JP2869183B2 - Bending method and apparatus - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a method and an apparatus for bending a sheet material.

(Conventional technology) Conventionally, in bending of a long material, the processing conditions have been determined by a skilled worker based on experience or by preliminary experiments before bending. However, reliable processing conditions could not be determined by this method.

On the other hand, in recent years, as an attempt to predict a bending angle, for example, a bending method disclosed in Japanese Patent Application No. 2-133536 filed by the present applicant has been proposed.

(Problems to be Solved by the Invention) However, in the above-described conventional bending method, an abnormality of the bending apparatus cannot be found until a defect is detected in the product after the bending.

The present invention has been made in view of the above points, and an object thereof is to measure the behavior of a bending device and compare the measured value with a predetermined amount to detect a defect in a product before detecting a defect of a product. It is an object of the present invention to provide a bending method and apparatus capable of detecting abnormalities in the bending.

(Means for Solving the Problems) In order to achieve the above object, the present invention provides a method of bending at least one of a lower die and an upper die to bend a long plate material placed on the lower die. The amount of movement from when at least one of the lower mold and the upper mold starts to move until the lower mold reaches the upper limit position or the upper mold reaches the lower limit position is measured at at least one place. In a bending method for comparing a given amount of movement and notifying an abnormality when the difference is larger than a predetermined amount, the bending method includes a mechanism for determining a position at which a plate material is bent, and the bending position is determined at least at one position. Measure,
Compare the bending position given to the NC device with the measured bending position,
When the difference is larger than a predetermined amount, an abnormality is notified, and a mechanism for correcting the longitudinal elastic deformation amount of the lower die or the upper die is provided. Measure the elastic deformation correction amount given to the NC device at one location, and compare the measured elastic deformation correction amount. If the difference is greater than a predetermined amount, notify the abnormality. If the difference from the value given to the NC unit is larger than the predetermined amount more than once consecutively, calculate the correction amount given to each NC unit based on each difference, and correct the value given to each NC unit. In addition, in a bending apparatus that includes an upper mold and a lower mold, and moves at least one of them to bend a long plate material placed on the lower mold, at least one of the lower mold and the upper mold Starts moving and the lower die is up A movement amount detection sensor that detects a movement amount until the limit position or the upper die reaches the lower limit position, a bending position detection sensor that detects a bending position of the long plate material, and a longitudinal elastic deformation of the lower die or the upper die. An elastic deformation amount correction mechanism for correcting the amount, a deformation correction amount detection sensor for detecting a longitudinal elastic deformation correction amount by the elastic deformation amount correction mechanism,
A deformation amount detection sensor that detects the amount of elastic deformation in the longitudinal direction of the upper mold or lower mold when the lower mold reaches the upper limit position or the upper mold reaches the lower limit position, and the lower mold reaches the upper limit position or the upper mold reaches the lower limit position A pressure detection sensor that detects the pressure when the pressure is applied, and the measured values of the movement amount detection sensor, the bending position detection sensor, the deformation correction amount detection sensor, the deformation amount detection sensor, and the pressure detection sensor, and the measurement values. A reference value to be compared with the reference value is obtained, and a bending angle of the long plate material after the bending process is predicted based on a value measured by the movement amount detection sensor and the deformation amount detection sensor, and is compared with the bending angle. Abnormality diagnosis means for taking a value, wherein at least one of a difference between each of the measured values and each of the reference values to be compared with the measurement value and a difference between the bending angle and the reference value is a predetermined value. Than value Characterized in that it has to inform the abnormality to the operator when it is diagnosed and heard.

(Function) According to the bending method of the present invention, when at least one of the lower mold and the upper mold is moved to bend the plate material placed on the lower mold, the movement amount and elasticity of the upper mold and the lower mold are changed. The amount of deformation is measured by a sensor, and these measured values are compared with numerical values given to the NC device, etc., and when the difference is larger than a predetermined amount, the operator is determined to be abnormal, and In this case, the abnormality and the abnormal part of the device can be found, and inspection and maintenance can be performed. Therefore, it is possible to prevent the occurrence of defective products after bending.

(Embodiment) An embodiment of the present invention will be described for the case where the upper die moves.

 1 to 3 show an example of a bending apparatus.

