JP2857569B2 - Cleaning device and cleaning method - Google Patents
Cleaning device and cleaning methodInfo
- Publication number
- JP2857569B2 JP2857569B2 JP15465393A JP15465393A JP2857569B2 JP 2857569 B2 JP2857569 B2 JP 2857569B2 JP 15465393 A JP15465393 A JP 15465393A JP 15465393 A JP15465393 A JP 15465393A JP 2857569 B2 JP2857569 B2 JP 2857569B2
- Authority
- JP
- Japan
- Prior art keywords
- fluid
- cleaning
- nozzle member
- nozzle
- passage space
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004140 cleaning Methods 0.000 title claims description 57
- 238000000034 method Methods 0.000 title description 17
- 239000012530 fluid Substances 0.000 claims description 52
- 239000012809 cooling fluid Substances 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000007664 blowing Methods 0.000 claims description 2
- 238000007599 discharging Methods 0.000 claims 1
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 66
- 229910052786 argon Inorganic materials 0.000 description 33
- 239000007789 gas Substances 0.000 description 16
- 239000010419 fine particle Substances 0.000 description 15
- 239000002245 particle Substances 0.000 description 12
- 239000007787 solid Substances 0.000 description 12
- 238000001816 cooling Methods 0.000 description 9
- 239000000126 substance Substances 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 5
- 235000012431 wafers Nutrition 0.000 description 5
- 238000005507 spraying Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 3
- 230000006378 damage Effects 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 235000011089 carbon dioxide Nutrition 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000011086 high cleaning Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Landscapes
- Cleaning In General (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、洗浄技術に関し、特に
高清浄度を要する被洗浄物表面を固化アルゴン粒子等の
微小固体粒子で洗浄する洗浄技術に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cleaning technique, and more particularly to a cleaning technique for cleaning the surface of an object requiring high cleanliness with fine solid particles such as solidified argon particles.
【０００２】[0002]
【従来の技術】ＬＳＩ製造工程における半導体ウエハ表
面上の微粒子や汚れは、最終製品の歩留りを大きく低下
させる。このため、半導体ウエハの表面洗浄が極めて重
要である。表面洗浄の重要性は、半導体ウエハに限ら
ず、液晶表示装置（ＬＣＤ）基板や印刷回路基板（ＰＣ
Ｂ）等、種々の精密機械において同様に依存する。な
お、洗浄に伴って環境破壊を生じさせないことも重要で
ある。2. Description of the Related Art Fine particles and dirt on the surface of a semiconductor wafer in an LSI manufacturing process greatly reduce the yield of a final product. Therefore, cleaning the surface of the semiconductor wafer is extremely important. The importance of surface cleaning is not limited to semiconductor wafers, but also includes liquid crystal display (LCD) substrates and printed circuit boards (PCs).
B) and the like also depend on various precision machines. It is also important not to cause environmental destruction with cleaning.
【０００３】従来より種々の表面洗浄方法が提案されて
いる。半導体ウエハの表面洗浄に用いられる表面洗浄方
法を例にとって以下に概略的に説明する。化学洗浄または溶剤洗浄 表面の汚れを化学反応もしくは溶解によって除去する方
法である。水、酸、有機溶媒、フレオン等が溶媒として
用いられるが、除去すべき汚れに対して有効な薬剤を選
択する必要がある。Conventionally, various surface cleaning methods have been proposed. This will be schematically described below by taking a surface cleaning method used for cleaning the surface of a semiconductor wafer as an example. This is a method of removing dirt on the surface of chemical cleaning or solvent cleaning by chemical reaction or dissolution. Water, acids, organic solvents, freon, etc. are used as solvents, but it is necessary to select an effective agent for the stain to be removed.
【０００４】超音波洗浄と組み合わせることにより、化
学的洗浄に物理的洗浄を組み合わせ、洗浄力を増大させ
ることもできる。洗浄後の表面に汚れを残さないために
は、高純度の薬剤を使用する必要がある。In combination with ultrasonic cleaning, chemical cleaning can be combined with physical cleaning to increase the cleaning power. In order not to leave stains on the surface after cleaning, it is necessary to use a high-purity chemical.
