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JP2859043B2 - Semiconductor substrate heat treatment equipment - Google Patents
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JP2859043B2 - Semiconductor substrate heat treatment equipment - Google Patents

Semiconductor substrate heat treatment equipment

Info

Publication number
JP2859043B2
JP2859043B2 JP20635992A JP20635992A JP2859043B2 JP 2859043 B2 JP2859043 B2 JP 2859043B2 JP 20635992 A JP20635992 A JP 20635992A JP 20635992 A JP20635992 A JP 20635992A JP 2859043 B2 JP2859043 B2 JP 2859043B2
Authority
JP
Japan
Prior art keywords
semiconductor substrate
infrared
heating furnace
heat treatment
measuring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP20635992A
Other languages
Japanese (ja)
Other versions
JPH0653153A (en
Inventor
好朗 嶋田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP20635992A priority Critical patent/JP2859043B2/en
Publication of JPH0653153A publication Critical patent/JPH0653153A/en
Application granted granted Critical
Publication of JP2859043B2 publication Critical patent/JP2859043B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、半導体基板熱処理装置
に関し、特に半導体基板温度を石英製加熱炉の外部より
赤外線放射量により測定する手段をもつ半導体基板熱処
理装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor substrate heat treatment apparatus, and more particularly to a semiconductor substrate heat treatment apparatus having means for measuring the temperature of a semiconductor substrate from the outside of a quartz heating furnace by the amount of infrared radiation.

【0002】[0002]

【従来の技術】図2は従来の一例を示す半導体基板熱処
理装置のブロック図である。従来の枚葉式半導体基板熱
処理装置は、図2に示すように、半導体基板6を収納す
る石英製加熱炉3と、半導体基板6を加熱する上部加熱
器1及び下部加熱器2と、半導体基板6より放射された
赤外線の強度を石英製加熱炉3の外部で計測及び温度換
算する赤外線計測器4と、赤外線計測器4から温度情報
を受け取り設定温度と比較しながら加熱器制御ラインを
通して、上部加熱器1と下部加熱器2を制御する制御器
9を有している。
2. Description of the Related Art FIG. 2 is a block diagram of a semiconductor substrate heat treatment apparatus showing an example of the prior art. As shown in FIG. 2, a conventional single-wafer semiconductor substrate heat treatment apparatus includes a quartz heating furnace 3 for housing a semiconductor substrate 6, an upper heater 1 and a lower heater 2 for heating the semiconductor substrate 6, 6, an infrared measuring device 4 for measuring the intensity of the infrared radiation radiated from the outside of the quartz heating furnace 3 and converting the temperature, and receiving the temperature information from the infrared measuring device 4 and comparing it with the set temperature, through the heater control line, It has a controller 9 for controlling the heater 1 and the lower heater 2.

【0003】図3は半導体基板の温度を測定する方法を
説明するための模式部分断面図である。次に赤外線計測
部の詳細について図3を用いて説明を行なう。ここで、
石英製加熱炉の上部壁3a及び下部壁3bの内側には、
過去に行なった半導体基板の熱処理によって生成された
生成膜8が付着しているとすると、半導体基板6より放
射された赤外線5は、生成膜8と石英製加熱炉の下部壁
3bを透過し減衰する。この減衰した赤外線が下部加熱
器2につけられた計測スリット7を通ったもののみが赤
外線計測器4によって計測される。そして捕捉された赤
外線量は半導体基板6の温度として換算される。
FIG. 3 is a schematic partial sectional view for explaining a method for measuring the temperature of a semiconductor substrate. Next, details of the infrared measurement unit will be described with reference to FIG. here,
Inside the upper wall 3a and the lower wall 3b of the quartz heating furnace,
Assuming that the generated film 8 generated by the heat treatment of the semiconductor substrate performed in the past adheres, the infrared rays 5 radiated from the semiconductor substrate 6 pass through the generated film 8 and the lower wall 3b of the quartz heating furnace and are attenuated. I do. Only the attenuated infrared ray passing through the measurement slit 7 provided in the lower heater 2 is measured by the infrared ray meter 4. Then, the amount of the captured infrared rays is converted as the temperature of the semiconductor substrate 6.

【0004】[0004]

【発明が解決しようとする課題】この従来の半導体基板
熱処理装置では、半導体基板の温度計測を石英製加熱炉
壁及び壁に付着した生成膜を透過した半導体基板からの
放射赤外線量の計測より換算する方法のみで行なってい
るので、石英製加熱炉内壁の生成膜量が変化することに
よって、生成膜透過時の赤外線透過率が変化し、温度計
測値に誤差を生じ、しばしば熱処理される半導体基板の
特性が得られないという問題がある。
In this conventional semiconductor substrate heat treatment apparatus, the temperature measurement of the semiconductor substrate is converted from the measurement of the amount of radiated infrared rays from the semiconductor substrate transmitted through the quartz furnace wall and the generated film attached to the wall. Since the amount of generated film on the inner wall of the quartz heating furnace changes, the infrared transmittance at the time of transmission of the generated film changes, causing an error in the temperature measurement value and often causing the semiconductor substrate to be heat-treated. However, there is a problem that the characteristics described above cannot be obtained.

