JP2861412B2 - Coin sorting device with coin sorting sensor and method of manufacturing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a coin sorting device used in a vending machine and the like, and more particularly to a coin sorting device having a coin sorting sensor bonded to a substrate of the coin sorting device with an adhesive, and a method of manufacturing the same. About.

[0002]

2. Description of the Related Art A coin sorting device incorporated in a vending machine or the like incorporates a coin sorting sensor for determining the authenticity of inserted coins.

FIG. 9 shows the structure of such a coin sorting apparatus. As shown in the drawing, the coin sorting device 1 has a coin insertion slot 3 into which coins 2 are inserted on the upper surface thereof, and a coin passage 4 from which a coin passage 4 is arranged downward with a certain inclination. . A coin sorting sensor 5 is located in the middle of the coin passage 4.
a and 5b are arranged, and at the lower end of the coin passage 4, a gate 6 for sorting the true coin 2a and the false coin 2b is attached. By switching the gate 6, the coin passage 4 can be selectively communicated with a true coin passage 7 and a false coin passage 8 arranged below the gate 6.

The coin sorting sensors 5a and 5b are circular magnetic sensors that form a high-frequency oscillating magnetic field around them. When the coins 2 pass through the portion of the coin passage 4 where these are arranged, the frequency of the magnetic field formed around them changes according to the outer diameter and the material of the passing coins 2 respectively. Based on this change, the authenticity of the passing coin 2 is determined.

FIG. 10 shows one coin sorting sensor 5a.
2 shows a cross-sectional configuration of FIG. As shown in this figure, the coin sorting sensor 5a has a sensor coil 11a adhered to a substrate 9a of the coin sorting device 1 with a two-component epoxy adhesive 10a, and a state covering the outer periphery of the sensor coil 11a. , A sensor core 12a similarly adhered to the substrate 9a by a two-component epoxy adhesive 10b
It is composed of

In such a conventional method of manufacturing the coin sorting apparatus 1, the coin sorting sensors 5a and 5b are adhered to the substrate 9a in the following procedure. First, the sensor coil 11
a, The sensor core 12a is positioned on the substrate, and its state is restrained by a fixing jig.

Next, a two-part mixed type epoxy adhesive 10a, 10b is applied to each bonding part. Thereafter, the two-part mixed epoxy adhesives 10a and 10b are cured by heating at 100 ° C. for one hour in a heat curing furnace.
Thereby, the sensor coil 11a, the sensor core 1
2a is bonded to the substrate 9a. After this, other components constituting the circuit of the coin sorting device 1 are transferred to the substrate 9.
a.

[0008]

However, the coin sorting sensors 5a and 5b are mounted on the device substrate 9 by the two-component epoxy adhesives 10a and 10b which require heat curing.
Since it is bonded to a, there are the following problems.

In order to heat and cure the applied two-liquid mixed type epoxy adhesives 10a and 10b at 100 ° C. for one hour, a substrate 9a on which a sensor coil 11a and a sensor core 12a constituting a sensor are positioned is mounted. Need to be placed in a heat curing oven for about 1 hour. For this reason, in the production line, this heat curing step is of a batch type, and mass productivity is significantly reduced.

[0010] Since a heating and curing furnace is required, equipment cost and equipment space of a production line are required. Further, the processing efficiency and the curing time limit the production efficiency.

In a state where the sensor coil 11a and the sensor core 12a are fixed to the substrate 9a by a fixing jig, about 1
Since it is necessary to perform heat curing for a long time, a large number of fixing jigs are required according to the production quantity.

[0012] Two-part mixed type epoxy adhesive 10a,
It takes a long time for 10b to harden and for the sensor coil 11a and the sensor core 12a to adhere to the substrate 9a. During this time, if a vibration or an impact is applied to the substrate 9a, a displacement of the sensor coil 11a occurs. When such a displacement occurs, the coin sorting sensor 5a,
It is not preferable because the accuracy of judging the authenticity of the coin 5b varies.

