JP2854782B2 - Electronic component fixing method, circuit board manufacturing method, and circuit board - Google Patents
Electronic component fixing method, circuit board manufacturing method, and circuit boardInfo
- Publication number
- JP2854782B2 JP2854782B2 JP5110479A JP11047993A JP2854782B2 JP 2854782 B2 JP2854782 B2 JP 2854782B2 JP 5110479 A JP5110479 A JP 5110479A JP 11047993 A JP11047993 A JP 11047993A JP 2854782 B2 JP2854782 B2 JP 2854782B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- substrate
- solder material
- circuit board
- connection pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
Landscapes
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、リード部品や面実装部
品等を電子回路基板にフラックスを用いないではんだ付
けすることのできる電子部品の固定方法、そのような固
定方法を用いた回路基板の製造方法及び回路基板に関す
る。The present invention relates to a method of fixing an electronic component which can be soldered without using a flux lead component and surface mount components such as an electronic circuit board, such solid
The present invention relates to a method for manufacturing a circuit board using a fixing method and a circuit board .
【０００２】[0002]
【従来の技術】電子部品を、電子回路基板にはんだ付け
を行う場合、はんだ付けの前工程で電子部品の搬送等の
ショックによる位置ずれ、移動、落下等を防ぐために、
一時的に、仮に電子回路基板に固定することが必要であ
る。従来、このような目的に用いる固定方法として、
（１）フラックスの粘性を利用する方法、（２）エポキ
シ樹脂のような熱硬化性樹脂を用いる方法、（３）紫外
線硬化型のアクリル系樹脂を用いる方法、等が知られて
いる。なお、この種の従来技術に関連するものとして、
特開平１−１５０４９３号公報等が挙げられる。2. Description of the Related Art When an electronic component is soldered to an electronic circuit board, in order to prevent a displacement, a movement, a drop, etc. due to a shock such as a transport of the electronic component in a pre-soldering process,
It is necessary to temporarily fix it to an electronic circuit board temporarily. Conventionally, as a fixing method used for such a purpose,
There are known (1) a method using the viscosity of flux, (2) a method using a thermosetting resin such as an epoxy resin, and (3) a method using an ultraviolet curable acrylic resin. As related to this kind of conventional technology,
JP-A-1-150493 is an example.
【０００３】[0003]
【発明が解決しようとする課題】上記従来技術は、それ
ぞれ次のような問題があった。すなわち、上記（１）に
記載のフラックスの粘性を利用する方法は、はんだ材や
被接合面がフラックスに覆われているため、リフロー中
に酸化を防止する等の利点はあるが、フラックスの付着
による搬送系のトラブルがあり、また、はんだ付け後の
フラックス残渣による腐食防止のために、有機溶剤によ
る洗浄が必要である等の問題があった。有機溶剤による
洗浄については、今後環境保全の立場から有機溶剤の使
用が困難になること、はんだ付け部の微細化、高密度化
により信頼性確保のために洗浄が困難になること等から
より大きな問題となる可能性がある。The above prior arts have the following problems. That is, the method using the viscosity of the flux described in the above (1) has the advantage of preventing oxidation during reflow since the solder material and the surface to be joined are covered with the flux, but the flux adheres. In addition, there is a problem such as a need for cleaning with an organic solvent in order to prevent corrosion due to a flux residue after soldering. The use of organic solvents for cleaning is more difficult because of the difficulty of using organic solvents from the standpoint of environmental protection and the difficulty of cleaning to secure reliability due to the miniaturization and high density of soldered parts. Can be a problem.
【０００４】上記（２）、（３）に記載の各種の樹脂を
用いる方法は、接着剤が電子部品と電子回路基板間に残
ることから、はんだ付け部への応力が発生するという問
題があった。また、フリップチップのような部品のはん
だ付けを行う場合等では、被接合面にこれらの接着剤を
塗布しなければならないため、はんだ付け不良が発生す
る等の問題があった。The method using the various resins described in the above (2) and (3) has a problem that the adhesive is left between the electronic component and the electronic circuit board, so that a stress is generated in the soldered portion. Was. Further, when soldering a component such as a flip chip or the like, it is necessary to apply these adhesives to the surface to be joined.
