JP2854041B2 - Hybrid integrated circuit device - Google Patents

Description

The present invention relates to a hybrid integrated circuit device, and more particularly, to a structure of a hybrid integrated circuit device having two hybrid integrated circuit boards and a connector.

(B) Conventional technology A conventional hybrid integrated circuit will be described with reference to FIGS. 6 and 7. FIG.

In the hybrid integrated circuit shown in FIG. 6, a conductive path (not shown) having a predetermined shape is formed on the surface of a ceramic substrate or an insulating metal substrate (51), and a plurality of circuit elements (53) are fixed on the conductive path. A metal lead terminal (56) is fixed to a fixing pad (not shown) continuous to a predetermined conductive path to form a hybrid integrated circuit board, and the hybrid integrated circuit board is mounted on a circuit element by a resin case (52). (53) is sealed so as to be sealed, and further filled with resin (59) to reinforce the fixing portion of the lead terminal (56).

With the increase in the density of the hybrid integrated circuit, a hybrid integrated circuit composed of two hybrid integrated circuit boards (61) and (62) as shown in FIG. 7 has been proposed.

In the figure, substrates (61) and (62) are insulating metal substrates in which one surface of a metal such as aluminum is coated with a resin, and a conductive path (not shown) having a predetermined shape is formed on each of the substrates. A plurality of circuit elements (63) and (64) are fixed to the substrate. Further, metallic lead terminals (65) (66) for external connection are fixed to fixing pads (not shown) which are continuous with predetermined conductive paths. Substrate (6) on which a hybrid integrated circuit is formed by fixing circuit elements and lead terminals
1) (62) is fixed to and integrated with the case material (67) such that the circuit elements (63) and (64) face each other. In addition,
In order to match the vertical pitch l of the lead terminals with the standardized pitch between the electrodes of the socket, the lead end is separated from the substrate by a predetermined portion l 'and has a substantially L-shape.

The hybrid integrated circuit is mounted on a main circuit board,
Alternatively, a socket (not shown) is inserted into the lead terminals (65) and (66) to establish connection with an external circuit.

(C) Problems to be Solved by the Invention In the conventional hybrid integrated circuit, prior to the fixing work of the lead terminals, the vertical and horizontal positioning and inclination adjustment of the lead terminals are simultaneously performed to adjust the fixed portions of the lead terminals. It had to be correctly opposed to the conductive path, and the assembly work required a high degree of skill.

In addition, the pitch between the electrodes in the vertical direction of the lead terminal is often not the designed value.

Furthermore, the fixed portion of the lead terminal is easily peeled off by an external force, and special care must be taken when handling the hybrid integrated circuit board immediately after the fixed lead terminal.

Furthermore, even if the fixing portion of the lead terminal is reinforced to some extent, vibration may occur, for example, in a case where the lead terminal is used for a vehicle, and the vibration may cause detachment of the external connector inserted into the lead terminal or separation of the fixed portion of the lead terminal. It was difficult to use it.

Furthermore, since the substrate size of the conventional two-substrate hybrid integrated circuit is not so large, input terminals for connection to external circuits are provided on one side of both substrates. However, as the size of the board increases, the lead terminals are led out from the peripheral edges of the two sides or the four sides of the board. As a result, the misalignment of the lead terminals further occurs, and the mounting operation becomes difficult.

(D) Means for Solving the Problems The present invention has been made in view of the problems described above,
A first insulating substrate on which a conductive path having a desired shape is formed and a plurality of circuit elements are connected on the conductive path, and a second insulating substrate disposed opposite to the first insulating substrate and having a plurality of circuit elements mounted thereon And a third insulating substrate and a case material for integrating the respective substrates, wherein a first connector is disposed between the peripheral ends of the first and second substrates or the first and third substrates. A second connector is mounted at a predetermined position on the first substrate, and a second connector is arranged such that a connection opening thereof is on the second and third substrate surfaces.

(E) Operation According to the present invention, the first connector is disposed in the space formed by the peripheral end portions of the first substrate and the third substrate having a relatively large size. By arranging the second connector on one substrate so that the connection opening is on the upper surface side, the connection of the hybrid integrated circuit composed of a plurality of substrates, that is, three substrates, to the external circuit is made by the first and the second substrates. This can be done only with the second connector.

Further, a structure without lead terminals can be achieved despite a highly integrated hybrid circuit composed of three substrates.

(F) Embodiment An embodiment of the present invention will be described below with reference to the drawings shown in FIGS.

