JP2851797B2 - IC card manufacturing mold - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a card base having a recess for burying an IC module. The present invention relates to a mold for manufacturing an IC card formed in the above.

[0002]

2. Description of the Related Art An IC card used for various electronic devices is generally constituted by embedding an IC module in a plastic card base material.
As shown in FIG. 4, an embedding recess 1a for embedding an IC module in the card base 1 is formed. This embedding recess 1a is usually formed in two stages by providing a step portion,
The central portion is formed in the thinnest portion 1b.

In order to form the card substrate, especially the embedding recess, a mold projection is provided at a predetermined position of a mold constituting the entire cavity, and a so-called injection is performed by pouring a molten resin into the cavity and solidifying it. It is made by a molding method.

When an IC card is molded by this type of injection molding method, there is a problem that the molten resin does not easily flow to the back side of the mold projection because the mold projection protrudes into the cavity.

[0005]

SUMMARY OF THE INVENTION To solve the above problem,
A mold for manufacturing an IC card formed in a nested mold separate from the mold that constitutes the entire cavity has been proposed (for example, Japanese Patent Laid-Open No.
Japanese Patent Publication No. 347628/347) has been able to overcome some of the disadvantages of the prior art.

In the mold, as shown in FIG. 5, a cavity 4 is provided between an upper mold 2 and a lower mold 3, and the upper mold 2 has a mold protrusion 5 for forming the embedding recess. To form
The mold protrusion 5 includes a nesting mold 6 separate from the upper mold 2. When the molten resin is injected from the resin pressure inlet 7, air is released from between the upper mold 2 and the nesting mold 6, and a relatively small amount of warpage or the like is obtained as compared with the case where there is no conventional nesting mold. Quality products.

However, since the thinnest portion at the center of the recess for embedding is extremely thin, about 0.2 mm, even if it is a nested mold separate from the upper mold, it still warps and unfills, etc. It was not possible to supply products of stable quality.

Accordingly, the present invention is to improve an IC card manufacturing mold in which a mold projection forming a recess for embedding a card base is provided with a nesting mold separate from the mold for the entire cavity. It is an object of the present invention to eliminate the above disadvantages.

[0009]

According to the present invention, there is provided a card base provided with a recess for embedding an IC module, wherein a mold projection for forming the recess for embedding is provided separately from a mold for forming the entire cavity. In a mold for manufacturing an IC card provided with a nesting mold, a center pin and one or a plurality of cylindrical pins provided outside the pin are arranged in the nesting mold. A die for manufacturing an IC card in which a front end is located at a protruding end surface of the die protruding portion, and a gap between the pins is made to escape by air.

Here, the fact that the tip of each pin is located at the end face of the mold projection means the following. That is,
Since the mold projection is usually formed in a step shape, the tip end surface has a tip end portion and a peripheral end portion located on the upper die side with respect to the tip end portion. In the first claim of the present application,
Both of these end faces are included, and the second claim of the present application means that the tip of each pin is located at the foremost end face.

[0011]

In this case, during the injection molding, the molten resin is released from the space between the nesting mold and the upper mold, and the molten resin flows around the back side of the mold projection. In the present invention, up to this point, according to the present invention, the present invention relates to the first aspect, in which the protruding end face of the nested step portion forming the recess for embedding the IC module of the card base material is formed from the pin gap. Since the air release gap portion is formed, molding can be performed without blowing air into the thinnest portion at the time of molding, and as a result, a product having stable quality without warping, unfilling and the like can be obtained.

According to a second aspect of the present invention, more specifically, the air release gap formed by the gap between the pins is replaced with an air release gap formed by the nested stepped portion forming the thinnest portion. Since it is formed on the protruding end surface, it is possible to solve the problem that the molten resin is unlikely to wrap around the back side of the mold protrusion corresponding to the thinnest portion.

[0013]

An embodiment of the present invention will be described below with reference to the drawings. Note that the same components as those of the prior art shown in FIG. 5 are denoted by the same reference numerals.

1 to 3, the mold of this embodiment has a cavity 4 provided between an upper mold 2 and a lower mold 3, and a mold for forming the embedding recess in the upper mold 2. A protrusion 5 is formed, and the mold protrusion 5 further includes a nesting mold 6 separate from the upper mold 2. Reference numeral 7 denotes a resin pressure inlet.

The nest 6 has a plurality of pins 11, 1.
2 and 13 are arranged, and the lower end of each pin is provided at the same plane position as the lower end surface of the nesting die 6. That is,
The center pin 11 has a diameter of 1 mm in the case of the embodiment, and a cylindrical pin 12 having a diameter of 3 mm is provided outside the pin 11.
However, a cylindrical pin 1 having a diameter of 5 mm is provided outside the pin 12.
3 are provided. Then, each pin 11, 12, 1
The gap 3 is configured as an air release gap.

In the above-described embodiment, at the time of injection molding, a molten resin (not shown) is fed from the resin pressure inlet 7 and injected into the cavity 4, and goes around the mold projection 5 to spread into the cavity 4. At this time, air is released from between the nesting mold 6 and the upper mold 2, and the molten resin is satisfactorily routed to the back side of the mold projection.

In this embodiment, the thinnest portion 1 of the card base 1 is
b, the pin 11, 11
An air escape gap portion formed by gaps 12 and 13 is formed. When formed on the protruding end surface 6a in this manner, molding can be performed without blowing air into the thinnest portion during molding.

However, according to the present invention, the pins 11, 12, 1
The air escape clearance formed by the gap 3
At the tip of the die including the tip, that is, both the tip end, that is, both the tip 6a and the peripheral portion located on the upper die side, or depending on the thickness of the thinnest part of the IC card. It may be formed only in the peripheral portion located on the upper die side from the protruding end surface 6a.

In the above-described embodiment, the pins 11, 12, 13
However, the number of pins and their shapes, modes, etc. may be appropriately selected according to the thickness, area, etc. of the thinnest portion of the card base material, and are limited to those of the present embodiment. Of course it is not.

[0020]

As described above, according to the present invention, the card projection provided with the concave portion for embedding the IC module is provided with the mold projection for forming the concave portion for embedding separately from the mold for forming the entire cavity. A mold for manufacturing an IC card having a nested body is improved, and a center pin and one or a plurality of cylindrical pins provided outside the pins are arranged on the nested mold. Since the gap of the air escape gap portion, during the injection molding, the molten resin is released from the space between the nesting mold and the upper mold, and the molten resin goes around the back side of the mold projection, and further, the pin Due to the air release gap formed by the gap, molding can be performed without blowing air into the thinnest portion during molding. In particular, the air escape gap consisting of the pin gap,
When formed on the end face of the nested step portion forming the thinnest portion, it is possible to solve the problem that the molten resin is hard to flow particularly on the back side of the mold projection corresponding to the thinnest portion.

As described above, according to the present invention, it is possible to obtain a product having stable quality without causing warpage, unfilling and the like.

[Brief description of the drawings]

FIG. 1 is a schematic cross-sectional view of a main part showing a mold for manufacturing an IC card substrate according to an embodiment of the present invention.

FIG. 2 is a view as viewed in the direction of arrows XX in FIG. 1;

FIG. 3 is a partially cutaway perspective view of a nested portion.

FIG. 4 is a perspective view showing an IC card base material.

FIG. 5 is a schematic cross-sectional view of a main part showing a mold for manufacturing an IC card base according to a conventional example.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 IC card 1a recess for embedding 1b thinnest portion 2 upper die 3 lower die 4 cavity 5 mold protrusion 6 nesting 11 pin 12 cylindrical pin 13 cylindrical pin

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁶ Identification symbol FI // B29L 31:34 (56) References JP-A-2-241496 (JP, A) JP-A-6-166064 (JP, A JP-A-7-80923 (JP, A) JP-A-7-40396 (JP, A) JP-A-6-285864 (JP, A) JP-A-6-304972 (JP, A) 75719 (JP, U) Japanese Utility Model Sho 62-80619 (JP, U) (58) Fields investigated (Int. Cl. ⁶ , DB name) B29C 45/26-45/44 B29C 33/00-33/76 B42D 15/10 521 G06K 19/077

Claims (2)

(57) [Claims] 1. An IC in which a card projection having an IC module embedding recess is provided with a nesting mold separate from a mold constituting the whole cavity at a mold projection forming the embedding recess.
In a mold for manufacturing a card, a center pin and one or a plurality of cylindrical pins provided outside the pins are arranged in the nesting mold, and a tip of each pin is the mold. A die for manufacturing an IC card, wherein the die is located at a protruding end surface of the protruding portion, and a gap between the pins is an air release gap. 2. An IC in which a card projection provided with a recess for embedding an IC module is provided with a nesting mold separate from a mold for forming the entire cavity at a projection of the mold forming the recess for embedding.
In a mold for manufacturing a card, a center pin and one or a plurality of cylindrical pins provided outside the pins are arranged in the nesting mold, and a tip of each pin is the mold. A die for manufacturing an IC card, wherein the die is located at the foremost end of the protruding end surface of the protruding portion, and the gap between the pins is an air release gap.