JP2893961B2 - I/O Relay - Google Patents

Description

Detailed Description of the Invention

[0001]

This invention relates to a non-contact input/output relay (I/O relay) used as an input/output interface for a programmable controller, an I/O terminal, etc.
This relates to a relay, and more specifically to the configuration of a case that houses a semiconductor element or a printed circuit board.

[0002]

2. Description of the Related Art The above-mentioned I/O relays are constructed by housing, in a case, the semiconductor elements (such as SCRs or transistors) that act as opening and closing parts and a printed circuit board that mounts the electronic circuitry that controls them. Conventionally, the cases used for input and output relays have been made of the same material (usually molded resin) and have the same shape and dimensions, regardless of the type of relay.

[0003]

Problems to be Solved by the Invention Due to the nature of I/O relays, the rated voltage and current for output relays are higher than for input relays, and therefore the amount of heat generated is also greater. However, conventionally, the same case was used for both input and output relays, which put the output relay at a disadvantage in terms of heat dissipation, and this resulted in limitations on the capacity of the output relay. On the other hand, if an attempt was made to enlarge the case for the output relay separately, the number of case types would increase, which would increase the cost of the I/O relay. The object of this invention is to provide an I/O relay that can accommodate larger capacity output relays while keeping costs low.

[0004]

The present invention relates to a semiconductor device .
The upper surface of the case that houses the above components is opened, and the open surface is closed by fitting a separate upper cover thereto.
The case is provided with a plurality of types of upper
A lid is provided, and the upper part is heated depending on the capacity of the semiconductor element.
The lid can be selected for use .
It is preferable that a recess and a protrusion for fitting the top cover are formed back to back on the side wall of the case.

[0005]

[Function] By closing the open side of the case with a separate top cover, it becomes possible to freely combine top covers of different materials and shapes with the same case, and to create a variety of cases according to specifications. Also, by forming a concave and convex part back to back for fitting the top cover to the case, it is possible to mold a case that can be fitted with a top cover on both the inside and outside with a simple mold structure.

[0006]

[Embodiments] An embodiment of the present invention will now be described with reference to Figures 1 to 8. First, Figure 5 shows a perspective view of the case. In the figure, case 1 is made of molded resin and is configured as a rectangular frame with open top and bottom. On the left and right side walls of case 1, there are two recesses 2 that drop in from the outside and two protrusions 3 that protrude inward, back to back. In addition, two vertical protrusions 4 are formed on the front and back surfaces of case 1, and further above these, there is a protrusion 5. Reference numeral 6 denotes a window hole into which a bottom plate, which will be described later, is fitted.

6 shows the top cover which closes the top surface of the case 1. The top cover 7 is made of aluminum, which has good thermal conductivity, and serves as a heat sink.
L-shaped heat dissipation fins 7b are integrally provided on both sides of the main body 7a. The left and right side walls of the main body 7a are provided with two protrusions 8 that protrude inward, corresponding to the recesses 2 of the case 1. The top cover 7 is attached to the case 1 from above so as to cover the outside, and the recesses 2 and the protrusions 8 are elastically fitted together to be fixed in place.

1 and 2 show an I/O device using a top cover 7.
The relay is shown in Fig. 1, with an enlarged cross-sectional view, and Fig. 2, with a side view of the lower part. In these figures, reference numeral 9 denotes a semiconductor element which serves as an opening and closing part, which is in intimate contact with the rear surface of a top cover 7 and fastened by a screw 10 and a nut 11. Reference numeral 12 denotes a printed circuit board on which component parts 13 of an electronic circuit which controls the semiconductor element 9 are mounted, and which is supported by being press-fitted into a bottom plate 14 made of an insulating material. Electrodes 15 which serve as input/output terminals are formed on both sides of the tip of the printed circuit board 12 which protrudes from the bottom plate 14.
The bottom plate 14, while supporting the printed circuit board 12, is fitted into the window hole 6 of the case 1 via the two protrusions 14a on each of the left and right sides, then the lead wires 16 of the semiconductor element 9 attached to the top cover 7 are connected to the printed circuit board 12, and finally the top cover 7 is attached to the case 1.

