JP2890731B2 - Method of manufacturing semiconductor device package and bonding member - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to an airtightly sealed semiconductor device package having a high degree of cleanness and excellent moisture resistance, in particular, adhesion of foreign matter to a semiconductor element or a light transmitting portion, and The present invention relates to a method for manufacturing a semiconductor device package in which moisture is prevented from entering, and a bonding member for a semiconductor device package.

[Conventional technology]

CCD (Charge Coupled Device), MOS (Metal Oxide S
semiconductor), solid-state imaging devices such as CPD (Charge Primming Device), and EPROM (Erasable and Programmab)
2. Description of the Related Art A semiconductor device using a semiconductor element having optical characteristics, such as a memory that can be written and erased by light such as le / Read Only Memory, is required to have hermetic sealing properties, particularly cleanliness and moisture resistance.

Generally, a semiconductor device is required to have a hermetic sealing property so that foreign matter such as dust and moisture do not enter therein. In particular, a semiconductor device having optical characteristics requires a light transmission property, and a light transmission property such as a semiconductor element or a lid is required. If foreign matter such as dust adheres to the portion, electric and optical characteristics are impaired, so that hermetic sealing, particularly cleanness, is required. Further, in order to prevent the light transmittance from being reduced due to the dew condensation of water, particularly, moisture resistance is required.

FIG. 5 is a sectional view of a semiconductor device having optical characteristics. In the figure, reference numeral 1 denotes a semiconductor device, and a semiconductor element (IC) is mounted on a die pad 3 formed in a box-shaped casing 2.
A chip 4 is fixed and connected to a lead 6 by a bonding wire 5. Then, a lid (lid) 7 is adhered to the opening of the casing 2 with an adhesive layer 8 for hermetic sealing, and is hermetically sealed to form a sealed space 9.
A package 10 is formed. As the adhesive layer, a resin adhesive has come to be used instead of the conventional glass sealant.

In such a semiconductor device 1, if there is a foreign substance of 1 μm or more inside the package 10, the fine electrode pattern on the semiconductor element 4 is short-circuited. In particular, the foreign substance of 10 μm or more covers the pixels of the semiconductor element 4. Failure or image failure also occurs. In addition, if there is moisture inside, dew is formed on the lid 7 and the like, and the light transmittance is reduced.

FIG. 6 is a sectional view showing a conventional joining member. In the figure, a bonding member 11 is formed by forming a resin adhesive layer 8 on a bonding surface around a lid 7. In the conventional joining member 11, the resin adhesive layer 8 is formed by screen printing, so that the cross-sectional shape of the adhesive layer 8 is trapezoidal or rectangular.

In a conventional method for manufacturing a semiconductor device package, the adhesive layer 8 of the joining member 11 shown in FIG. 6 is pressure-bonded to the joining surface of the casing 2 on which the semiconductor element 4 and the lead 6 are mounted, and is heated and pressed. The package 10 is formed by curing the adhesive layer 8.

However, in such a conventional method for manufacturing the semiconductor device package 10, the resin adhesive layer 8
Has a trapezoidal or rectangular cross-sectional shape, and when it is pressed against the joint surface of the casing 2 and cured, gas such as a solvent is hardly released from the adhesive layer 8, resulting in poor workability and poor adhesion. The solvent and other gases and air generated from the agent layer 8 remain at the bonding interface, so that the hermetic sealing property is reduced and the moisture resistance is likely to be deteriorated. In addition, since the formation of the adhesive layer 8 is performed by screen printing, foreign matter such as dust generated by peeling of the coating material on the screen surface is sealed in the package 10 while adhering to the lid 7,
Alternatively, there is a problem that the adhesive layer printed on a portion other than the joining surface is peeled off and becomes a foreign substance, and the cleanliness is easily reduced.

[Problems to be solved by the invention]

An object of the present invention is to provide a method of manufacturing a semiconductor device package which is excellent in workability and hermetic sealing after joining, and in particular, provides a package having high moisture resistance and cleanliness in order to solve the above problems, and An object of the present invention is to provide a bonding member used for manufacturing such a semiconductor device package.

[Means for solving the problem]

The present invention relates to the following method of manufacturing a semiconductor device package and a joining member.

(1) A casing forming a package, a lid joined to an opening of the casing to form a sealed space, and a resin adhesive layer formed between the casing and the lid or between the casing and the lid. In a method of manufacturing a semiconductor device package having a resin adhesive layer formed between the provided spacers and each of the spacers, any one of the casing, the lid and the spacer is used as a component for a bonding member, and the bonding is performed. A method for manufacturing a semiconductor device, comprising: forming a package by bonding a bonding member having a resin adhesive layer having an arc-shaped cross section on a surface thereof to a casing or a lid.