【０００５】水は、高純度が得やすく、大量に使用する
こともできるが、表面に水が残ると気体中から種々の物
質が溶け込み、ウォータマーク等のその後の汚染原因と
なる。また、水によって溶解することのできる汚れの種
類は限られている。[0005] Water can easily be obtained in high purity and can be used in a large amount. However, if water remains on the surface, various substances dissolve from the gas and cause subsequent contamination such as watermarks. Also, the types of dirt that can be dissolved by water are limited.
【０００６】その他の有用な溶剤は、使用後廃棄すると
環境破壊を生じさせるものが多い。環境破壊を防止する
ため、循環使用する場合は、循環液の再精製が困難であ
り、高価なものとなる。また、同一薬剤を用いて洗浄を
繰り返し、薬剤中に汚染物が累積すると、洗浄表面にこ
の汚染物が再付着することとなり、製品不良を起こして
しまうこともある。[0006] Many other useful solvents cause environmental destruction when disposed after use. When used in circulation to prevent environmental destruction, it is difficult to re-purify the circulating liquid, which is expensive. Further, if cleaning is repeated using the same chemical and contaminants accumulate in the chemical, the contaminants re-adhere to the cleaning surface, which may cause a product defect.
【０００７】氷微粒子吹き付け 氷の微粒子を表面に吹き付け、表面上の微粒子および汚
れを除去する方法である。しかしながら、現在作成でき
る氷の微粒子の径は、十分小さくすることが困難であ
り、１μｍ以下の微粒子の除去が困難である。[0007] This is a method of spraying ice fine particles onto the surface to remove fine particles and dirt on the surface. However, it is difficult to make the diameter of the ice particles that can be produced at present sufficiently small, and it is difficult to remove particles having a diameter of 1 μm or less.
【０００８】ＣＯ2 微粒子吹き付け ドライアイスの微粒子を表面に吹き付け、表面上の微粒
子および汚れを除去する方法である。しかしながら、炭
酸ガス中から炭化水素化合物を極低濃度まで除去するこ
とは極めて困難であり、ＣＯ2 を冷却して吹き付ける
と、炭化水素化合物が凝縮し、洗浄表面に固着してしま
う。また、ＣＯ2 もＣの汚染源となる。[0008] CO 2 particles blown blown dry ice particles to the surface, a method of removing particulates and dirt on the surface. However, it is extremely difficult to remove hydrocarbon compounds from carbon dioxide to an extremely low concentration. When CO 2 is cooled and sprayed, the hydrocarbon compounds condense and adhere to the cleaning surface. CO 2 is also a source of C contamination.
【０００９】ガス噴射 ガスを固体表面に吹き付け、固体表面を洗浄する方法で
ある。しかしながら、固体表面上にはガス流速が極めて
遅い境界層が形成されてしまい、このような遅いガス流
速によっては微粒子を除去する力が弱い。したがって、
１μｍ以下の微粒子の除去は困難である。なお、粒子の
表面付着力は直径に比例し、ガス粒が粒子に与える除去
力は粒子の直径の二乗に比例する。In this method, a gas injection gas is sprayed on a solid surface to clean the solid surface. However, a boundary layer having a very low gas flow rate is formed on the solid surface, and the power for removing fine particles is weak due to such a low gas flow rate. Therefore,
It is difficult to remove fine particles of 1 μm or less. In addition, the surface adhesive force of the particles is proportional to the diameter, and the removal force given to the particles by the gas particles is proportional to the square of the particle diameter.
【００１０】極低温アルゴンガス吹き付け アルゴンガスまたはアルゴンガスを含む混合ガスを極低
温にし、表面に吹き付ける方法である（たとえば、ヨー
ロッパ特許公開公報ＥＰＡ４６１，４７６号参照）。[0010] The mixed gas containing cryogenic argon gas blowing argon gas or argon gas to cryogenic, a method of spraying the surface (e.g., see European Patent Publication No. EPA461,476).
【００１１】ノズルから真空容器中にガスを開放するこ
とにより、ガスは急激に断熱膨張し、その温度を低下さ
せる。温度低下の結果、固体アルゴンが形成され、固体
アルゴン微粒子が被洗浄物表面上に衝突する。By releasing the gas from the nozzle into the vacuum vessel, the gas rapidly adiabatically expands and lowers its temperature. As a result of the temperature drop, solid argon is formed, and solid argon fine particles collide with the surface of the object to be cleaned.