In view of the above problems, an object of the present invention is to use an adhesive under curing conditions that does not require a heat curing step,
An object of the present invention is to provide a coin sorting device provided with a coin sorting sensor that is compatible with flow production, has excellent mass productivity, and has stable quality, and a method of manufacturing the same.

[0014]

In order to solve the above-mentioned problems, the present invention relates to a coin sorting device in which a sensor core and a sensor coil of a coin sorting sensor are adhered to a substrate of the coin sorting device by an adhesive. The basic feature of this means is that the adhesive is a cold reaction type adhesive.

Here, the room temperature reaction type adhesive is preferably a two-part mixed type ultraviolet curing adhesive. For example, a two-part mixed type acrylic ultraviolet curing adhesive is used in order to enhance the weather resistance of the bonded part. Is preferred.

Alternatively, a moisture reactive curing type hot melt adhesive may be used as the room temperature reactive adhesive.

Further, in the present invention, it is desirable to dispose an elastic fixing spacer in a compressed state between the sensor core and the sensor coil. Here, as the fixing spacer, for example, a sponge type spacer made of a flexible material, a ring type spacer having an arc-shaped cross section, a disc spring type spacer, or a leaf spring type spacer having a corrugated plate type cross section is used. Can be used.

A coin sorting device provided with a coin sorting sensor according to the present invention includes a step of positioning a sensor core and a sensor coil on a substrate, and a step of positioning a sensor core and a sensor coil on a substrate and a two-liquid bonding portion on the substrate and the sensor coil. It is manufactured by a manufacturing method including a step of applying a mixed type ultraviolet curing adhesive, and a step of irradiating at least a part of these bonding portions with ultraviolet light. It is preferable that each of the above steps is sequentially performed on the conveyor line.

Alternatively, a step of applying a moisture-reactive curable hot-melt adhesive that has been heated and melted to an adhesive portion between the substrate and the sensor core and an adhesive portion between the substrate and the sensor coil; A step of positioning the sensor core and the sensor coil on the substrate before the adhesive cools down, and manufacturing by sequentially performing the above-described steps on a conveyor line.

In the manufacturing method according to the present invention, in the step of positioning the sensor core and the sensor coil on the substrate, an elastic fixing spacer is further arranged between the sensor core and the sensor coil in a compressed state. It is effective to position the sensor coil in a state in which the spacer is pressed against the substrate by the return force from the compressed state of the spacer.

[0021]

According to the present invention, the bonding portion between the substrate and the sensor core and the sensor coil exhibits an adhesive function in a short time without applying a long-time heating operation, and thereafter the adhesive is cured at a temperature higher than normal temperature. An adhesive having the following properties (room temperature reaction-curable adhesive in the present invention) is used.

For example, a two-part mixed type ultraviolet curing adhesive is:
It has a function of curing in a short time by irradiation of ultraviolet rays (UV curing function) and a function of curing by a reaction of a curing agent blended in one of the two liquids to be mixed (reaction curing function). When a two-component mixed type ultraviolet curing adhesive having such a function is applied to an adhesive portion between a substrate of a coin sorting device and a sensor core and an adhesive portion between the substrate and a sensor coil, and then irradiated with ultraviolet light (UV), UV-irradiated part 2
The liquid mixture type ultraviolet curing adhesive is cured by the UV curing function, and exhibits the bonding function in a short time.

However, UV is partially shielded from light, and there is a portion that is not irradiated. Even in such a two-part mixed type ultraviolet curing adhesive at the bonding portion, the adhesive is cured at room temperature by the reaction curing function of the curing agent, gels in a short time, and exhibits the bonding function.

On the other hand, the moisture-reaction-curable hot-melt adhesive is applied in a heated and molten state, and then cooled and cooled down in an extremely short time to perform an adhesive function (initial adhesive function).
And has a function of reacting and curing by the moisture in the atmosphere (reaction curing function) simply by leaving it at room temperature. Therefore, the sensor coil and the sensor core can be bonded to the substrate in a short time only by applying the moisture-reaction-curable hot-melt adhesive in a molten state and then leaving it at room temperature. Further, by the reaction curing function, the moisture reaction curing type hot melt adhesive is cured until it has strong adhesive strength. Therefore, an adhesive structure having high environmental resistance such as heat resistance and cold resistance can be realized.

