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JP2876138B2 - Thin-film two-terminal element - Google Patents
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JP2876138B2 - Thin-film two-terminal element - Google Patents

Thin-film two-terminal element

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Publication number
JP2876138B2
JP2876138B2 JP33411489A JP33411489A JP2876138B2 JP 2876138 B2 JP2876138 B2 JP 2876138B2 JP 33411489 A JP33411489 A JP 33411489A JP 33411489 A JP33411489 A JP 33411489A JP 2876138 B2 JP2876138 B2 JP 2876138B2
Authority
JP
Japan
Prior art keywords
film
thin
terminal element
conductor
hard carbon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP33411489A
Other languages
Japanese (ja)
Other versions
JPH03192219A (en
Inventor
英一 太田
裕治 木村
均 近藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ricoh Co Ltd
Original Assignee
Ricoh Co Ltd
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Filing date
Publication date
Application filed by Ricoh Co Ltd filed Critical Ricoh Co Ltd
Priority to JP33411489A priority Critical patent/JP2876138B2/en
Publication of JPH03192219A publication Critical patent/JPH03192219A/en
Application granted granted Critical
Publication of JP2876138B2 publication Critical patent/JP2876138B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は薄膜二端子素子に関し、詳しくは、OA機器用
やTV用等のフラットパネルディスプレイなどに好適に使
用しうるスイッチング素子、特に液晶表示装置のスイッ
チング素子として有用な薄膜二端子素子に関する。
Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin-film two-terminal element, and more specifically, a switching element, particularly a liquid crystal display, which can be suitably used for flat panel displays for OA equipment and TVs. The present invention relates to a thin-film two-terminal element useful as a switching element of a device.

〔従来の技術〕[Conventional technology]

OA機器端末機や液晶TVには大面積液晶パネルの使用の
要望が強く、そのため、アクティブ・マトリックス方式
では各画素ごとにスイッチを設け、電圧を保持するよう
に工夫されている。
There is a strong demand for the use of large-area liquid crystal panels for OA equipment terminals and liquid crystal TVs. For this reason, in the active matrix system, a switch is provided for each pixel to maintain the voltage.

ところで、前記スィッチの一つとしてMIM(Metal Ins
ulator Metal)素子が多く用いられている。これは薄膜
二端子素子がスイッチングに良好な非線形な電流−電圧
特性を示すためである。そして、従来からの薄膜二端子
素子は、ガラス板のような絶縁基板上に下部電極として
Ta、Al、Ti等の金属電極を設け、その上に前記金属の酸
化物又はSiOx、SiNx等からなる絶縁膜を設け、更にその
上に、上部電極としてAl、Cr等の金属電極を設けたもの
が知られている。そして上記絶縁膜は一般に下部電極の
陽極酸化又は熱酸化により(特開昭62−62333号、同57
−196589号公報)、あるいは気相合成されたSiOx、SiNx
により形成されている。
By the way, MIM (Metal Ins
(ulator metal) elements are often used. This is because the thin-film two-terminal element exhibits a good nonlinear current-voltage characteristic for switching. And the conventional thin film two-terminal element is used as a lower electrode on an insulating substrate such as a glass plate.
A metal electrode of Ta, Al, Ti, etc. was provided, an oxide film of the metal or an insulating film made of SiOx, SiNx, etc. was provided thereon, and a metal electrode of Al, Cr, etc. was provided thereon as an upper electrode. Things are known. The insulating film is generally formed by anodic oxidation or thermal oxidation of the lower electrode (Japanese Patent Application Laid-Open Nos. 62-62333 and 57-63).
-196589), or SiOx and SiNx synthesized by gas phase
Is formed.

〔発明が解決しようとする課題〕[Problems to be solved by the invention]

しかしながら、絶縁膜として陽極酸化膜を用いた薄膜
二端子素子においては、(1)絶縁膜が下部電極金属の
陽極酸化膜に限られるため、その物性値の制御、ひいて
は薄膜二端子素子の特性の制御を任意に行うことは不可
能である。(2)300〜600℃程度の熱処理が必要である
ため、用いる基板材質が耐熱性の高いものに限定され
る。(3)比誘電率が高いため、液晶表示装置のスイッ
チング素子として用いる場合、(素子容量/液晶表示装
置容量<1/10という制約から)素子面積を小さくする必
要があり、高度な微細加工が要求される。
However, in a thin-film two-terminal device using an anodic oxide film as an insulating film, (1) Since the insulating film is limited to the anodic oxide film of the lower electrode metal, control of the physical properties thereof and, consequently, the characteristics of the thin-film two-terminal device Control cannot be performed arbitrarily. (2) Since a heat treatment at about 300 to 600 ° C. is required, the material of the substrate to be used is limited to those having high heat resistance. (3) Since the dielectric constant is high, when used as a switching element of a liquid crystal display device, it is necessary to reduce the element area (due to the constraint of element capacitance / liquid crystal display device capacity <1/10), which requires advanced fine processing. Required.

また、後述のごとく、比誘電率εと素子の急峻性β
には、 の関係があり、εが高いと急峻性は小さくなってしま
い、高密度の、表示には不適となってしまう、等の欠点
を有している。
Further, as described later, the relative permittivity ε r and the steepness β of the element
In When the value of εr is high, the steepness is reduced, and there are disadvantages such as high density and unsuitability for display.

さらに、絶縁層として、気相で合成されるSiOx、SiNx
を用いた薄膜二端子素子においては、上記(1)の欠点
はほぼ解消されるものの、成膜温度が300℃程度と高
く、上記(2)と同様の問題がある。また、(4)ダス
ト等によるピンホールが発生しやすく歩留りが低下する
という問題点を有している。
Furthermore, as the insulating layer, SiO x and SiN x synthesized in the gas phase
In the thin film two-terminal element using the method, although the disadvantage (1) is almost eliminated, the film formation temperature is as high as about 300 ° C., and there is the same problem as the above (2). Further, (4) there is a problem that pinholes are easily generated due to dust or the like, and the yield is reduced.

本発明者らの研究によれば、絶縁膜に硬質炭素膜を使
用することで上記(1)〜(4)の問題点が解決される
ことがわかったが、通常の硬質炭素膜は、可視光に対す
る吸収が大きく、褐色であるため、(5)素子部以外の
硬質炭素膜を除去しなければならず、プロセス工程が増
えてしまう。また、素子部以外の硬質炭素膜を除去しな
ければ液晶セルの透過光量が減少し、画質が著しく劣化
してしまう。
According to the study of the present inventors, it has been found that the above problems (1) to (4) can be solved by using a hard carbon film as an insulating film. (5) The hard carbon film other than the element portion must be removed because the light absorption is large and the color is brown, and the number of process steps increases. Unless the hard carbon film other than the element portion is removed, the amount of light transmitted through the liquid crystal cell is reduced, and the image quality is significantly deteriorated.

本発明は、以上のような従来技術の実情に鑑みてなさ
れたもので、上記の(1)〜(5)の問題点が全て解決
された薄膜二端子素子を提供することを目的とする。
SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances of the related art, and has as its object to provide a thin-film two-terminal element in which all of the above problems (1) to (5) have been solved.

〔課題を解決するための手段〕[Means for solving the problem]

上記目的を達成するため、本発明によれば、第一の導
体と第二の導体との間に絶縁膜を介在させてなる薄膜二
端子素子において、該絶縁膜は光学的バンド幅が2.4eV
以上の硬質炭素膜からなることを特徴とする薄膜二端子
素子が提供される。
To achieve the above object, according to the present invention, in a thin-film two-terminal element having an insulating film interposed between a first conductor and a second conductor, the insulating film has an optical bandwidth of 2.4 eV.
There is provided a thin-film two-terminal element comprising the above hard carbon film.

〔作用〕[Action]

本発明の薄膜二端子素子の絶縁膜は光学的バンド幅が
2.4eV以上の硬質炭素膜で構成されていることから、可
視光に無色透明となり、上記(1)〜(4)の問題はも
ちろんのこと、素子部以外の硬質炭素膜を除去しなくて
もすむことから上記(5)の問題も解決される。
The insulating film of the thin film two-terminal element of the present invention has an optical bandwidth.
Since it is composed of a hard carbon film of 2.4 eV or more, it becomes colorless and transparent to visible light, and not only the above problems (1) to (4) but also without removing the hard carbon film other than the element portion. As a result, the problem (5) is also solved.

〔実施例〕〔Example〕

以下本発明を更に詳述する。 Hereinafter, the present invention will be described in more detail.