【０００５】本発明の第１の目的は、フラックスを用い
ないではんだ付けを行う方法で、充分な部品の固定力
（粘着力）を有し、はんだ付け後に洗浄工程を必要とし
ない電子部品の固定方法を提供することにある。本発明
の第２の目的は、そのような固定方法を用いた回路基板
の製造方法を提供することにある。本発明の第３の目的
は、接続信頼性に優れた回路基板を提供することにあ
る。 A first object of the present invention is to provide a method for soldering without using a flux, which has a sufficient component fixing force (adhesive force) and does not require a cleaning step after soldering. It is to provide a fixing method. The present invention
A second object of the present invention is to provide a circuit board using such a fixing method.
It is to provide a manufacturing method of. Third object of the present invention
Is to provide a circuit board with excellent connection reliability.
You.
【０００６】上記第１の目的を達成するために、本発明
の電子部品の固定方法は、少なくとも一方にはんだ材が
付与された電子部品と基板を、はんだ材の融点以下の沸
点を持つ物質で仮固定し、基板と電子部品をはんだ材の
融点以上に加熱してはんだ付けするようしたものであ
る。また、上記第１の目的を達成するために、本発明の
電子部品の固定方法は、少なくとも一方にはんだ材が付
与された電子部品と基板を、はんだ付け時の加熱により
蒸発する物質を用いて基板と電子部品を仮固定し、基板
と電子部品を加熱することにより、はんだ付けをするよ
うにしたものである。また、上記第２の目的を達成する
ために、本発明の回路基板の製造方法は、予めはんだ材
が付与された電子部品を、はんだ付け時の加熱により蒸
発する物質が供給された基板の接続パターン上に載置
し、基板と電子部品を加熱することにより、電子部品と
接続パターンを接続するようにしたものである。この加
熱は、第１の温度でプリヒートし、さらに第１の温度よ
りも高い第２の温度ではんだ材を加熱溶融するように
し、上記の物質をはんだ材の融点以下、かつ、第１の温
度以上の沸点を有する物質とすることが好ましい。ま
た、上記第２の目的を達成するために、本発明の回路基
板の製造方法は、予めはんだ材が付与された電子部品
を、はんだ付け時の加熱により蒸発する物質が供給され
た基板の接続パターン上に載置し、基板と電子部品を加
熱して、はんだ材を溶融させると共に上記物質を蒸発さ
せ、電子部品と接続パターンを接続することにより、上
記物質の残渣の洗浄工程を省略するようにしたものであ
る。また、上記第３の目的を達成するために、本発明の
回路基板は、予めはんだ材が付与された電子部品が、回
路基板の接続パターンに、はんだ付け時の加熱により蒸
発する物質を介して仮固定された状態で加熱されること
により、電子部品と接続パターンが接続されてなるもの
である。 In order to achieve the first object, a method of fixing an electronic component according to the present invention is to provide a method of fixing an electronic component and a substrate, at least one of which is provided with a solder material, by using a substance having a boiling point equal to or lower than the melting point of the solder material. It is temporarily fixed, and the substrate and the electronic component are heated above the melting point of the solder material and soldered. Further, in order to achieve the first object, the present invention
When fixing electronic components, at least one of them is soldered.
The applied electronic components and substrate are heated by soldering.
The board and electronic components are temporarily fixed using a substance that evaporates,
And soldering by heating the electronic components.
It is something that has been done. Also, the second object is achieved.
Therefore, the method for manufacturing a circuit board
The electronic components with
Placed on the connection pattern of the substrate to which the emitted substance is supplied
By heating the board and the electronic components,
The connection patterns are connected. This addition
The heat is preheated at a first temperature, and
To melt the solder material at the second temperature
Then, the above-mentioned substance is set at a temperature lower than the melting point of the solder material and at the first temperature.
It is preferable to use a substance having a boiling point of at least degree. Ma
In order to achieve the second object, a circuit board according to the present invention is provided.
The manufacturing method of the board is an electronic component to which a solder material has been applied in advance.
Is supplied with a substance that evaporates due to heating during soldering.
On the connection pattern of the board, and add the board and electronic components.
Heat to melt the solder material and evaporate the above substances.
By connecting the electronic components and the connection pattern.
The cleaning step for the residue of the substance is omitted.
You. In order to achieve the third object, the present invention
The circuit board is used for electronic components to which solder material has been applied in advance.
To the connection pattern of the circuit board by heating during soldering.
Heating in a state of temporary fixation through the evolving substance
By connecting electronic components and connection patterns
It is.
【０００７】上記物質は、常温で液体であることが好ま
しい。そして、リフロー前は搭載した電子部品の振動に
耐え得る粘度を持つことが好ましい。例えば、粘度とし
て、２０℃で１０ポアズ以上あることが好ましい。ま
た、その沸点は、プリヒートの温度以上であることが好
ましく、１５０℃以上、はんだ材の融点以下であること
がより好ましい。また、この物質は、はんだ材を覆うこ
とのできる量を用いることが好ましい。これにより、は
んだ材の酸化を防ぐことができる。さらにまた、この液
体は、毒性がないか又は極めて小さいか、かつ分解して
も毒性がないか又は極めて小さいものが好ましい。この
ような液体として、エチレングリコールやトリメチレン
グリコール等が挙げられる。The above substance is preferably liquid at room temperature. Before reflow, it is preferable to have a viscosity that can withstand the vibration of the mounted electronic component. For example, the viscosity is preferably 10 poise or more at 20 ° C. Further, the boiling point is preferably not lower than the preheating temperature, more preferably not lower than 150 ° C. and not higher than the melting point of the solder material. It is preferable to use this substance in an amount that can cover the solder material. Thereby, oxidation of the solder material can be prevented. Furthermore, it is preferred that the liquid is non-toxic or very low and that it is non-toxic or very low when decomposed. Examples of such a liquid include ethylene glycol and trimethylene glycol.
【０００８】[0008]
【作用】電子部品を搭載したときに、液体の表面張力及
び粘性が部品をずらさないように保持する働きをし、は
んだ材と被接合面を完全に覆うことで、はんだ付け部を
保護し、はんだ材が溶融するまでその効力を維持する。
さらに、溶融直前に液体は蒸発するため、リフロー後に
は残渣がない。[Function] When electronic components are mounted, the surface tension and viscosity of the liquid work to keep the components from shifting, and by completely covering the solder material and the surface to be joined, the soldering part is protected. Maintains its effectiveness until the solder material melts.
Further, since the liquid evaporates immediately before melting, there is no residue after reflow.
【０００９】[0009]
【実施例】以下、本発明を図面を用いて詳細に説明す
る。図１は、本発明の電子部品の固定方法の一実施例を
説明するための電子部品を搭載したセラミック基板の部
分断面図、図２は、本発明を説明するための工程図であ
る。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the drawings. FIG. 1 is a partial cross-sectional view of a ceramic substrate on which an electronic component is mounted for explaining one embodiment of a method for fixing an electronic component according to the present invention, and FIG. 2 is a process diagram for explaining the present invention.
【００１０】本実施例の固定方法は、図１に示すよう
に、接続パターン２が設けられたセラミック基板１の上
に、予めはんだ材３が供給されたＬＳＩ等の複数の電子
部品５を液体４により保持して行うものである。このよ
うな方法でのはんだ付け時の固定方法は、従来はフラッ
クス等を液体４の代わりに用いる方法が広く一般に行わ
れている。本実施例は、表１に示すエチレングリコー
ル、トリメチレングリコール等を液体４として用いる方
法であり、以下図２によりその方法を説明する。As shown in FIG. 1, a fixing method according to the present embodiment is a method in which a plurality of electronic components 5 such as LSIs to which a solder material 3 is supplied in advance are placed on a ceramic substrate 1 provided with a connection pattern 2. 4 is performed. Conventionally, as a fixing method at the time of soldering by such a method, a method of using a flux or the like instead of the liquid 4 is widely and generally performed. The present embodiment is a method using ethylene glycol, trimethylene glycol or the like shown in Table 1 as the liquid 4. The method will be described below with reference to FIG.
