JP2877883B2 - Lead wire connection structure of temperature sensing element - Google Patents
Lead wire connection structure of temperature sensing elementInfo
- Publication number
- JP2877883B2 JP2877883B2 JP7268790A JP7268790A JP2877883B2 JP 2877883 B2 JP2877883 B2 JP 2877883B2 JP 7268790 A JP7268790 A JP 7268790A JP 7268790 A JP7268790 A JP 7268790A JP 2877883 B2 JP2877883 B2 JP 2877883B2
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- electrode
- welding
- connection structure
- wire connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 title claims description 41
- 238000003466 welding Methods 0.000 claims description 18
- 230000035515 penetration Effects 0.000 claims description 13
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 8
- 229910000531 Co alloy Inorganic materials 0.000 claims description 5
- 230000003746 surface roughness Effects 0.000 claims description 5
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910000521 B alloy Inorganic materials 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229910000990 Ni alloy Inorganic materials 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 229910000640 Fe alloy Inorganic materials 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- 229910052580 B4C Inorganic materials 0.000 description 1
- -1 Kovar wire Chemical compound 0.000 description 1
- QDWJUBJKEHXSMT-UHFFFAOYSA-N boranylidynenickel Chemical compound [Ni]#B QDWJUBJKEHXSMT-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
Landscapes
- Thermistors And Varistors (AREA)
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は、感温素子にリード線を接続する構造に関す
る。Description: TECHNICAL FIELD The present invention relates to a structure for connecting a lead wire to a temperature-sensitive element.
（従来の技術） 感温素子は、第４図に示すように、セラミック素子本
体１の両面に電極２を一体に設け、その電極２にリード
線３を当て、該リード線３を電極２に固着し、リード線
３の引出し部を残して素子全体を保護用絶縁ガラス層４
により覆って構成される。(Prior Art) As shown in FIG. 4, a temperature-sensitive element is provided with electrodes 2 integrally on both surfaces of a ceramic element body 1, a lead wire 3 is applied to the electrode 2, and the lead wire 3 is connected to the electrode 2. After fixing, the entire element is protected by a protective insulating glass layer 4 except for a lead-out portion of the lead wire 3.
It is comprised by covering.
この感温素子において、リード線３の電極２への接続
は、第５図に示すように、パラレルギャップ溶接により
行なうことが提案されている（特開昭54−43560号、特
開昭62−81001号）。すなわち、２本の電極棒５をリー
ド線３上に押し当て、この間に電圧を印加してリード線
３ないしは電極２の一部に通電することにより、電極棒
５間のリード線３を電極２に接する底部まで溶融させ
（溶融部を3aで示している）、溶接する。In this temperature-sensitive element, it has been proposed that the connection of the lead wire 3 to the electrode 2 is performed by parallel gap welding as shown in FIG. No. 81001). That is, the two electrode rods 5 are pressed onto the lead wire 3 and a voltage is applied during this time to energize the lead wire 3 or a part of the electrode 2, thereby connecting the lead wire 3 between the electrode rods 5 to the electrode 2. Melt to the bottom contacting (the fused portion is indicated by 3a) and weld.
（発明が解決すべき課題） このように、従来は、溶接の名の通り、リード線３の
一部を底部まで、すなわち断面形状の全体を溶融させて
溶接している。しかしこの溶接時の熱が素子本体１に伝
達されるため、抵抗−温度特性の劣化が生じるという問
題点がある。また、特開昭62−81001号に記載のよう
に、リード線に貴金属を用いれば、コスト高を招くとい
う問題点がある。(Problems to be Solved by the Invention) As described above, conventionally, as in the name of welding, a part of the lead wire 3 is welded to the bottom, that is, the entire cross-sectional shape is melted. However, since the heat at the time of this welding is transmitted to the element main body 1, there is a problem that the resistance-temperature characteristics deteriorate. Further, as described in Japanese Patent Application Laid-Open No. 62-81001, if a noble metal is used for the lead wire, there is a problem that the cost is increased.
本発明は、このような問題点を解決すること、すなわ
ち、リード線の溶接時の溶融熱による素子本体の特性劣
化を生じるおそれがなく、廉価に実現できる感温素子の
リード線接続構造を提供することを目的とする。The present invention solves such a problem, that is, provides a lead connection structure of a temperature-sensitive element which can be realized at a low cost without the risk of deterioration of the characteristics of the element body due to heat of fusion during welding of the lead. The purpose is to do.