本発明は、第一の導体と第二の導体の間に介在させる
絶縁膜に、光学的バンド幅が2.4eV以上の硬質炭素膜
(i−C膜、ダイヤモンド状炭素膜、アモルファスダイ
ヤモンド膜、ダイヤモンド薄膜とも呼ばれる。)を用い
たものである。
According to the present invention, a hard carbon film having an optical bandwidth of 2.4 eV or more (i-C film, diamond-like carbon film, amorphous diamond film, diamond film) is formed on an insulating film interposed between the first conductor and the second conductor. (Also referred to as a thin film).

本発明者らは、硬質炭素膜の作製法に関して鋭意研究
した結果、プラズマ発生を間欠的にすること、具体的に
はプラズマ周波数を100KHz以下とするか、方形波パルス
プラズマを使用することで、プラズマ密度の減少を引き
起こさずに、電子温度を増加することができ、その結
果、比較的低温でも、よりダイヤモンド構造に近く、光
学的バンド幅の大きい硬質炭素膜が成膜できることを見
出した。
The present inventors have conducted intensive research on the method of forming a hard carbon film, and as a result, by intermittently generating plasma, specifically, by setting the plasma frequency to 100 KHz or less, or by using a square wave pulsed plasma, It has been found that the electron temperature can be increased without causing a decrease in plasma density, and as a result, even at a relatively low temperature, a hard carbon film having a closer optical structure to a diamond structure can be formed.

第1図及び第2図に本発明の薄膜二端子素子に使用さ
れる硬質炭素膜の成膜装置を示す。これらの図におい
て、101は上部電極、102は下部電極、103は基板、104は
プラズマ電源、105は直流電源(バイアス印加用)、106
は磁界コイル、107はサセプター、108は導波管、109は
整合器、110は電力モニター、111はマイクロ波発振器、
112はプランジャーである。また、代表的な成膜条件を
表−1及び表−2に示す。
1 and 2 show an apparatus for forming a hard carbon film used in the thin-film two-terminal element of the present invention. In these figures, 101 is an upper electrode, 102 is a lower electrode, 103 is a substrate, 104 is a plasma power supply, 105 is a DC power supply (for bias application), 106
Is a magnetic field coil, 107 is a susceptor, 108 is a waveguide, 109 is a matching unit, 110 is a power monitor, 111 is a microwave oscillator,
112 is a plunger. Tables 1 and 2 show typical film forming conditions.

表−1 プラズマ出力;0.1〜50W/cm2 周波数;100KHz以下 圧力;10-3〜10Torr 堆積温度;室温〜900℃ 表−2 プラズマ出力 ;20〜400W tOFF(インターバル時間) ;2×10-5sec以上 tON/toOFF ;10以上 圧力 ;10-3〜100Torr 堆積温度 ;室温〜950℃ 第1図に示したものは平行平板型プラズマCVD装置で
あるが、プラズマ電源104の周波数は100KHz以下となっ
ており、第3図に示すように、通常の13.5MHz高周波プ
ラズマに対して電子温度が2〜3倍程度高くなっている
ことが分かる。
Table 1 Plasma output; 0.1~50W / cm 2 Frequency; 100 KHz or less pressure; 10 -3 to 10 Torr deposition temperature: room temperature to 900 ° C. Table 2 plasma power; 20~400W t OFF (interval time); 2 × 10 - 5 sec or more t ON / to OFF ; 10 or more Pressure; 10 -3 to 100 Torr Deposition temperature; Room temperature to 950 ° C. The thing shown in FIG. 1 is a parallel plate type plasma CVD apparatus, but the frequency of the plasma power supply 104 is 100 KHz. As shown in FIG. 3, it can be seen that the electron temperature is about two to three times higher than that of normal 13.5 MHz high frequency plasma.

反応ガスとしては、有機化合物ガス、特に炭化水素ガ
スが用いられる。これら原料における相状態は常温常圧
において必ずしも気相である必要はなく、加熱或は減圧
等により溶融、蒸発、昇華等を経て気化し得るものであ
れば、液相でも固相でも使用可能である。
As the reaction gas, an organic compound gas, particularly, a hydrocarbon gas is used. The phase state of these raw materials does not necessarily need to be a gaseous phase at normal temperature and normal pressure, but may be used in a liquid phase or a solid phase as long as it can be vaporized through melting, evaporation, sublimation, etc. by heating or decompression. is there.

原料ガスとしての炭化水素ガスについては、例えばCH
4、C2H6、C3H8、C4H10等のパラフィン系炭化水素、C2H4
等のアセチレン系炭化水素、オレフィン系炭化水素、ア
セチレン系炭化水素、ジオレフィン系炭化水素、さらに
は芳香族炭化水素などすべての炭化水素を少なくとも含
むガスが使用可能である。さらに、炭化水素以外でも、
例えば、アルコール類、ケトン、エーテル類、エステル
類、CO、CO2等、少なくとも炭素元素を含む化合物であ
れば使用可能である。これら原料ガスはプラズマ中で成
膜活性種(ラジカルとイオン)に分解され、基板103上
に硬質炭素膜が堆積される。また、より大面積化、均一
性向上、低温製膜の目的で、低圧下で堆積を行なうた
め、磁界効果を利用する方法がさらに好ましい。
For hydrocarbon gas as a source gas, for example, CH
4 , C 2 H 6 , C 3 H 8 , C 4 H 10, etc., paraffinic hydrocarbons, C 2 H 4
Gases containing at least all hydrocarbons such as acetylene-based hydrocarbons, olefin-based hydrocarbons, acetylene-based hydrocarbons, diolefin-based hydrocarbons, and aromatic hydrocarbons can be used. In addition, other than hydrocarbons,
For example, compounds containing at least a carbon element, such as alcohols, ketones, ethers, esters, CO, and CO 2 can be used. These source gases are decomposed into film-forming active species (radicals and ions) in plasma, and a hard carbon film is deposited on the substrate 103. Further, a method utilizing a magnetic field effect is more preferable because deposition is performed under a low pressure for the purpose of increasing the area, improving uniformity, and forming a film at a low temperature.

次に本発明による落膜二端子素子の作製法について述
べる。
Next, a method for manufacturing a falling film two-terminal element according to the present invention will be described.

第4図は本発明の薄膜二端子素子の一構成例を示す図
であり、第5図は従来素子の構成を示す図である。第4
図及び第5図において、1,11は絶縁基板、2,12は第一の
導体(バスライン)、3,13は第二の導体(画素電極)、
4,14は絶縁膜(硬質炭素膜)である。第5図に示す従来
素子は、絶縁膜14が通常の硬質炭素膜からなり、光学的
バンド幅が比較的小さく、褐色であるため、第二の導体
(画素電極)13の下にある絶縁膜を除去しておかざるを
えなかった。これに対し、本発明の素子では、第4図の
ごとく、絶縁膜4を構成する硬質炭素膜の光学的バンド
幅2.4eV以上と大きく、可視光に対し透明であるため、
第二の導体(画素電極)3の下にある絶縁膜を除去する
必要がなく、エッチングプロセスを省略することができ
る。
FIG. 4 is a diagram showing a configuration example of a thin-film two-terminal device of the present invention, and FIG. 5 is a diagram showing a configuration of a conventional device. 4th
In FIG. 5 and FIG. 5, reference numerals 1 and 11 denote insulating substrates, 2 and 12 denote first conductors (bus lines), 3 and 13 denote second conductors (pixel electrodes),
Reference numerals 4 and 14 are insulating films (hard carbon films). In the conventional device shown in FIG. 5, the insulating film 14 is made of a normal hard carbon film, has a relatively small optical bandwidth and is brown, so that the insulating film under the second conductor (pixel electrode) 13 is formed. Had to be removed. On the other hand, in the device of the present invention, as shown in FIG. 4, the optical band width of the hard carbon film constituting the insulating film 4 is as large as 2.4 eV or more and is transparent to visible light.
There is no need to remove the insulating film under the second conductor (pixel electrode) 3, and the etching process can be omitted.