As shown in FIGS. 1 (a) and 1 (b), in this bending apparatus, the ram 2 is driven by the pressurizing cylinder 1, and the plate 3 is attached to the upper mold 4 attached to the ram 2 and the bed 5. Bending is performed by sandwiching the lower mold 6 with the lower mold 6.

That is, an upper mold moving amount detecting sensor 7 for detecting the moving amount of the upper mold is provided at the end of the ram 2, and the bed 5 or the lower mold 6 has a deformation amount detecting sensor for detecting an elastic deformation amount in the longitudinal direction. Sensors 8A and 8B are provided respectively.

Further, the same deformation amount detection sensors 8C and 8D are provided on the ram 2 at the corresponding positions.

Then, the signal data from each sensor and the data to be given to the NC unit 25 are input to the data capturing unit 26 shown in FIG. 1A, and the arithmetic and display unit which constitutes abnormality diagnosis means with the data capturing unit 26. Calculated and displayed at 27.

As described above, the configuration is such that the amount of movement of the upper mold 4 and the lower mold deformation δA, the lower mold deformation δB, and the upper mold deformation δC generated at the time of bending the plate material 3 can be detected. Further, a pressing force detection sensor 9 is attached to an inlet of the pressurizing cylinder 1.

In this case, there is no problem even if the lower die moves instead of the upper die, and there is no problem even if the bed 5 is driven instead of the ram 2.

As shown in FIGS. 2 (a), 2 (b) and 2 (c), the bending apparatus has a convex curved surface adjusting device 10 as an elastic deformation correcting mechanism for correcting an elastic deformation in a longitudinal direction.

In this convex curved surface adjusting device 10, as shown in FIG. 2 (a), both ends of an intermediate plate 12 in which a slit 14 is formed are supported, and a central portion 13 is provided at a substantially central position of the intermediate plate 12.
Is provided, and by pulling up the central portion 13 in the vertical direction, the intermediate plate 12 is curved to adjust the amount of deformation of the lower die so as to correspond to the amount of deformation of the upper die.

FIG. 2 (b) shows an intermediate plate 12 provided on the bed 5 in a horizontal direction, and a wedge-shaped part 11 corresponding to the amount of deformation due to pressure.
FIG.

FIG. 2 (c) shows an intermediate plate holder 15 having a U-shaped cross section fixed in the longitudinal direction of the bed, and a plurality of wedge-shaped parts 11 in this holder 15 in a direction perpendicular to the longitudinal direction of the bed. The wedge-shaped component 11 is provided slidably, and the convex curved surface adjusting device 10 is fixed on the slope of the wedge-shaped component 11.

That is, by driving the wedge-shaped component 11 by the drive motor 16, the amount of elastic deformation in the longitudinal direction of the bed, the ram, the lower die, or the upper die is corrected. The deformation correction amount detection sensor 18 is attached to the intermediate plate holder 15.

In this bending apparatus, as shown in FIG. 3, during bending, the bending positioning device 21 is moved by the drive motors 19 and 20, and the plate 3 is moved to the back gauge 22 and the pusher 22.
23 and determine the bending position. Bending position detection sensor
24 is attached to bed 5.

Then, as shown in FIG. 4 (a), the upper mold 4 comes into contact with the surface of the plate 3 and then descends further, so that when the upper mold 4 reaches the lower limit as shown in FIG. 3 is a predetermined angle θ
And the amount of movement is measured at the position of the upper mold 4 at this time.

Next, the steps of this embodiment will be described with reference to the flowchart of FIG.

 First, in steps 30 to 33, data is fetched.

That is, the amount of movement S of the upper die, the amount of elastic deformation δ in the longitudinal direction of the upper or lower die at the lower limit position of the upper die, the pressing force P at the lower limit position of the upper die, the deformation correction amount d, and the bending position Y is measured by the upper die movement amount detection sensor 7, the deformation amount detection sensor 8, the pressing force detection sensor 9, the deformation correction amount detection sensor 18, and the bending position detection sensor 24, and these measured values are read by the data acquisition unit 26. Take in. At the same time, the upper die moving amount NS, the longitudinal elastic deformation correction amount Nd, and the bending position NY to be given to the NC device are taken into the data taking unit 26.

Diagnosis of an abnormality of the bending apparatus is performed by the operation display unit 27 based on the data taken in, and an operator is notified of any abnormality.

A predetermined amount for diagnosing an abnormality of the bending device is shown below.

That is, the predetermined amount for diagnosing the abnormality of the upper die movement amount is AS, the predetermined amount for diagnosing the abnormality of the bending position is AY, and the predetermined amount for diagnosing the abnormal elastic deformation correction amount in the longitudinal direction is A. A
d, a predetermined amount for diagnosing an abnormal amount of elastic deformation in the longitudinal direction of the upper die or the lower die at the lower limit position of the upper die, Aδ, a predetermined amount for diagnosing an abnormality of the pressing force at the lower limit position of the upper die. AP
And Here, each predetermined amount is a positive number.

In addition, Bδ and BP are predetermined amounts that serve as comparison references when diagnosing an elastic deformation amount of the upper die or the lower die at the lower limit position of the upper die and a pressing force abnormality at the lower limit position of the upper die, respectively.

Above, when the following conditions are satisfied, it is diagnosed as abnormal.

That is, when the moving amount of the upper die is | S−NS |> AS in step 34, and when the bending position is | Y−NY |> AY in step 35, the longitudinal elastic deformation correction amount is | d−Nd | If> Ad In step 37, the amount of elastic deformation in the longitudinal direction of the upper mold or the lower mold at the lower limit of the upper mold is | δ−Bδ |> Aδ In step 38, the pressing force at the lower limit of the upper mold is | P -BP |> AP Each predetermined amount for diagnosing an abnormality of the bending apparatus may be set to the following three levels.

Level 1: When the product after bending is good, but there is a risk of becoming defective.Level 2: When the product after bending becomes defective.Level 3: When a fatal defect occurs in the bending machine. If the abnormality level is 1 or 2 in steps 34 to 36, an abnormality is displayed in step 41, and further, in step 42, the difference between the measured value and the value given to each NC device as described above, | It is determined whether or not S−NS |, | Y−NY |, | d−Nd | is greater than each of the predetermined amounts AS, AY, and Ad continuously n times. If it is larger than the predetermined amount, each difference ESm,
EYm, Edm (m = 1, 2,..., N−1, n) is calculated by the operation display unit 27 based on the following equation.

ESm = Sm = NS (m = 1,2, ..., n-1, n) EYm = Ym-NY (m = 1,2, ..., n-1, n) Edm = dm-Nd (m = 1, 2,..., N−1, n) Further, in step 43, the values MNS, MNY, and MNd to be given to the respective NC devices after the correction are calculated by the operation display unit 27 based on the following formula, and these corrected values MNS , MNY, MNd.

Here, Sm, Ym, and dm are the measured amount of movement of the upper die, the bending position, and the amount of elastic deformation in the longitudinal direction, respectively.

MNS = NS- (ES1 + ES2 + ... + ESn-1 + ESn) / n MNY = NY- (EY1 + EY2 + ... + EYn-1 + EYn) / n MNd = NY- (Ed1 + Ed2 + ... + Edn-1 + Edn) / n If the level is 3, an abnormality is displayed in step 44, and inspection and maintenance of the bending apparatus are performed in step 45.

The prediction of the bending angle is performed in step 39 based on the movement amount S of the upper mold and the elastic deformation δ in the longitudinal direction of the upper mold or the lower mold at the lower limit position of the upper mold at the lower position of the upper mold. The calculation display unit 27 predicts the bending angle θ of the product and displays it.

Diagnosis of abnormality is performed on the operation display unit 27 based on the predicted bending angle θ, and if there is abnormality, the operator is notified.

That is, assuming that the target bending angle is Pθ and the predetermined amount for diagnosing the bending angle abnormality is Aθ (positive number), it is determined in step 40 that | θ−Pθ |> Aθ is abnormal.

The predetermined amount Aθ for diagnosing an abnormality may be set to the above-described three levels. When the abnormality level is 1 or 2, an abnormality is displayed in step 46 and further continuously in step 47 for n times. It is determined whether or not both have become abnormal. If the abnormal level is 3, the process proceeds to step 44.

Next, if the pressing force is | P−BP |> AP in step 38, an abnormality is displayed in step 48, and in step 49, inspection and maintenance of the bending device are performed.

