JP2876706B2 - Copper alloy wires for electric and electronic equipment - Google Patents
Copper alloy wires for electric and electronic equipmentInfo
- Publication number
- JP2876706B2 JP2876706B2 JP10102090A JP10102090A JP2876706B2 JP 2876706 B2 JP2876706 B2 JP 2876706B2 JP 10102090 A JP10102090 A JP 10102090A JP 10102090 A JP10102090 A JP 10102090A JP 2876706 B2 JP2876706 B2 JP 2876706B2
- Authority
- JP
- Japan
- Prior art keywords
- weight
- electric
- copper alloy
- electronic equipment
- properties
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title claims description 10
- 229910052758 niobium Inorganic materials 0.000 claims description 10
- 239000010949 copper Substances 0.000 claims description 7
- 239000012535 impurity Substances 0.000 claims description 2
- 238000005452 bending Methods 0.000 description 14
- 239000004020 conductor Substances 0.000 description 8
- 238000012360 testing method Methods 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000002244 precipitate Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 238000010622 cold drawing Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000010583 slow cooling Methods 0.000 description 2
- 239000006104 solid solution Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- -1 for example Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000005491 wire drawing Methods 0.000 description 1
Landscapes
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
Description
【発明の詳細な説明】 [産業上の利用分野] この発明は、強度・導電性および曲げ特性に優れた銅
合金細線に関し、より詳細には電気機器、計測機器、医
療機器および情報通信機器等に用いられる信頼性の高い
細線導体等に関するものである。Description: TECHNICAL FIELD The present invention relates to a copper alloy fine wire having excellent strength, conductivity and bending characteristics, and more particularly to an electric device, a measuring device, a medical device, an information communication device and the like. The present invention relates to a highly reliable fine wire conductor and the like used in the present invention.
[従来の技術] 電子機器、計測機器、医療機器および情報通信機器等
に用いられる導体としては、従来より、タフピッチ銅お
よび無酸素銅などの純銅が主に用いられており、一部に
は、銅−錫系合金および銅−ベリリウム系合金等が使用
されている。[Prior art] Pure copper such as tough pitch copper and oxygen-free copper has been mainly used as conductors used in electronic devices, measuring devices, medical devices, information communication devices, and the like. Copper-tin-based alloys and copper-beryllium-based alloys are used.
[発明が解決しようとする課題] 最近の電気・電子ならびに通信産業の発展に伴い、使
用される導体に対する要求特性も一段と厳しくなってき
ており、さらに導体のサイズに対してもより細いものが
要求されるようになってきた。[Problems to be Solved by the Invention] With the recent development of the electric / electronic and telecommunication industries, required characteristics of conductors used have become more severe, and furthermore, smaller conductors have been required. It has come to be.
このような状況の中で、導電率等の電気的特性と、引
張特性や曲げ特性などの機械的特性の両方の特性におい
て信頼性の高い導体が要望されるようになってきてい
る。Under such circumstances, a conductor with high reliability in both electrical properties such as electrical conductivity and mechanical properties such as tensile properties and bending properties has been demanded.
この発明の目的は、このような従来からの要望を満足
すべく、引張強さや屈曲特性等の機械的特性および導電
率等の電気的特性に優れた電気・電子機器用銅合金細線
を提供することにある。An object of the present invention is to provide a copper alloy fine wire for electric / electronic equipment which is excellent in mechanical properties such as tensile strength and flexural properties and electrical properties such as electrical conductivity in order to satisfy such conventional needs. It is in.
[課題を解決するための手段] この発明に従う電気・電子機器用銅合金細線は、Nb、
SiおよびTiの各元素をそれぞれ0.01重量%以上含有し、
かつ、前記各元素を合計で、1.0〜4.0重量%含有し、残
部がCuおよび不可避不純物からなることを特徴としてい
る。[Means for Solving the Problems] The copper alloy fine wire for electric / electronic equipment according to the present invention comprises Nb,
Containing 0.01% by weight or more of each element of Si and Ti,
Further, it is characterized in that each of the above elements is contained in a total of 1.0 to 4.0% by weight, and the balance consists of Cu and unavoidable impurities.
また、この発明に従う電気・電子機器用銅合金細線に
おいて、Nb、SiおよびTiの各元素の含有量について、重
量比Nb/Siが1〜12の範囲であり、かつ、重量比Ti/Siが
0.5〜4の範囲であれば、この発明の目的をより効果的
に達成することができる。Further, in the copper alloy thin wire for electric and electronic equipment according to the present invention, the content of each element of Nb, Si and Ti, the weight ratio Nb / Si is in the range of 1 to 12, and the weight ratio Ti / Si is
Within the range of 0.5 to 4, the object of the present invention can be more effectively achieved.
なお、この発明に従う電気・電子機器用銅合金細線に
おいて、他の金属、たとえばSn、Ag、NiおよびAu等のめ
っきを施しても、特性が劣化することもなく十分な電気
的および機械的特性を得ることができる。このようなめ
っきは、最終の工程で行なってもよいし、伸線加工の前
の途中の工程で行なってもよい。In the copper alloy thin wires for electric / electronic devices according to the present invention, even if plating with other metals, for example, Sn, Ag, Ni and Au, sufficient electrical and mechanical properties are obtained without deteriorating the properties. Can be obtained. Such plating may be performed in the final step, or may be performed in an intermediate step before wire drawing.
さらに、これらの発明の電気・電子機器用銅合金細線
は、複数本を束ねた撚線として使用することで、機械的
特性の向上がより一層期待できる。Furthermore, by using the copper alloy fine wires for electric / electronic devices of these inventions as a stranded wire obtained by bundling a plurality of wires, further improvement in mechanical properties can be expected.
[作用] Nb、SiおよびTiをそれぞれ0.01重量%以上含有し、か
っ、各元素を合計で1.0〜4.0重量%の範囲で含有させる
ことにより、Cu母相中において固溶する元素を少なく
し、かつ微細な析出物を均一に分散させて導電率等の電
気的特性と引張特性および曲げ特性などの機械的特性と
を両立させることができる。この発明において、微細な
析出物が均一に分散するのは、Nb、TiおよびSiの相互作
用によるものであり、この発明で規定する範囲内で含有
させることにより、このような均一な分布状態を達成す
ることができる。各元素の合計が4.0重量%を越えると
固溶または析出する元素が増加し、著しく導電率等の電
気的特性が低下する。また、その合計が1.0重量%未満
になると、析出する粒子が少なくなるため十分な引張特
性および曲げ特性等の機械的特性を得るのが困難とな
る。[Function] By containing 0.01% by weight or more of each of Nb, Si and Ti, and by adding each element in a range of 1.0 to 4.0% by weight in total, the number of elements which form a solid solution in the Cu matrix is reduced. In addition, fine precipitates can be uniformly dispersed to achieve both electrical properties such as electrical conductivity and mechanical properties such as tensile properties and bending properties. In the present invention, fine precipitates are uniformly dispersed due to the interaction of Nb, Ti, and Si, and by containing them within the range specified in the present invention, such a uniform distribution state is obtained. Can be achieved. If the sum of the respective elements exceeds 4.0% by weight, the amount of elements that form a solid solution or precipitate increases, and electrical characteristics such as electrical conductivity are remarkably deteriorated. On the other hand, if the total is less than 1.0% by weight, it is difficult to obtain sufficient mechanical properties such as tensile properties and bending properties because the number of precipitated particles is reduced.
また、Nb、SiおよびTiの各元素の重量比を特定の範囲
内に限定しているのは、Nb、TiおよびSiの相互作用を考
慮したからである。このような範囲では、Cu母相中によ
り硬く微細な析出物を均一に析出させることができ、得
られる合金細線の引張特性および曲げ特性等の機械的特
性をより向上させることができる。より微細な析出粒子
が均一に分布することで、極細線への加工も良好とな
り、極細線でも十分な機械的特性を得ることができる。Further, the weight ratio of each element of Nb, Si and Ti is limited to a specific range because the interaction between Nb, Ti and Si is considered. Within such a range, harder and finer precipitates can be uniformly precipitated in the Cu matrix, and the mechanical properties such as tensile properties and bending properties of the obtained alloy fine wire can be further improved. By uniformly distributing finer precipitation particles, processing into an ultrafine wire is also improved, and sufficient mechanical properties can be obtained even with an ultrafine wire.