（課題を解決するための手段） 上記の目的を達成するため、本発明は、素子本体両面
に、Ni−Ｂ合金からなる電極を、２μｍ〜10μｍの厚み
に、かつその表面粗さを0.5μmRmax〜３μmRmaxに形成
し、鉄、ニッケル、コバルト系合金からなるリード線を
素子本体両面の電極にパラレルギャップ溶接により溶接
し、該溶接によるリード線の表面からの溶け込み深さ
を、リード線の直径あるいは厚さの1/5〜4/5としたこと
を特徴とする。(Means for Solving the Problems) In order to achieve the above object, the present invention provides an electrode made of a Ni-B alloy on both surfaces of an element body to a thickness of 2 μm to 10 μm and a surface roughness of 0.5 μm Rmax. ３3 μm Rmax, and a lead wire made of iron, nickel, and cobalt alloy is welded to the electrodes on both sides of the element body by parallel gap welding, and the penetration depth from the surface of the lead wire by the welding is determined by the diameter of the lead wire or The thickness is set to 1/5 to 4/5.
すなわち本発明は、パラレルギャップ溶接において
は、リード線は電極に圧接した状態で溶接されることか
ら、リード線の一部の断面全体を溶融させなくとも、電
極面との接触部分を軟化させた状態とすれば、接続が可
能であることを確認し、上記構造を実現したものであ
る。That is, in the present invention, in the parallel gap welding, since the lead wire is welded in pressure contact with the electrode, the contact portion with the electrode surface was softened without melting the entire cross section of a part of the lead wire. In the state, it is confirmed that connection is possible, and the above structure is realized.
（作用） 本発明は上述の構造を有するので、リード線の溶融熱
は従来より大幅に少なくなり、素子本体への熱的影響が
減少する。(Operation) Since the present invention has the above-described structure, the heat of fusion of the lead wire is significantly reduced as compared with the related art, and the thermal effect on the element body is reduced.
（実施例） 第１図は本発明によるリード線の接続構造の一実施例
を溶接状態で示す側面図、第２図はその一部断面図であ
る。本実施例において、素子本体１はアルミナ−炭化ホ
ウ素系セラミックからなり、この素子本体１は、常温な
いし約500℃の範囲において、温度Ｔの逆数（1/T）が抵
抗Ｒの対数1nRに比例する負の抵抗−温度特性を有する
ものである。この素子本体１に対し電極２は無電解メッ
キにより形成されたニッケル−ホウ素（Ni−Ｂ）合金か
らなる。リード線３は、例えばコバール線のような鉄、
ニッケル、コバルト系合金からなる。これらの素子本体
１、電極２、リード線３、さらにこれらの周囲を覆うガ
ラス層（図示せず）も、熱膨張率が近似した材質のもの
が選択される。また、溶接棒５として、Ni−ＷまたはNi
−Crが用いられる。(Embodiment) FIG. 1 is a side view showing an embodiment of a lead wire connection structure according to the present invention in a welded state, and FIG. 2 is a partial sectional view thereof. In this embodiment, the element body 1 is made of an alumina-boron carbide-based ceramic, and the reciprocal (1 / T) of the temperature T is proportional to the logarithm 1nR of the resistance R in a range from room temperature to about 500 ° C. It has a negative resistance-temperature characteristic. The electrodes 2 of the element main body 1 are made of a nickel-boron (Ni-B) alloy formed by electroless plating. The lead wire 3 is made of iron such as Kovar wire,
It consists of nickel and cobalt alloys. The element body 1, the electrodes 2, the lead wires 3, and the glass layer (not shown) covering the periphery thereof are also selected from materials having similar thermal expansion coefficients. Further, as the welding rod 5, Ni-W or Ni
-Cr is used.
しかして本発明においては、リード線３の溶接部3a
は、リード線３の一部の断面全体を溶融させるのではな
く、表面側から途中の深さまで溶融させることによって
溶接する。この溶け込み深さは、第２図に示すように、
リード線３の表面（電極２の反対側の面）より1/5〜4/5
（＝A/D）程度が好適である。この溶け込み深さが1/5未
満であると、溶接強度が十分でなく、4/5を超えると、
素子本体１への熱的影響が生じて来る。このリード線３
は、丸線のみでなく、角線も用いられる。Thus, in the present invention, the welded portion 3a of the lead wire 3
Is welded not by melting part of the entire cross section of the lead wire 3 but by melting from the surface side to an intermediate depth. This penetration depth, as shown in FIG.
1/5 to 4/5 from the surface of lead wire 3 (the surface opposite to electrode 2)
(= A / D) is preferable. If the penetration depth is less than 1/5, the welding strength is not sufficient, and if it exceeds 4/5,
A thermal effect on the element body 1 occurs. This lead wire 3
Uses not only round lines but also square lines.
このような溶け込み深さＡを得るための電極棒５の形
状は、第１図に示すギャップＧが0.2mm〜0.4mmであるこ
とが好ましい。ギャップＧが0.2mm以上なければ必要な
溶け込み深さが得がたく、また、0.4mmを超えると、溶
接部3aの溶け込み部が第２図に示すように湾曲面状に形
成されることから、電極２との接触部まで溶融状態にな
りやすい。また、電極棒５の先端部の厚さW1は、0mm〜
0.2mm、本体部の厚さW2は、熱放散の必要から6.5mm以上
であることが好ましい。また、加圧力は電極棒５の１本
当たり100g〜500gであることが接触抵抗を安定させ、か
つ素子を損傷させないという理由で好ましい。The shape of the electrode rod 5 for obtaining such a penetration depth A is preferably such that the gap G shown in FIG. 1 is 0.2 mm to 0.4 mm. If the gap G is not more than 0.2 mm, the required penetration depth is difficult to obtain, and if it exceeds 0.4 mm, the penetration of the weld 3a is formed into a curved surface as shown in FIG. It is easy to be in a molten state up to the contact portion with the electrode 2. The thickness W1 of the tip of the electrode rod 5 is 0 mm to
The thickness W2 of the main body is preferably 0.2 mm or more and 6.5 mm or more from the need for heat dissipation. Further, it is preferable that the pressing force be 100 g to 500 g per electrode rod 5 because the contact resistance is stabilized and the element is not damaged.
第３図は、リード線３の直径が0.25mmである場合にお
いて、電極棒５間に印加する電極パルスの一例を示すも
ので、まずプレヒートパルスP1（波高値0.5V、パルス長
0.2msec）を加え、0.1msec後に本溶接パルスP2（1.0V−
1.25Vパルス長10msec＋1.25Vパルス長10msec）を加え、
30A〜50Aの電流が流れるようにする。本溶接パルスの電
圧を高くして電流値が50Aを超えるようにすると、リー
ド線３が直径Ｂの全範囲にわたって溶け込むようにな
る。FIG. 3 shows an example of an electrode pulse applied between the electrode rods 5 when the diameter of the lead wire 3 is 0.25 mm.
0.2msec), and after 0.1msec, the main welding pulse P2 (1.0V−
1.25V pulse length 10msec + 1.25V pulse length 10msec)
Make the current of 30A to 50A flow. If the current value exceeds 50 A by increasing the voltage of the main welding pulse, the lead wire 3 will melt over the entire range of the diameter B.
このような溶接部3aの溶け込み深さを前記範囲で安定
して得るには、リード線３の直径Ｄあるいは厚さは0.3m
m以下であることが好ましい。溶け込み深さが0.3mmを超
えると、必要溶け込み深さを得るには電流が大きくなっ
てリード線３と電極棒５との接触抵抗が電流の流れに影
響を与えて安定した溶け込み深さを得ることができな
い。また、リード線３として必要な剛性を持たせるに
は、0.1mm以上の直径あるいは厚みが必要である。In order to stably obtain such a penetration depth of the welded portion 3a in the above range, the diameter D or the thickness of the lead wire 3 is 0.3 m.
m or less. If the penetration depth exceeds 0.3 mm, the current increases to obtain the required penetration depth, and the contact resistance between the lead wire 3 and the electrode rod 5 affects the flow of current to obtain a stable penetration depth. Can not do. In addition, a diameter or thickness of 0.1 mm or more is required to provide the necessary rigidity as the lead wire 3.
また、電極２をNi−Ｂ合金により形成し、その表面粗
さを無電解メッキにより、0.5μmRmax〜３μmRmaxとす
ることが、必要な溶接強度を得る上で好ましい。Further, it is preferable that the electrode 2 is formed of a Ni-B alloy and the surface roughness is adjusted to 0.5 μmRmax to 3 μmRmax by electroless plating in order to obtain necessary welding strength.
また、前記電極２の厚さは、必要な導電性と強度を得
る上で２μｍ〜10μｍの範囲であることが好ましい。The thickness of the electrode 2 is preferably in the range of 2 μm to 10 μm in order to obtain required conductivity and strength.
なを実際の試作の結果を説明すると、素子本体１、電
極２およびリード線３の材質を前記実施例ものとし、電
極２の厚さを3.5μｍ、その表面粗さを１μmRmax、リー
ド線３の直径を0.25mm、ギャップＧを0.3m、電極棒５の
加圧力を250gとした条件のもとで、本溶接パルスの電流
値を50A以上としてリード線３の一部を全直径にわたっ
て溶け込ませた場合には不良率が15％であったが、本溶
接パルスP2の電流値を30A〜50Aとして溶け込み深さ（A/
D）を1/5〜4/5の範囲におさめた場合には、不良率が３
％となり、歩留りが向上した。To explain the results of the actual trial production, the materials of the element body 1, the electrode 2 and the lead wire 3 are the same as those in the above embodiment, the thickness of the electrode 2 is 3.5 μm, the surface roughness is 1 μm Rmax, and the lead wire 3 is Under the conditions that the diameter was 0.25 mm, the gap G was 0.3 m, and the pressure of the electrode rod 5 was 250 g, the current value of the main welding pulse was set to 50 A or more, and a part of the lead wire 3 was melted over the entire diameter. In this case, the defect rate was 15%, but the penetration value (A /
If D) falls within the range of 1/5 to 4/5, the defect rate is 3
%, And the yield was improved.
本発明は、上記以外の材質の負、正の抵抗−温度特性
を有する感温素子にも適用できる。The present invention can also be applied to temperature-sensitive elements made of materials other than those described above, which have negative and positive resistance-temperature characteristics.
（発明の効果） 本発明によれば、素子本体両面に、Ni−Ｂ合金からな
る電極を、２μｍ〜10μｍの厚みに、かつその表面粗さ
を0.5μmRmax〜３μmRmaxに形成し、鉄、ニッケル、コ
バルト系合金からなるリード線を前記素子本体両面の電
極にパラレルギャップ溶接により溶接し、該溶接による
リード線の表面からの溶け込み深さを、リード線の直径
あるいは厚さの1/5〜4/5としたので、素子本体に与える
熱的影響が緩和され、性能劣化が防止され、歩留りが向
上する。また、本発明は、リード線として、コバール線
のような鉄、ニッケル、コバルト系合金を用いるので、
廉価にリード線の接続構造を実現することができる。(Effects of the Invention) According to the present invention, an electrode made of a Ni-B alloy is formed on both surfaces of an element body to a thickness of 2 μm to 10 μm and a surface roughness of 0.5 μmRmax to 3 μmRmax. A lead wire made of a cobalt alloy is welded to the electrodes on both surfaces of the element body by parallel gap welding, and the penetration depth from the surface of the lead wire by the welding is 1/5 to 4 / of the diameter or thickness of the lead wire. Since it is 5, the thermal effect on the element body is reduced, performance degradation is prevented, and the yield is improved. In addition, the present invention uses iron, nickel, and cobalt-based alloy such as Kovar wire as the lead wire,
A lead wire connection structure can be realized at low cost.
第１図は本発明による感温素子のリード線の接続構造の
一実施例を示す側面図、第２図はその要部を示す断面
図、第３図は本発明の構造を得るための印加電圧パルス
の一例を示すタイムチャート、第４図は従来の感温素子
を示す斜視図、第５図はその一部断面図である。 1:素子本体、2:電極、3:リード線、3a:溶接部、4:ガラ
ス層、5:電極棒FIG. 1 is a side view showing an embodiment of a connection structure of lead wires of a temperature-sensitive element according to the present invention, FIG. 2 is a cross-sectional view showing a main part thereof, and FIG. FIG. 4 is a time chart showing an example of a voltage pulse, FIG. 4 is a perspective view showing a conventional temperature sensing element, and FIG. 5 is a partial sectional view thereof. 1: element body, 2: electrode, 3: lead wire, 3a: weld, 4: glass layer, 5: electrode rod
Claims (2)
を、２μｍ〜10μｍの厚みに、かつその表面粗さを0.5
μmRmax〜３μmRmaxに形成し、 鉄、ニッケル、コバルト系合金からなるリード線を前記
素子本体両面の電極にパラレルギャップ溶接により溶接
し、 該溶接によるリード線の表面からの溶け込み深さを、リ
ード線の直径あるいは厚さの1/5〜4/5とした ことを特徴とする感温素子のリード線接続構造。An electrode made of a Ni-B alloy is provided on both sides of an element body to a thickness of 2 μm to 10 μm and a surface roughness of 0.5 μm.
A lead wire made of iron, nickel, and a cobalt-based alloy is welded to the electrodes on both sides of the element body by parallel gap welding, and the penetration depth from the surface of the lead wire by the welding is determined. A lead wire connection structure for a temperature-sensitive element, characterized in that the diameter or thickness is 1/5 to 4/5.
2mm〜0.4mmとしたことを特徴とする請求項１記載の感温
素子のリード線接続構造。2. The parallel gap length in said welding is set to 0.
The lead wire connection structure for a temperature-sensitive element according to claim 1, wherein the length is 2 mm to 0.4 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7268790A JP2877883B2 (en) | 1990-03-20 | 1990-03-20 | Lead wire connection structure of temperature sensing element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7268790A JP2877883B2 (en) | 1990-03-20 | 1990-03-20 | Lead wire connection structure of temperature sensing element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03272103A JPH03272103A (en) | 1991-12-03 |
| JP2877883B2 true JP2877883B2 (en) | 1999-04-05 |
Family
ID=13496532
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7268790A Expired - Fee Related JP2877883B2 (en) | 1990-03-20 | 1990-03-20 | Lead wire connection structure of temperature sensing element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2877883B2 (en) |
-
1990
- 1990-03-20 JP JP7268790A patent/JP2877883B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03272103A (en) | 1991-12-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |