JP2851655B2 - Manufacturing method of electronic equipment - Google Patents
Manufacturing method of electronic equipmentInfo
- Publication number
- JP2851655B2 JP2851655B2 JP1318806A JP31880689A JP2851655B2 JP 2851655 B2 JP2851655 B2 JP 2851655B2 JP 1318806 A JP1318806 A JP 1318806A JP 31880689 A JP31880689 A JP 31880689A JP 2851655 B2 JP2851655 B2 JP 2851655B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- metal
- conductor pattern
- external lead
- electronic device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 28
- 239000002184 metal Substances 0.000 claims description 28
- 239000004020 conductor Substances 0.000 claims description 17
- 239000011347 resin Substances 0.000 claims description 13
- 229920005989 resin Polymers 0.000 claims description 13
- 230000000630 rising effect Effects 0.000 claims description 12
- 238000001816 cooling Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 4
- 238000005452 bending Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 239000006071 cream Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000000191 radiation effect Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
Landscapes
- Structure Of Printed Boards (AREA)
- Electronic Switches (AREA)
- Casings For Electric Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
【発明の詳細な説明】 ［産業上の利用分野］ 本発明は、金属−絶縁層−導体パターンの三層構造か
らなる金属ベース回路基板を利用した電子機器の製造方
法に関する。The present invention relates to a method for manufacturing an electronic device using a metal-based circuit board having a three-layer structure of a metal, an insulating layer, and a conductor pattern.
［従来の技術］ 金属−絶縁層−導体パターンの三層構造からなる金属
ベース回路基板が電子機器、例えば固体素子継電器（以
下、ソリッド・ステート・リレーという）のベース回路
基板として使用されている。この金属ベース回路基板
は、基材として例えばアルミニューム金属を用い、その
上に絶縁層を形成し、該絶縁層上に銅箔からなるあらか
じめ定めた電気回路を構成する導体パターンが形成され
ている。上記の金属ベース回路基板を用いた従来のソリ
ッド・ステート・リレーを第５図に示す。2. Description of the Related Art A metal-based circuit board having a three-layer structure of a metal-insulating layer-conductor pattern is used as a base circuit board of an electronic device, for example, a solid-state relay (hereinafter, referred to as a solid-state relay). This metal-based circuit board uses, for example, aluminum metal as a base material, forms an insulating layer thereon, and has a conductor pattern constituting a predetermined electric circuit made of copper foil formed on the insulating layer. . FIG. 5 shows a conventional solid-state relay using the above-mentioned metal-based circuit board.
第５図において、金属ベース回路基板１の導体パター
ン２上にクリーム半田を塗布し、電子部品３、外部導出
端子４を搭載し、さらに絶縁材で成形された耐熱性ケー
ス５を上記電子部品３等の搭載部品の位置決め治具と兼
用させ、電気炉を通過させて搭載部品を金属ベース回路
基板１の導体パターン２上に半田固着させる。その後、
耐熱性ケース５の内部空間に樹脂を充填して搭載部品を
封入する。In FIG. 5, cream solder is applied on the conductor pattern 2 of the metal base circuit board 1, the electronic component 3 and the external lead-out terminal 4 are mounted, and the heat-resistant case 5 formed of an insulating material is attached to the electronic component 3. The mounting component is also used as a positioning jig for the mounting component, and is passed through an electric furnace to fix the mounting component on the conductor pattern 2 of the metal base circuit board 1 by soldering. afterwards,
The interior space of the heat-resistant case 5 is filled with resin to encapsulate the mounted components.
最後に、上部カバー６を被せて所定のソリッド・ステ
ート・リレー７を完成させている。Finally, the predetermined solid state relay 7 is completed by covering the upper cover 6.
［発明が解決しようとする課題］ しかしながら、従来のソリッド・ステート・リレーの
構造では次のような解決すべき課題があった。[Problem to be Solved by the Invention] However, the structure of the conventional solid state relay has the following problems to be solved.
（１）ソリッド・ステート・リレー自体の構造の小型化
を図るには搭載部品の点数を減らす必要があり、回路構
成上の限界があった。(1) In order to reduce the size of the structure of the solid state relay itself, it is necessary to reduce the number of mounted components, and there is a limit in the circuit configuration.
（２）小型化を図るために、単に金属ベース回路基板を
小さくしたのでは、該回路基板上に搭載された発熱する
電子部品からの放熱が十分なされず、ソリッド・ステー
ト・リレーの信頼性の低下に結び付く。(2) Simply reducing the size of the metal-based circuit board in order to reduce the size does not provide sufficient heat radiation from the heat-generating electronic components mounted on the circuit board, and the reliability of the solid-state relay is reduced. Leads to a decline.
［発明の目的］ 本発明は、搭載部品の個数の制限や金属ベース回路基
板の面積を小さくすることなく、小型化と高信頼性の維
持を図り得る電子機器の製造方法を提供することを目的
とする。[Object of the Invention] An object of the present invention is to provide a method of manufacturing an electronic device that can achieve miniaturization and maintain high reliability without limiting the number of mounted components and reducing the area of a metal-based circuit board. And
［課題を解決するための手段］ 本発明の電子機器の製造方法は、金属−絶縁層−導体
パターンの三層構造からなる金属ベース回路基板の導体
パターン上の所定位置に電子部品および外部導出端子を
搭載・固着する第１の工程と、前記導体パターンに搭載
・固着された電子部品および外部導出端子が内側になる
ようにして該回路基板の一部を、該導体パターンごと略
直角に折曲げて立上げ片を形成する第２の工程と、次い
で、該回路基板の底面を別体の冷却体上に載置・固定
し、かつ、前記立上げ片を含めて前記回路基板を包囲す
るようにケースを配置する第３の工程と、該ケース内に
樹脂を充填して該回路基板に搭載・固着された電子部品
および外部端子の一部を樹脂封止する第４の工程と、を
含むことを特徴とするものである。[Means for Solving the Problems] A method for manufacturing an electronic device according to the present invention provides an electronic component and an external lead terminal at predetermined positions on a conductor pattern of a metal base circuit board having a three-layer structure of a metal-insulation layer-conductor pattern. A first step of mounting and fixing the circuit board, and bending a part of the circuit board so that the electronic component and the external lead-out terminal mounted and fixed to the conductor pattern are on the inner side together with the conductor pattern at a substantially right angle. A second step of forming a rising piece, and then mounting and fixing the bottom surface of the circuit board on a separate cooling body, and surrounding the circuit board including the rising piece. And a fourth step of filling the inside of the case with a resin and sealing the part of the electronic components and the external terminals mounted and fixed to the circuit board with a resin. It is characterized by the following.
［作用］ 本発明の電子機器の製造方法は、金属ベース回路基板
の導体パターン上の所定の位置に電子部品および外部導
出端子を搭載し、クリーム半田等を介在させて電気炉に
通し、半田固着させる。上記の搭載部品を半田固着させ
た後、金属ベース回路基板の所定の位置から搭載部品が
内側になるように、導体パターンごと略直角に折曲げて
立上げ片を形成する。その後、この立上げ片の周囲を囲
むようにケースを配置し、該ケース内に樹脂を充填して
搭載部品を樹脂封止する。こうして完成した電子機器
は、金属ベース回路基板の立上げ片の部分にも電子部品
等を搭載・固着させ、当該部分を放熱部として利用する
ことができるため、従来と同一の大きさでもより大電力
用の電子機器とすることができるとともに、放熱効果の
向上により信頼性を高めることができる。[Operation] According to the method for manufacturing an electronic device of the present invention, an electronic component and an external lead-out terminal are mounted at predetermined positions on a conductor pattern of a metal-based circuit board, and are passed through an electric furnace with cream solder or the like interposed therebetween to fix the solder. Let it. After the above-mentioned mounted components are fixed by soldering, the conductor pattern is bent substantially at a right angle so that the mounted components are located inside from a predetermined position of the metal base circuit board to form a rising piece. Thereafter, a case is arranged so as to surround the rising piece, and the case is filled with a resin to seal the mounted components with the resin. In the electronic device completed in this way, electronic components and the like are mounted and fixed also on the rising pieces of the metal-based circuit board, and that portion can be used as a heat radiating portion. In addition to being an electronic device for electric power, reliability can be improved by improving a heat radiation effect.
［実施例］ 以下に、本発明の実施例を図を参照して説明する。Embodiment An embodiment of the present invention will be described below with reference to the drawings.
第１図は、金属ベース回路基板11の展開図である。こ
の回路基板11は、金属−絶縁層−導体パターンの三層構
造からなり、金属として例えばアルミニューム金属、導
体パターンとして銅箔により所定のパターンを形成した
ものを用いている。金属ベース回路基板11には、中央の
底板部11aと、この底板部11aの左右に連ねて側板部11b,
11cと、図示の上方に連ねて中央側板部11dが形成され
る。底板部11a,側板部11b,11cおよび中央側板部11dには
所定の電子部品12a,12b,12cが図示しない半田クリーム
介して搭載され、また、左右の側板部11b,11c上には、
外部導出端子14が半田クリームを介して搭載される。こ
の状態で電気炉内を通過させ、電子部品12aないし12cお
よび外部導出端子14を各部の導体パターン上に搭載・固
着させる。上記の外部導出端子14は、第２図から明らか
なように断面略コ字状に形成され、左右の側板部11b,11
cの端面部との沿面距離を確保している。FIG. 1 is a development view of the metal base circuit board 11. FIG. The circuit board 11 has a three-layer structure of a metal-insulating layer-conductor pattern, and uses a metal having a predetermined pattern formed of, for example, aluminum metal and a conductor pattern of copper foil. The metal base circuit board 11 has a central bottom plate portion 11a and side plate portions 11b,
A central side plate portion 11d is formed so as to be continuous with 11c and above in the figure. Predetermined electronic components 12a, 12b, 12c are mounted on the bottom plate portion 11a, the side plate portions 11b, 11c, and the central side plate portion 11d via solder cream (not shown), and on the left and right side plate portions 11b, 11c,
The external lead-out terminal 14 is mounted via a solder cream. In this state, the electronic components 12a to 12c and the external lead-out terminals 14 are mounted and fixed on the conductor pattern of each part by passing through the electric furnace. The external lead-out terminal 14 is formed in a substantially U-shaped cross section as is apparent from FIG.
The creepage distance from the end face of c is secured.
次に、電子部品12aないし12cおよび外部導出端子14を
搭載・固着した金属ベース回路基板11を一点鎖線Ｌの部
分からそれぞれ略直角に折曲げて、第３図に示すように
立上げ片15a,15b,15cを形成する。この立上げ片15a,15
b,15cの形成工程は、３箇所同時に形成するようにして
も良いし、また、１箇所毎に形成するようにして良い。
また、上記の回路基板11を折曲げる場合、銅箔製の導体
パターンも基材のアルミニューム金属および絶縁層とと
もに折曲げるが、各層間の接着強度が高いため、絶縁層
から剥離することはない。Next, the metal base circuit board 11 on which the electronic components 12a to 12c and the external lead-out terminals 14 are mounted and fixed is bent substantially at right angles from the dashed line L, respectively, as shown in FIG. 15b and 15c are formed. These rising pieces 15a, 15
In the step of forming b and 15c, three places may be formed simultaneously, or one place may be formed.
Further, when the above-mentioned circuit board 11 is bent, the conductor pattern made of copper foil is also bent together with the aluminum metal and the insulating layer of the base material, but since the adhesive strength between the layers is high, it is not separated from the insulating layer. .
上記の折曲げ加工後に、金属ベース回路基板11とは別
体の金属板からなる冷却体16を、該回路基板11における
底板部11aの外側底面に取り付ける。冷却体16の取付方
法は、良熱伝導性の接着剤で固定しても良いし、金属ベ
ース回路基板11の複数個所に透孔を設ける一方、冷却体
16にはねじ孔を設け、これらを利用してねじにより両者
を締結するようにしても良い。After the bending, the cooling body 16 made of a metal plate separate from the metal base circuit board 11 is attached to the outer bottom surface of the bottom plate portion 11a of the circuit board 11. The method of mounting the cooling body 16 may be fixed with an adhesive having good heat conductivity, or a through hole may be provided at a plurality of positions of the metal base circuit board 11, while the cooling body 16 may be fixed.
16 may be provided with screw holes, and these may be used to fasten the two with screws.
次に、第４図に示すように、冷却体16上で、かつ、金
属ベース回路基板11の前記した立上げ片15a,15b,15cを
包囲するように絶縁性樹脂等からなるケース17を上部か
ら被せ、当該ケース17内には樹脂を充填して硬化させる
ことにより、外部導出端子14のみが封止樹脂18から外部
に露出した所定の電子機器が完成する。Next, as shown in FIG. 4, a case 17 made of an insulating resin or the like is placed on the cooling body 16 so as to surround the rising pieces 15a, 15b, 15c of the metal base circuit board 11. By filling the inside of the case 17 with a resin and curing the resin, a predetermined electronic device in which only the external lead-out terminal 14 is exposed to the outside from the sealing resin 18 is completed.
なお、上記の実施例では金属ベース回路基板に立上げ
片を三方に形成した例について図示し、説明したが、例
えば四方でも一方でもその数に限定されるものではな
い。また、金属ベース回路基板の導体パターンの材質も
銅箔に限らず、導電性の良好の材料であれば、いずれの
材料でも良い。In the above-described embodiment, an example in which the rising pieces are formed on the metal base circuit board in three directions is shown and described. However, the number is not limited to four, for example. Further, the material of the conductor pattern of the metal base circuit board is not limited to copper foil, and any material having good conductivity may be used.
［発明の効果］ 以上のように、本発明によれば、金属ベース回路基板
の立上げ片部分にも電子部品を搭載・固着させ、該立上
げ片部分も放熱面として利用するようにしたので、 放熱面積が大きくなり、従来と同一の大きさであっても
より大電力用の電子機器の製作が可能となる。また、電
子機器の放熱効果が良好となるので、当該電子機器の信
頼性が向上するなどの優れた効果がある。[Effects of the Invention] As described above, according to the present invention, the electronic component is mounted and fixed also on the rising piece of the metal base circuit board, and the rising piece is also used as a heat dissipation surface. However, the heat radiation area is increased, and even if the size is the same as the conventional size, it is possible to manufacture electronic equipment for higher power. In addition, since the heat radiation effect of the electronic device is improved, there are excellent effects such as improvement in reliability of the electronic device.
第１図は、本発明の電子機器に使用する金属ベース回路
基板の展開図、第２図は、その正面図、第３図は、上記
金属ベース回路基板を折曲げた状態の斜視図、第４図
は、冷却体上に所定の形状に折曲げた金属ベース回路基
板を載置してケースにて包囲し、ケース内部に樹脂を充
填して完成させた電子機器の斜視図、第５図は、従来の
電子機器の構造を説明するために図示したソリッド・ス
テート・リレーの斜視図である。 11……金属ベース回路基板、 12a,12b,12c……電子部品、 14……外部導出端子、16……冷却体、 17……ケース、 18……封止樹脂。FIG. 1 is an exploded view of a metal-based circuit board used in the electronic device of the present invention, FIG. 2 is a front view thereof, FIG. FIG. 4 is a perspective view of an electronic device in which a metal base circuit board bent in a predetermined shape is placed on a cooling body, is surrounded by a case, and is filled with resin inside the case, and FIG. FIG. 2 is a perspective view of a solid state relay illustrated to explain a structure of a conventional electronic device. 11 ... metal base circuit board, 12a, 12b, 12c ... electronic components, 14 ... external lead terminals, 16 ... cooling body, 17 ... case, 18 ... sealing resin.
フロントページの続き (58)調査した分野(Int.Cl.6，ＤＢ名) H05K 5/06 H05K 7/20 H03K 17/00Continuation of the front page (58) Field surveyed (Int.Cl. 6 , DB name) H05K 5/06 H05K 7/20 H03K 17/00
Claims (1)
らなる金属ベース回路基板の導体パターン上の所定位置
に電子部品および外部導出端子を搭載・固着する第１の
工程と、 前記導体パターンに搭載・固着された電子部品および外
部導出端子が内側になるようにして該回路基板の一部
を、該導体パターンごと略直角に折曲げて立上げ片を形
成する第２の工程と、 次いで、該回路基板の底面を別体の冷却体上に載置・固
定し、かつ、前記立上げ片を含めて前記回路基板を包囲
するようにケースを配置する第３の工程と、 該ケース内に樹脂を充填して該回路基板に搭載・固着さ
れた電子部品および外部端子の一部を樹脂封止する第４
の工程と、 を含むことを特徴とする電子機器の製造方法。A first step of mounting and fixing an electronic component and an external lead-out terminal at predetermined positions on a conductive pattern of a metal-based circuit board having a three-layer structure of a metal-insulating layer-conductive pattern; A second step of forming a rising piece by bending a part of the circuit board together with the conductor pattern so that the electronic component and the external lead terminal mounted and fixed to the inside are inside, A third step of mounting and fixing the bottom surface of the circuit board on a separate cooling body, and arranging a case so as to surround the circuit board including the rising pieces; And a resin sealing part of the electronic components and the external terminals mounted on and fixed to the circuit board by filling the resin.
A method for manufacturing an electronic device, comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1318806A JP2851655B2 (en) | 1989-12-11 | 1989-12-11 | Manufacturing method of electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1318806A JP2851655B2 (en) | 1989-12-11 | 1989-12-11 | Manufacturing method of electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03181198A JPH03181198A (en) | 1991-08-07 |
| JP2851655B2 true JP2851655B2 (en) | 1999-01-27 |
Family
ID=18103150
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1318806A Expired - Fee Related JP2851655B2 (en) | 1989-12-11 | 1989-12-11 | Manufacturing method of electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2851655B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004082612A (en) * | 2002-08-28 | 2004-03-18 | Shimano Inc | Outdoor appearance parts |
-
1989
- 1989-12-11 JP JP1318806A patent/JP2851655B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03181198A (en) | 1991-08-07 |
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