JP2849638B2 - Imaging device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image device such as an LED head, a contact type image sensor, and a liquid crystal shutter array head.

[0002]

2. Description of the Related Art Image devices such as an LED head, a liquid crystal shutter array head, and a contact image sensor use an image array such as an LED array and a lens array. Then, the substrate on which the image array is mounted and the lens array are positioned with respect to the housing, and the image array is indirectly positioned with respect to the lens array. However, the technique of positioning the image array relative to the lens array is imperfect, especially the technique of positioning in the lateral direction (in the direction perpendicular to the optical axis). Such misalignment prevents alignment between the center line of the image array and the center line of the lens array, resulting in a decrease in light amount, unevenness in light amount, and the like.

[0003]

SUMMARY OF THE INVENTION It is an object of the present invention to accurately and easily position an image array in a lateral direction with respect to a lens array, to simplify a housing shape, and to provide a substrate for an image array and a substrate for a drive circuit. And easy connection and fixation thereof, and to prevent problems such as warpage due to thermal expansion.

[0004]

An image apparatus according to the present invention comprises a first substrate made of glass or ceramic on which an image array is mounted;
A second substrate made of plastic on which the drive circuit is mounted, and the first and second substrates are clipped using clip terminals so that both ends of the second substrate extend to both outer sides of the first substrate.
What is claimed is: 1. An image apparatus comprising: a first substrate and a second substrate; wherein the first and second substrates are housed in a plastic housing; And a screw hole is provided on the inner surface of the housing, and screws are inserted into the through hole and the screw hole of the housing in a state where the extending portions at both ends of the second substrate are in contact with the housing. Thereby, the second substrate is positioned at a predetermined position of the housing.

[0005] As an image device, the LED shown in the embodiment is used.
In addition to the head, any device using an image array and a lens array, such as a liquid crystal shutter array head and a contact image sensor, may be used.

[0006]

According to the present invention, a first substrate made of glass or ceramic on which an image array is mounted, and a second substrate made of plastic on which a drive circuit is mounted are mounted on both ends of the first substrate. The first and second substrates are closely fixed back to back using clip terminals so as to extend to the outside, and the first and second substrates are fixed.
A substrate is accommodated in a plastic housing, a through hole is provided in an extension of the second substrate at a position on the extension of the first substrate, and a screw hole is provided in an inner surface of the housing to form a second substrate. The second substrate is positioned at a predetermined position of the housing by inserting screws through the through holes and the screw holes of the housing with the extending portions at both ends of the substrate abutting on the housing.

As a result, the image array can be positioned on a plane perpendicular to the optical axis direction. This positioning can be performed easily and accurately by positioning the through hole of the second substrate (drive circuit substrate) with the screw hole of the housing with a screw.

Further, the first substrate (image array substrate) and the second substrate are brought into close contact with each other back to back, and both are connected and fixed by clip terminals. Then, a base plate between the first substrate and the second substrate becomes unnecessary, and the housing shape is simplified. Also, electrical connection and mechanical fixing can be performed simultaneously.

Further, since both the second substrate and the housing are made of plastic, the thermal expansion coefficients of the two are almost equal, and even if external heat, ambient temperature change, and heat from the image apparatus are applied, The housing and the second substrate expand in substantially the same manner. As a result, the quality of the image is maintained despite the temperature change, and the housing and the second substrate are not warped, and the through holes and the screw holes of the housing are not damaged.

The first substrate is made of glass or ceramic and has a different coefficient of thermal expansion from the second substrate made of plastic. However, the connection between the two is made by the clip terminal, and the mismatch in the coefficient of thermal expansion between the substrates is caused by the deformation of the clip terminal. Absorbed, there is no problem such as one of the substrates warping or clip terminal coming off.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment will be described using an LED head as an example. In FIGS. 1 and 2, reference numeral 2 denotes a housing, which is inexpensive and has high rigidity and heat resistance and high processing accuracy, and is a polyphenylene sulfide.
Use engineering plastics such as polycarbonate. Reference numeral 4 denotes an image array, which is an LED array here. For example, about 40 image arrays 4 are linearly arranged. Reference numeral 6 denotes an image array substrate as a first substrate, using a glass substrate or a ceramic substrate whose surface is glass-glazed.
A substrate that is flat and has high surface smoothness is used. Reference numeral 8 denotes a drive circuit for the image array 4, which includes a drive IC, a capacitor, and the like.
It is mounted on a drive circuit board 10 as a second board using an inexpensive printed board such as plastic. Reference numeral 12 denotes a lens array such as a self-focusing lens array. Reference numeral 14 denotes a metal cover which covers the opening of the housing 2, electrostatically shields the image array 4, the drive circuit 8, and the like, and also prevents toner and paper dust from entering.

Reference numerals 16 and 18 denote clip terminals, respectively, which are provided in large numbers along both longitudinal end surfaces of the substrates 6 and 10, respectively.
The clip terminals 16 and 18 are formed on the substrates 6 and 1 by their elasticity.
0 is pressed to bring them into close contact, and they are fixed to the substrates 6, 10 by soldering or the like, and they are also electrically connected. In the embodiment, the clip terminal 16 on the right side of FIG. 2 is used for both coupling and electrical connection of the substrate, and the clip terminal 18 on the left side is used only for the close contact of the substrates 6 and 10. For this reason, the left clip terminal 18 is referred to as a board fixing clip terminal.

The housing 2 basically includes a first piece 20 parallel to the substrate 6, a second piece 22 perpendicular to the first piece 20 and parallel to the side surface of the lens array 12, and a board 6 perpendicular to the first piece 20. ,
10 and a third piece 24 parallel to the end face. In addition, the housing 2 is provided with a fourth piece 26 so as to position the right side surface of the lens array 12. Reference numeral 28 denotes a protrusion provided on the first piece 20, which is provided with a vertical reference surface at a tip thereof, and is positioned in contact with the main surface of the substrate 6.

Reference numeral 30 denotes an adjusting screw, and reference numeral 32 denotes a screw hole provided in the housing 2. Numeral 34 denotes a spacer made of, for example, plastic or rubber. A pressing portion 36 is formed by bending the cover 14 and presses the bottom surface of the substrate 10 in the drawing.

The clip terminals 16 are arranged at a pitch of, for example, about 1 mm at a portion having the smallest pitch, and at a pitch of, for example, about 5 mm at other portions. Protrusion 2
8 are provided, for example, about several to ten, and the board fixing clip terminals 18 are provided in the same number as the protrusions 28, about ten to about ten. The plastic printed circuit board 10 includes a pressing portion 36.
As a result, it is pressed upward from the lower side of the figure. This is because the force from the screw 30 is applied to the metal cover 14 and acts from the pressing portion 36 along the center line of the substrate 10. A spacer 34 is provided so that the screw 30 does not apply an excessive force to the printed circuit board 10. The main surface of the substrate 6 made of glass or the like is pressed toward a vertical reference surface provided on the lower surface of the projection 28, and the main surface of the substrate 6 is positioned by the vertical reference surface. The closest position to the light emitting portion of the image array 4 is the main surface of the substrate 6, which is positioned on the reference surface provided on the protrusion 28, so that the lens array 12 and the image array 4 can be positioned. The vertical spacing of The means for pressing the substrate 10 itself is arbitrary. For example, an elastic material such as rubber may be arranged between the metal cover 14 and the substrate 10, and the pressing may be performed by the force from the screw 30 via the elastic material.

Since the substrates 6 and 10 are connected by the clip terminals 16 and 18, no adhesive is required. For this reason, there is no need to wait for the adhesive to cure, and there is no reduction in focusing performance due to variations in the thickness of the adhesive. Although not particularly limited, there is no need to arrange a base plate drawn out of the housing between the substrates 6 and 10, and the housing 2 having a simple shape can be used.

The horizontal plane of the image array 4 with respect to the lens array 12 (a plane perpendicular to the optical axis, xy in this embodiment)
Call it a plane. ), Will be described. As described later, the substrate 6 is positioned on the xy plane with respect to the substrate 10. The extending portion of the substrate 10 extending outward from both ends of the substrate 6 has a precisely positioned through hole, through which a screw 30 is passed and positioned in a screw hole 32 of the housing 2. As a result, the substrate 6 is accurately positioned on the xy plane with respect to the housing 2. Moreover, the positioning is very easy.

The housing 2 has a first piece 20 and a second piece 22 and a third piece 24 perpendicular to the first piece 20. The deformation is prevented by the rib effect regardless of the direction of the deformation.

The assembly of the image apparatus will be described. As shown in FIGS. 4 to 6, the substrates 6 and 10 are superimposed back to back,
The clip terminals 16 and 18 are soldered. For example, cream solder is used for soldering, and soldering is performed in a non-contact manner using a hot air heater or the like. Since there is no contact, no force is applied to the electrode on the surface of the substrate 6 made of glass or the like, and the electrode is not peeled or damaged. The hot air heater can perform local heating and the heating time is as short as about several seconds, so that the image array 4 and the drive circuit 10 are not damaged. 4 to 6, reference numeral 40 denotes a through hole provided in the substrate 10 for passing the screw 30 through. Reference numeral 42 denotes a longitudinal direction mark, and reference numeral 44 denotes a center line mark, both provided on the substrate 10 and used for positioning the substrate 6.

FIG. 7 shows the positioning of the substrate 6 with respect to the substrate 10. In the figure, 50 is a TV camera, 52 is a monitor, and observes the vicinity of the through hole 40. The monitor 52 displays a center line 54 in the X direction and a center line 56 in the Y direction as a cursor, and positions the intersection such that the intersection appears at the center of the through hole 40. Both ends in the longitudinal direction (X direction) of the substrate 6 are positioned at edges of the longitudinal direction mark 42.
As a result, the substrate 6 is positioned in the X direction of the substrate 10. Next, the X-direction center line 54 passing through the center of the through hole 40 passes through the center between the center line marks 44, and passes through the center of the image array 4 of the substrate 6. For this purpose, the fixed position may be confirmed while moving the substrate 6 with a manipulator or the like. By doing so, the center line of the substrate 6 is positioned using the through hole 40, and the vertical displacement of the monitor 52 in FIG. 7 is prevented.
The left and right positions of the substrate 6 on the monitor 52 are positioned by the longitudinal marks 42.

When the positioning between the substrates 6 and 10 is completed,
Soldering is performed at the clip terminals 16 and 18 as described above.
After that, the substrates 6 and 10 are set on the housing 2 from the side, the metal cover 14 is attached, and the substrates are fixed with screws 30. As is clear from FIGS. 2 and 3, the substrates 6, 10 are inserted not from below but from the side, so that the image array 4 is not mounted obliquely or does not hit the housing 2 and is damaged.

[0022]

According to the first aspect of the present invention, the first substrate on which the image array is mounted can be accurately and easily positioned in the lateral direction of the housing, and the position between the first substrate and the second substrate can be reduced. There is no need to interpose a base plate between the two, so that both can be easily connected and fixed, and furthermore, the warpage of the substrate due to thermal expansion can be prevented.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view of an image apparatus according to an embodiment.

FIG. 2 is a cross-sectional view in a short direction of the image apparatus according to the embodiment.

FIG. 3 is a cross-sectional view in a short half direction at an adjustment screw portion of the image apparatus according to the embodiment.

FIG. 4 is a plan view showing a state where the image array substrate and the driving circuit substrate are combined.

FIG. 5 is a side view showing a state where the image array substrate and the drive circuit substrate are combined.

FIG. 6 is a bottom view of the state where the image array substrate and the drive circuit substrate are combined.

FIG. 7 is a diagram showing positioning of an image array substrate on a drive circuit substrate;

[Explanation of symbols]

 Reference Signs List 2 housing 4 image array 6 image array board (first board) 8 drive circuit 10 drive circuit board (second board) 12 lens array 14 metal cover 16 clip terminal 18 board fixing clip terminal 20 first piece 22 second piece 24 Third piece 26 Fourth piece 28 Projection 30 Adjusting screw 32 Screw hole 34 Spacer 36 Pressing part 40 Through hole 42 Longitudinal mark 44 Center line mark 50 TV camera 52 Monitor 54 X direction center line 56 Y direction center line

Continuation of the front page (51) Int.Cl. ⁶ Identification symbol FI H04N 1/036 (56) References JP-A-4-138262 (JP, A) JP-A-3-213362 (JP, A) JP-A-1 JP-A-2-136254 (JP, A) JP-A-1-292894 (JP, A) JP-A-63-273340 (JP, A) JP-A-3-62846 (JP, U) ) Japanese Utility Model Application 1-83552 (JP, U) Japanese Utility Model Application 4-89356 (JP, U) Japanese Utility Model Application 1987-87453 (JP, U) (58) Fields investigated (Int. Cl. ⁶ , DB name) B41J 2/44 B41J 2/45 B41J 2/455 H01L 33/00 H04N 1/028 H04N 1/036

Claims (1)

(57) [Claims] 1. A first substrate made of glass or ceramic on which an image array is mounted, and a second substrate made of plastic on which a driving circuit is mounted, both ends of which extend to both outer sides of the first substrate. The first and second substrates are tightly fixed to each other back to back using clip terminals, and the first and second substrates are accommodated inside a plastic housing. A state in which a through hole is provided in the extending portion of the second substrate at a position on the extension of one substrate, and a screw hole is provided in an inner surface of the housing so that the extending portions at both ends of the second substrate are in contact with the housing. Wherein the second substrate is positioned at a predetermined position of the housing by inserting a screw into the through hole and a screw hole of the housing.