【0005】本発明の目的は、半導体基板の温度を正確
に測定し、所望の特性が得られる半導体基板熱処理装置
を提供することである。
An object of the present invention is to provide a semiconductor substrate heat treatment apparatus capable of accurately measuring the temperature of a semiconductor substrate and obtaining desired characteristics.

【0006】[0006]

【課題を解決するための手段】本発明の半導体基板熱処
理装置は、半導体基板を収納する石英製加熱炉と、この
石英製加熱炉の外部に配置される加熱器と、赤外線を測
定する赤外線測定器と、赤外線量により温度を換算する
制御器と、前記加熱器から発生し前記石英製加熱炉を透
過する赤外線を前記赤外線測定器で測定する第1の測定
系と、前記半導体基板から発生する赤外線を前記赤外線
測定器で測定する第2の測定系と、前記第1の測定系と
前記第2の測定系とを切換える開閉器とを備えている。
According to the present invention, there is provided a semiconductor substrate heat treatment apparatus, comprising: a quartz heating furnace for accommodating a semiconductor substrate; a heater disposed outside the quartz heating furnace; A controller for converting the temperature by the amount of infrared rays, a first measurement system for measuring infrared rays generated from the heater and passing through the quartz heating furnace with the infrared measuring instrument, and generated from the semiconductor substrate. A second measurement system for measuring infrared light with the infrared measurement device; and a switch for switching between the first measurement system and the second measurement system.

【0007】[0007]

【実施例】次に本発明について図面を参照して説明す
る。図1は、本発明の一実施例を示す半導体基板熱処理
装置のブロック図である。この半導体基板熱処理装置
は、石英製加熱炉3の内壁に付着する生成膜に着目し、
この生成膜を透過する上部加熱炉1の赤外線量の光学的
透過率変化を測定し、その変化率で半導体基板6の放射
する赤外線量を補正し半導体基板の温度を求めることで
ある。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings. FIG. 1 is a block diagram of a semiconductor substrate heat treatment apparatus showing one embodiment of the present invention. This semiconductor substrate heat treatment apparatus focuses on a generated film attached to the inner wall of the quartz heating furnace 3,
The change in the optical transmittance of the amount of infrared light of the upper heating furnace 1 that passes through the generated film is measured, and the amount of infrared light emitted from the semiconductor substrate 6 is corrected based on the change rate to determine the temperature of the semiconductor substrate.

【0008】すなわち、図1に示すように、赤外線の発
光部として上部加熱炉1を、受光部として赤外線測定器
4を使用する測定経路と、半導体基板6の発生する赤外
線を測定する経路と前記測定経路とを切換える開閉機1
2とを設けたことである。
That is, as shown in FIG. 1, a measurement path using the upper heating furnace 1 as a light emitting part of infrared rays and an infrared measuring instrument 4 as a light receiving part, a path for measuring the infrared rays generated by the semiconductor substrate 6, and Switch 1 for switching between measurement paths
2 is provided.

【0009】次に、これら測定経路による測定手順につ
いて説明する。まず、下部加熱器2の発光による石英製
加熱炉3での反射光を赤外線計測器4で測定するのを防
止するため、下部加熱器制御ラインの開閉機12を開
き、下部加熱器2を停止させた後、制御器9より加熱器
制御ラインに一定加熱信号を出し、上部加熱器1から一
定強度の赤外線を発光させる。上部加熱炉1より放射さ
れた一定強度の赤外線は石英製加熱炉3を透過し、赤外
線計測器4に入射して、赤外線強度が測定される。そし
て赤外線計測器4により測定された赤外線強度値は、通
常の半導体基板の温度測定時の温度測定信号と同様に制
御器9に戻され、壁面に生成膜が付着していないときの
赤外線加熱炉の透過赤外線量と比較して石英製加熱炉3
の光学的透過率を算出する。
Next, a measurement procedure using these measurement paths will be described. First, in order to prevent the reflected light from the heating furnace 3 made of quartz from being emitted by the lower heater 2 from being measured by the infrared measuring device 4, the lower heater control line switch 12 is opened and the lower heater 2 is stopped. After that, a constant heating signal is output from the controller 9 to the heater control line, and the upper heater 1 emits infrared light of a constant intensity. The infrared rays of a constant intensity emitted from the upper heating furnace 1 pass through the quartz heating furnace 3 and enter the infrared measuring device 4, where the infrared intensity is measured. The infrared intensity value measured by the infrared measuring device 4 is returned to the controller 9 in the same manner as a normal temperature measurement signal at the time of measuring the temperature of the semiconductor substrate. Compared with the amount of transmitted infrared light from the quartz heating furnace 3
Is calculated.