【００１２】たとえば、加圧状態でのアルゴンを含むガ
スを、その圧力でのアルゴンガスの液化点よりも高い温
度まで冷却し、ノズルから真空容器中に吹き出すことに
より、気体アルゴンを固体アルゴンに変化させる方法が
提案されている。For example, a gas containing argon in a pressurized state is cooled to a temperature higher than the liquefaction point of the argon gas at that pressure, and is blown out from a nozzle into a vacuum vessel to change the gaseous argon into solid argon. A method has been proposed.
【００１３】アルゴンよりも高い液化温度を有する不純
物は、予め液化させて除去することもできる。しかしな
がら、この方法によって得られる固体アルゴン微粒子の
数は少量であり、洗浄能力が弱い。Impurities having a liquefaction temperature higher than that of argon can be removed by liquefaction in advance. However, the number of solid argon fine particles obtained by this method is small, and the cleaning ability is weak.
【００１４】[0014]
【発明が解決しようとする課題】アルゴンは不活性元素
であり、固体表面に付着しても悪影響を与えることは極
めて少ない。また、アルゴンの固化温度は比較的高温で
あり、冷却によって固体アルゴンを得ることも比較的容
易である。Argon is an inert element, and has very little adverse effect even if it adheres to a solid surface. In addition, the solidification temperature of argon is relatively high, and it is relatively easy to obtain solid argon by cooling.
【００１５】しかしながら、上述の固体アルゴンの微粒
子を吹き付ける洗浄方法では、高い洗浄能力を得ること
が困難であった。本発明者は、液化温度以下に冷却した
アルゴンをノズルに供給し、液滴を含むアルゴンを真空
雰囲気中にノズルから噴出させることにより、効率的に
アルゴン微粒子を得、洗浄を行なう方法を提案した（特
願平５−１１５１９号）。However, in the above-described cleaning method of spraying the fine particles of solid argon, it was difficult to obtain high cleaning performance. The present inventor has proposed a method in which argon cooled down to a liquefaction temperature or less is supplied to a nozzle, and argon containing droplets is ejected from the nozzle into a vacuum atmosphere to efficiently obtain argon fine particles and perform cleaning. (Japanese Patent Application No. 5-11519).
【００１６】図２は、このようなアルゴン微粒子による
表面洗浄に用いる洗浄装置の構成例を示す。図２（Ａ）
は洗浄装置の構成を断面図で示し、図２（Ｂ）はそのノ
ズル部材を拡大して断面図で示す。FIG. 2 shows an example of the structure of a cleaning apparatus used for cleaning the surface with such fine particles of argon. FIG. 2 (A)
FIG. 2B is a sectional view showing the structure of the cleaning apparatus, and FIG. 2B is an enlarged sectional view of the nozzle member.
【００１７】ノズル部材１は管状であり、その一端は閉
じられている。ノズル部材１の１側面には図２（Ｂ）に
示すように多数のノズル穴５が形成されている。ノズル
部材１の開放端から圧力を印加したアルゴン流体を供給
すると、ノズル穴５から流体が吹き出す。The nozzle member 1 is tubular, and one end thereof is closed. A plurality of nozzle holes 5 are formed on one side surface of the nozzle member 1 as shown in FIG. When a pressure-applied argon fluid is supplied from the open end of the nozzle member 1, the fluid blows out from the nozzle hole 5.
【００１８】図２（Ａ）に示すように、真空容器４内で
ノズル部材１のノズル穴５と対向するように、被洗浄物
２を保持部材３上に配置する。真空容器４内を排気し、
ノズル部材１にアルゴンを含む流体を供給し、ノズル穴
５から吹き出させる。ノズル穴５から吹き出した流体
は、急激に断熱膨張を行い、アルゴン固体微粒子を形成
し、被洗浄物２表面に吹き付けられ、微粒子の衝撃力を
利用して表面洗浄を行なう。As shown in FIG. 2A, the object 2 to be cleaned is arranged on the holding member 3 so as to face the nozzle hole 5 of the nozzle member 1 in the vacuum vessel 4. The inside of the vacuum container 4 is evacuated,
A fluid containing argon is supplied to the nozzle member 1 and blown out from the nozzle hole 5. The fluid blown out from the nozzle hole 5 rapidly adiabatically expands to form argon solid fine particles, which are sprayed on the surface of the object 2 to be cleaned, and perform surface cleaning using the impact force of the fine particles.