(2) The method of manufacturing a semiconductor device package according to (1), wherein the adhesive is discharged by a dispenser to form an adhesive layer on the joining member.

(3) a casing forming a package, a lid joined to an opening of the casing to form a sealed space, and a resin adhesive layer formed between the casing and the lid or between the casing and the lid. When manufacturing a semiconductor device package having a resin adhesive layer formed between the provided spacer and each, a joining member for forming a sealing space by joining with a casing or a lid, A joining member for a semiconductor device package, characterized in that any one of a lid, a casing, and a spacer is used as a joining member constituent material, and a joining surface of the joining member has a resin adhesive layer formed in an arc shape in cross section.

(4) The bonding member for a semiconductor device package according to (3), wherein the adhesive layer is formed by discharging the adhesive with a dispenser.

The casing forming the package may have a structure capable of accommodating the object to be sealed of the semiconductor element.The lid is joined to the opening, and a resin adhesive layer for hermetic sealing is provided on the joint surface. Is formed. The materials of the casing and the lid are not limited, and any material such as plastic, ceramics, glass, and metal can be adopted. The adhesive layer may be any resin adhesive that bonds the casing and the lid in a hermetically sealed manner,
For example, an epoxy-based, acrylic-based, phenol-based, urethane-based, silicone-based, rubber-based resin, or hot-melt-based resin can be used, and an epoxy-based resin adhesive is particularly preferable.

The bonding member for a semiconductor device package of the present invention is a bonding member that forms a hermetically sealed semiconductor device package by bonding to a casing or a lid, and a resin for hermetically sealing the bonding surface of the lid, the casing, or the spacer. Is formed in an arc-shaped cross section. As such a joining member, a member in which a resin adhesive layer is formed on a lid is generally used, but a member formed on a casing may be used, and in some cases, both surfaces of a spacer inserted between the casing and the lid may be used. A resin adhesive layer may be formed.

To form an adhesive layer made of resin with a circular arc cross section, the lid,
The dispenser is moved by a robot or the like along the joint surface of the casing or the spacer to form a resin adhesive layer on the joint surface. The adhesive discharged from the dispenser forms an adhesive layer having a circular cross section due to surface tension.

The joining member thus formed can be directly used for forming a package by joining it to a lid or a casing. However, when a package is formed at another place or time, the adhesive is dried, and the partially cured product or preform is dried. It is possible to form a hermetic sealing adhesive layer by completely curing the polymer as a polymer and joining it to a lid, a casing or a spacer.

[Operation] The bonding member for a semiconductor device package of the present invention is manufactured by discharging a resin adhesive from a dispenser on a bonding surface of a lid, a casing, or a spacer to form an adhesive layer. At this time, since the adhesive layer can be accurately formed at a necessary place, the excess is not peeled off and becomes dust as in the conventional case, and the cleanliness is not reduced.

The method for manufacturing a semiconductor device package according to the present invention includes the steps of: bonding the adhesive layer of the bonding member obtained above to a bonding surface of a casing or a lid containing an object to be sealed such as a semiconductor element; The adhesive layer is cured by applying pressure to form a hermetically sealed semiconductor device package.

At this time, the adhesive layer of the joining member has an arcuate cross-sectional shape, and is cured when heated and pressurized while the top portion is in contact with the casing or the lid, so that a gas such as a solvent volatilizes from the adhesive layer. In addition, the time required for curing is shortened, the workability is improved, and the released gas and air hardly remain, so that a package having high hermetic sealing properties can be obtained.

In the hermetically sealed semiconductor device package thus formed, the joining surface is hermetically sealed by the adhesive layer, so that intrusion of dust, other foreign matter and moisture is prevented, and hermetic sealing performance is improved. In particular, the moisture resistance and the cleanness are increased.

〔Example〕

Hereinafter, the present invention will be described with reference to embodiments in the drawings. First
FIG. 2 is an exploded cross-sectional view showing a method of manufacturing a semiconductor device package according to an embodiment. FIG. 2 is a bottom view of a bonding member for a semiconductor device package. FIG. It is sectional drawing which shows the manufacturing method of a joining member, and the same code | symbol as FIG. 5 and FIG. 6 shows the same or equivalent part.

1 to 4, a bonding member 11 is a resin adhesive layer having an arc-shaped cross section over the entire periphery of a bonding surface formed on the periphery of the back surface of a lid (lid) 7 made of a transparent material. 8 are formed.

In FIG. 4, reference numeral 12 denotes a dispenser, and a resin adhesive 14 stored in a cylindrical reservoir 13 is discharged from a nozzle 15 at a constant rate.

As shown in FIG. 4, the bonding member 11 is manufactured by discharging an adhesive 14 from a dispenser 12 to form an adhesive layer 8 on the bonding surface of the lid 7. At this time, the adhesive layer 8
Can be accurately formed at a necessary place, so that there is no possibility that the excess is peeled off and becomes dust as in the conventional case, and the cleanliness is not reduced.

As shown in FIG. 1, the method of manufacturing the semiconductor device package 10 is such that the joining member obtained by the above is attached to the joining surface of the casing 2 accommodating the semiconductor element 4, the lead 6, and the like.
Eleven adhesive layers 8 are pressed against each other, and the adhesive layers 8 are cured by heating and pressing to form an airtightly sealed package 10 shown in FIG.

At this time, the adhesive layer 8 of the joining member 11 has an arc shape in cross section, and is heated and pressed while the top portion is in contact with the joining surface of the casing 2 and then hardened.
Gases such as solvent easily evaporate from the resin, shortening the time required for curing, improving workability, and keeping the released gas and air less likely to remain.
10 is obtained.

Since the hermetically sealed semiconductor device package 10 thus formed is bonded in a hermetically sealed manner with the bonding surface by the adhesive layer 8, intrusion of dust, other foreign matter, and moisture is prevented, and hermetically sealed. Properties, especially moisture resistance and cleanliness, are eliminated, and there is no adhesion of foreign substances and no condensation of moisture.

Although the above embodiments relate to a semiconductor device having optical characteristics, the present invention can be similarly applied to a hermetically sealed package of a general semiconductor device or a hermetically sealed package of another object to be sealed. . Also, the example in which the adhesive layer 8 is formed on the lid 7 as the joining member 11 has been described. However, the joining member 11 may be formed by forming the adhesive layer 8 on the casing 2 or the spacer.

[Effects of the Invention] As described above, according to the present invention, a resin adhesive layer having an arc-shaped cross section is formed on a joining member, and the package is formed by joining with a casing or a lid. It is possible to manufacture a semiconductor device package which is excellent in properties and hermetic sealing after bonding, and in particular, has high moisture resistance and high cleanliness.

[Brief description of the drawings]

1 is an exploded cross-sectional view showing a method of manufacturing a semiconductor device package according to an embodiment, FIG. 2 is a bottom view of a bonding member for a semiconductor device package, FIG. 3 is a cross-sectional view taken along the line AA, and FIG. Sectional view showing a method for manufacturing a package joining member,
FIG. 5 is a sectional view of a semiconductor device, and FIG. 6 is a sectional view showing a conventional joining member. In the drawings, the same reference numerals denote the same or corresponding parts, 1 denotes a semiconductor device, 2 denotes a casing, 3 denotes a die pad, 4 denotes a semiconductor element, 5 denotes a bonding wire, 6 denotes a lead, 7 denotes a lid, and 8 denotes an adhesive layer. , 9 is a sealed space, 10 is a package,
11 is a joining member, 12 is a dispenser, and 14 is an adhesive.

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-62-221134 (JP, A) JP-A-60-74652 (JP, A) JP-A-1-231355 (JP, A) (58) Field (Int.Cl. ⁶ , DB name) H01L 23/02 B

Claims (4)

(57) [Claims] A casing that forms a package; a lid that is joined to an opening of the casing to form a sealed space; and a resin adhesive layer formed between the casing and the lid, or a lid of the casing and the lid. In a method for manufacturing a semiconductor device package having a resin adhesive layer formed between a spacer provided therebetween and each other, any one of the casing, the lid and the spacer is used as a component for a joining member, A method for manufacturing a semiconductor device, comprising: bonding a bonding member having a resin adhesive layer having an arc-shaped cross section on a bonding surface thereof to a casing or a lid to form a package. 2. The method for manufacturing a semiconductor device package according to claim 1, wherein the adhesive is discharged by a dispenser to form an adhesive layer on the joining member. 3. A casing forming a package, a lid joined to an opening of the casing to form a sealing space, and a resin adhesive layer formed between the casing and the lid or a lid of the casing and the lid. A bonding member for forming a sealed space by bonding to a casing or a lid when manufacturing a semiconductor device package having a resin adhesive layer formed between the spacers provided therebetween and each of them. A joining member for a semiconductor device package, wherein any one of a lid, a casing, and a spacer is used as a joining member constituent material, and a joining surface of the joining member has a resin adhesive layer formed in an arc shape in cross section. . 4. The bonding member for a semiconductor device package according to claim 3, wherein the adhesive layer is formed by discharging the adhesive with a dispenser.