【００１１】[0011]
【表１】 [Table 1]
【００１２】図２（ａ）に示すように、セラミック基板
１上に、ディスペンサーにより液体４の予めコントロー
ルされた量を供給する。この供給量は、はんだ材３と接
続パターン２を完全に覆い、なおかつ後の工程で、液体
４の表面張力等で電子部品５を持ち上げない量にコント
ロールする。As shown in FIG. 2A, a pre-controlled amount of the liquid 4 is supplied onto the ceramic substrate 1 by a dispenser. The supply amount is controlled so as to completely cover the solder material 3 and the connection pattern 2 and not to lift the electronic component 5 due to the surface tension of the liquid 4 in a later step.
【００１３】次に、図２（ｂ）に示すように、予めはん
だ材３が供給されたＬＳＩ等の複数の電子部品５を、液
体４が塗布されたセラミック基板１上の接続パターン２
に位置合わせを行い搭載する。その際、液体４は接続パ
ターン２とはんだ材３を完全に覆い大気と遮断する。そ
の後、フラックスを用いる場合と同様にリフローはんだ
付け（例えばＮ2雰囲気を用いたガスリフロー等）を行
う。電子部品５を搭載したセラミック基板１は、リフロ
ー炉内で１２０℃程度にプリヒートされ、搬送される。
この間は、はんだ材３は液体４に覆われており、はんだ
材３の酸化等を防止している。液体４は、はんだ材３の
溶融直前に蒸発を開始し、はんだ材３と接続パターン２
が接合を始める。このとき、はんだ材３と接続パターン
２は位置合わせのとき多少ずれていても、本来はんだ材
３と接続パターン２が接合するときに働くセルフアライ
メント効果を助長する形で、液体４が電子部品５に対し
て浮力としてうまく働く。Next, as shown in FIG. 2B, a plurality of electronic components 5 such as LSIs to which a solder material 3 has been supplied in advance are connected to a connection pattern 2 on a ceramic substrate 1 on which a liquid 4 is applied.
Align and mount. At this time, the liquid 4 completely covers the connection pattern 2 and the solder material 3 and shuts off the atmosphere. After that, reflow soldering (for example, gas reflow using an N 2 atmosphere) is performed in the same manner as when using a flux. The ceramic substrate 1 on which the electronic components 5 are mounted is preheated to about 120 ° C. in a reflow furnace and transported.
During this time, the solder material 3 is covered with the liquid 4 to prevent the solder material 3 from being oxidized. The liquid 4 starts to evaporate just before the melting of the solder material 3 and the solder material 3 and the connection pattern 2
Begins joining. At this time, even if the solder material 3 and the connection pattern 2 are slightly displaced at the time of alignment, the liquid 4 is used to promote the self-alignment effect that originally works when the solder material 3 and the connection pattern 2 are joined. Works well as buoyancy against
【００１４】リフロー後は図２（ｃ）に示すように、液
体４の残渣はなく、液体４を除去するための洗浄工程は
必要としない。また、はんだ付け部の接合性は液体４に
なんら阻害されておらず、所定の接続パターン２に確実
にはんだ付けすることができる。液体４として、表１記
載のエチレングリコール、トリメチレングリコールのい
ずれを用いても確実にはんだ付けができた。After the reflow, as shown in FIG. 2C, there is no residue of the liquid 4, and no cleaning step for removing the liquid 4 is required. Further, the joining property of the soldering portion is not hindered by the liquid 4 at all, and the soldering can be reliably performed on the predetermined connection pattern 2. Regardless of the liquid 4 used, any of ethylene glycol and trimethylene glycol shown in Table 1 could be reliably soldered.
【００１５】本実施例は、フラックスを用いないはんだ
付けであり、液体４はフラックスのようにはんだ材３や
接続パターン２の酸化膜等を除去する作用はないので、
予め何らかの方法でこれらの表面を清浄化してある。ま
た、本実施例で説明した液体４は、毒性、はんだ付け性
等に関し予め選定したものを使用している。さらに、前
述した作用を持つ液体であれば、実施例で述べてきたよ
うな液体である必要はなく、常温では固体等でもよい。
また、はんだ材３は電子部品５に付与されている例を述
べたが、セラミック基板１の接続パターン２に付与され
ているときも、両者に付与されているときも同様に処理
できる。In this embodiment, the soldering is performed without using a flux, and the liquid 4 does not have the function of removing the solder material 3 and the oxide film of the connection pattern 2 unlike the flux.
These surfaces have been previously cleaned in some way. Further, the liquid 4 described in the present embodiment uses a liquid selected in advance with respect to toxicity, solderability, and the like. Further, as long as the liquid has the above-described function, the liquid does not need to be the liquid described in the embodiment, and may be a solid at room temperature.
Although the example in which the solder material 3 is applied to the electronic component 5 has been described, the same processing can be performed when the solder material 3 is applied to the connection pattern 2 of the ceramic substrate 1 and when both are applied.
【００１６】[0016]
【発明の効果】以上説明したように、本発明によれば、
フラックスを用いないで、ＬＳＩ等電子部品をはんだ付
けする際の固定に、使用するはんだ材の融点以下の沸点
と粘性を持つ物質を使用することで、はんだ付けの前工
程における搬送等のショックによる位置ずれ、移動、落
下等を防止し、電子部品等を確実に接続パターンに保
持、固定することができた。また、電子部品を電子回路
基板に搭載後のリフロー工程で、はんだ材が溶融する直
前に固定用に塗布した物質は蒸発し、リフロー後の洗浄
工程を省略できるほか、接着剤のように接合面に残るこ
ともないから、はんだ付け不良や、接合面への応力発生
による接続信頼性の問題等は発生しない。さらに、はん
だ付け工程が簡単になることから低コスト化につなが
る。As described above, according to the present invention,
By using a substance with a boiling point and viscosity lower than the melting point of the solder material to be used for soldering electronic components such as LSIs without using flux, shocks such as transport in the pre-soldering process may be caused. It was possible to prevent displacement, movement, drop, etc., and to securely hold and fix electronic components and the like to the connection pattern. In addition, in the reflow process after mounting the electronic components on the electronic circuit board, the substance applied for fixing immediately before the solder material is melted evaporates, and the cleaning process after the reflow can be omitted. Therefore, no problems such as poor soldering and connection reliability due to generation of stress on the joint surface do not occur. Further, the soldering process is simplified, which leads to cost reduction.
【図面の簡単な説明】[Brief description of the drawings]
【図１】本発明の電子部品の固定方法の一実施例を説明
するための電子部品を搭載したセラミック基板の部分断
面図。FIG. 1 is a partial cross-sectional view of a ceramic substrate on which an electronic component is mounted for describing an embodiment of a method for fixing an electronic component according to the present invention.
【図２】本発明の電子部品の固定方法の一実施例を説明
するための工程図。FIG. 2 is a process diagram for explaining an embodiment of a method for fixing an electronic component according to the present invention.
１……セラミック基板 ２……接続パターン ３……はんだ材 ４……液体 ５……電子部品 DESCRIPTION OF SYMBOLS 1 ... Ceramic substrate 2 ... Connection pattern 3 ... Solder material 4 ... Liquid 5 ... Electronic components
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平１−236636（ＪＰ，Ａ) 特開 平１−102994（ＪＰ，Ａ) 特開 平１−102995（ＪＰ，Ａ) (58)調査した分野(Int.Cl.6，ＤＢ名) H05K 3/34 C07C 31/20 C07C 31/22────────────────────────────────────────────────── ─── Continuation of front page (56) References JP-A-1-236636 (JP, A) JP-A-1-102994 (JP, A) JP-A-1-102995 (JP, A) (58) Field (Int.Cl. 6 , DB name) H05K 3/34 C07C 31/20 C07C 31/22
Claims (8)
子部品と基板をはんだ付けする電子部品の固定方法にお
いて、上記はんだ材の融点以下の沸点を有する物質で、
上記基板と上記電子部品を仮固定させ、上記基板と上記
電子部品を上記はんだ材の融点以上に加熱してはんだ付
けをすることを特徴とする電子部品の固定方法。1. A method of fixing an electronic component to which an electronic component having a solder material applied to at least one side and a substrate is soldered, comprising: a substance having a boiling point equal to or lower than a melting point of the solder material.
It was provisionally fixing the substrate and the electronic component, the method of fixing an electronic component, characterized by soldering the substrate and the <br/> electronic part is heated above the melting point of the solder material.
子部品と基板をはんだ付けする電子部品の固定方法にお
いて、はんだ付け時の加熱により蒸発する物質を用い
て、上記基板と上記電子部品を仮固定させ、上記基板と
上記電子部品を加熱することにより、はんだ付けをする
ことを特徴とする電子部品の固定方法。2. An electrode having a solder material applied to at least one of the electrodes.
The method of fixing electronic components to be used for soldering child components and substrates
Use a substance that evaporates due to heating during soldering.
Then, the substrate and the electronic component are temporarily fixed, and the substrate is
A method for fixing an electronic component , comprising soldering by heating the electronic component.
において、上記物質は、常温で液体であることを特徴と
する電子部品の固定方法。3. The method for fixing an electronic component according to claim 1, wherein the substance is a liquid at normal temperature.
子部品と基板をはんだ付けする電子部品の固定方法にお
いて、エチレングリコール又はトリメチレングリコール
を含む液体で上記基板と上記電子部品を仮固定させ、上
記基板と上記電子部品を上記はんだ材の融点以上に加熱
してはんだ付けをすることを特徴とする電子部品の固定
方法。4. An electrode provided with a solder material on at least one side.
The method of fixing electronic components to be used for soldering child components and substrates
And ethylene glycol or trimethylene glycol
Temporarily fix the substrate and the electronic component with a liquid containing
Heat the substrate and the electronic components above the melting point of the solder material
A method for fixing an electronic component, characterized by performing soldering .
を接続することにより回路基板を製造する方法におい
て、はんだ付け時の加熱により蒸発する物質を上記基板
に供給し、予めはんだ材が付与された上記電子部品を上
記物質が供給された上記接続パターン上に載置し、上記
基板と上記電子部品を加熱することにより、上記電子部
品と上記接続パターンを接続することを特徴とする回路
基板の製造方法。 5. A substrate and an electronic component on which a connection pattern is formed.
Method of manufacturing a circuit board by connecting
The material that evaporates due to heating during soldering
And the electronic component, which has been soldered in advance, is
Place on the connection pattern supplied with the substance,
By heating the substrate and the electronic component, the electronic part
Circuit for connecting a product to the connection pattern
Substrate manufacturing method.
て、上記加熱は、第１の温度でプリヒートする工程と、
該第１の温度よりも高い第２の温度で上記はんだ材を加
熱溶 融する工程とを行うものであって、上記物質は、上
記はんだ材の融点以下、かつ、上記第１の温度以上の沸
点を有する物質であることを特徴とする回路基板の製造
方法。 6. The method for manufacturing a circuit board according to claim 5, wherein
Wherein the heating is a step of preheating at a first temperature;
The solder material is applied at a second temperature higher than the first temperature.
A performs the step of Netsu溶 fusion, the material is above
Boiling point below the melting point of the solder material and above the first temperature
Manufacture of a circuit board characterized by being a substance having a point
Method.
を接続することにより回路基板を製造する方法におい
て、はんだ付け時の加熱により蒸発する物質を上記基板
に供給し、予めはんだ材が付与された上記電子部品を上
記物質が供給された上記接続パターン上に載置し、上記
基板と上記電子部品を加熱して、上記はんだ材を溶融さ
せると共に上記物質を蒸発させ、上記電子部品と上記接
続パターンを接続することにより、上記物質の残渣の洗
浄工程を省略することを特徴とする回路基板の製造方
法。 7. A substrate on which a connection pattern is formed and an electronic component.
Method of manufacturing a circuit board by connecting
The material that evaporates due to heating during soldering
And the electronic component, which has been soldered in advance, is
Place on the connection pattern supplied with the substance,
Heat the board and the electronic components to melt the solder material.
And evaporates the substance, and makes contact with the electronic component.
By connecting the connection pattern, the residue of the above substances can be washed.
Circuit board manufacturing method characterized by omitting the purification process
Law.
る回路基板において、はんだ付け時の加熱により蒸発す
る物質が上記基板に供給され、予めはんだ材が付与され
た上記電子部品が上記物質を介して上記接続パターン上
に仮固定された状態で加熱されることにより、上記電子
部品と上記接続パターンが接続されてなることを特徴と
する回路基板。 8. It has an electronic component connected to the connection pattern.
Evaporating due to heating during soldering
Material is supplied to the substrate, and a solder material is applied in advance.
The electronic component is placed on the connection pattern via the substance.
By heating in a state temporarily fixed to the
Characterized in that the parts and the connection pattern are connected
Circuit board.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5110479A JP2854782B2 (en) | 1993-05-12 | 1993-05-12 | Electronic component fixing method, circuit board manufacturing method, and circuit board |
| JP23383998A JP3525752B2 (en) | 1993-05-12 | 1998-08-20 | Component soldering method and circuit board manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5110479A JP2854782B2 (en) | 1993-05-12 | 1993-05-12 | Electronic component fixing method, circuit board manufacturing method, and circuit board |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23383998A Division JP3525752B2 (en) | 1993-05-12 | 1998-08-20 | Component soldering method and circuit board manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06326449A JPH06326449A (en) | 1994-11-25 |
| JP2854782B2 true JP2854782B2 (en) | 1999-02-03 |
Family
ID=14536763
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5110479A Expired - Fee Related JP2854782B2 (en) | 1993-05-12 | 1993-05-12 | Electronic component fixing method, circuit board manufacturing method, and circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2854782B2 (en) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3294460B2 (en) * | 1995-03-06 | 2002-06-24 | 株式会社日立製作所 | Circuit board manufacturing method |
| JP3120695B2 (en) * | 1995-05-19 | 2000-12-25 | 株式会社日立製作所 | Electronic circuit manufacturing method |
| JPH09232742A (en) * | 1996-02-28 | 1997-09-05 | Hitachi Ltd | Manufacturing method of electronic circuit device |
| JP3385925B2 (en) * | 1997-08-05 | 2003-03-10 | 株式会社日立製作所 | Electronic circuit manufacturing method |
| JP3732639B2 (en) * | 1998-01-08 | 2006-01-05 | 株式会社日立製作所 | Soldering method and electronic device manufacturing method |
| JP4505783B2 (en) * | 2003-01-31 | 2010-07-21 | 日立金属株式会社 | Solder bump manufacturing method and manufacturing apparatus |
| JP5807221B2 (en) * | 2010-06-28 | 2015-11-10 | アユミ工業株式会社 | Bonded structure manufacturing method, heat-melt treatment method, and system thereof |
| CN103765566B (en) * | 2011-11-24 | 2016-10-19 | 松下知识产权经营株式会社 | Flip Chip Bonding Device |
| JP6213946B2 (en) * | 2013-03-29 | 2017-10-18 | 国立研究開発法人産業技術総合研究所 | Circuit board bonding method and semiconductor module manufacturing method |
| JP6786781B2 (en) * | 2015-09-25 | 2020-11-18 | 日亜化学工業株式会社 | Manufacturing method of light emitting device |
| SG11201909928PA (en) * | 2017-05-05 | 2019-11-28 | Pink Gmbh Thermosysteme | Soldering device and a method for producing a solder connection of components using adhesive material for temporary connection of the components |
| CN111615745A (en) * | 2018-02-23 | 2020-09-01 | 富士胶片株式会社 | Manufacturing method of joined body, temporary fixing member, and laminated body |
| JP7007607B2 (en) * | 2020-04-16 | 2022-01-24 | 日亜化学工業株式会社 | Manufacturing method of light emitting device |
-
1993
- 1993-05-12 JP JP5110479A patent/JP2854782B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06326449A (en) | 1994-11-25 |
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