【0010】次に、石英製加熱炉3の光学的透過率信号
を赤外線計測器4にフィードバックさせ、開閉器12を
切換えて石英製加熱炉3から発生する赤外線量を測定
し、制御器9に記憶された生成膜のある石英製加熱炉の
透過率で測定された赤外線量を補正し、半導体基板の熱
処理時における温度を測定する。
Next, the optical transmittance signal of the quartz heating furnace 3 is fed back to the infrared measuring device 4, and the switch 12 is switched to measure the amount of infrared rays generated from the quartz heating furnace 3. The infrared ray amount measured based on the transmittance of the quartz heating furnace having the stored film is corrected, and the temperature of the semiconductor substrate during the heat treatment is measured.

【0011】このように半導体基板熱処理時に生成され
る膜によって石英製加熱炉3の透過率変化を測定し、半
導体基板の処理温度を補正することによって誤差のない
測定が出来、半導体基板の所望の特性が得られる。ま
た、この赤外線透過率によって加熱炉の交換時期も知る
ことが出来るという利点もある。
As described above, the change in the transmittance of the quartz heating furnace 3 is measured by the film formed during the heat treatment of the semiconductor substrate, and the correction of the processing temperature of the semiconductor substrate enables the measurement without any error. Characteristics are obtained. In addition, there is an advantage that the time for replacing the heating furnace can be known from the infrared transmittance.

【0012】[0012]

【発明の効果】以上説明したように本発明は、上部加熱
器が発生する赤外線を石英製加熱炉に透過させ、石英製
加熱炉の光学的透過率を測定する測定経路を設け、石英
製加熱炉内壁の生成膜付着量による透過率を測定し、半
導体基板から発生する赤外線量を前記透過率で補正して
半導体基板の温度を測定することによって、熱処理時の
正確な温度を測定出来、所望の特性の半導体基板が得ら
れるという効果がある。
As described above, according to the present invention, the infrared ray generated by the upper heater is transmitted to the quartz heating furnace, and a measurement path for measuring the optical transmittance of the quartz heating furnace is provided. By measuring the transmittance of the inner wall of the furnace based on the amount of generated film attached, correcting the amount of infrared rays generated from the semiconductor substrate by the transmittance, and measuring the temperature of the semiconductor substrate, it is possible to accurately measure the temperature at the time of heat treatment. There is an effect that a semiconductor substrate having the following characteristics can be obtained.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施例を示す半導体基板熱処理装置
のブロック図である。
FIG. 1 is a block diagram of a semiconductor substrate heat treatment apparatus showing one embodiment of the present invention.

【図2】従来の一例を示す半導体基板熱処理装置のブロ
ック図である。
FIG. 2 is a block diagram of a semiconductor substrate heat treatment apparatus showing an example of the related art.

【図3】半導体基板の温度を測定する方法を説明するた
めの模式部分断面図である。
FIG. 3 is a schematic partial cross-sectional view illustrating a method for measuring the temperature of a semiconductor substrate.

【符号の説明】[Explanation of symbols]

1 上部加熱器 2 下部加熱器 3 石英製加熱炉 4 赤外線計測器 6 半導体基板 9 制御器 12 開閉器 DESCRIPTION OF SYMBOLS 1 Upper heater 2 Lower heater 3 Quartz heating furnace 4 Infrared measuring device 6 Semiconductor substrate 9 Controller 12 Switch

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 半導体基板を収納する石英製加熱炉と、
この石英製加熱炉の外部に配置される加熱器と、赤外線
を測定する赤外線測定器と、赤外線量により温度を換算
する制御器と、前記加熱器から発生し前記石英製加熱炉
を透過する赤外線を前記赤外線測定器で測定する第1の
測定系と、前記半導体基板から発生する赤外線を前記赤
外線測定器で測定する第2の測定系と、前記第1の測定
系と前記第2の測定系とを切換える開閉器とを備えるこ
とを特徴とする半導体基板熱処理装置。
A quartz heating furnace for accommodating a semiconductor substrate;
A heater arranged outside the quartz heating furnace, an infrared measuring instrument for measuring infrared rays, a controller for converting the temperature by the amount of infrared rays, and infrared rays generated from the heater and transmitted through the quartz heating furnace. A first measurement system for measuring infrared light from the semiconductor substrate with the infrared measurement device, a second measurement system for measuring infrared light generated from the semiconductor substrate with the infrared measurement device, the first measurement system, and the second measurement system. A semiconductor substrate heat treatment apparatus, comprising:
JP20635992A 1992-08-03 1992-08-03 Semiconductor substrate heat treatment equipment Expired - Fee Related JP2859043B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20635992A JP2859043B2 (en) 1992-08-03 1992-08-03 Semiconductor substrate heat treatment equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20635992A JP2859043B2 (en) 1992-08-03 1992-08-03 Semiconductor substrate heat treatment equipment

Publications (2)

Publication Number Publication Date
JPH0653153A JPH0653153A (en) 1994-02-25
JP2859043B2 true JP2859043B2 (en) 1999-02-17

Family

ID=16522019

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20635992A Expired - Fee Related JP2859043B2 (en) 1992-08-03 1992-08-03 Semiconductor substrate heat treatment equipment

Country Status (1)

Country Link
JP (1) JP2859043B2 (en)

Also Published As

Publication number Publication date
JPH0653153A (en) 1994-02-25

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