JP2896161B2 - Solid electrolytic capacitors - Google Patents
Solid electrolytic capacitorsInfo
- Publication number
- JP2896161B2 JP2896161B2 JP1133258A JP13325889A JP2896161B2 JP 2896161 B2 JP2896161 B2 JP 2896161B2 JP 1133258 A JP1133258 A JP 1133258A JP 13325889 A JP13325889 A JP 13325889A JP 2896161 B2 JP2896161 B2 JP 2896161B2
- Authority
- JP
- Japan
- Prior art keywords
- outer container
- terminal
- solid electrolytic
- anode
- capacitor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000003990 capacitor Substances 0.000 title claims description 62
- 239000007787 solid Substances 0.000 title claims description 28
- 239000007784 solid electrolyte Substances 0.000 claims description 13
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 7
- 239000004020 conductor Substances 0.000 description 8
- 229920001940 conductive polymer Polymers 0.000 description 4
- 229920003002 synthetic resin Polymers 0.000 description 4
- 239000000057 synthetic resin Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 229920000128 polypyrrole Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【産業上の利用分野】 この発明は、陰極側に有機導電性ポリマー等が用いら
れた固体電解コンデンサに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid electrolytic capacitor using an organic conductive polymer or the like on a cathode side.
従来、電子回路の小型化、とりわけ混成集積化等の要
請から、電解コンデンサの小型化、チップ化が期待され
ているが、その期待を担う電解コンデンサとして有機導
電性ポリマーを用いた固定電解コンデンサがある。 この種の固体電解コンデンサでは、例えば、アルミニ
ウム板を陽極体に用いてその表面にエッチングにより拡
面化処理を行い、その表面に電解処理によって誘電体層
を形成し、この誘電体層の上面に有機半導体層を成長さ
せて陰極体とするものが知られている。Conventionally, due to the demand for miniaturization of electronic circuits, especially for hybrid integration, downsizing and chipping of electrolytic capacitors are expected.Fixed electrolytic capacitors using organic conductive polymers are expected as electrolytic capacitors that fulfill this expectation. is there. In this type of solid electrolytic capacitor, for example, an aluminum plate is used as an anode body to perform a surface enlargement process by etching on a surface thereof, a dielectric layer is formed on the surface by electrolytic treatment, and an upper surface of the dielectric layer is formed. It is known that a cathode body is formed by growing an organic semiconductor layer.
ところで、このような固体電解コンデンサは、原理的
な構造では従来の固体電解コンデンサと同様であるが、
低インピーダンス化等の電気的な特性を踏まえ、信頼性
の高い素子として実現するには、電極の取出し等で種々
の問題点が存する。 特に、陽極体を成す基板上に選択的に形成された誘電
体層上に陰極体が形成されるが、この陰極体に有機導電
性ポリマーが使用されるので、この陰極体に対する陰極
端子の取出しが非常に厄介であり、低インピーダンス化
が期待できる有機導電性ポリマーを用いても、端子接続
において接続抵抗を増加させたり、接続の信頼性を低下
させる等の不都合がある。 また、コンデンサ素子自体が微細化されたとしても、
端子構造が複雑化し、固体電解コンデンサに対する端子
の占める体積が大きく、容量形成上の体積効率が低下す
る等の不都合がある。 そこで、この発明は、陽極端子及び陰極端子の取出し
の簡略化を実現した固体電解コンデンサを提供すること
を目的とする。By the way, such a solid electrolytic capacitor is similar in principle to a conventional solid electrolytic capacitor,
In order to realize a highly reliable element based on electrical characteristics such as low impedance, there are various problems in taking out electrodes and the like. In particular, a cathode body is formed on a dielectric layer selectively formed on a substrate forming an anode body, and since an organic conductive polymer is used for the cathode body, extraction of a cathode terminal with respect to the cathode body However, even if an organic conductive polymer that can be expected to have low impedance is used, there are inconveniences such as an increase in connection resistance in terminal connection and a decrease in connection reliability. Also, even if the capacitor element itself is miniaturized,
The terminal structure is complicated, the volume occupied by the terminal with respect to the solid electrolytic capacitor is large, and the volume efficiency in forming the capacitance is reduced. Therefore, an object of the present invention is to provide a solid electrolytic capacitor which realizes simplification of taking out an anode terminal and a cathode terminal.
この発明の固体電解コンデンサは、陽極体の表面部に
選択的に誘電体層と固体電解質層とが形成されるととも
に、前記陽極体の露出部が形成されたチップ状を成すコ
ンデンサ素子と、前記陽極体の前記露出部に対応した陽
極端子とともに前記固体電解質層に対応した陰極端子を
持つ外装容器とを備え、前記陽極体の前記露出部に前記
外装容器の前記陽極端子、かつ、前記固体電解質層に前
記外装容器の前記陰極端子を導電性接着剤を以て接続し
て前記外装容器と前記コンデンサ素子とを合体させ、前
記外装容器内に前記コンデンサ素子を収容した構成とし
たものである。A solid electrolytic capacitor according to the present invention, wherein a dielectric layer and a solid electrolyte layer are selectively formed on a surface portion of an anode body, and a chip-shaped capacitor element having an exposed portion of the anode body formed therein; and An outer container having an anode terminal corresponding to the exposed portion of the anode body and a cathode terminal corresponding to the solid electrolyte layer, wherein the exposed terminal of the anode body has the anode terminal of the outer container, and the solid electrolyte The cathode terminal of the outer container is connected to the layer with a conductive adhesive to combine the outer container and the capacitor element, and the capacitor element is accommodated in the outer container.
この発明の固体電解コンデンサでは、コンデンサ素子
と、必要な陽極端子及び陰極端子を備えた外装容器とが
独立して形成され、外装容器の陽極端子に前記コンデン
サ素子の陽極体の露出部を接続し、また、外装容器の陰
極端子に前記コンデンサ素子の固体電解質層を接続する
ことによって、コンデンサ素子と外装容器とを合体させ
るとともに、外装容器内にコンデンサ素子を収容させて
いる。 したがって、この発明の固体電解コンデンサでは、コ
ンデンサ素子を収容すべき外装容器と陽極端子及び陰極
端子とを同時に形成でき、端子構造の簡略化とともに、
耐湿性を高めた精度の高い固体電解コンデンサが実現さ
れる。In the solid electrolytic capacitor of the present invention, the capacitor element and the outer container having the necessary anode and cathode terminals are formed independently, and the exposed portion of the anode body of the capacitor element is connected to the anode terminal of the outer container. In addition, by connecting the solid electrolyte layer of the capacitor element to the cathode terminal of the outer container, the capacitor element and the outer container are combined, and the capacitor element is accommodated in the outer container. Therefore, in the solid electrolytic capacitor of the present invention, the outer container to accommodate the capacitor element, the anode terminal and the cathode terminal can be formed simultaneously, and the terminal structure is simplified,
A highly accurate solid electrolytic capacitor with improved moisture resistance is realized.
以下、この発明を図面に示した実施例を参照して詳細
に説明する。 第1図は、この発明の固体電解コンデンサの実施例を
示す。第1図の(A)及び(B)に示すように、コンデ
ンサ素子2及び外装容器7が独立して形成された後、第
1図の(C)に示すように、両者を合体させることによ
り、固体電解コンデンサ10が構成されている。 (a)コンデンサ素子2 第1図の(A)及び(B)に示すように、コンデンサ
素子2には厚さ1mm程度の純度の高いアルミニウム板又
はアルミニウム合金板等の弁金属板で形成された陽極体
20が用いられる。陽極体20の表面には、エッチングによ
って拡面化処理が施された後、陽極酸化によって誘電体
層21が露出部22を残して選択的に形成されている。そし
て、この陽極体20の表面には、誘電体層21が形成されて
いない露出部22を覆い、選択的に透過窓が形成されたス
クリーンを用いてレジスト等を印刷することにより、ス
クリーンの透過窓を通して絶縁層23が選択的に形成され
る。なお、絶縁層23は、絶縁性レジストの他、他の絶縁
物の塗布等によって形成してもよい。この絶縁層23の開
口24から選択的に露出させた誘電体層21の表面には、そ
の表面を覆う固体電解質層25が形成されている。この固
体電解質層25は、化学重合や電解重合等の処理によって
形成されたポリピロール重合膜等の有機半導体層によっ
て構成される。そして、固体電解質層25の表面には、カ
ーボンペーストや導電ペースト等を印刷又は塗布等の手
段によって陰極導体層26が形成されている。 また、陽極体20の表面に形成された露出部22は、陽極
体20の表面に一様に誘電体層21を生成させた後、露出部
22とすべき部分の誘電体層21を選択的に除去してもよ
い。 (b)外装容器7 第1図の(A)に示すように、外装容器7は絶縁性合
成樹脂等で一体成形によって形成され、コンデンサ素子
2を収容可能な収容部70が形成されている。 そして、外装容器7の底部には、コンデンサ素子2の
表面上の段差を吸収する段部73が形成されており、その
一体成形と同時に金属板からなる陽極端子71及び陰極端
子72が形成されている。陽極端子71は、収容部70の底面
側にコンデンサ素子2の陽極体20の露出部22に対応し、
かつ、陰極端子72は、陰極導体層26に対応して設置され
ているとともに、陽極端子71及び陰極端子72は外装容器
7の外壁部を貫通して外壁部から底面側に配設され、フ
ェイスボンディング可能な電極端子として形成されてい
る。 (c)固体電解コンデンサ10の形成 第1図の(B)に示すように、外装容器7の内部にお
ける陽極端子71及び陰極端子72上に導電ペースト等の導
電性及び接着性を備えた導電性接着剤74、75を塗布した
後、陽極端子71側に陽極体20の露出部22、陰極端子72側
に陰極導体層26を接合する。 この接合によって、陽極端子71側と陽極体20の露出部
22とが電気的に接続されるとともに、陰極端子72側と陰
極導体層26とが電気的に接続され、第1図の(C)に示
すように、導電性接着剤74、75でコンデンサ素子2と外
装容器7とが合体されて固体電解コンデンサ10が形成さ
れる。この場合、コンデンサ素子2に生じている陽極体
20の露出部22と陰極導体層26との間の段差は外装容器7
の底面部に形成された段部73によって吸収されるので、
コンデンサ素子2は外装容器7の収容部70の内部に水平
に固定されることになる。 以上のように、独立して形成されたコンデンサ素子2
及び外装容器7を用いて一つの固体電解コンデンサ10を
形成するので、端子構造の簡略化が図られるとともに、
コンデンサ素子2を収容すべき外装容器7と陽極端子71
及び陰極端子72とが同時に形成され、端子構造の簡略化
とともに、耐湿性を高めた精度の高い固体電解コンデン
サが得られる。 次に、第2図は、外装容器を用いた固体電解コンデン
サの他の実施例を示す。 外装容器9の底面部を水平に形成するとともに、その
底面部に電極端子92A、92Bを設置して外装容器9から引
き出し、その底面側に配設する。この外装容器9の内部
に、前記第2実施例で用いられた単一の陽極体20上に形
成されたコンデンサ素子2A、2Bを設置し、導電性接着剤
75によって電気的に接続するとともに外装容器9の内部
にコンデンサ素子2A、2Bを固着し、バイポーラ形の固体
電解コンデンサ11が得られる。 この場合も、陽極体20に陽極端子を形成すれば、陽極
端子と各電極端子92A、92Bとの間でコンデンサ素子2A、
2Bを個別に用いることができる。 次に、第3図に示すように、外装容器7に収容された
陽極体20の背面部に合成樹脂等を塗布するとともに、外
装容器7と陽極体20との間にその合成樹脂等の一部を侵
入させて絶縁被覆13を形成すれば、絶縁被覆13で陽極体
20側を覆い、かつ、外装容器7の開口部を閉塞できるの
で、固体電解コンデンサ10の耐湿性の向上を図ることが
できる。 次に、第4図に示すように、陽極体20が外装容器9の
開口面より内部に入り込むように外装容器9の側壁を高
くして収容部90を深く形成するとともに、陽極体20の裏
面部側に形成された空間部に合成樹脂等を充填して絶縁
被覆13を形成すれば、絶縁被覆13で陽極体20側を覆い、
かつ、外装容器9の開口部を閉塞できるので、固体電解
コンデンサ11の耐湿性をより向上させることができる。
これは、第1図に示す固体電解コンデンサについても同
様に形成することができる。 なお、各実施例において、固体電解質層の上に陰極導
体層を設置したが、固体電解質層の上に陽極端子を導電
性接着剤で接続することにより、導電性接着剤で陰極導
体層を兼用させることも可能である。Hereinafter, the present invention will be described in detail with reference to embodiments shown in the drawings. FIG. 1 shows an embodiment of the solid electrolytic capacitor of the present invention. After the capacitor element 2 and the outer container 7 are independently formed as shown in FIGS. 1A and 1B, by combining them as shown in FIG. 1C. The solid electrolytic capacitor 10 is configured. (A) Capacitor element 2 As shown in FIGS. 1A and 1B, the capacitor element 2 is formed of a valve metal plate such as a high-purity aluminum plate or aluminum alloy plate having a thickness of about 1 mm. Anode body
20 is used. After the surface of the anode body 20 is subjected to a surface enlargement process by etching, a dielectric layer 21 is selectively formed by anodic oxidation leaving an exposed portion 22. Then, on the surface of the anode body 20, the exposed portion 22 where the dielectric layer 21 is not formed is covered, and a resist or the like is selectively printed using a screen having a transmission window formed thereon, so that the transmission of the screen is performed. The insulating layer 23 is selectively formed through the window. Note that the insulating layer 23 may be formed by applying another insulating material in addition to the insulating resist. On the surface of the dielectric layer 21 selectively exposed from the opening 24 of the insulating layer 23, a solid electrolyte layer 25 covering the surface is formed. The solid electrolyte layer 25 is composed of an organic semiconductor layer such as a polypyrrole polymer film formed by a process such as chemical polymerization or electrolytic polymerization. The cathode conductor layer 26 is formed on the surface of the solid electrolyte layer 25 by printing or coating a carbon paste, a conductive paste, or the like. The exposed portion 22 formed on the surface of the anode body 20 is formed by uniformly forming the dielectric layer 21 on the surface of the anode body 20 and then exposed.
The portion of the dielectric layer 21 that should be 22 may be selectively removed. (B) Outer Container 7 As shown in FIG. 1 (A), the outer container 7 is formed by integral molding of an insulating synthetic resin or the like, and has a housing part 70 capable of housing the capacitor element 2. A step 73 for absorbing a step on the surface of the capacitor element 2 is formed at the bottom of the outer container 7, and an anode terminal 71 and a cathode terminal 72 made of a metal plate are formed at the same time as the integral molding. I have. The anode terminal 71 corresponds to the exposed portion 22 of the anode body 20 of the capacitor element 2 on the bottom side of the housing 70,
Further, the cathode terminal 72 is provided corresponding to the cathode conductor layer 26, and the anode terminal 71 and the cathode terminal 72 penetrate through the outer wall of the outer container 7 and are disposed from the outer wall to the bottom surface. It is formed as a bondable electrode terminal. (C) Formation of Solid Electrolytic Capacitor 10 As shown in FIG. 1B, a conductive paste or other conductive material having conductive and adhesive properties is provided on the anode terminal 71 and the cathode terminal 72 inside the outer container 7. After applying the adhesives 74 and 75, the exposed portion 22 of the anode body 20 is joined to the anode terminal 71 side, and the cathode conductor layer 26 is joined to the cathode terminal 72 side. By this bonding, the anode terminal 71 side and the exposed portion of the anode body 20 are exposed.
22 are electrically connected, and the cathode terminal 72 side and the cathode conductor layer 26 are electrically connected. As shown in FIG. 2 and the outer container 7 are united to form a solid electrolytic capacitor 10. In this case, the anode body generated in the capacitor element 2
The step between the exposed portion 22 of 20 and the cathode conductor layer 26 is
As it is absorbed by the step 73 formed on the bottom part of
The capacitor element 2 is horizontally fixed inside the accommodating portion 70 of the outer container 7. As described above, the capacitor element 2 formed independently
In addition, since one solid electrolytic capacitor 10 is formed using the outer container 7, the terminal structure can be simplified,
Outer container 7 for housing capacitor element 2 and anode terminal 71
And the cathode terminal 72 are formed at the same time, so that a highly accurate solid electrolytic capacitor having simplified terminal structure and improved moisture resistance can be obtained. Next, FIG. 2 shows another embodiment of a solid electrolytic capacitor using an outer container. The bottom surface of the outer container 9 is formed horizontally, and the electrode terminals 92A and 92B are provided on the bottom portion, pulled out from the outer container 9, and arranged on the bottom surface side. Inside the outer container 9, the capacitor elements 2A and 2B formed on the single anode body 20 used in the second embodiment are placed, and a conductive adhesive is provided.
The capacitor elements 2A and 2B are electrically connected to each other by the reference numeral 75, and the capacitor elements 2A and 2B are fixed inside the outer casing 9, thereby obtaining a bipolar solid electrolytic capacitor 11. Also in this case, if the anode terminal is formed on the anode body 20, the capacitor element 2A, between the anode terminal and each electrode terminal 92A, 92B,
2B can be used individually. Next, as shown in FIG. 3, a synthetic resin or the like is applied to the back surface of the anode body 20 accommodated in the outer container 7 and one piece of the synthetic resin or the like is interposed between the outer container 7 and the anode body 20. If the insulating coating 13 is formed by invading the
Since the 20 side can be covered and the opening of the outer container 7 can be closed, the moisture resistance of the solid electrolytic capacitor 10 can be improved. Next, as shown in FIG. 4, the accommodating portion 90 is formed deep by raising the side wall of the outer package 9 so that the anode body 20 enters the inside of the outer package 9 from the opening surface thereof, and the back surface of the anode body 20 is formed. If the insulating portion 13 is formed by filling a synthetic resin or the like into the space formed on the portion side, the insulating member 13 covers the anode body 20 side,
In addition, since the opening of the outer container 9 can be closed, the moisture resistance of the solid electrolytic capacitor 11 can be further improved.
This can be similarly formed for the solid electrolytic capacitor shown in FIG. In each of the examples, the cathode conductor layer was provided on the solid electrolyte layer, but by connecting the anode terminal on the solid electrolyte layer with the conductive adhesive, the cathode conductor layer was also used as the conductive adhesive. It is also possible to make it.
以上説明したように、この発明によれば、次のような
効果が得られる。 (a)コンデンサ素子と端子板とを別個に形成できると
ともに、端子構造の簡略化が図られ、生産性を向上させ
ることができ、また、両者の製造工程におけるエラーが
互いに影響を与えないので、信頼性の向上とともに精度
の高い固体電解コンデンサが実現できる。 (b)コンデンサ素子を収容すべき外装容器と陽極端子
及び陰極端子とを同時に形成できるとともに、コンデン
サ素子を別個に形成でき、端子構造の簡略化が得られ、
しかも、外装容器によって固体電解コンデンサの耐湿性
能を高めることができる。As described above, according to the present invention, the following effects can be obtained. (A) Since the capacitor element and the terminal plate can be formed separately, the terminal structure can be simplified, productivity can be improved, and errors in both manufacturing processes do not affect each other. A solid electrolytic capacitor with high accuracy can be realized with improved reliability. (B) The outer container in which the capacitor element is to be accommodated, the anode terminal and the cathode terminal can be formed simultaneously, and the capacitor element can be formed separately, so that the terminal structure can be simplified.
Moreover, the moisture resistance of the solid electrolytic capacitor can be enhanced by the outer container.
第1図はこの発明の固体電解コンデンサの実施例を示す
図、 第2図ないし第4図はこの発明の固体電解コンデンサの
他の実施例を示す縦断面図である。 2……コンデンサ素子 20……陽極体 21……誘電体層 22……露出部 25……固体電解質層 7、9……外装容器 10、11……固体電解コンデンサ 71……陽極端子 72……陰極端子 74、75……導電性接着剤FIG. 1 is a view showing an embodiment of the solid electrolytic capacitor of the present invention, and FIGS. 2 to 4 are longitudinal sectional views showing another embodiment of the solid electrolytic capacitor of the present invention. 2 Capacitor element 20 Anode body 21 Dielectric layer 22 Exposed portion 25 Solid electrolyte layer 7, 9 Outer container 10, 11 Solid electrolytic capacitor 71 Anode terminal 72 Cathode terminal 74, 75 ... Conductive adhesive
───────────────────────────────────────────────────── フロントページの続き (72)発明者 金子 敦子 東京都青梅市東青梅1丁目167番地の1 日本ケミコン株式会社内 (56)参考文献 実開 平2−33426(JP,U) 実開 昭59−112927(JP,U) (58)調査した分野(Int.Cl.6,DB名) H01G 9/05 ──────────────────────────────────────────────────続 き Continuation of the front page (72) Inventor Atsuko Kaneko 1-167, Higashi-Ome, Ome-shi, Tokyo 1 Inside Nippon Chemi-Con Corporation (56) References JP-U 2-33426 (JP, U) JP-A 59 −112927 (JP, U) (58) Fields investigated (Int. Cl. 6 , DB name) H01G 9/05
Claims (1)
電解質層とが形成されるとともに、前記陽極体の露出部
が形成されたチップ状を成すコンデンサ素子と、 前記陽極体の前記露出部に対応した陽極端子とともに前
記固体電解質層に対応した陰極端子を持つ外装容器とを
備え、 前記陽極体の前記露出部に前記外装容器の前記陽極端
子、かつ、前記固体電解質層に前記外装容器の前記陰極
端子を導電性接着剤を以て接続して前記外装容器と前記
コンデンサ素子とを合体させ、前記外装容器内に前記コ
ンデンサ素子を収容したことを特徴とする固体電解コン
デンサ。1. A chip-shaped capacitor element in which a dielectric layer and a solid electrolyte layer are selectively formed on a surface portion of an anode body and an exposed portion of the anode body is formed; An outer container having an anode terminal corresponding to the exposed portion and a cathode terminal corresponding to the solid electrolyte layer, wherein the exposed portion of the anode body has the anode terminal of the outer container, and the solid electrolyte layer has the anode terminal. A solid electrolytic capacitor, wherein the cathode terminal of the outer container is connected with a conductive adhesive to combine the outer container and the capacitor element, and the capacitor element is accommodated in the outer container.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1133258A JP2896161B2 (en) | 1989-05-26 | 1989-05-26 | Solid electrolytic capacitors |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1133258A JP2896161B2 (en) | 1989-05-26 | 1989-05-26 | Solid electrolytic capacitors |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02312219A JPH02312219A (en) | 1990-12-27 |
| JP2896161B2 true JP2896161B2 (en) | 1999-05-31 |
Family
ID=15100412
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1133258A Expired - Lifetime JP2896161B2 (en) | 1989-05-26 | 1989-05-26 | Solid electrolytic capacitors |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2896161B2 (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59112927U (en) * | 1983-01-21 | 1984-07-30 | 日立コンデンサ株式会社 | chip capacitor |
| JPH0233426U (en) * | 1988-08-25 | 1990-03-02 |
-
1989
- 1989-05-26 JP JP1133258A patent/JP2896161B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02312219A (en) | 1990-12-27 |
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