[実施例] 第1表に示す組成の合金を黒鉛鋳型を用いて半連続鋳
造し、直径8mmの棒材を得た。第1表において、実施例
で示される番号1から5までの組成は、いずれもこの発
明に従うものである。詳細には、番号1、2および3
は、Nb、SiおよびTiの各元素をそれぞれ0.01重量%以上
含有し、かつ、上記元素の合計が、1.0〜4.0重量%の範
囲内にあり、しかも、各元素の重量比が、この発明に従
う範囲内にある。一方、実施例の番号4および5では、
各元素をそれぞれ0.01重量%以上含有し、かつ、上記元
素の合計が1.0〜4.0重量%の範囲内にあるが、各元素の
重量比は考慮されていない。また、第1表において、比
較例で示される番号6から11までの組成は、Nb、Siおよ
びTiの各元素をそれぞれ0.01重量%以上含有するが、上
記各元素の合計が1.0〜4.0重量%の範囲外にある。上記
実施例について得られた細線と、上記比較例について得
られた細線を比較することで、この発明において上記各
元素の含有量または含有量および含有比を限定した意義
を明らかにすることができる。また、第1表において従
来例で示される番号12、13および14は従来の技術による
ものである。従来例と実施例とを比較することで、この
発明の効果を明らかにすることができる。Example An alloy having the composition shown in Table 1 was semi-continuously cast using a graphite mold to obtain a rod having a diameter of 8 mm. In Table 1, the compositions of Nos. 1 to 5 shown in the examples are all in accordance with the present invention. In detail, the numbers 1, 2 and 3
Contains 0.01% by weight or more of each element of Nb, Si and Ti, and the total of the above elements is in the range of 1.0 to 4.0% by weight, and the weight ratio of each element is in accordance with the present invention. In range. On the other hand, in Examples 4 and 5,
Each element is contained in an amount of 0.01% by weight or more, and the total of the above elements is in the range of 1.0 to 4.0% by weight, but the weight ratio of each element is not considered. Further, in Table 1, the compositions of Nos. 6 to 11 shown in Comparative Examples each contain 0.01% by weight or more of each element of Nb, Si and Ti, and the total of the above elements is 1.0 to 4.0% by weight. Is out of range. By comparing the thin line obtained in the above example with the thin line obtained in the comparative example, it is possible to clarify the significance of limiting the content or the content and the content ratio of each element in the present invention. . The numbers 12, 13 and 14 shown in Table 1 in the conventional example are based on the conventional technology. The effect of the present invention can be clarified by comparing the conventional example with the embodiment.
第1表に示す組成の直径8mmの棒材を940℃で3時間加
熱保持した後、水中で冷却した。この棒材をさらに以下
に示すような工程で、番号順に処理を行ない、直径0.12
mmの導体を得た。 A rod having a composition shown in Table 1 and having a diameter of 8 mm was heated and held at 940 ° C. for 3 hours, and then cooled in water. This bar is further processed in the following order in the following steps to obtain a diameter of 0.12 mm.
mm conductor was obtained.
冷間伸線 8φmm→1.6φmm,減面率96% 熱処理 460℃×3時間→徐冷 冷間伸線 1.6φmm→0.12φmm,減面率99.4% 熱処理 400℃×3時間→徐冷 なお、従来例については上記工程の熱処理を行なうこ
となく直径8mmから直径0.12mmまで冷間伸線した。Cold drawing 8φmm → 1.6φmm, 96% reduction in area Heat treatment 460 ℃ × 3 hours → Slow cooling Cold drawing 1.6φmm → 0.12φmm, 99.4% reduction in area Heat treatment 400 ℃ × 3 hours → Slow cooling In the example, the wire was cold drawn from a diameter of 8 mm to a diameter of 0.12 mm without performing the heat treatment in the above step.
得られた素線について、引張強さおよび導電率を測定
し、屈曲試験を行なった。屈曲試験については、第1図
に示すような装置を用いた。すなわち第1図に示すよう
に、導体のサンプル1の下方端におもり2を取付け、こ
のサンプル1をホイール3とホイール4の間に通し、サ
ンプル1の上方端を想像線で示すように左右に交互に90
°傾けて屈曲し、サンプルが切断するまでの屈曲回数を
測定した。この屈曲試験については、素線を7本撚合わ
せた撚線についても測定を行なった。なお、ホイール3
および4の直径は30mmであり、おもり2は素線の場合10
0gとし、撚線の場合700gとした。About the obtained strand, the tensile strength and the electric conductivity were measured, and the bending test was performed. For the bending test, an apparatus as shown in FIG. 1 was used. That is, as shown in FIG. 1, a weight 2 is attached to the lower end of the conductor sample 1, and the sample 1 is passed between the wheel 3 and the wheel 4, and the upper end of the sample 1 is moved right and left as shown by imaginary lines. 90 alternately
The sample was bent at an angle, and the number of bendings until the sample was cut was measured. In this bending test, measurement was also performed on a stranded wire obtained by twisting seven strands. Wheel 3
And 4 have a diameter of 30 mm and a weight 2 of 10
0 g, and 700 g for a stranded wire.
