JP2865985B2 - Reflow soldering equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a reflow soldering apparatus for soldering a wiring board or the like in a low oxygen concentration atmosphere.

[0002]

2. Description of the Related Art FIG. 5 is a sectional side view showing an example of a conventional reflow soldering apparatus for performing soldering in a low oxygen concentration atmosphere.

In this drawing, reference numeral 1 denotes a wiring board, and 2 denotes an entire reflow soldering apparatus which fills an inert gas and solders the wiring board 1 in a low oxygen concentration atmosphere. Reference numeral 3 denotes a conveyor provided in a transfer path of the wiring board 1, and 4 denotes a heating unit which forms a furnace of the reflow soldering apparatus 2, and includes a first heating unit 4A, a second heating unit 4B of a preheating unit, and a heating unit of a reflow unit. It comprises a third heating section 4C. Reference numeral 5 denotes a heating means such as a hot-wire type heater for emitting heat rays, 6 denotes a labyrinth part, 6A denotes a labyrinth part on the loading side (entrance side) of the wiring board 1, and 6B denotes a discharge side (outlet side). The labyrinth portion 7 is a depressing plate provided in the labyrinth portions 6A and 6B for suppressing the outflow of the furnace atmosphere in the heating portion 4 and is made of a plate-like member and intersects the X direction in the transport direction of the wiring board 1. Are arranged side by side. 8 is a supply source of an inert gas such as N ₂ , 9 is a piping section, 10
Is a flow control valve.

That is, the wiring board 1 is sequentially conveyed from the first and second heating units 4A and 4B provided with the heating means 5 such as a heater to the third heating unit 4C (from the preheating unit to the reflow unit). Preheating and reflow soldering of the wiring board 1 are performed.

In addition, an inert gas (eg, N ₂ ) is supplied from an inert gas supply source 8 into the furnace including the heating section 4 and introduced therein to enable soldering in a low oxygen concentration atmosphere. I have.

On the other hand, at the entrance and the exit for carrying in and carrying out the wiring substrate 1, a suppression plate 7 for suppressing thermal convection of the atmosphere in the furnace and outflow to the outside of the furnace is provided side by side, so that the atmosphere in the furnace is outside the furnace. The labyrinth portions 6A and 6B are configured to suppress the rise of the oxygen concentration in the furnace due to the outflow and the invasion of the atmosphere into the furnace.

[0007]

By the way, in the conventional reflow soldering apparatus 2 as described above, the labyrinth portions 6A and 6B are provided at the inlet and the outlet of the reflow soldering apparatus 2, so that the outflow of the atmosphere in the furnace is performed. And the flow of air into the furnace can be suppressed.

However, the provision of the labyrinth portion 6 increases the furnace length (the length of the wiring board 1 in the transport direction). Therefore, when the labyrinth portion 6 is made longer, the effect of suppressing the outflow of the atmosphere in the furnace and the inflow of the atmosphere into the furnace can be further enhanced as described above, but since the furnace length becomes longer, reflow soldering is performed. There is a problem that the entire device 2 becomes large.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned conventional problems, and is intended to reduce the length of a furnace without impairing an inert gas atmosphere in a reflow soldering apparatus. The aim is to obtain a device.

[0010]

According to the present invention, a plurality of heating means for heating a wiring board by radiating a heat ray are provided along a conveying direction of the wiring board. juxtaposed suppression plate comprising a plate-like member in a direction intersecting the transport direction of the wiring board between the substrate transport path
And the labyrinth part with the heating means on the inlet or outlet side
It is provided integrally and has a shorter overall length .

[0011] The suppression plate has a surface on which a layer of a far-infrared radiating substance that emits far-infrared rays is formed.

[0012]

According to the present invention, the wiring board is heated by passing the heat rays radiated from the heating means between the suppression plates arranged in the heating section. On the other hand, the suppression plate prevents the inert gas atmosphere in the furnace from flowing out into the atmosphere and the air from entering the furnace. Further, far-infrared rays are generated by the layer of the far-infrared emitting material, and the wiring board is efficiently heated.

[0013]

FIG. 1 is a side sectional view showing an embodiment of the present invention, FIG. 2 is an enlarged side sectional view of a main part of FIG. 1, and FIG. 3 is an enlarged plan view showing a heater portion of FIG. . In these figures,
5 denote the same parts, and 11 denotes the entire reflow soldering apparatus of the present invention.

As described above, this embodiment is characterized in that a flow path composed of a labyrinth portion 6A is formed between the hot wire type heating means 5 of the first heating portion 4A and the conveyor 3 of the wiring board 1. There is. The labyrinth section 6 is provided on at least one of the inlet side and the outlet side of the reflow soldering apparatus 11, and the far-infrared panel heater 12 is provided above the first heating section 4A as the heating means 5 and the lower side is provided. Is provided with a far infrared ray pipe heater 13.
The plate-like member forming the flow path of the labyrinth 6, that is, the suppression plate 7, is provided between the heaters 12 and 13 and the conveyor 3. In addition, the far-infrared pipe heater 13 is provided with each depressing plate 7 as shown in FIGS.
It is a configuration to be disposed between them.

However, both the upper and lower sides are provided with the far infrared panel heater 12 or the far infrared pipe heater 13.
The configuration may be unified.

As described above, since the heat rays radiated from the heating means 5 pass between the suppression plates 7 forming the flow path of the labyrinth portion 6A, the wiring board 1 can be heated. On the other hand, the deterrent plate 7 suppresses the outflow of the atmosphere in the furnace into the atmosphere and the intrusion of the atmosphere into the furnace.

Therefore, it is possible to shorten the furnace length while maintaining the good atmosphere sealing properties inside and outside the furnace.
Further, if the labyrinth portion 6 is additionally provided following the heating portion 4, it is possible to realize a much better atmosphere sealing property even with the same furnace length as that of the conventional device.

FIG. 4 is a side sectional view showing another example of the heating means shown in FIG. 2, and the same reference numerals as those in FIG. 1 denote the same parts. The heating section 4 having excellent heating efficiency can be formed by coating the surface of the heating section 4.

As described above, by providing the layer of the far-infrared radiating substance 14 on the surface of the suppression plate 7, far-infrared rays are also radiated from the heated suppression plate 7 to be used for heating the wiring board 1,
Heating by the heating means 5 can be performed more effectively.

[0020]

As described above, according to the present invention, a plurality of heating means for radiating a heat ray to heat a wiring board are provided along the transport direction of the wiring board, and at least an inlet side or an outlet side heating means is provided. inlet side or heating the hand of the outlet side labyrinth portion by <br/> juxtaposed inhibit plates made of a plate-like member in a direction intersecting the transport direction of the wiring board between the transport path of the wiring substrate
Since the entire length is shortened by being provided integrally with the step, it is possible to achieve both sealing of the inert gas atmosphere and shortening of the furnace length of the reflow soldering apparatus. Therefore, it is possible to reduce the size of the reflow soldering apparatus and to improve the controllability of the atmosphere, and to obtain an inexpensive reflow soldering apparatus. In addition, since the suppression plate has a layer of a far-infrared radiating substance that emits far-infrared rays on its surface, it can effectively heat the wiring board and has an advantage that it can form a heating section with excellent thermal efficiency. Have.

Further, since the surface of the suppression plate is formed with a layer of a far-infrared ray radiating substance that emits far-infrared rays, it is possible to effectively heat the wiring board and form a heating section having excellent thermal efficiency. Have the advantages that can be.

[Brief description of the drawings]

FIG. 1 is a side sectional view showing one embodiment of the present invention.

FIG. 2 is an enlarged side sectional view showing a main part of FIG.

FIG. 3 is an enlarged plan view showing a heater portion of FIG. 2;

FIG. 4 is a side sectional view showing another example of the heating means of FIG. 2;

FIG. 5 is a side sectional view showing an example of a conventional reflow soldering apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Wiring board 3 Conveyor 4 Heating part 5 Heating means 6 Labyrinth part 7 Suppression plate 11 Reflow soldering device 14 Far infrared radiation material

Claims (2)

(57) [Claims] 1. A reflow soldering apparatus for soldering a wiring board in an atmosphere of a low oxygen concentration filled with an inert gas, wherein a plurality of heating means for heating the wiring board by radiating heat rays are provided on the wiring board. provided along the conveying direction of, parallel to at least the inlet side or inhibit plates made of a plate-like member in a direction intersecting the transport direction of the wiring board between said heating means on the outlet side and the transport path of the wiring substrate Set up
Integrate the labyrinth with the heating means on the inlet or outlet side
A reflow soldering machine characterized by being provided with a shorter overall length . 2. The reflow soldering apparatus according to claim 1, wherein the restraining plate has a surface formed with a layer of a far-infrared radiating substance that emits far-infrared rays.