第4図を参照して本発明の薄膜二端子素子の作製法に
ついて述べると、先ず、絶縁基板1(材料としてはガラ
ス板、プラスチック板又はフレキシブルなプラスチック
フィルム等)に導体膜を形成する。その材料としてはIT
O,In2O3、ZnO,SnO2等透明導電体あるいはAl、Ni、Cr、N
iCr、Pt、Ag、Au、Cu、Mo、Ti、Ta等の金属あるいは高
ドープの半導体等が使用され、蒸着、スパッタリング等
の成膜法で堆積される。次に、該導体膜をウェット又は
トライエッチングにより所定パターンにパターンニング
して、バスラインとなる第一の導体2とする。そして、
その上にプラズマCVD(間欠プラズマ)により光学的バ
ンド幅2.4eV以上の硬質炭素膜4を全面に堆積させる。
さらに、その上に画素電極となる第二の導体3を形成す
る。この形成に使われる具体的な材料、形成法は第一の
導体2の形成の場合と同様である。こうして第一の導体
−硬質炭素膜−第二の導体からなる薄膜二端子素子が得
られる。
Referring to FIG. 4, the method of manufacturing the thin-film two-terminal element of the present invention will be described. First, a conductive film is formed on an insulating substrate 1 (made of a glass plate, a plastic plate, a flexible plastic film, or the like). IT is the material
Transparent conductors such as O, In 2 O 3 , ZnO, SnO 2 or Al, Ni, Cr, N
A metal such as iCr, Pt, Ag, Au, Cu, Mo, Ti, Ta, or a highly doped semiconductor is used, and is deposited by a film forming method such as evaporation or sputtering. Next, the conductor film is patterned into a predetermined pattern by wet or tri-etching to obtain a first conductor 2 serving as a bus line. And
A hard carbon film 4 having an optical bandwidth of 2.4 eV or more is deposited on the entire surface by plasma CVD (intermittent plasma).
Further, a second conductor 3 serving as a pixel electrode is formed thereon. The specific material and forming method used for this formation are the same as those for forming the first conductor 2. In this way, a thin-film two-terminal element comprising the first conductor, the hard carbon film, and the second conductor is obtained.

第6図〜第9図は本発明による薄膜二端子素子の別の
構成例を示す図で、第6図の素子はサンドイッチ型構造
であり、第7図〜第9図の素子はコプレナー型構造であ
る。これらの構成の相違は、バスラインとなる第一の導
体2と画素電極となる第二の導体3のどちらが絶縁膜4
に対して上部にくるか、ということによっており、それ
以外の点は、材料、作製法ともに第4図の素子の場合と
概ね同じである。
6 to 9 are views showing another configuration example of the thin film two-terminal element according to the present invention. The element in FIG. 6 has a sandwich type structure, and the element in FIGS. 7 to 9 has a coplanar type structure. It is. The difference between these configurations is that either the first conductor 2 serving as a bus line or the second conductor 3 serving as a pixel electrode is formed on the insulating film 4.
In other respects, the material and the manufacturing method are almost the same as those of the element shown in FIG.

本発明の薄膜二端子素子の第一の電極(下部電極)
2、第二の電極(上部電極)4の厚さは通常、それぞれ
数百〜数千Åの範囲である。また絶縁膜(硬質炭素膜)
3の厚さは100〜8000Å、望ましくは200〜6000Å、さら
に望ましくは30〜4000Åの範囲である。
First electrode (lower electrode) of the thin-film two-terminal element of the present invention
2. The thickness of the second electrode (upper electrode) 4 is usually in the range of several hundred to several thousand Å. Insulating film (hard carbon film)
The thickness of 3 ranges from 100 to 8000, preferably 200 to 6000, more preferably 30 to 4000.

以上のような薄膜二端子素子を有する基板を用いて液
晶表元装置を作るには、その基板とストライプ状の共通
電極が形成された第二の基板を用意し、両基板間に常法
により液晶層を形成すればよい。
To make a liquid crystal display device using a substrate having a thin film two-terminal element as described above, prepare a substrate and a second substrate on which a stripe-shaped common electrode is formed, and use a conventional method between the two substrates. What is necessary is just to form a liquid crystal layer.

〔発明の効果〕〔The invention's effect〕

本発明の薄膜二端子素子は第一の導体と第二の導体と
の間に介在させた絶縁膜が、光学的バンド幅が2.4eV以
上の硬質炭素膜からなり、この膜は 1)プラズマCVD法等の気相合成法で作製されるため、
成膜条件によって物性が広範囲に制御でき、従ってデバ
イス設計の自由度が大きい、 2)硬質でしかも厚膜にできるため、機械的損傷を受け
難く、また厚膜化によるピンホールの減少も期待でき
る、 3)室温付近の低温においても良質な膜を形成できるの
で、基板材質に制約がない、 4)膜厚、膜質の均一性に優れているため、薄膜デバイ
ス用として適している、 5)誘電率が低いので、高度の微細加工技術を必要とせ
ず、従って素子の大面積化に有利である、 6)可視光に対して無色透明であるため、素子部以外の
硬質炭素膜を除去する必要がなく、工程が短縮される、 等の特長を有し、このような絶縁膜を用いた薄膜二端子
素子は液晶表示用スイッチング素子として好適である。
In the thin-film two-terminal device of the present invention, the insulating film interposed between the first conductor and the second conductor is made of a hard carbon film having an optical bandwidth of 2.4 eV or more. Since it is produced by a gas phase synthesis method such as
The physical properties can be controlled over a wide range depending on the film formation conditions, and therefore the degree of freedom in device design is large. 3) Since a good quality film can be formed even at a low temperature near room temperature, there is no restriction on the material of the substrate. 4) Because of excellent uniformity of film thickness and film quality, it is suitable for thin film devices. 5) Dielectric Since the rate is low, it does not require advanced microfabrication technology and is therefore advantageous for increasing the area of the element. 6) Since it is colorless and transparent to visible light, it is necessary to remove the hard carbon film other than the element part The thin film two-terminal element using such an insulating film is suitable as a switching element for a liquid crystal display.

【図面の簡単な説明】[Brief description of the drawings]

第1図及び第2図は本発明の薄膜二端子素子の絶縁膜に
使用される硬質炭素膜を成膜する装置を示す図、第3図
はプラズマ電源周波数と電子温度の関係を示すグラフ、
第4図は本発明による薄膜二端子素子の構造例を示す斜
視図、第5図は従来の薄膜二端子素子の構造を示す斜視
図、第6図〜第9図は本発明による薄膜二端子素子の別
の構造例を示す断面図である。 1…基板、2…第一の導体 3…絶縁膜、4…第二の導体
1 and 2 are views showing an apparatus for forming a hard carbon film used as an insulating film of a thin-film two-terminal element of the present invention, FIG. 3 is a graph showing the relationship between plasma power supply frequency and electron temperature,
FIG. 4 is a perspective view showing an example of the structure of a thin-film two-terminal element according to the present invention, FIG. 5 is a perspective view showing the structure of a conventional thin-film two-terminal element, and FIGS. It is sectional drawing which shows another structural example of an element. DESCRIPTION OF SYMBOLS 1 ... Substrate, 2 ... First conductor 3 ... Insulating film, 4 ... Second conductor

───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭64−40929(JP,A) 特開 昭64−40930(JP,A) 特開 平1−164925(JP,A) (58)調査した分野(Int.Cl.6,DB名) G02F 1/136 510 ────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-64-40929 (JP, A) JP-A-64-40930 (JP, A) JP-A-1-164925 (JP, A) (58) Field (Int.Cl. 6 , DB name) G02F 1/136 510

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】第一の導体と第二の導体との間に絶縁膜を
介在させてなる薄膜二端子素子において、該絶縁膜は光
学的バンド幅が2.4eV以上の硬質炭素膜からなることを
特徴とする薄膜二端子素子。
1. A thin-film two-terminal element having an insulating film interposed between a first conductor and a second conductor, wherein the insulating film is made of a hard carbon film having an optical bandwidth of 2.4 eV or more. A thin-film two-terminal element characterized by the above-mentioned.
JP33411489A 1989-12-21 1989-12-21 Thin-film two-terminal element Expired - Fee Related JP2876138B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP33411489A JP2876138B2 (en) 1989-12-21 1989-12-21 Thin-film two-terminal element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33411489A JP2876138B2 (en) 1989-12-21 1989-12-21 Thin-film two-terminal element

Publications (2)

Publication Number Publication Date
JPH03192219A JPH03192219A (en) 1991-08-22
JP2876138B2 true JP2876138B2 (en) 1999-03-31

Family

ID=18273682

Family Applications (1)

Application Number Title Priority Date Filing Date
JP33411489A Expired - Fee Related JP2876138B2 (en) 1989-12-21 1989-12-21 Thin-film two-terminal element

Country Status (1)

Country Link
JP (1) JP2876138B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6835523B1 (en) 1993-05-09 2004-12-28 Semiconductor Energy Laboratory Co., Ltd. Apparatus for fabricating coating and method of fabricating the coating

Also Published As

Publication number Publication date
JPH03192219A (en) 1991-08-22

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