(Effect of the Invention) As described above, the present invention, when at least one of the lower mold and the upper mold is moved to bend a plate material placed on the lower mold, the movement amount and elasticity of the upper mold and the lower mold. The amount of deformation is measured by a sensor, and these measured values are compared with numerical values given to the NC device, etc., and when the difference is larger than a predetermined amount, the operator is determined to be abnormal, and , It is not necessary to detect the defect of the product after the bending, and it is possible to find the abnormality of the device and the abnormal part at an early stage.

Further, since abnormalities and abnormal parts of the apparatus can be found before the bent product becomes defective, defective production can be prevented.

In this case, since the control is performed when the difference between each measured value and the value given to each NC device is continuously increased, the bending time can be reduced.

[Brief description of the drawings]

1 (a) and 1 (b) are a front view and a side view of a bending device,
2 (a), 2 (b) and 2 (c) are views each showing a main part of an elastic deformation correction mechanism, FIG. 3 is a view showing an example of a bending positioning device, and FIGS. 4 (a) and 4 (b) are bending figures. FIG. 5 is an explanatory diagram of the angle and the upper die moving amount, and FIG. 5 is a diagram showing a flowchart of an example of the present invention. DESCRIPTION OF SYMBOLS 1 ... Cylinder for pressurization 2 ... Ram 3 ... Plate material 4 ... Upper mold 5 ... Bed 6 ... Lower mold 7 ... Upper mold moving amount detection sensor 8 ... Deformation amount detection sensor 9 ... Force detection Sensor 10 Convex curved surface adjustment device 18 Deformation correction amount detection sensor 21 Bending positioning device 24 Bending position detection sensor 25 NC device 26 Data acquisition unit 27 Calculation display unit

Claims (2)

(57) [Claims] 1. A method for bending a long plate material placed on a lower mold by moving at least one of a lower mold and an upper mold, wherein at least one of the lower mold and the upper mold starts to move. Measure the amount of movement until the lower mold reaches the upper limit position or the upper mold reaches the lower limit position at at least one location, compare the measured movement amount with the movement amount given to the NC unit, and when the difference is larger than the predetermined amount This bending method has a mechanism to determine the bending position of the plate material, measures the bending position at at least one location, and compares the bending position given to the NC device with the measured bending position. In addition, when the difference is larger than a predetermined amount, an abnormality is notified, and a mechanism for correcting the amount of elastic deformation in the longitudinal direction of the lower die or the upper die is provided. The amount of elastic deformation is measured at least at one point, and the amount of elastic deformation correction given to the NC device is compared with the measured amount of elastic deformation correction. If the difference is larger than a predetermined amount, an abnormality is notified. If the difference with the value given to the NC device is larger than each predetermined amount more than once consecutively, the correction amount given to each NC device is calculated based on the difference, and the value given to each NC device is corrected. A bending method characterized by performing. 2. A bending apparatus comprising an upper die and a lower die, wherein at least one of the upper die and the lower die is moved to bend a long plate material placed on the lower die. A movement amount detection sensor that detects the amount of movement from the start of movement until the lower die reaches the upper limit position or the upper die reaches the lower limit position, a bending position detection sensor that detects a bending position of the long plate material, and a lower die or an upper die An elastic deformation amount correction mechanism for correcting the amount of elastic deformation in the longitudinal direction, a deformation correction amount detection sensor for detecting the amount of elastic deformation in the longitudinal direction by the elastic deformation amount correction mechanism, and a lower mold having an upper limit position or an upper mold. A deformation amount detection sensor that detects the amount of elastic deformation in the longitudinal direction of the upper mold or the lower mold when the lower mold reaches the lower limit position, and a pressure detection sensor that detects the pressing force when the lower mold reaches the upper limit position or the upper mold reaches the lower limit position. Pressure detection And the measurement values by the movement amount detection sensor, the bending position detection sensor, the deformation correction amount detection sensor, the deformation amount detection sensor and the pressing force detection sensor, and the reference value to be compared with the measurement values are taken in. And an abnormality diagnosing means for predicting a bending angle of the long plate material after bending and measuring a reference value to be compared with the bending angle based on measured values of the movement amount detection sensor and the deformation amount detection sensor, An abnormality when the abnormality diagnosis unit diagnoses that at least one of a difference between each of the measured values and each of the reference values to be compared with the measured value and a difference between the bending angle and the reference value is larger than a predetermined value. A bending apparatus characterized in that it is notified.