As described above, the room temperature reaction type adhesive represented by the two-part mixture type ultraviolet curing adhesive and the moisture reaction curing type hot melt adhesive exhibits an initial bonding function in a short time, and Since no heating is required, a batch-type heat curing step is not required. Therefore, the productivity is improved, and the production efficiency is not limited by the heat curing treatment capacity or the curing time. Also, many jigs for fixing the sensor core and the sensor coil to the substrate are not required. Furthermore, since the time until bonding is short, there is a low risk that the sensor coil will be displaced before bonding and fixing are completed.

When positioning the sensor core and the sensor coil on the substrate, an elastic fixing spacer is arranged in a compressed state between the sensor core and the sensor coil, and the fixed spacer is compressed. When the above-mentioned adhesive is applied while the sensor coil is pressed against the substrate due to the returning force from the sensor coil, no displacement of the sensor coil occurs until the adhesive exerts the adhesive function. Therefore, it is possible to prevent a variation in the accuracy of the coin sorting sensor for judging coins.

[0027]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS First Embodiment Next, a coin sorting sensor of a coin sorting apparatus according to a first embodiment of the present invention will be described below with reference to FIG.

FIG. 1 is a sectional view of a coin sorting sensor.
As shown in this figure, a coin sorting sensor 5 is provided on a substrate 9 of a coin sorting apparatus having the same structure as that of FIG. 9 by using a two-liquid mixed type acrylic ultraviolet curing adhesive (hereinafter, referred to as a two-liquid mixed type UV adhesive) 13a. The sensor coil 11 includes a bonded sensor coil 11 and a sensor core 12 (a ferrite core) bonded to the substrate 9 with a two-liquid mixed type UV adhesive 13b so as to cover the outer periphery thereof.

A method for manufacturing such a coin sorting sensor 5 will be described below. First, a coin sorting sensor 5 is mounted on a substrate 9 of a coin sorting apparatus made of a polycarbonate resin molded product.
Sensor coil 11 and sensor core 12 constituting
And a permanent magnet (not shown) from the back side via the substrate 9.
And position it. At this time, the sensor coil 11
The sensor core 12 is arranged so as to cover the outer periphery of the sensor core.

Next, the two components constituting the two-component mixed type UV adhesive
A predetermined amount of the liquid is measured and mixed by a two-liquid mixing dispenser, and the liquid is dropped into the sensor core 12 from a slit portion (not shown) of the sensor core 12, and the sensor coil 11
Is applied with a two-component mixed type UV adhesive 13a. The two-component mixed type UV adhesive 13b is also applied to the outer peripheral portion of the sensor core 12. Here, such a two-liquid mixed type U
As the V adhesive, a trade name of World Lock No. 845
Those manufactured by Kyoritsu Chemical Industry Co., Ltd.
A product manufactured by Toyo Ink Mfg. Co., Ltd., which is commercially available under the trade name of DIMAX BX89-13, can be given.

Next, the substrate 9 on which the sensor coil 11 and the sensor core 12 are positioned is placed on a conveyor line with their positioning surfaces facing upward, and UV
It passes through an (ultraviolet) irradiation conveyor furnace. In this UV irradiation conveyor furnace, UV (ultraviolet rays) are irradiated downward, and the UV
The liquid mixture type UV adhesive 13b is irradiated with UV. This U
A high-pressure mercury lamp is installed in the V irradiation conveyor furnace, and the high-pressure mercury lamp has a UV irradiance of 250 mW / cm.
² , UV irradiation amount is 3000mJ / cm ²
(Ultraviolet light). By this UV irradiation, 2
The liquid mixture type UV adhesive 13b is cured by the adhesive, and the sensor core 12 is bonded to the substrate 9 in a short time.

