JP2869977B2 - Jig for cross section observation of semiconductor integrated circuit - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a jig for fixing a cross-section observation sample to a microscope when observing a cut cross section of a semiconductor integrated circuit with an optical microscope.

[Conventional technology]

2. Description of the Related Art In a semiconductor integrated circuit, a method of irradiating light to a cut end face of the semiconductor integrated circuit, making the reflected light perpendicularly enter an objective lens of an optical microscope, and observing a state of the cut end face is adopted.

Conventionally, this kind of jig for observing a cross section of a semiconductor integrated circuit has two rotating shaft fixing plates 9, 9 arranged in parallel on a base 11, as shown in FIGS. Each rotating shaft fixing plate 9,1
The sample stage 4 is rotatably supported on rotating shafts 7, 7 that are respectively supported by the shafts 0. The lower edge of the semiconductor integrated circuit 1 is inserted into the fixing groove 3 of the sample stand 4 and fastened and fixed with the fixing screw 2, and the cut end face is mounted upward, and the operation handle 8 is used to drive the gear train 5, 6 through the gear train 5, 6. The sample stage 4 is rotated about the rotation axis 7 so that the cut end surface of the semiconductor integrated circuit 1 is adjusted to an angle facing the objective lens of the microscope (not shown).

[Problems to be solved by the invention]

In the above-described conventional observation jig, the rotation axis 7
Was located farther away from the observation surface of the sample,
As shown in FIG. 11, when the sample stage 4 is rotated by θ ° when adjusting the angle of the observation surface of the sample with respect to the objective lens of the microscope with a large radius of rotation r, the sample becomes Δx (=
(rsinθ), and has the disadvantage that it moves out of the plane of the microscope.

An object of the present invention is to provide a jig for observing a cross section of a semiconductor integrated circuit which has solved the above-mentioned problems.

[Differences of the Invention from the Prior Art]

Compared to the conventional observation jig described above, the present invention can make the horizontal movement of the sample observation surface due to rotation extremely small by reducing the distance between the center line of rotation of the sample stage and the observation surface of the sample. Has differences.

[Means for solving the problem]

In order to achieve the object, a jig for observing a cross section of a semiconductor integrated circuit according to the present invention irradiates light to a cut end face obtained by cutting a plate-shaped semiconductor integrated circuit, receives reflected light thereof, and receives light reflected from the cut end face. A jig for observing a cross-section for observing a state, comprising: a sample stage fixedly holding the plate-shaped semiconductor integrated circuit in a vertical position in which a cut end surface of the plate-shaped semiconductor integrated circuit is upward; Is rotatably supported on a rotating shaft. The plate-shaped semiconductor integrated circuit has a cut end face disposed near the height of the rotating shaft and is held by the sample stage. The distance between the cut end face of the planar semiconductor integrated circuit and the cut end face of the planar semiconductor integrated circuit is made extremely small to reduce the horizontal displacement.

〔Example〕

 Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Example 1) Fig. 1 is a front view showing Example 1 of the present invention, Fig. 2 is a plan view thereof, and Fig. 3 is a side view thereof.

In the figure, two rotating shaft fixing plates 9, 9 are planted in parallel on a base 11, and rotating shafts 7, 7 are supported at the upper end positions of the rotating shaft fixing plates 9, 9, respectively. The sample stage 4 is attached to the sample stages 7 and 7 via the support arms 10 and 10, and the two rotation shafts 7 and 7 are attached to the sample stage 4.
A fixed groove 3 whose depth is set so that the cut end surface 1a of the semiconductor integrated circuit 1 coincides with the line connecting the rotation shaft cores of 7 is inserted into the fixed groove 3 and the lower edge of the semiconductor integrated circuit 1 is inserted into the fixed groove 3. And fix with the fixing screw 2. 8 is an operation handle, 5,
Reference numeral 6 denotes a gear train for transmitting the rotational force of the operation handle 8 to the rotating shaft 7.

A semiconductor integrated circuit (hereinafter, referred to as a sample) 1 as a sample for cross-sectional observation is fixed with a fixing screw 2 inserted into a fixing groove 3 of a sample table 4, and a cut end surface 1 a of the sample 1 is provided with two rotating shafts 7, 7
Is held at the height of the line connecting the. FIG. 4 is a side view showing the sample stage before and after adjusting the angle of the sample. The sample 1 is rotated by rotating the operation handle 8 to thereby form the gear train 5,
Rotation in the θ direction about the rotation axis 7 via 6, the distance r between the center line of rotation of the sample table 4 and the observation surface 1 a of the sample 1 is extremely short, so that a horizontal displacement x due to the rotation is obtained.
(= Rsinθ) is very small. In addition, by increasing the gear ratio of the gear trains 5 and 6, it is possible to slightly apply rotation to the sample 1.

Second Embodiment FIG. 5 is a front view showing a second embodiment of the present invention, FIG. 6 is a plan view of the same, and FIG. 7 is a front view showing an operation state.

In this embodiment, the left and right ends of the base 11 have angle adjusting screws 12 of the base 11, respectively. In this embodiment, there is an advantage that the cut end surface 1a of the semiconductor integrated circuit 1 can be adjusted in parallel with the objective lens of the microscope by adjusting the inclination angle θ 'of the base 11 with the screw 12. [Effects of the Invention] As described above, the present invention minimizes the distance between the center line of rotation of the sample stage and the observation surface of the sample to minimize the rotation when adjusting the angle of the sample with respect to the objective lens of the microscope. This has the effect of minimizing the horizontal displacement of the sample due to

[Brief description of the drawings]

FIG. 1 is a front view showing a first embodiment of the present invention, FIG. 2 is a plan view of the same, FIG. 3 is a side view thereof, and FIG. 4 shows a sample stage before and after adjusting the angle of the sample in the first embodiment. FIG. 5 is a front view showing Embodiment 2 of the present invention, FIG. 6 is a plan view of the same,
7 is a front view showing a state in which the angle of the base is adjusted, FIG. 8 is a front view showing a conventional example, FIG. 9 is a plan view thereof, FIG. 10 is a side view thereof, and FIG. It is a side view which shows the sample stand before and after adjusting the angle of a sample. 1 sample (semiconductor integrated circuit) 4 sample table 7 rotating shaft

Claims (1)

(57) [Claims] 1. A cross-section observation jig for irradiating a cut end surface obtained by cutting a plate-shaped semiconductor integrated circuit with light, receiving reflected light thereof, and observing a state of the cut end surface. A sample stage fixedly holding the plate-shaped semiconductor integrated circuit in a vertical posture in which a cut end surface of the semiconductor integrated circuit is directed upward, the sample stage being rotatably supported by a rotating shaft, and a plate-shaped semiconductor integrated circuit; The cut end face is disposed near the height position of the rotation axis and is held by the sample stage, and the distance between the rotation center of the sample stage and the cut end surface of the plate-shaped semiconductor integrated circuit is extremely small. A jig for observing a cross section of a semiconductor integrated circuit, wherein a horizontal shift of a cut end surface of the plate-shaped semiconductor integrated circuit is reduced.