table 7 is directly below the component holding head 8b as shown in FIGS. Is positioned. In this state, the one component holding head 8b is lowered again, and the chip-shaped circuit component a held at the tip of the component chuck 83 is placed on the circuit board b, where the suction of the component chuck 83 is released. The holding head 8b moves up. As shown in FIG. 5, on the circuit board b, solder c is printed in advance on an electrode land d on which a chip-shaped circuit component a is to be mounted, and an adhesive e is previously applied between the electrode lands d. It has been applied. The chip-shaped circuit component a is adhered with the adhesive and fixed on the circuit board b.

Next, the circuit board b is moved to a position directly below the other component holding head 8a by the table 7 shown in FIGS. 1 and 3, and is then placed on the circuit board b in the same manner as the component holding head 8b. The circuit component a is mounted. The component chuck 83 of the component holding head 8a and the chip-shaped circuit component a at the tip thereof are shown by two-dot chain lines in FIG. Thus, in the component holding head 8a, the component holding head 8b
The chip-shaped circuit component a is mounted between the chip-shaped circuit components a mounted by the above. For this reason, even if the minimum interval that the guide case 61 of the template 6 and the component chuck 83 of the component holding head 8 can take is p shown in FIG. 5, the chip-shaped circuit is formed at a smaller interval of p ₁ or p _2. The component a can be mounted on the circuit board b.

Further, in the illustrated embodiment, the template 6
Since the chip-shaped circuit components a are also stored in the guide cases 61 in the regions 6c and 6d,
The template 6 moves so that c and 6d are located immediately below the component holding heads 6a and 6b, respectively. And area 6
Operations from picking up the chip-shaped circuit component a from the guide case 61 of c and 6d to mounting on the next circuit board b are performed in the same manner as described above. That is, in this case, 1
The chip-like circuit components a are mounted on the two circuit boards b by the operation of the cycle. Thereafter, the template 6 returns directly below the distributor 2, and the same operation is repeated thereafter.

On the other hand, when the template 6 has only the two regions 6a and 6b, the template 6 is directly below the distributor 2 every time the chip-shaped circuit component a is mounted on one circuit board b twice. Return to That is, the chip-shaped circuit components a are mounted on the circuit boards b one by one by the operation of one cycle. Further, the four regions 6a to 6d of the template 6 are about 1/1 of the position where the chip-shaped circuit component a is mounted on the circuit board b.
It is also possible to arrange the guide cases 61 in accordance with the position of each four, and mount the chip-shaped circuit components a picked up from these four regions on a single circuit board b. in this case,
Four component holding heads 8a, 8b,... Provided with component chucks 83 corresponding to the position patterns of the guide cases 61 arranged in the respective regions 6a to 6d are required. By mounting the chip-shaped circuit component a back and forth on the same circuit board b by the four component holding heads 8a, 8b,..., The guide case 61 of the template 6 and the component chuck 83 of the component holding head 8 can be taken. About 1/4 of the minimum interval
The chip-shaped circuit component a can be mounted on the circuit board b at intervals of. The circuit board b on which the chip-shaped circuit component a is mounted is sent to a solder reflow furnace, where the solder printed on the electrode land d is reflowed, and the chip-shaped circuit component a is soldered.

Next, the embodiment shown in FIG. 6 will be described. In this embodiment, the template 6 has four regions 6a.
6d is provided in the same manner as in the previous embodiment, but the area 8a of the template 6 is
8d, four component holding heads 8a to 8d are provided. Further, the component holding heads 8a, 8
Two tables 7 are arranged immediately below the component holding heads 8a, 8b and 8c, 8d so that the circuit board b can be moved directly below the component holding heads 8c, 8d. This table 7 is an XY-θ table including an X table 71 and a Y-θ table 72, which is the same as in the above-described embodiment.

In this embodiment, four component holding heads 8
a to 8b, four regions 6a to 6 of the template 6
d, the chip-like circuit components a are simultaneously taken up,
Two circuit boards b, b on each table 7, 7 (one circuit board b in FIG. 6 is hidden and visible by the parts moving unit 8) by two component holding heads 8a, 8b and 8c, 8d. ), Each of the chip-shaped circuit components a is mounted back and forth. Therefore, in this embodiment, the chip-shaped circuit components a are simultaneously mounted on the two circuit boards b by one cycle of the mounting operation.

[0034]

As described above, according to the present invention, it is possible to mount chip-shaped circuit components on a circuit board at a higher density without being restricted by the space between the storage portion of the template and the component chuck of the component holding head. Will be able to Thereby, high-density mounting of the chip-shaped circuit components on the circuit board can be achieved.

[Brief description of the drawings]

FIG. 1 is a schematic perspective view showing an entire chip-shaped circuit component mounting device according to an embodiment of the present invention.

FIG. 2 is a side view of the chip-shaped circuit component mounting apparatus according to the embodiment, in a state where a template has been moved directly below a component moving unit.

FIG. 3 is a side view of the chip-shaped circuit component mounting device according to the embodiment, in a state where a circuit board has been moved directly below a component moving unit.

FIG. 4 is an enlarged vertical sectional side view showing a relationship between a component holding head and a template of the chip-shaped circuit component mounting apparatus according to the embodiment.

FIG. 5 is an enlarged vertical sectional side view showing a relationship between a component holding head and a circuit board of the chip-shaped circuit component mounting apparatus according to the embodiment.

FIG. 6 is a schematic perspective view showing an entire chip-shaped circuit component mounting apparatus according to another embodiment of the present invention.

[Explanation of symbols]

 Reference Signs List 1 Hopper container 2 Distributor 6 Template 6a Template area 6b Template area 6c Template area 6d Template area 7 Table 8a Component holding head 8b Component holding head 83 Component chuck a Chip-shaped circuit component b Circuit board

Continuation of front page (72) Inventor Kazuo Sakaguchi 6-16-20 Ueno, Taito-ku, Tokyo Taiyo Yuden Co., Ltd. (58) Field surveyed (Int.Cl. ⁶ , DB name) H05K 13/04

Claims (4)

(57) [Claims] A chip-shaped circuit component (a) is sent out one by one from a plurality of hopper containers (1), in which the chip-shaped circuit components (a) are stored in a bulk, and each hopper container (1) is sent out. ), (1)... Are distributed and supplied by the distributor (2) according to the position pattern to be mounted on the circuit board (b), and the template (6) is distributed according to the co-located pattern. ), The chip-shaped circuit component (a) received in the storage portion arranged above and stored in the storage portion of the template (6) is kept in the stored relative arrangement with the component holding heads (8a), (8).
b) A chip-like circuit component mounting method for holding the substrate at a position and moving it onto the circuit board (b) for mounting, wherein the plurality of regions (6a), (6)
b) pick up the chip-shaped circuit components (a) from the storage portions arranged in different positional patterns, respectively, with the component holding heads (8a), (8b), etc., and attach these chip-shaped circuit components (a) to the same circuit board. (B) A method for mounting a chip-shaped circuit component, which is mounted on the same area one after another. 2. A table (7) for holding a circuit board (b) and a plurality of chip-shaped circuit components (a) which are stored in bulk and each of which is sent out one by one. The hopper containers (1), (1)... And the chip-like circuit components (a) sent from each hopper container (1), (1)... Are distributed according to the position pattern to be mounted on the circuit board (b). A template (6) in which a distributor (2) to be supplied, a storage section for receiving the chip-shaped circuit component (a) supplied from the distributor (2) are arranged according to the position pattern, and the template (6). The component holding heads (8a), (8b), which hold the chip-shaped circuit components (a) stored in the storage portion of the storage portion in the stored relative arrangement, and move and mount the circuit components on the circuit board (b). ), The template (6) includes a plurality of regions (6a), (6b), in which the storage portions are arranged according to different position patterns.
And the component chuck (8) according to the position pattern of the storage portion on each area of the template (6).
3) A chip-shaped circuit component mounting device comprising a plurality of component holding heads (8a), (8b). 3. The component holding heads (8a) and (8b).
The chip-shaped circuit component mounting device according to claim 2, wherein ... move up and down independently of each other and perform suction operation independently. 4. The XY-θ table, wherein the table (7) is a XY-θ table capable of moving a circuit board (b) held thereon in X and Y directions and rotating in a plane direction. Item 4. The chip-shaped circuit component mounting device according to item 2 or 3.