In such an I/O relay, heat generated from the semiconductor element 9 is transferred directly to the top cover 7, and heat generated from the electronic components 13 is transferred to the top cover 7 via the air inside the case 1 and dissipated into the air. The top cover 7 is provided with heat dissipation fins 7b and has a large surface area, making it suitable for a large-capacity output relay.

Next, Fig. 7 shows another embodiment of the top cover. This top cover 17 is also made of aluminum, but it does not have the heat dissipation fins 7b of the top cover 7, and is designed to be attached to the inside of the case 1.
In place of the protrusions 8 in the upper cover 17, there are window holes 18. This upper cover 17 is inserted into the inside of the case 1 from above, and the window holes 18 fit into the protrusions 3 to be fixed. The semiconductor element is attached to the upper cover 17 in the same manner as in the case of the upper cover 7. This type of upper cover 17 is used for relays in which the lateral dimensions are limited, although the heat dissipation effect of the upper cover 7 is not required.

[0011] Figure 8 shows yet another embodiment of the top cover. This top cover 19 is made of molded resin, and like top cover 17, is inserted inside case 1 and window hole 20 fits into protrusion 3, but has protruding parts 19a on both sides so that their end faces are flush with the side faces of case 1 when attached. Figure 3 is a cross-sectional view of an I/O relay using top cover 19, and Figure 4 is a perspective view. This top cover 19 is used for small-capacity relays that do not require much heat dissipation effect, and although not shown in Figure 3, a semiconductor element is mounted on printed circuit board 12.

4, the relay is shown inserted into the socket 21. The socket 21 has a structure in which locking claws 21b are raised at the front and rear of the body 21a, and although not shown, a slit is formed on the top surface of the body 21a into which the tip of the printed circuit board 12 is inserted, and furthermore, the terminal board 2 is inserted into the slit so as to come into contact with the electrode 15.
When the relay is inserted into the socket 21, the window of the locking tab 21b elastically engages with the protrusion 4 of the case 1, and the two are connected.
When removing the relay from the case 1, hook your finger on the protruding portion 5 of the case 1 and pull out the relay. Note that the socket 21 on the right side of Figure 4 is electrically connected to the relay, while the socket 21 on the left side is used simply to mechanically support the relay. The socket 21 is inserted into a printed circuit board such as an I/O terminal via a terminal board 22 and fixed by soldering.

As described above, in the illustrated configuration, the case 1 has an open top surface, which is covered by a separate upper cover 7,
Since the container is closed by the upper covers 7, 17, 19, the upper covers 7, 17, 19 may be made of different materials, shapes, and dimensions depending on the purpose of use.
By selecting 9, cases with various functions can be freely constructed, and it is easy to accommodate large-capacity output relays. Moreover, the main body of the case is the same, and only the top cover needs to be different, so the cost is lower than if the entire case were manufactured to various specifications. Also, by placing the recess 2 and protrusion 3 of the case 1 back-to-back as shown in the figure, the case 1 that can be fitted with top covers on both the inside and outside can be molded with a simple mold configuration.

[0014]

According to the present invention, various cases can be constructed by using the same main body and different top cover parts made of different materials and with different shapes, so that it is possible to manufacture an I/O relay that is optimally suited to the specifications while keeping costs down.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of an embodiment of the present invention.

FIG. 2 is a side view of a main portion of FIG.

FIG. 3 is a cross-sectional view of another embodiment of the present invention.

4 is a perspective view of the relay of FIG. 3 inserted into a socket;

5 is a perspective view of the case in FIG. 1;

6 is a perspective view of the upper cover in FIG. 1;

FIG. 7 is a perspective view of another embodiment of a top cover.

8 is a perspective view of the upper cover in FIG. 3. FIG.

[Explanation of symbols]

REFERENCE SIGNS LIST 1 case 2 concave portion 3 convex portion 7 top cover 9 semiconductor element 12 printed circuit board 17 top cover 19 top cover 21 socket

Claims (2)

(57) [Claims] [Claim 1] The top surface of a case for accommodating a semiconductor element is opened, and the open surface is closed by fitting a separate top cover , and a heat dissipating device is provided for the common case.
A plurality of different types of the upper lids are provided, and the semiconductor element
The I/O relay is characterized in that the top cover is selected and used according to the capacity of the relay . 2. An I/O relay according to claim 1, wherein a recess and a protrusion for fitting said upper cover are formed back to back on a side wall of said case.