At this time, the two-liquid mixed type UV adhesive 13a inside the sensor core 12 cannot be cured by the UV because the UV is blocked by the sensor core 12. However, this two-component mixed type UV adhesive 13a, 1
3b, a curing agent is mixed, and the curing reaction proceeds even at room temperature due to the reaction curing function of the curing agent.
It gels in about 5 to 30 minutes. Due to such a curing reaction, the two-component mixed type UV adhesive 13a applied to the bonding portion between the sensor coil 11 and the substrate 9 is cured, exhibits an adhesive function, and the sensor coil 11 and the substrate 9 are bonded. .
After that, other components constituting the coin sorting circuit are attached to the board 9.

In order to improve the adhesion between the substrate 9 and the attached components, the substrate 9 is annealed in the final step. Even by this annealing, the two-liquid mixed type UV adhesive 13a at the bonding portion of the sensor coil 11 to which the UV has not been irradiated is hardened with the adhesive.

As described above, in the present embodiment, the bonding between the substrate 9 and the sensor coil 11 and the sensor core 12 is performed in two steps.
Since the liquid mixture type UV adhesives 13a and 13b are used, they can be bonded in a short time by the UV curing function by the UV irradiation and the reaction curing function by the curing agent. In particular, since the two-component mixed type UV adhesive 13b at the bonding portion between the substrate 9 and the sensor core 12 is cured in a very short time by UV curing, it is possible to immediately proceed to the next step. Therefore, the conventional batch-type heat curing process is not required, and the component can be mounted on the conveyor line like other components mounted on the substrate 9. Therefore, a remarkable improvement in productivity can be realized.

Further, the necessary UV irradiation conveyor furnace only needs to be arranged on the conveyor line which has been conventionally used for mounting other parts, and a heating and curing furnace is not required. realizable.

Further, it is not necessary to prepare a large number of permanent magnets for restraining the sensor core and the sensor coil on the substrate.

Since the sensor core 11 and the sensor coil 12 are bonded in a short time, vibration and impact are applied to the substrate 9 before the bonding is completed.
Since the problem that the positional relationship between the sensor coil 1 and the sensor coil 12 is shifted hardly occurs, the quality of the coin sorting sensor 5 can be stabilized.

In this example, acrylic was used as the two-component mixed type UV adhesive. However, the present invention is not limited to this. Epoxy or the like may be used, and a UV curing function by UV irradiation and a reaction curing function by a curing agent are used. Any adhesive provided may be used.

Second Embodiment Next, a coin sorting sensor of a coin sorting apparatus according to a second embodiment of the present invention will be described below with reference to FIG.

FIG. 2 is a sectional view of the coin sorting sensor.
As shown in this figure, a coin sorting sensor 15 is provided on a substrate 19 of a coin sorting apparatus having the same structure as that of FIG. It has a sensor coil 21 bonded by a cured adhesive 23a, and a sensor core 22 (ferrite core) bonded to the substrate 19 by a two-liquid mixed type UV adhesive 23b while covering the outer periphery thereof. A fixing spacer 24 shown in FIG. 3 is disposed between the sensor coil 21 and the sensor core 22.

FIG. 3 is a cross-sectional view of the fixing spacer 24, which is a disk-shaped sponge-type spacer made of a flexible plastic foam.
A through hole 24c is formed in the center of 24b. As shown in FIG. 2, a convex portion 22 a at the center of the inside of the sensor core 22 is passed through the through hole 24 c, and one end surface 24 b of the fixing spacer 24 contacts the inner surface of the sensor core 22 and the other end surface 24 a The fixing spacer 24 is disposed in a state where the space between the end faces 24a and 24b is compressed so that the end faces the end faces of the sensor coil 21.
Here, the fixing spacer 24 has flexibility,
The sensor coil 2 is restored by the return force from the compressed state.
1 is in a state of being pressed against the substrate 19.

A method for manufacturing the coin sorting sensor 15 having such a configuration will be described below. First, the substrate 19 of the coin sorting device
Similarly to the first embodiment, the sensor coil 21 and the sensor core 22 constituting the coin sorting sensor 15 are applied to a fixing jig (not shown) having a built-in permanent magnet from the back side via the substrate 19. , The sensor coil 22 is arranged so as to cover the outer periphery of the sensor coil 21. At this time, the fixing spacer 24 is arranged between the sensor coil 21 and the sensor core 22 in a compressed state, and the sensor coil 21 is positioned so as to be pressed against the substrate 19 by the restoring force.