FIG. 1 is a cross-sectional view showing a hybrid integrated circuit device of the present invention, wherein (1a), (1b) and (1c) are first, second and third insulating substrates, and (2) is a respective insulating substrate (1a). ) (1b) Conductive paths formed on (1c), (3) the respective insulating substrates (1a) (1b)
(1c) is a flexible film for connecting, (4) is a first connector connected to a conductive path (2) formed on the flexible film (3), and (40) is a first substrate (1).
a) a second connector mounted thereon, (5) a case material for fixing the respective substrates (1a) (1b) (1c), and (6) a first and third substrate (1a) (1c) (7) and (7a) are the resin injected into the space (6).

As each of the insulating substrates (1a), (1b), and (1c), a glass epoxy resin substrate, a ceramic substrate, a phenol substrate, or a metal substrate subjected to insulation treatment is mainly used. In this embodiment, a metal substrate such as aluminum is used in consideration of heat dissipation and shielding. An alumite film is formed on the surface of the metal substrate, and an insulating process is performed.

The respective substrates (1a) (1b) (1c) are as shown in FIG.
Each is connected and supported by a flexible film (3) so as to be separated by a predetermined distance. The film (3) only needs to have flexibility, and here, a general polyimide film is used.

A conductive path (2) having a desired shape formed of copper foil is formed on substantially the entire surface of the film (3).

Although not apparent from FIG. 2, the distance between the first substrate (1a) and the third substrate (1c) is determined by connecting a first connector (4), which will be described later, to the periphery of each substrate (1a) (1c). A sufficient distance is kept from the necessity of the arrangement between the ends. On the other hand,
The distance between the first substrate (1a) and the second substrate (1b) only needs to be such that the respective substrates (1a) and (1b) can be bent and arranged. That is, the distance between the second substrate (1b) connected to the first substrate (1a) and the third substrate (1c) is designed to be different.

The plurality of conductive paths (2) formed on the film (3) between the first substrate (1a) and the third substrate (1c) are formed to be substantially linear. On a conductive path (2) formed on the film (3), a plurality of through holes (3) to which connection terminals of a first connector (4) described later are connected.
c) is formed. Also, in the area near the film (3) provided with the through hole (3c), the strain generated at the connection terminal fixing portion of the first connector (4) to which the reinforcing film plate (3d) is adhered. It is designed to minimize it.

A plurality of circuit elements are mounted on desired positions of the conductive path (2) formed on each of the substrates (1a) (1b) (1c). First
On the substrate (1a), a circuit element (8) having heat generation such as a power transistor or a memory IC is mainly mounted.
Circuit elements (8) that are connected to the nearby conductive path (2) by wires and that do not generate heat, such as transistors, chip resistors, and chip capacitors, are mainly provided on the second and third substrates (1b) and (1c). Is connected to a nearby conductive path (2) mounted on the device by a wire.

And the other connector on the first substrate (1a),
That is, the second connector (40) is fixed.

Here, the first and second connectors (4) and (40) will be briefly described.

As the first and second connectors (4), as shown in FIGS. 3 and 4, standardized female connectors are generally used. First and second connectors (4) (4
Although not shown, a large number of external connection terminals are arranged in the openings (4a) and (40a) of (0). Lead terminals (4b) and (40b) extending from the external connection terminals are led out of the first and second connectors (4) and (40). The first lead terminal (4b) is connected to the first and third substrates (1
a) Inserted into the through hole (3c) of the flexible film (3) between (1c) and fixedly connected to the conductive path (2) by soldering, and the second lead terminal (40b) is mounted on the first substrate (1a). Is fixedly connected to the conductive path (2).

The respective substrates (1a), (1b) and (1c) are integrated by a case material (5) such that the respective circuit elements (8) face each other.

FIG. 5 is a perspective view showing the case member (5), which is formed in a frame shape and includes a frame body (5a) and two ends in the longitudinal direction of the frame body (5a). The extended plate (5
b) and an auxiliary frame (5) having the same height as the frame (5a).
c) and a connecting body (5d) for connecting the auxiliary frame (5c) and the frame portion (5a), and is formed of an insulating resin material. Peripheral end of case material (5) and respective substrates (1a) (1b) (1c)
Are designed to be substantially equal.

When each of the substrates (1a) (1b) (1c) and the case material (5) are fixed, the first substrate (1a) is on the lower side, and the second and third substrates (1b) (1c) are on the upper side. The film (3) between the substrates is bent and arranged so that the substrate is fixedly integrated with the case material. At this time, the second connector (40) is completely housed and arranged in the auxiliary frame (5c) of the case material (5), and the second and third substrates (1b) (1c ) Are defined on the same plane.

When the respective substrates (1a), (1b) and (1c) are integrated with the case material (5), the extension plate (5b) of the case material (5) and the first, third
A flexible film (3) is bent and arranged in a bellows shape in a space (6) formed at a peripheral end portion of the substrates (1a) and (1c), and a first connector (4) is housed and arranged.

Since the height of the space (6) formed at the peripheral end of the first and third substrates (1a) (1c) and the thickness of the first connector (4) are substantially the same, The protrusion (4c) provided on the first connector (4) and the board (1a) (1
The projections (1a ') and (1b') provided on the peripheral end surface of b) are brought into contact with each other, and the connector (4) is temporarily fixed in the space (6).

The space (6) is filled with an epoxy resin (7), and the first connector (4) is fixed. The injection port for filling the resin (7) in the space (6) is formed by the protrusion (4c) of the connector (4) and the protrusions (1a ') (1b') of the substrates (1a) (1b). A gap (arrow) is injected from a gap at both ends in the longitudinal direction of the first connector (4) although not shown. When the resin (7) is injected, the connector (4) has a projection (4c), a projection (1a ') (1b') and a projection bar (5c).
There is no positional deviation because the position is regulated by.

On the other hand, the space between the second connector (40) and the auxiliary frame (5c) of the case material (5) is also filled with the epoxy resin (7a), and the second connector (40) is firmly fixed.

The bent portions of the first substrate (1a) and the second substrate (1b) are completely covered by the lid (10).

According to the present invention, the first connector (4) is inserted into the space (6) formed by the peripheral portion of the first board (1a) and the third board (1c) having a relatively large size. ), And the second connector (40) is arranged on the first substrate (1a) such that the connection opening is on the upper surface side.
That is, the connection of the hybrid integrated circuit consisting of three substrates to the external circuit can be made only by the first and second connectors (4) and (40), so that the connection with the external circuit can be made extremely easily. .

(G) Effects of the Invention As described in detail above, according to the present invention, the connection structure of a relatively large-scale hybrid integrated circuit device including a plurality of substrates can be formed only by connectors, so that connection can be performed very easily.

Further, since the first and second connectors are firmly fixed by the resin, it is possible to provide a hybrid integrated circuit device integrated with a connector, which is extremely excellent in strength against external stress such as vibration.

In addition, since each connector used in the present invention can use a standardized connector, the cost does not increase.

Further, in the present invention, since the first connector is attached via the flexible film, the first connector is not affected by the heat generated by the first substrate at all.

Further, in the present invention, a large current can be passed since the copper foil is used for the conductive path formed on the flexible material.

Further, in the present invention, since each connector uses a standardized connector, there is an advantage that the design can be easily changed even if the substrate size is changed or the connector itself is changed.

[Brief description of the drawings]

1 is a cross-sectional view showing the present invention, FIGS. 2A and 2B are cross-sectional views and a plan view showing a flexible film and a substrate used in the present embodiment, and FIGS. 3 and 4 are perspective views showing connectors. FIG. 5 is a perspective view showing a case material, and FIGS. 6 and 7 are sectional views showing a conventional example. (1a) (1b) (1c) ... substrate, (2) ... conductive path,
(3) ... flexible film, (4) ... first connector, (40) ... second connector, (5) ... case material, (6) ... space, (7) ... resin .

 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References Japanese Utility Model Sho 63-65246 (JP, U) Japanese Utility Model Sho 61-171280 (JP, U) Japanese Utility Model Hei 1-89488 (JP, U)

Claims (3)

(57) [Claims] A first insulating substrate on which a conductive path having a desired shape is formed and a plurality of circuit elements are connected on the conductive path; and a plurality of circuits on which a conductive path having a desired shape is respectively formed and on the conductive path. A second insulating substrate and a third insulating substrate to which elements are respectively connected, and a mounting surface of the second insulating substrate and a mounting surface of the third insulating substrate with respect to a mounting surface of the first insulating substrate. A case material that is disposed to face and integrates the three insulating substrates; a conductive path of the first insulating substrate, a conductive path of the second insulating substrate, and a conductive path of the third insulating substrate are disposed; The first
An insulating substrate, a flexible film connecting the second insulating substrate and the third insulating substrate, and between the first insulating substrate and the second insulating substrate or between the first insulating substrate and the third insulating substrate. A flexible film positioned between insulating substrates, a first connector electrically connected to conductive means disposed thereon, and peripheral ends of the two insulating substrates disposed opposite to each other and inside thereof A space in which the flexible material and the first connector are housed in a space consisting of: a terminal led out from the first connector is inserted into a through hole provided in a conductive means of the flexible material; The hybrid integrated circuit device is electrically connected, and the connected flexible member is provided with a reinforcing means. 2. The hybrid integrated circuit device according to claim 1, wherein said flexible material is accommodated by being bent in said space. 3. The hybrid integrated circuit device according to claim 1, wherein said space is filled with a resin.