JP2850797B2 - Package equipment for electronic components - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a packaging device for electronic components which accommodates various electronic components, assembles a connector or the like, and seals it with a sealing material.

[0002]

2. Description of the Related Art Hitherto, there has been known an electronic component packaging device for protecting various electronic components housed in a container with a sealing material to protect the electronic components from an external environment.

[0003]

By the way, before the hardening treatment, the fluidity is good from the boundary of the assembled parts, such as connectors, mounted on the container for electrically connecting to various electronic parts housed in the container. There was a problem that the sealing material leaked out of the container due to its surface tension and capillary action.

Therefore, the present invention has been made to solve such a problem, and it is possible to prevent the sealing material for sealing the internal volumes of various electronic components housed in the container from leaking before the curing process. An object is to provide a package device for electronic components.

[0005]

According to a first aspect of the present invention, there is provided a package device for an electronic component, comprising: a bottomed container for accommodating various electronic components; and a predetermined peripheral wall of the container, and an upper end of the peripheral wall. And an assembling part for joining the contact surface with the edge surface and making the end joined to the upper end edge surface an inclined shape or an arc shape to form an acute angle.

According to a second aspect of the present invention, there is provided a package device for an electronic component having a bottomed container for storing various electronic components, an upper end surface of a predetermined peripheral wall surface of the container and an inner wall surface adjacent to the upper end surface. And an assembling part for holding a predetermined gap and sandwiching and assembling the inner wall surface and the outer wall surface of the peripheral wall surface.

According to a third aspect of the present invention, there is provided a package device for an electronic component having a stepped portion at a top end surface of a peripheral wall surface for storing various electronic components, and the stepped portion is gently formed in an inclined shape or an arc shape. It is provided with a container having a rising shape.

[0008]

According to the first aspect of the present invention, various electronic components are housed in a bottomed container, and the upper edge of a predetermined peripheral wall surface of the container and the contact surface of the assembled component are joined. The end of the assembled part joined to the upper end surface is formed into an inclined shape or an arc-like acute angle shape. For this reason, the boundary between the upper end surface of the peripheral wall surface of the container and the end of the assembled component joined to each other has a gentle rise, and when filling various electronic components housed in the container with the sealing material, The crawling before the curing treatment due to the surface tension of the sealing material at the boundary portion and the capillary phenomenon is suppressed.

According to a second aspect of the present invention, various electronic components are stored in a bottomed container, and an upper end surface of a predetermined peripheral wall surface of the container and an inner wall surface adjacent to the upper end surface. An assembly component having a predetermined gap is assembled so as to sandwich the inner wall surface and the outer wall surface of the surrounding wall surface. In this manner, a predetermined gap is held between the assembled part which is assembled by sandwiching the inner wall surface and the outer wall surface of the peripheral wall surface of the container and the upper edge surface of the container and the inner wall surface adjacent to the upper edge surface. Therefore, when the sealing material is filled on the various electronic components housed in the container, the rise of the sealing material before the hardening treatment due to the surface tension of the sealing material and the capillary phenomenon is suppressed.

According to a third aspect of the present invention, the step formed on the upper edge of the peripheral wall of the bottomed container for storing various electronic components has a gently rising shape having an inclined shape or an arc shape. It is shaped. For this reason, when filling the sealing material onto various electronic components housed in the container, the surface tension of the sealing material on the stepped portion of the peripheral wall surface of the container and the climbing before the hardening treatment due to the capillary phenomenon are suppressed. .

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to specific embodiments.

Embodiment 1 FIG. 1 is a sectional view showing the overall configuration of an ignition coil / igniter integrated module using an igniter and a power switch, each of which is an electronic component package device according to a first embodiment of the present invention. .

In FIG. 1, reference numeral 100 denotes an ignition coil / igniter integrated module. The ignition coil / igniter integrated module 100 includes a core 11, a primary coil 12, and a secondary spool 13 made of a magnetic material having a mounting hole. It is composed of a wound secondary coil 14 and an igniter 20, is arranged in a resin case 15, and after a predetermined wiring connection, is filled with an epoxy resin or the like and integrated. The ignition coil / igniter integrated module 100 includes a battery (not shown) and an internal combustion engine control ECU (El
A primary connector 16 for connecting to an ectronic control unit (electronic control unit) and a secondary connector 17 for connecting to a high-voltage cable for an ignition plug (not shown) are provided.

FIG. 2 is a plan view of the igniter 20 built in the ignition coil / igniter integrated module 100 of FIG. 1, and FIG. 3 is a sectional view taken along line AA of FIG. In addition,
2 and 3, conductive patterns and the like forming an electric circuit on the surface of the ceramic substrate are omitted.

2 and 3, the igniter 20
Is a metal container 21 having a bottomed rectangular cylindrical shape in an electrically floating state, a ceramic substrate 22 bonded to the inner bottom surface thereof with an adhesive, and a plurality of external devices connected to predetermined land portions of the ceramic substrate 22. A connection terminal 23, a connector 24 for integrally holding the external connection terminals 23 in an insulated state and assembling them with the metal container 21, and sealing the inner volume of the metal container 21 on the surface of the ceramic substrate 22 to form various parts on the circuit surface. It is made of silicon gel 25 as a transparent potting agent that protects electronic components from the external environment. The connector 24 and the metal container 21 are arranged such that the mounting groove 24a of the connector 24 is
Of the metal container 21 and joined by an adhesive (silicon-based adhesive) 26 as a sealing agent applied in advance to the upper end surface 21a of the metal container 21.

A predetermined conductor pattern, a thick film resistor, a protective mask and the like are printed on the surface of the ceramic substrate 22, and various electronic components such as a chip capacitor and a power transistor are mounted on predetermined lands of the conductor pattern. It is electrically connected by reflow soldering or the like, and is jump-connected by wire bonding or the like as necessary.

Next, a packaging device for electronic components in the igniter 20 of the present embodiment will be described with reference to FIG.

In the manufacturing process of the igniter 20, the silicon gel 25 is filled on the surface of the ceramic substrate 22 joined to the metal container 21. Since the silicon gel 25 has good fluidity, it is almost uniformly filled to every corner of various electronic components on the surface of the ceramic substrate 22. On the other hand, the silicon gel 25 has a peripheral wall surface of the metal container 21 due to surface tension and capillary action. To reach the vicinity of the upper edge surface 21a of the upper surface. At this time, the connector 24 is attached to the metal container 21, but since the mounting groove 24 a of the connector 24 is joined by the adhesive 26 previously applied to the upper end surface 21 a of the metal container 21, The silicon gel 25 does not leak from the gap due to the capillary phenomenon or the like. In addition, since the ends 24b and 24c of the connector 24 joined to the upper end surface 21a of the metal container 21 are inclined and have an acute angle (in FIG. 3, a projection having an inclination of about 45 °). The ends 24b and 24c of these connectors 24 and the metal container 21
The silicon gel 25 whose liquid level has risen due to surface tension from the boundary portion with the upper end edge surface 21a does not leak due to capillary action or the like.

Here, in the conventional package device for electronic parts, if the filled silicon gel 25 has reached the upper end surface 21a of the metal container 21 by surface tension, it will not be processed until it is thermally cured in a later step. During this period, the problem of leakage from the boundary between the ends 24b and 24c of the connector 24 and the upper end surface 21a of the metal container 21 and protruding to the peripheral wall surface of the metal container 21 and contaminating it was accepted.

By employing the electronic component package device in this embodiment, it is not necessary to form a complicated sealing shape at the joint between the metal container 21 and the assembled components such as the connector 24. In addition, after the thermosetting treatment of the silicon gel 25, a troublesome step of removing the protruding portion can be omitted, which can contribute to cost reduction, and various electronic components on the ceramic substrate 22 surface in the metal container 21 can be removed from the external environment. Therefore, the reliability of the sealing material, which is to protect the sealing material, can be improved.

As described above, the package device for electronic components of the present embodiment is assembled on the bottomed rectangular cylindrical metal container 21 for storing various electronic components, and on the predetermined peripheral wall surface of the metal container 21.
The contact surface of the peripheral wall surface with the upper end edge surface 21a is bonded with an adhesive 26.
And an assembling component comprising a connector 24 having the end portions 24b and 24c joined to the upper end edge surface 21a and having an inclined shape or an arc shape and having an acute angle. The embodiment of item 1 can be adopted.

Accordingly, various electronic components are accommodated in the bottomed rectangular cylindrical metal container 21, and the upper edge 21 a of a predetermined peripheral wall surface of the metal container 21 and the connector 24, which is an assembly component, are provided.
Are joined with an adhesive 26, and the upper edge 2
The ends 24b and 24c of the connector 24 joined to the connector 1a are formed into an acute angled shape. Therefore, the boundary between the upper end edge surface 21a of the peripheral wall surface of the metal container 21 and the ends 24b and 24c of the connector 24 has a gentle rising shape, and is sealed on various electronic components housed in the metal container 21. When the silicon gel 25 serving as the stopper is filled, the silicon gel 25 before the thermosetting treatment does not leak out of the metal container 21 from the boundary due to surface tension or capillary action.

Here, the igniter 2 shown in FIGS.
0 and FIG. 4 and FIG.
The igniter 30 shown in FIG.

FIG. 4 is a plan view of an igniter 30 showing a modified example of the igniter 20 comprising the electronic component package device of the above embodiment, and FIG. 5 is a sectional view taken along the line BB of FIG. Components having the same configuration or corresponding parts as in the examples are denoted by the same reference numerals and symbols.

In the igniter 30 shown in FIGS. 4 and 5,
In order to insulate the plurality of external connection terminals 23 connected to predetermined land portions of the ceramic substrate 22 from the metal container 21 while maintaining a predetermined interval, the metal connection 21 is replaced with the connector 24 shown in FIGS. The insulating member 34 is inserted and joined. The operation and effect on the silicon gel 25 at the boundary between the ends 34b and 34c of the insulating member 34 and the upper end surface 21a of the metal container 21 are the same as in the above-described embodiment, and the description thereof will be omitted.

<Embodiment 2> FIGS. 6 and 7 show an igniter 40 comprising an electronic component packaging apparatus according to a second embodiment of the present invention, FIG. 6 is a plan view, and FIG.
FIG. 4 is a cross-sectional view taken along a line, and components having the same configuration or corresponding parts as those of the above-described embodiment are denoted by the same reference numerals and symbols. In FIGS. 6 and 7, conductive patterns and the like that form an electric circuit on the ceramic substrate surface are omitted. Further, the overall configuration of the ignition coil / igniter integrated module using the igniter 40 of the present embodiment is the same as that of FIG. 1 and the detailed description thereof is omitted.

6 and 7, the igniter 40
Is a metal container 21 having a bottomed rectangular cylindrical shape in an electrically floating state, a ceramic substrate 22 bonded to the inner bottom surface thereof with an adhesive, and a plurality of external devices connected to predetermined land portions of the ceramic substrate 22. A connection terminal 23, a connector 44 for integrally holding the external connection terminals 23 in an insulated state and assembling them to the metal container 21, and sealing an inner volume of the metal container 21 on the ceramic substrate 22 to thereby make a circuit surface and various electronic components. Of silicone gel 25 as a transparent potting agent that protects from the external environment.

The connector 44 and the metal container 21 are assembled in such a manner that the mounting groove 44a of the connector 44 is inserted into a predetermined peripheral wall surface of the metal container 21 and the front end surface of the connector 44 contacts the bottom surface of the metal container 21. Is attached. In this structure, it is not necessary to join the peripheral wall surface including the upper end edge surface 21a of the metal container 21 and the connector 44 with an adhesive or the like.

Next, an electronic component packaging device in the igniter 40 of the present embodiment will be described with reference to FIG.

During the manufacturing process of the igniter 40,
Silicon gel 25 is filled on the surface of the ceramic substrate 22 joined to the metal container 21. Since the silicon gel 25 has good fluidity, it is filled almost uniformly to the circuit surface on the surface of the ceramic substrate 22 and all the corners of various electronic components. On the other hand, the silicon gel 25 is filled with the metal container 21 due to surface tension and capillary action. To reach the vicinity of the upper end edge surface 21a of the peripheral wall surface.

At this time, the inside and the upper edge 2 of the peripheral wall of the metal container 21 facing the mounting groove 44a of the connector 44
A gap 47 is formed at a predetermined interval from the gap 1a. The interval of the gap 47 is determined by the silicon gel 2 due to a capillary phenomenon or the like.
5 rises up the gap 47 and the upper edge 21 of the metal container 21.
a is not exceeded.

By employing the electronic component packaging device in the present embodiment, it is not necessary to form a complicated seal shape at an assembly portion of the metal container 21 and the assembly components such as the connector 44. In addition, after the thermosetting treatment of the silicon gel 25, a troublesome step of removing the protruding portion can be omitted, which can contribute to cost reduction, and various electronic components on the ceramic substrate 22 surface in the metal container 21 can be removed from the external environment. Therefore, the reliability of the sealing material, which is to protect the sealing material, can be improved.

As described above, the package device for electronic components of the present embodiment has a bottomed rectangular cylindrical metal container 21 for accommodating various electronic components, and the upper edge surface 21a of the peripheral wall surface of the metal container 21.
And an assembling part comprising a connector 44 for securing a predetermined gap in an inner wall surface adjacent to the upper end edge surface 21a and holding and mounting the inner and outer wall surfaces of the peripheral wall surface. The embodiment of item 2 can be adopted.

Accordingly, various electronic components are accommodated in the bottomed rectangular cylindrical metal container 21, and the upper peripheral surface 21a of the predetermined peripheral wall surface of the metal container 21 and the inner wall surface adjacent to the upper peripheral surface 21a are fixed to the predetermined distance. The connector 44, which is an assembly component in which the gap 47 is held, is assembled so as to sandwich the inner wall surface and the outer wall surface of the surrounding wall. As described above, the connector 44 assembled with the inner wall surface and the outer wall surface of the peripheral wall surface of the metal container 21 interposed therebetween and the upper edge surface 21a of the metal container 21 and the inner wall surface adjacent to the upper edge surface 21a have predetermined values. Gap 47 is held. For this reason, when the silicone gel 25 as a sealing material is filled on the various electronic components housed in the metal container 21, the silicon gel 25 before the thermosetting treatment is removed from the metal container 21 through the gap 47 due to surface tension or capillary phenomenon. There is no leakage outside.

<Embodiment 3> FIG. 8 is a perspective view showing a metal or plastic resin container 210 comprising an electronic component packaging device according to a third embodiment of the present invention.
By using the container 210 of this embodiment, the igniter and the like in the above-described embodiment can be configured.

In FIG. 8, on the peripheral side surface of the container 210, an upper edge 210a having a lower height from the bottom surface and an upper edge 210c having a higher height from the upper edge 210a by the height of the step 210b are provided. Is formed. This step 2
10b is a gentle rising shape with an inclined shape.

Next, the operation will be described.

In the process of manufacturing an igniter or the like, a sealing material such as silicon gel is filled on the surface of the ceramic substrate joined to the container 210. This sealing material such as silicon gel has good fluidity, so it is almost uniformly filled to every corner of various electronic components on the surface of the ceramic substrate. On the other hand, sealing material such as silicon gel has surface tension and capillary phenomenon. By container 2
10 reaches the vicinity of the upper end edge surface 210a of the peripheral wall surface.

At this time, if the rising of the step portion 210b following the upper end edge surface 210a of the peripheral wall surface of the container 210 has an acute angle, the sealing material such as silicon gel whose liquid level rises due to the surface tension may cause a capillary phenomenon or the like. Works and leaks from the boundary. Therefore, the step portion 210b on the peripheral wall surface of the container 210 of the present embodiment is formed in a gently inclined shape (in FIG. 8, an inclined shape having an inclination of about 45 ° with respect to the upper edge 210a). Step 210b and container 21
The sealing material, such as silicon gel, whose liquid level has risen due to surface tension from the boundary portion between the peripheral wall surface and the upper end edge surface 210a, does not leak due to capillary action or the like.

By employing the electronic component packaging apparatus in this embodiment, it is possible to eliminate the troublesome step of removing the protruding portion after the hardening treatment of the sealing material such as silicon gel filled in the container 210. This can contribute to cost reduction and improve the reliability of the sealing material for protecting various electronic components and the like on the ceramic substrate surface in the container 210 from the external environment.

As described above, the packaging device for electronic components of the present embodiment has a stepped portion 210b at the upper end edges 210a and 210c of the peripheral wall surface in the shape of a bottomed rectangular tube for housing various electronic components. Is provided with a container 210 having a gently rising shape with an inclined shape or a circular arc shape, which can be the embodiment of claim 3.

Accordingly, the step 210b formed following the upper edge 210a of the peripheral wall of the bottomed rectangular cylindrical container 210 in which various electronic components are stored has a gently rising shape having an inclined shape or an arc shape. ing. For this reason,
For example, when a sealing material such as silicon gel is filled on various electronic components housed in the container 210, the sealing material such as silicon gel before the hardening treatment may cause an upper edge 2 due to surface tension or capillary phenomenon.
It does not leak out of the container 210 from the boundary between the step 10a and the step 210b.

[0043]

As described above, according to the electronic component package device of the first aspect, various electronic components are stored in the bottomed container, and are assembled with the upper edge of the predetermined peripheral wall surface of the container. The contact surface of the attached part is joined, and the end of the assembled part joined to the upper end edge has an inclined shape or an acute shape of an arc shape, and is joined to the upper end edge of the peripheral wall surface of the container. The boundary with the end of the assembled component has a gentle rise. For this reason, when filling the various electronic components housed in the container with, for example, the sealing material, it is possible to prevent the surface tension of the sealing material at the boundary portion and the rise before the hardening treatment due to the capillary phenomenon. Therefore, it is not necessary to make the assembly portion of the container and the assembly component a complicated seal shape. In this case, after the curing treatment of the sealing material, it is possible to omit a troublesome process of removing the protruding portion, thereby contributing to cost reduction and protecting various electronic components in the container from the external environment. The reliability of the sealing material can be improved.

According to the electronic component package device of the second aspect, various electronic components are stored in the bottomed container, and the upper end surface of a predetermined peripheral wall surface of the container and the inner wall surface adjacent to the upper end surface. And an assembly part holding a predetermined gap is sandwiched between the inner wall and the outer wall of the peripheral wall, and is assembled while sandwiching the inner wall and the outer wall of the peripheral wall of the container. A predetermined gap is held between the attached component and the upper end edge surface of the container and the inner wall surface adjacent to the upper end edge surface. For this reason, when filling various electronic components accommodated in the container with, for example, a sealing material, it is possible to suppress the surface tension of the sealing material into the gaps and the rise before the hardening treatment due to the capillary phenomenon. . Therefore, it is not necessary to make the assembly portion of the container and the assembly component a complicated seal shape. In this case, after the curing treatment of the sealing material, it is possible to omit a troublesome process of removing the protruding portion, thereby contributing to cost reduction and protecting various electronic components in the container from the external environment. The reliability of the sealing material can be improved.

According to the electronic component package device of the third aspect, the step formed on the upper edge of the peripheral wall surface of the bottomed container in which various electronic components are stored has a gradual or arc-shaped step. It has a rising shape. For this reason,
For example, when filling a sealing material onto various electronic components housed in a container, surface tension of the sealing material at a boundary portion between a peripheral wall surface of the container and a stepped portion or a rise before a curing process due to a capillary phenomenon may occur. Can be deterred. Therefore, in this case, after the hardening treatment of the sealing material, a troublesome step of removing the protruding portion can be omitted, which can contribute to cost reduction and protect various electronic components in the container from the external environment. The reliability of the sealing material can be improved.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing an overall configuration of an ignition coil / igniter integrated module using an igniter including an electronic component package device according to a first embodiment and a second embodiment of the present invention.

FIG. 2 is a plan view showing an igniter including the electronic component package device according to the first embodiment of the present invention.

FIG. 3 is a cross-sectional view taken along line AA of FIG.

FIG. 4 is a plan view showing a modified igniter of the electronic component package device according to the first embodiment of the present invention.

FIG. 5 is a sectional view taken along line BB of FIG. 4;

FIG. 6 is a plan view showing an igniter including an electronic component package device according to a second embodiment of the present invention.

FIG. 7 is a sectional view taken along line CC of FIG. 6;

FIG. 8 is a perspective view showing a belonging package including an electronic component packaging device according to a third embodiment of the present invention.

[Explanation of symbols]

 21 Metal container 21a Upper edge surface (of peripheral wall) 24 Connector (assembled part) 24b, 24c End 47 Gap 210 Container 210b Step

Claims (3)

(57) [Claims] 1. An electronic component package device in which various electronic components housed in a container are sealed with a sealing material, wherein a bottomed container for housing the various electronic components and a predetermined shape of the container are provided. An assembling part which is attached to a peripheral wall surface and joins a contact surface with an upper edge surface of the peripheral wall surface, and an end portion joined to the upper edge surface is formed into an inclined shape or an arc shape to form an acute angle. A packaging device for electronic components, comprising: 2. An electronic component package device comprising various electronic components housed in a container sealed with a sealing material, wherein the container has a bottomed shape for storing the various electronic components, and a predetermined shape of the container. An electronic component, comprising: an upper part edge surface of the peripheral wall surface and an inner wall surface adjacent to the upper edge surface, and an assembly part for holding a predetermined gap and holding and mounting the inner wall surface and the outer wall surface of the peripheral wall surface. Package equipment for parts. 3. A package device for electronic components, wherein various electronic components housed in a container are sealed with a sealing material. A package device for an electronic component, comprising: a container having a portion, wherein the step portion has a slope or an arc shape and a gentle rising shape.