素線の引張強さ、導電率および屈曲試験の結果ならび
に撚線の屈曲試験の結果を第2表に示す。第2表より、
実施例が、比較例および従来例に比べ、高い導電率とよ
りよい引張強さを兼備えたものであることが明らかにさ
れる。また、第2表に示されるように、撚線は屈曲特性
が著しく向上している。Table 2 shows the results of the tensile strength, conductivity, and bending test of the strand, and the results of the bending test of the stranded wire. From Table 2,
It is clear that the examples have both higher conductivity and better tensile strength than the comparative examples and the conventional examples. Further, as shown in Table 2, the twisted wire has significantly improved bending characteristics.
なお、実施例の直径0.12mmの銅合金細線に、Snまたは
Agをめっきしたものを作製し、引張強さ、導電率および
屈曲特性を測定した。その結果、めっきを施していない
ものと同程度の特性が得られた。In addition, in the copper alloy fine wire of the diameter of 0.12 mm of the example, Sn or
Ag-plated products were prepared, and tensile strength, electrical conductivity, and bending characteristics were measured. As a result, the same characteristics as those without plating were obtained.
[発明の効果] 以上説明したように、この発明に従う銅合金細線は、
引張強さおよび屈曲特性等の機械的特性と導電率等の電
気的特性とが両立して優れているため、電子機器、計測
機器、医療機器および情報通信機器等の分野で導体とし
て利用すると効果的である。 [Effect of the Invention] As described above, the copper alloy fine wire according to the present invention is
Because mechanical properties such as tensile strength and flexural properties and electrical properties such as electrical conductivity are compatible, they are effective when used as conductors in the fields of electronic equipment, measuring equipment, medical equipment and information communication equipment. It is a target.
第1図は、この発明の実施例において行われた屈曲試験
の装置を示す概略図である。 図において、1はサンプル、2はおもり、3および4は
ホイールを示す。FIG. 1 is a schematic view showing an apparatus for a bending test performed in an embodiment of the present invention. In the figure, 1 indicates a sample, 2 indicates a weight, and 3 and 4 indicate wheels.
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.6,DB名) H01B 1/02 H01B 5/02 C22C 9/00 H01L 23/48 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. 6 , DB name) H01B 1/02 H01B 5/02 C22C 9/00 H01L 23/48
Claims (1)
量%以上含有し、かつ、前記Nb、SiおよびTiの各元素を
合計で1.0〜4.0重量%含有し、残部がCuおよび不可避不
純物からなり、かつ 前記Nb、SiおよびTiの各元素の含有量について、重量比
Nb/Siが1〜12の範囲であり、かつ、重量比Ti/Siが0.5
〜4の範囲であることを特徴とする、電気・電子機器用
銅合金細線。1. An element containing 0.01% by weight or more of each of Nb, Si and Ti, 1.0 to 4.0% by weight in total of each of the elements Nb, Si and Ti, with the balance being Cu and inevitable impurities. And for the content of each of the elements Nb, Si and Ti, the weight ratio
Nb / Si is in the range of 1 to 12, and the weight ratio Ti / Si is 0.5
A thin copper alloy wire for electric / electronic equipment, wherein the thickness is in the range of ~ 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10102090A JP2876706B2 (en) | 1990-04-16 | 1990-04-16 | Copper alloy wires for electric and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10102090A JP2876706B2 (en) | 1990-04-16 | 1990-04-16 | Copper alloy wires for electric and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03297010A JPH03297010A (en) | 1991-12-27 |
| JP2876706B2 true JP2876706B2 (en) | 1999-03-31 |
Family
ID=14289522
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10102090A Expired - Fee Related JP2876706B2 (en) | 1990-04-16 | 1990-04-16 | Copper alloy wires for electric and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2876706B2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6012422B2 (en) | 2012-11-15 | 2016-10-25 | キヤノン株式会社 | toner |
-
1990
- 1990-04-16 JP JP10102090A patent/JP2876706B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6012422B2 (en) | 2012-11-15 | 2016-10-25 | キヤノン株式会社 | toner |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03297010A (en) | 1991-12-27 |
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| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |