JP2869943B2 - Hybrid IC with relay board with resistance - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid IC capable of obtaining various signal processing functions, and more particularly to an improved resistor as an electronic component used in an internal circuit.
The present invention relates to a hybrid IC having a relay board with a resistor provided with a relay board and used in an ultra-high frequency band.

[0002]

2. Description of the Related Art FIG.
It is a fragmentary perspective view showing C. Hybrid IC substrate 2
On 0, a predetermined wiring pattern 21 is formed in advance. The wiring pattern 21 includes a signal pattern 21a forming a signal path, and an earth pattern 21b formed on the entire surface of the substrate excluding the signal pattern 21a. Various circuit elements are fixedly arranged along the signal pattern 21a by soldering or the like.

The circuit element shown in FIG. 1 is a multilayer ceramic capacitor 22 as a coupling capacitor, and terminals 22a at both ends are fixedly arranged on a signal pattern 21a. The end of the signal pattern 21a of the capacitor 22 is connected to the ground pattern 21b. A resistance film 23 of several ohms is provided at this connection to prevent resonance of the capacitor 22.

Next, FIG. 5 is a plan view showing another conventional example, in which a relay board 30 and a resistor 31 are provided on the ground pattern 21b of the substrate 20, respectively. The capacitor 22 is provided on the base 30. A wire 32 is connected between the relay stand 30 and the resistor 31 and between the resistor 31 and the ground pattern 21b.

[0005]

However, in the structure shown in FIG. 4, since the wiring pattern 21 is fixed, it is not possible to change the wiring pattern 21 after production and there is no flexibility. Met. For example, even if a partial circuit pattern is changed, the entire pattern must be recreated. In addition, the etching process for forming the resistive film 23 becomes complicated, and it cannot be easily manufactured. Further, the wiring pattern 21
Since the signal pattern 21a and the ground pattern 21b are formed on the same surface, there is a risk that the solder when the capacitor 22 is soldered flows out from the signal pattern 21a to the ground pattern 21b side. .

Although the structure shown in FIG. 5 has the advantage of increasing the degree of freedom of the wiring pattern, the number of connection points is increased, the failure rate is increased, and a large ground area is required. In particular, in the ultra-high frequency band, there is a risk that actual operation may not be guaranteed even if the connection state is checked only visually, for example, the connection may operate in a certain state even if the connection is poor. Has been an issue that must be avoided in order to reduce the failure rate. Hybrid ICs are now being manufactured at higher densities with the use of ultra-high frequencies up to the gigahertz band, and are being produced in a variety of types and in small quantities. Any of the conventional technologies described above can be applied to these hybrid ICs. It's getting harder.

The present invention has been made in view of the above problems, and in a hybrid IC used in an ultra-high frequency band, electronic components can be arranged with a degree of freedom after designing and creating a wiring pattern. It is another object of the present invention to provide a hybrid IC having a junction board with a resistor that can be easily manufactured without increasing the installation area for arranging the electronic components.

[0008]

In order to achieve the above object, a hybrid IC having a relay board with a resistor according to the present invention is provided.
A predetermined ground pattern 2b is formed on the substrate 1 constituting the hybrid IC, and on the ground pattern 2b, immediately below the place where the electronic components are arranged, along the surface of the base 5 Conductive films 6a, 6 in thin film form
b, and a relay board with resistance 4 on which the resistive film 7 is formed.

[0009]

The electronic components can be freely arranged on the ground pattern 2b on the substrate 1 of the hybrid IC. This electronic component is connected to the earth pattern 2b via the relay board 4 with resistance.
Is electrically connected to The relay stand with resistance 4 is formed to have thin film conductive films 6 a and 6 b and a resistance film 7 on a base 5. Therefore, the electronic component can be grounded via the resistor of a predetermined value in the resistance film 7 only by fixing it on the relay stand 4 with resistance by soldering or the like. Can be.

[0010]

FIG. 1 is a perspective view showing a hybrid IC having a relay board with resistance according to the present invention. A signal pattern 2a and a ground pattern 2b (not shown) are formed as wiring patterns 2 on the upper surface of the substrate 1. On the ground pattern 2b, a relay board 4 with a resistor shown below can be fixedly arranged.

As shown in the cross-sectional view of FIG. 2, the relay board with resistance 4 has a base 5 made of an insulating substrate material, and conductive films 6a, 6b provided on the upper surface and side surfaces of the base 5.
Further, it is composed of a resistance film 7 provided between the conductive films 6a and 6b. Explaining the preparation procedure, first, a resistor made of tantalum is provided on the base 5 in a film shape to form the resistor film 7. Next, the upper and side surfaces of the base 5 are plated with gold to form conductive films 6a and 6b. Next, the resistive film 7 is etched to remove the conductive films 6a and 6b from the resistive film 7 and the resistive film 7 is exposed. When manufacturing as described above, as shown in FIG. 1, the conductive films 6a and 6b and the resistive film 7 are all formed inside by a predetermined distance p from the side edge. According to the above-described forming method, the size of the resistance film 7 can be accurately formed and the predetermined resistance value can be obtained.

The above-described relay stand 4 with a resistor is provided at a position where the coupling capacitor 22 is arranged, as shown in FIG. On the ground pattern 2b, one terminal 22a of the capacitor 22 is fixedly connected so that one is connected to the other relay stand 10 or the signal pattern 2a (not shown). Then, the other terminal 22 of the capacitor 22
In the place where “a” is provided, the relay stand 4 with resistance is fixedly disposed below. The bottom surface of the base 5 of the relay stand 4 with resistance is fixed on the ground pattern 2b by a conductive adhesive or soldering.

The other terminal 22a of the capacitor 22 is fixed by soldering to the conductor film 6a on the upper surface of the resistance relay stand 4. During the soldering, the conductive film 6a is formed inside the side edge by a predetermined distance p, and the conductive film 6a
Is connected to the ground pattern 2b via the side edge portion where the edge is formed.
Since the solder is located at a predetermined height above the surface, the solder stays only in the conductive film 6a and does not flow into the ground pattern 2b.

Next, the conductive film 6b and the ground pattern 2b are electrically connected by bonding using a wire 11 or the like. As a result, a resistor having a predetermined value by the resistance film 7 is connected to one end of the capacitor 22.
The resonance preventing action of the capacitor 22 can be obtained.

Since the above-mentioned relay stand 4 with resistance can be freely provided at an arbitrary position on the ground pattern 2b, it can be easily installed with a degree of freedom even after a wiring pattern is determined and created. . Also, a large area of the ground pattern 2 is formed on the substrate 1 and, for example,
A circuit can also be constructed by placing the relay board on the entire surface as the ground pattern 2, and in this case, or the area of the ground including the case where the relay board 4 with a resistor is installed on the ground pattern 2 as described above. And a hybrid I having a guaranteed performance up to the ultra-high frequency band.
C can now be created.

Next, FIG. 3 is a side view showing a modification of the relay board with resistance. As shown in this figure, the conductive film 6b may be provided continuously up to the bottom surface of the base 5.
As a result, the conductive film 6b is in direct contact with the ground pattern 2, and the conductive film 6b on the bottom portion of the base 5 and the ground pattern 2 are directly connected to each other without using the wire 11 by a conductive adhesive.
Alternatively, it can be fixedly connected by solder or the like, and the same operation and effect as those of the above embodiment can be obtained.

[0017]

The hybrid IC having a relay board with a resistor according to the present invention has a structure in which a relay board provided with a resistor is arbitrarily arranged on a ground pattern. The electronic components can be arranged with a certain degree, and the electronic components can be installed in a small area without increasing the area for arranging the electronic components.

[Brief description of the drawings]

FIG. 1 shows a hybrid I having a relay board with resistance according to the present invention.
The perspective view showing C.

FIG. 2 is a side view of the relay stand portion with the resistor.

FIG. 3 is a side view showing a modification of the relay stand with resistance.

FIG. 4 is a perspective view showing a conventional hybrid IC.

FIG. 5 is a plan view showing another conventional example.

[Explanation of symbols]

1 ... substrate, 2 wiring patterns, 2a signal pattern, 2b ground pattern, relay board with 4 resistors, 5 bases, 6a and 6b conductive films, 7 resistive films, 11 wires, 22 capacitors.

Claims (1)

(57) [Claims] In a hybrid IC in which electronic circuit elements are mounted at a high density in an ultra-high frequency band, a predetermined ground pattern (2b) is formed on a substrate (1) constituting the hybrid IC. Above, just below the place where the electronic component is arranged, a relay board with a resistor in which a conductive film (6a, 6b) and a resistive film (7) are formed in a thin film along the surface of the base (5) (4) A hybrid IC having a relay board with a resistor, characterized by being provided with (4).