【００１９】ところで、ノズル部材１に冷却したアルゴ
ンを含む流体を供給しても、ノズル部材１が常温に保た
れている間は流体が加熱され、常温のガス状態となる。
温度上昇によって流体は著しく膨張する。By the way, even if a cooled fluid containing argon is supplied to the nozzle member 1, the fluid is heated while the nozzle member 1 is kept at room temperature, and becomes a gas state at room temperature.
Fluid expands significantly with increasing temperature.
【００２０】したがって、流体がノズル部材１で加熱さ
れると、流体の体積は急激に膨張し、ノズル穴５から吹
き出してもその質量は小さなものでしかない。したがっ
て、断熱膨張によって生じる寒冷の量も小さい。Therefore, when the fluid is heated by the nozzle member 1, the volume of the fluid rapidly expands, and even when the fluid blows out from the nozzle hole 5, its mass is only small. Therefore, the amount of cold generated by the adiabatic expansion is also small.
【００２１】したがって、洗浄用吹き付け時に適量の流
体を流すノズル径およびノズル数に設計すると、流体が
十分冷却されていない初期においては、ノズル穴５を通
過する流体量が少なく、システムの冷却に時間がかか
る。Therefore, if the nozzle diameter and the number of nozzles through which an appropriate amount of fluid flows at the time of spraying for cleaning are designed, the amount of fluid passing through the nozzle hole 5 is small in the early stage when the fluid is not sufficiently cooled, and it takes time to cool the system. It takes.
【００２２】一方、急速にノズル部材およびその内部の
流体が冷却されるようにノズル径およびノズル数を設計
すると、初期の冷却動作が終了した後には過大な流体量
がノズル穴５を通過してしまう。On the other hand, if the nozzle diameter and the number of nozzles are designed so that the nozzle member and the fluid in the nozzle member are rapidly cooled, an excessive amount of fluid passes through the nozzle hole 5 after the initial cooling operation is completed. I will.
【００２３】また、ノズル部材１を含むシステム内に
は、どうしても製作時にゴミが取り込まれる。また、部
品内面も初期にはゴミを発生する部分を多く含む。メン
テナンスのため、ノズル部材を取外し、外気に触れさせ
た後も同様の状態となる。これらのゴミは、ノズル穴５
を通しては効率よく除去することができない。In the system including the nozzle member 1, dust is inevitably taken in at the time of manufacture. Further, the inner surface of the component also includes many portions that generate dust in the initial stage. The same state is maintained after the nozzle member is removed for maintenance and exposed to outside air. These debris are collected in the nozzle hole 5
Can not be removed efficiently.
【００２４】このように、従来のアルゴン粒子吹き付け
洗浄装置においては、冷却初期およびクリーニング時に
ノズル部材を通して十分な量の流体を流すことか困難で
あった。As described above, in the conventional argon particle spray cleaning apparatus, it is difficult to flow a sufficient amount of fluid through the nozzle member at the beginning of cooling and at the time of cleaning.
【００２５】本発明の目的は、洗浄作業の初期およびク
リーニング時にはノズル部材に十分量の流体を供給で
き、かつ洗浄作業時には所望量のみの流体をノズル穴か
ら噴出させることのできる洗浄装置を提供することであ
る。An object of the present invention is to provide a cleaning apparatus which can supply a sufficient amount of fluid to the nozzle member at the beginning of cleaning operation and at the time of cleaning, and can discharge only a desired amount of fluid from the nozzle hole at the time of cleaning operation. That is.
【００２６】[0026]
【課題を解決するための手段】本発明の洗浄装置は、気
密な真空容器と、前記真空容器中に配置され、被洗浄物
を保持するための保持手段と、内部に流体通過空間を有
し、流体通過空間から前記保持手段上に向かって開いた
小開口を複数有するノズル部材と、前記ノズル部材の流
体通過空間の一端に冷却した流体を供給することのでき
る冷却流体供給配管と、前記ノズル部材の流体通過空間
の他端に接続された排気用配管と、前記排気用配管の開
閉状態を制御するバルブ手段とを有する。A cleaning apparatus according to the present invention has an airtight vacuum container, holding means for holding an object to be cleaned, which is disposed in the vacuum container, and a fluid passage space therein. A nozzle member having a plurality of small openings opened from the fluid passage space toward the holding means, a cooling fluid supply pipe capable of supplying a cooled fluid to one end of the fluid passage space of the nozzle member, and the nozzle It has an exhaust pipe connected to the other end of the fluid passage space of the member, and valve means for controlling the open / close state of the exhaust pipe.
【００２７】[0027]
【作用】ノズル部材の流体通過空間の両端に冷却流体供
給配管と排気用配管とを接続したため、ノズル部材の流
体通過空間に十分量の流体を供給し、冷却またはクリー
ニングを行なうことができる。Since the cooling fluid supply pipe and the exhaust pipe are connected to both ends of the fluid passage space of the nozzle member, a sufficient amount of fluid can be supplied to the fluid passage space of the nozzle member to perform cooling or cleaning.
【００２８】バルブ手段を閉じることにより、排気用配
管が閉状態となり、洗浄動作時には冷却流体供給配管か
ら供給された冷却した流体はノズル部材の小開口から真
空容器中に噴出する。小開口の数および寸法を適切に設
計することにより、所望の洗浄機能が得られる。By closing the valve means, the exhaust pipe is closed, and during the cleaning operation, the cooled fluid supplied from the cooling fluid supply pipe blows out from the small opening of the nozzle member into the vacuum vessel. By properly designing the number and size of the small openings, a desired cleaning function can be obtained.
【００２９】[0029]
【実施例】図１は、本発明の実施例による洗浄装置の構
成を概略的に示す。ノズル部材１は、両端の開いた管状
であり、その１側面には多数のノズル穴５が形成されて
いる。ノズル穴５の寸法および数は、洗浄作業時に所望
量の流体がノズル穴５から噴出するように設計される。FIG. 1 schematically shows the structure of a cleaning apparatus according to an embodiment of the present invention. The nozzle member 1 has a tubular shape with both ends open, and has a large number of nozzle holes 5 formed on one side thereof. The dimensions and number of the nozzle holes 5 are designed such that a desired amount of fluid is ejected from the nozzle holes 5 during the cleaning operation.
【００３０】ノズル部材１の一端には、冷却したアルゴ
ンを含む流体を供給する供給用配管１２が接続され、他
端には排気用配管６が接続されている。ノズル部材１
は、真空容器４中に配置され、冷却流体供給配管１２お
よび排気用配管６は真空容器４内部から外部に貫通して
いる。ノズル部材１のノズル穴５と対向するように、被
洗浄物２を保持駆動するための保持部材３が真空容器４
内に配置されている。A supply pipe 12 for supplying a cooled fluid containing argon is connected to one end of the nozzle member 1, and an exhaust pipe 6 is connected to the other end. Nozzle member 1
The cooling fluid supply pipe 12 and the exhaust pipe 6 penetrate from the inside of the vacuum vessel 4 to the outside. The holding member 3 for holding and driving the object 2 to be cleaned is opposed to the nozzle hole 5 of the nozzle member 1.
Is located within.
【００３１】排気用配管６には、バルブ７が結合され、
排気用配管６の開閉状態を制御する。排気用配管６は、
バルブ７を介して排気装置８に接続されている。また、
真空容器４も、排気用配管１３、バルブ１４を介して排
気装置８に接続されている。A valve 7 is connected to the exhaust pipe 6.
The open / close state of the exhaust pipe 6 is controlled. The exhaust pipe 6
It is connected to an exhaust device 8 via a valve 7. Also,
The vacuum container 4 is also connected to the exhaust device 8 via an exhaust pipe 13 and a valve 14.
【００３２】以下、半導体ウエハ等の被洗浄物２を洗浄
する洗浄作業を説明する。まず、被洗浄物２を保持部材
３上に設置し、真空容器４内を排気する。また、冷却流
体供給用配管１２から冷却した流体をノズル部材１に供
給し、排気用配管６、バルブ７を介して排気装置８によ
って排気する。Hereinafter, a cleaning operation for cleaning an object 2 to be cleaned such as a semiconductor wafer will be described. First, the object to be cleaned 2 is set on the holding member 3 and the inside of the vacuum container 4 is evacuated. Further, the cooled fluid is supplied from the cooling fluid supply pipe 12 to the nozzle member 1 and exhausted by the exhaust device 8 via the exhaust pipe 6 and the valve 7.
【００３３】冷却された流体がノズル部材１を通過する
ことにより、ノズル部材は冷却される。なお、真空容器
４の冷却を防止するために、真空容器４内において排気
用配管６の周囲にヒータ１０を設け、加熱を行なっても
よい。When the cooled fluid passes through the nozzle member 1, the nozzle member is cooled. In order to prevent cooling of the vacuum vessel 4, a heater 10 may be provided around the exhaust pipe 6 in the vacuum vessel 4 to perform heating.
【００３４】ノズル部材１が十分冷却した時には、バル
ブ７を閉じてノズル部材１から排気用配管６に冷却流体
が流れ込まないようにする。真空容器４内は、排気用配
管１３、バルブ１４を介して排気装置８で排気し続ける
ことにより、ノズル部材１内の冷却流体はノズル部材１
のノズル穴５を通って真空容器４内に噴出する。When the nozzle member 1 is sufficiently cooled, the valve 7 is closed to prevent the cooling fluid from flowing from the nozzle member 1 into the exhaust pipe 6. By continuously evacuating the inside of the vacuum vessel 4 by the exhaust device 8 via the exhaust pipe 13 and the valve 14, the cooling fluid in the nozzle member 1
Through the nozzle hole 5 of FIG.
【００３５】流体がアルゴンを含む場合、ノズル部材１
から真空容器４内にアルゴンを含む流体が噴出する際、
急激に断熱膨張が行なわれ、流体中にアルゴン微粒子が
発生する。なお、供給する流体をアルゴンの液化温度以
下に制御すれば、アルゴン液滴を多数含む流体がノズル
部材１に供給され、ノズル穴５を通って噴出される際に
容易に多数のアルゴン微粒子が発生する。When the fluid contains argon, the nozzle member 1
When a fluid containing argon is jetted into the vacuum vessel 4 from
Adiabatic expansion is rapidly performed, and argon fine particles are generated in the fluid. If the supplied fluid is controlled to a temperature equal to or lower than the liquefaction temperature of argon, a fluid containing a large number of argon droplets is supplied to the nozzle member 1, and when ejected through the nozzle hole 5, a large number of argon particles are easily generated. I do.
【００３６】必要に応じ、保持部材３を２軸方向に駆動
することにより、被洗浄物２の全表面をアルゴン微粒子
で走査し、洗浄することができる。なお、特願平５−３
１９５０号に開示した保持部材の高速および低速駆動方
式や、特願平５−７１７７６号に開示した異なるノズル
径を組み合わせて用いる方法や、特願平５−７１７７７
号に開示した洗浄後の被洗浄物表面をガスで加熱する方
式等を合わせて用いることもできる。By driving the holding member 3 in two axial directions as needed, the entire surface of the object 2 to be cleaned can be scanned and cleaned with argon fine particles. In addition, Japanese Patent Application No. 5-3
Japanese Patent Application No. 5-71776 discloses a method of driving a holding member at high speed and low speed, a method using a combination of different nozzle diameters disclosed in Japanese Patent Application No. 5-71776.
And the method of heating the surface of the object to be cleaned after cleaning with a gas, which is disclosed in Japanese Patent Application Laid-Open No. H11-216, can also be used.
【００３７】このように、冷却初期においては、排気用
配管から排気することにより、ノズル部材に十分量の流
体を流し、ノズル部材内をクリーニングすると共にノズ
ル部材を急激に冷却することができる。このため、洗浄
作業全体に必要とされる時間が短縮される。なお、洗浄
作業を伴わず、ノズル部材内をクリーニングのみするこ
とも可能である。As described above, in the initial stage of cooling, exhausting from the exhaust pipe allows a sufficient amount of fluid to flow through the nozzle member, thereby cleaning the inside of the nozzle member and rapidly cooling the nozzle member. Therefore, the time required for the entire cleaning operation is reduced. In addition, it is also possible to clean only the inside of the nozzle member without performing the cleaning operation.
【００３８】なお、ノズル部材からの排気用配管を独立
して排気装置に接続する構成を説明したが、排気用配管
を真空容器内に開放することも可能である。この場合、
大気による排気用配管の加熱が期待できないため、バル
ブ７が良好に作動するように排気用配管６のバルブ７よ
り上流部分に所望の加熱容量を有するヒータを設けるこ
とが好ましい。Although the structure in which the exhaust pipe from the nozzle member is independently connected to the exhaust device has been described, the exhaust pipe can be opened in the vacuum vessel. in this case,
Since heating of the exhaust pipe by the atmosphere cannot be expected, it is preferable to provide a heater having a desired heating capacity at a portion of the exhaust pipe 6 upstream of the valve 7 so that the valve 7 operates properly.
【００３９】以上実施例に沿って本発明を説明したが、
本発明はこれらに制限されるものではない。たとえば、
種々の変更、改良、組み合わせ等が可能なことは当業者
に自明であろう。The present invention has been described in connection with the preferred embodiments.
The present invention is not limited to these. For example,
It will be apparent to those skilled in the art that various modifications, improvements, combinations, and the like can be made.
【００４０】[0040]
【発明の効果】以上説明したように、本発明によれば、
微粒子を用いた洗浄装置において、初期冷却時およびク
リーニング時にはノズル部材に十分量の冷却流体を流
し、急速にクリーニングもしくは冷却を行なうことがで
きる。As described above, according to the present invention,
In a cleaning apparatus using fine particles, a sufficient amount of cooling fluid is supplied to the nozzle member at the time of initial cooling and cleaning, so that cleaning or cooling can be rapidly performed.
【図１】本発明の実施例による洗浄装置を概略的に示す
断面図である。FIG. 1 is a cross-sectional view schematically illustrating a cleaning apparatus according to an embodiment of the present invention.
【図２】参考例による洗浄装置を概略的に示す断面図で
ある。FIG. 2 is a sectional view schematically showing a cleaning apparatus according to a reference example.
１ ノズル部材 ２ 被洗浄物 ３ 保持部材 ４ 真空容器 ５ ノズル穴 ６、１３ 排気用配管 ７、１４ バルブ ８ 排気装置 １０ ヒータ １２ 冷却流体供給配管 DESCRIPTION OF SYMBOLS 1 Nozzle member 2 Object to be washed 3 Holding member 4 Vacuum container 5 Nozzle hole 6, 13 Exhaust pipe 7, 14 Valve 8 Exhaust device 10 Heater 12 Cooling fluid supply pipe
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平２−130921（ＪＰ，Ａ) 特開 平３−46869（ＪＰ，Ａ) 実開 平１−87862（ＪＰ，Ｕ) 特公 昭60−3555（ＪＰ，Ｂ２) 特公 昭63−17591（ＪＰ，Ｂ２) 特許2529468（ＪＰ，Ｂ２) 特許2529431（ＪＰ，Ｂ２) 実公 平３−5421（ＪＰ，Ｙ２) (58)調査した分野(Int.Cl.6，ＤＢ名) B08B 1/00 - 11/04 B24C 1/00 H01L 21/304 341──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-2-130921 (JP, A) JP-A-3-46869 (JP, A) JP-A-1-877862 (JP, U) 3555 (JP, B2) JP-B-63-17591 (JP, B2) Patent 2529468 (JP, B2) Patent 2529431 (JP, B2) .Cl. 6 , DB name) B08B 1/00-11/04 B24C 1/00 H01L 21/304 341
Claims (5)
保持手段と、 内部に流体通過空間を有し、流体通過空間から前記保持
手段上に向かって開いた小開口を複数有するノズル部材
と、 前記ノズル部材の流体通過空間の一端に冷却した流体を
供給することのできる冷却流体供給配管と、 前記ノズル部材の流体通過空間の他端に接続された排気
用配管と、 前記排気用配管の開閉状態を制御するバルブ手段とを有
する洗浄装置。An airtight vacuum container, holding means for holding an object to be cleaned, which is disposed in the vacuum container, and having a fluid passage space therein, and extending from the fluid passage space onto the holding means. A nozzle member having a plurality of small openings that are open and closed, a cooling fluid supply pipe capable of supplying a cooled fluid to one end of a fluid passage space of the nozzle member, and a nozzle member connected to the other end of the fluid passage space of the nozzle member A cleaning device, comprising: an exhaust pipe, and valve means for controlling an open / close state of the exhaust pipe.
ら外部に延在し、前記バルブ手段が前記真空容器の外部
で排気用配管に結合している請求項１記載の洗浄装置。2. The cleaning apparatus according to claim 1, wherein the exhaust pipe extends from the inside of the vacuum vessel to the outside, and the valve means is connected to the exhaust pipe outside the vacuum vessel.
熱手段を有する請求項１または２記載の洗浄装置。3. The cleaning apparatus according to claim 1, further comprising a heating unit coupled to the exhaust pipe.
空間を有し、複数の小開口を有するノズル部材の流体通
過空間の端から冷却した流体を供給し、他端から排気す
る工程と、 前記ノズル部材が冷却された後、前記排気を停止し、前
記真空容器内を排気しつつ前記流体通過空間の一端から
冷却された流体を供給して、前記複数の小開口から冷却
流体を前記真空容器内に吹き出させる工程とを有する洗
浄方法。4. A step of supplying a cooled fluid from an end of a fluid passage space of a nozzle member having a plurality of small openings and having a fluid passage space inside the vacuum container and having a fluid passage space therein, and exhausting the fluid from the other end. After the nozzle member is cooled, the evacuation is stopped, a cooled fluid is supplied from one end of the fluid passage space while evacuating the vacuum vessel, and the cooling fluid is supplied from the plurality of small openings. And blowing it into a vacuum vessel.
口を有する洗浄用ノズルの一端に流体供給配管を接続
し、他端に流体排出配管を接続する工程と、 前記一端から流体を供給しつつ、前記他端から強制排出
させることにより、前記ノズル内および配管内をクリー
ニングする工程とを含む洗浄用ノズルのクリーニング方
法。5. A step of connecting a fluid supply pipe to one end of a cleaning nozzle having a fluid passage space therein and having a plurality of small openings, and connecting a fluid discharge pipe to the other end; Cleaning the inside of the nozzle and the piping by forcibly discharging from the other end while supplying the cleaning nozzle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15465393A JP2857569B2 (en) | 1993-06-25 | 1993-06-25 | Cleaning device and cleaning method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15465393A JP2857569B2 (en) | 1993-06-25 | 1993-06-25 | Cleaning device and cleaning method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH078929A JPH078929A (en) | 1995-01-13 |
| JP2857569B2 true JP2857569B2 (en) | 1999-02-17 |
Family
ID=15588945
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15465393A Expired - Fee Related JP2857569B2 (en) | 1993-06-25 | 1993-06-25 | Cleaning device and cleaning method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2857569B2 (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2529431B2 (en) | 1990-02-09 | 1996-08-28 | 大陽酸素株式会社 | Cleaning equipment |
| JP2529468B2 (en) | 1990-11-30 | 1996-08-28 | 大陽酸素株式会社 | Semiconductor wafer cleaning apparatus and cleaning method |
| JP6317591B2 (en) | 2014-02-06 | 2018-04-25 | 日東電工株式会社 | Double-sided pressure-sensitive adhesive sheet and method for producing the same |
-
1993
- 1993-06-25 JP JP15465393A patent/JP2857569B2/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2529431B2 (en) | 1990-02-09 | 1996-08-28 | 大陽酸素株式会社 | Cleaning equipment |
| JP2529468B2 (en) | 1990-11-30 | 1996-08-28 | 大陽酸素株式会社 | Semiconductor wafer cleaning apparatus and cleaning method |
| JP6317591B2 (en) | 2014-02-06 | 2018-04-25 | 日東電工株式会社 | Double-sided pressure-sensitive adhesive sheet and method for producing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH078929A (en) | 1995-01-13 |
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