In this state, as in the first embodiment, the two-liquid mixed type UV adhesive 23a is applied to the bonding portion of the sensor coil 21, and the two-part mixed type UV adhesive is also applied to the outer peripheral portion of the sensor core 22. 23b is applied.

Next, the substrate 19 on which the sensor coil 21 and the sensor core 22 are positioned is placed on a conveyor line with their positioning surfaces facing upward, and the UV
The two-liquid mixed type UV adhesive 23b is cured through an (ultraviolet) irradiation conveyor furnace. In this state, the fixing jig that restrains the sensor coil 21 and the sensor core 22 on the substrate 19 is removed.

Thereafter, the substrate 19 on which the sensor coil 21 and the sensor core 22 are mounted is transported on a conveyor line to a process for mounting other components.

On the other hand, the two-component mixed type UV adhesive 23a inside the sensor core 22, which is blocked by the sensor core 22 and is not irradiated with UV, is cured by the reactive curing function of the mixed curing agent. The sensor coil 21 and the substrate 19 are bonded. Also, by the annealing performed in the final step, the two-liquid mixed type UV adhesive 23a,
23b is cured with an adhesive.

In the present embodiment, a two-component mixed type UV adhesive which exhibits an adhesive function in a short time is used, and further, a heat curing step is not required. Therefore, since each process can be performed by a flow operation on a conveyor line, mass productivity is excellent. Here, the fixing spacer 24 is arranged in a compressed state between the sensor coil 21 and the sensor core 22, and the sensor coil 21 is positioned in a state of being pressed against the substrate 19 by the return force thereof. I have. Therefore,
Even if vibration is applied to the substrate 19 before the two-liquid mixed type UV adhesive 23a at the bonding portion between the substrate 19 and the sensor coil 21 is cured, the sensor coil 21 does not shift. For this reason, it is possible to always manufacture the coin sorting sensor 15 having no variation in the accuracy of coin determination. Further, since the fixing jig is removed before the other parts are attached after the UV irradiation, the number of fixing jigs may be the minimum necessary.

Third Embodiment Next, a coin sorting sensor of a coin sorting apparatus according to a third embodiment of the present invention will be described below with reference to FIG.

FIG. 4 is a sectional view of the coin sorting sensor.
As shown in this figure, the coin sorting sensor 25 is bonded to a substrate 29 of a coin sorting device having the same structure as that of FIG. 9 by a moisture-reaction-curable hot-melt adhesive (hereinafter, referred to as a moisture-curable HM adhesive) 33a. In the state where the sensor coil 31 and the outer periphery of the sensor coil 31 are covered,
And a sensor core 32 (ferrite core) bonded by an adhesive 33b. Here, a fixing spacer 34 shown in FIG. 5 is arranged between the sensor coil 31 and the sensor core 32.

FIG. 5 is a cross-sectional view of the fixing spacer 34. The fixing spacer 34 is a ring-shaped spacer made of polyethylene terephthalate and has a semicircular cross section. As shown in FIG. 4, the edge 34a on one surface side is in contact with the inner surface of the sensor core 32, and the other surface 34b having a curved surface is
The fixing spacer 34 is disposed in a compressed state between the edge 34a and the surface 34b so as to be in contact with the end surface of the sensor coil 31. The repulsive force of the curved surface causes the sensor coil 31 to be pressed against the substrate 29. It is positioned in the state where it was set.

A method of manufacturing the coin sorting sensor 25 having such a configuration will be described below. First, the substrate 29 of the coin sorting device
The moisture-curable HM adhesives 33a and 33b heated to about 120 ° C. and melted are applied to predetermined positions by using an applicator gun.

Next, the moisture-curable HM adhesive 33a, 33
The sensor coil 31 and the sensor core 32 are positioned during about 5 to 15 seconds until b cools. here,
The sensor coil 31 and the sensor core 32 are previously assembled by disposing the fixing spacer 34 in a compressed state therebetween, and the sensor coil 31 and the sensor core 32 are held on the substrate 29 in this state. It is pressed against the substrate 29 using a jig (not shown) and positioned.

Thereafter, the moisture-curable HM adhesives 33a and 33b are cooled at room temperature for 30 to 60 seconds, and the moisture-curable HM adhesives 33a and 33b are cooled.
By exhibiting the initial bonding function of the M adhesives 33a and 33b,
The sensor coil 31 and the sensor core 32 are bonded to the substrate 29. Thus, the initial bonding is completed, and the holding jig is removed. Thereafter, the substrate 29 is transported to a process for attaching another component.

In this state, the moisture-curable HM adhesive 33
Although a and 33b have not reached reaction hardening, after 3 to 9 hours at room temperature, they are reactively hardened by moisture in the atmosphere, and the moisture-curable HM adhesives 33a and 33b have extremely strong adhesive strength. Present.

Here, examples of the moisture-curable HM adhesive used are Hybon 4810, 4830, and 486 (trade names).
0, manufactured by Hitachi Chemical Polymer Co., Ltd., trade names Dicktight H-130, H-210,
H-610, H-930, H-950, H-960 manufactured by Dainippon Ink and Chemicals, Inc., trade names Esdine 9601, 9605, 9606,
9607, which is commercially available from Sekisui Chemical Co., Ltd., and the like.

As described above, in the present embodiment, a moisture-curing HM adhesive which exhibits an initial bonding function in a very short time by cooling and reacts and cures after standing is used as an adhesive. The sensor coil 31 and the sensor core 32 can be efficiently bonded and fixed to the substrate 29. Therefore, all the steps can be performed as a flow operation on the conveyor line, and thus, excellent mass productivity is achieved. Further, similarly to the second embodiment, the sensor coil 3
1 and the sensor core 32, the fixing spacer 34 is arranged in a compressed state, and the fixing spacer 34
, The sensor coil 31 is pressed against the substrate 29. Therefore, the moisture-curable HM adhesive 33a,
While 33b is not fully exerting its adhesive function, the substrate 2
Even if vibrations or the like are applied to 9, no displacement of the sensor coil 31 occurs. For this reason, a highly accurate coin sorting sensor can always be manufactured. Moreover, no equipment for curing the adhesive is required. The used moisture-curable HM adhesives 33a and 33b exhibit a strong adhesive function with the passage of time, and thus have high environmental resistance.

In this embodiment, the substrate is previously coated with a moisture-curable H
Although the sensor coil and the sensor core are positioned after applying the M adhesive, the moisture curing type HM adhesive may be applied after the sensor coil and the sensor core are positioned on the substrate by changing the process order.

As described above, in the second and third embodiments, the sponge type spacer and the ring type spacer are used as the fixing spacer to prevent the sensor coil from being displaced. The spacer for use may have a shape shown in FIGS. 6 to 8 in addition to the above shape.

FIG. 6 is a cross-sectional view of a disc spring-type fixing spacer 41. In a state where the space between the bottom 41a of the dish shape and the other edge 41b is compressed, the sensor core and the sensor coil are connected. Use it by placing it in between. Here, a disc spring type spacer of another shape may be used as long as it has a restoring force against compression on both surfaces.

FIG. 7 is a front sectional view of a leaf spring type fixing spacer 42 having a corrugated plate-shaped cross section, and FIG. 8 is a side sectional view of the fixing spacer 42 having a central flat surface 42b having a mounting hole 42a. And the flat surfaces 42c and 42d on both sides are compressed and used between the sensor core and the sensor coil. Here, as long as it has a curved portion like a corrugated plate and the curved portion has a restoring force, a leaf spring type spacer of another shape may be used.

Further, as a fixing spacer, Example 2 was used.
In the above, a plastic foam was used, and in Example 3, a ring made of polyethylene terephthalate was used. However, the material is not limited, and the repulsive force urges the sensor coil toward the substrate and can be pressed. I just need. Further, the fixing spacer may be cut from a sheet made of polyethylene terephthalate, polypropylene, or the like and processed into a predetermined shape, or may be formed by directly molding those materials.

The room-temperature reactive adhesive according to the present invention may be a two-part mixed type ultraviolet curable adhesive, a moisture reactive curable hot melt adhesive, or a quick-curing adhesive which exhibits an initial adhesive function by a short-time heat treatment. Adhesive, an adhesive exhibiting an initial adhesive function by irradiation with an electron beam, and these adhesives may have a property of reacting and hardening later in a temperature atmosphere at normal temperature or higher. .

[0063]

As described above, in the coin sorting device provided with the coin sorting sensor and the method of manufacturing the same according to the present invention, the sensor core and the sensor coil constituting the coin sorting sensor are combined with a two-component mixed type ultraviolet curing adhesive. It is characterized in that it is bonded to the substrate with a room temperature reaction type adhesive such as a moisture reaction hardening type hot melt adhesive, so that the following effects are obtained.

The room-temperature reactive adhesive exhibits an initial bonding function in a short time without a long heating operation,
Thereafter, the adhesive is cured. Therefore, a batch-type heat curing step for a long time is not required, and mass production by flow production is possible. Therefore, the productivity of the coin sorting device provided with the coin sorting sensor can be improved.

Since bonding and fixing can be performed in a short time,
The displacement of the sensor coil hardly occurs during the assembly process. Therefore, a coin sorting device provided with a high quality coin sorting sensor can be manufactured.

When a two-component mixed type ultraviolet curing adhesive is used as the room-temperature reactive adhesive, the adhesive can be bonded in a short time by curing by UV irradiation, and a curing reaction using a curing agent can be used. Therefore, since a heat curing step is not required, mass production by flow production is possible.

As a two-part mixed type ultraviolet curing adhesive,
When a liquid mixture type acrylic ultraviolet curing adhesive is used, a coin sorting device having a coin sorting sensor having a high weather resistance of the adhesive and a short curing time and a manufacturing method thereof can be realized.

When a moisture-reactive curable hot-melt adhesive is used as the room-temperature reactive adhesive, the adhesive can be bonded in an extremely short time due to the initial bonding function by cooling, and the reactive hardening by moisture can be used. Therefore, high productivity can be realized without requiring a curing device such as a heat curing device.

When the elastic fixing spacer is arranged in a compressed state between the sensor coil and the sensor core, the sensor coil is pressed against the substrate by a return force from the compressed state of the fixing spacer. No displacement of the sensor coil occurs. Therefore,
Since there is no variation in the accuracy of determining coins, a coin sorting device provided with a high-quality coin sorting sensor can always be manufactured.

When the above steps are sequentially performed on a conveyor line, extremely high productivity can be realized.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating a structure of a coin sorting sensor of a coin sorting device according to a first embodiment of the present invention.

FIG. 2 is a sectional view showing a structure of a coin sorting sensor of a coin sorting apparatus according to a second embodiment of the present invention.

FIG. 3 is a cross-sectional view illustrating a structure of a fixing spacer used in a coin sorting sensor according to a second embodiment of the present invention.

FIG. 4 is a sectional view showing a structure of a coin sorting sensor of a coin sorting apparatus according to a third embodiment of the present invention.

FIG. 5 is a cross-sectional view illustrating a structure of a fixing spacer used in a coin sorting sensor according to a third embodiment of the present invention.

FIG. 6 is a cross-sectional view showing a structure of a fixing spacer having a structure different from that of the fixing spacer shown in FIG.

FIG. 7 is a front sectional view showing a structure of a fixing spacer having still another structure.

8 is a side sectional view showing the structure of the fixing spacer shown in FIG. 7;

FIG. 9 is a schematic configuration diagram of a coin sorting device provided with a coin sorting sensor.

FIG. 10 is a sectional view showing the structure of a conventional coin sorting sensor.

[Explanation of symbols]

 Reference Signs List 1 coin sorting device 5 coin sorting sensor 15 coin sorting sensor 25 coin sorting sensor 9 coin sorting device substrate 19 coin sorting device substrate 29 coin sorting device substrate 11 sensor coil 21 sensor coil 31 sensor coil 12 sensor core 22 sensor core 32 Sensor core 13a Two-component acrylic UV curing adhesive 13b Two-component acrylic UV curing adhesive 23a Two-component acrylic UV curing adhesive 23b Two-component acrylic UV curing adhesive 33a Moisture reactive curing Type hot melt adhesive 33b Moisture reaction curing type hot melt adhesive 24 Fixing spacer 34 Fixing spacer 41 Fixing spacer 42 Fixing spacer

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-61-28568 (JP, A) JP-A-49-2853 (JP, A) Real opening Sho-64-44483 (JP, U) (58) Field (Int.Cl. ⁶ , DB name) G07D 5/08 C09J 4/02

Claims (10)

(57) [Claims] 1. A coin sorting device in which a sensor core and a sensor coil of a coin sorting sensor are adhered to a substrate of the coin sorting device by an adhesive, wherein the adhesive is a room-temperature reactive type made of a two-component mixed type ultraviolet curing adhesive. An adhesive, wherein the coin sorting sensor is an adhesive that can be irradiated with ultraviolet light and an ultraviolet light is shielded between the substrate and the sensor core and the sensor coil, as an adhesive part of the room-temperature reactive adhesive. And a coin sorting device comprising a coin sorting sensor. 2. A coin sorting apparatus according to claim 1, wherein said two-part mixed type ultraviolet curing adhesive is a two-part mixed type acrylic ultraviolet curing adhesive. 3. The coin sorting sensor according to claim 1, wherein an elastic fixing spacer is arranged in a compressed state between the sensor core and the sensor coil. A coin sorting device equipped with 4. A coin sorting device in which a sensor core and a sensor coil of a coin sorting sensor are adhered to a substrate of the coin sorting device with an adhesive, wherein the adhesive is a room-temperature reactive adhesive, and A coin sorting device provided with a coin sorting sensor, wherein a fixing spacer having elasticity is arranged between the sensor coil and the sensor coil in a compressed state. 5. The coin sorting device according to claim 4, wherein the room temperature reactive adhesive is a moisture reactive curing type hot melt adhesive. 6. A method for manufacturing a coin sorting device in which a sensor core and a sensor coil of a coin sorting sensor are adhered to a substrate of the coin sorting device with an adhesive, a step of positioning the sensor core and the sensor coil on the substrate. Applying a two-part mixed type ultraviolet curable adhesive to an adhesive portion between the substrate and the sensor core and an adhesive portion between the substrate and the sensor coil; and irradiating at least a part of the adhesive portion with ultraviolet light. And a method of manufacturing a coin sorting device provided with a coin sorting sensor. 7. The method for manufacturing a coin sorting apparatus according to claim 6, wherein said two-part mixed type ultraviolet curing adhesive is a two-part mixed type acrylic ultraviolet curing adhesive. 8. A method for manufacturing a coin sorting device comprising a coin sorting sensor according to claim 6, wherein each of the steps is sequentially performed on a conveyor line. 9. A method of manufacturing a coin sorting device, wherein a sensor core and a sensor coil of a coin sorting sensor are adhered to a substrate of the coin sorting device by an adhesive. Applying a heated and melted moisture-reactive curable hot-melt adhesive to an adhesive portion with the sensor coil, and before the moisture-reactive curable hot-melt adhesive is cooled, the sensor core is attached to the substrate. And a step of positioning the sensor coil, wherein each of the steps is sequentially performed on a conveyor line, the method for manufacturing a coin sorting device provided with a coin sorting sensor. 10. The step of positioning the sensor core and the sensor coil on the substrate according to any one of claims 6 to 9, wherein an elastic fixing member is provided between the sensor core and the sensor coil. A coin sorter provided with a coin sorter sensor, wherein the spacer is arranged in a compressed state, and the sensor coil is positioned in a state of being pressed against the substrate by a return force from the compressed state of the fixing spacer. Device manufacturing method.