JP2898680B2 - Method and apparatus for manufacturing printed circuit board - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a manufacturing method and a manufacturing apparatus for automatically and continuously manufacturing a printed circuit board.

(Prior art)

2. Description of the Related Art Conventionally, printed circuit boards are punched into strips and then into individual pieces by a manual press.

That is, a large number of printed boards are manufactured by punching a strip from a sheet-like substrate and then punching an individual board from the strip (see FIGS. 2 to 4 described later). That is, the individual board thus obtained is called a printed board.

The printed circuit board is, for example, an individual printed circuit board such as a chip-on-board, and has a conductor circuit and a through hole (not shown) on the board.

[Problem to be solved]

However, the above prior art has the following problems.

That is, since the printed board is manufactured by a manual press machine, the punching process requires a long time, the work is complicated, and the board is easily damaged.

For example, when the punching process is completed, a tool such as air blowing or tweezers is used to take out the substrate from the mold of the manual press machine. Therefore, these operations require a large number of manpowers and are liable to cause damage and dirt on the conductor circuits on the substrate surface. As a result, product defects occur, and the yield decreases.

SUMMARY OF THE INVENTION The present invention has been made in view of such a conventional problem, and an object of the present invention is to provide a method and an apparatus for manufacturing a printed circuit board which can be automatically manufactured without causing damage or dirt on the printed circuit board. It is.

[MEANS FOR SOLVING THE PROBLEMS] The present invention provides a substrate setting step of setting substrates in a stack, a substrate positioning step of taking in substrates one by one by suction, and positioning the punched strips, and A first pressing step of punching into a strip shape and holding the strip-shaped substrate in the upper die, a strip taking-out process of extracting the punched strip by extruding the held strip-shaped substrate from the upper die and dropping, And a second pressing step of punching the inside of the strip into individual pieces, and a method for manufacturing a printed circuit board.

The most remarkable aspects of the present invention are the substrate positioning step of taking in the substrates one by one by vacuum suction and positioning them for punching in a strip shape, punching the substrate in a strip shape and setting the strip substrate in the upper die. And a strip removing step of removing the punched strip by extruding the held strip-shaped substrate from the upper die and dropping it.

As a method of holding the strip-shaped substrate on the upper die, for example, there is a method of holding the punched strip by means of a fit between the die side surface of the upper die and the strip-shaped substrate in the upper die of the first press machine.

As a method of taking out the punched strips, for example, as shown in the embodiment, the transfer belt conveyor is slid and moved under the upper mold in the first press machine which holds the strips and holds the strips with hydraulic pressure. There is a method in which a strip is released by a cylinder, dropped on the belt conveyor, and is automatically conveyed.

For example, a strip is formed by arranging a large number of individual substrates on a sheet substrate, and punching the group of individual substrates into a strip. (Second
(See FIG. 3, FIG. 3).

In addition, punching the inside of the strip into individual pieces means that individual printed boards such as a plurality of chip-on-boards of the strip-shaped substrate can be easily individualized without being individually separated. Punching into a state (see FIG. 4).

On the other hand, as an apparatus for manufacturing the printed circuit board, there are a substrate setting apparatus for stacking and setting the substrates, a board positioning apparatus for taking in the boards by suction and punching them into strips, and A first press machine for punching the strip into a strip and holding the strip substrate on the upper die, and a strip for extracting the punched strip from the first press by extruding the held strip substrate from the upper die and dropping it. There is a printed circuit board manufacturing apparatus characterized by comprising a take-out device, a strip positioning device for positioning for punching the strip into individual pieces, and a second press machine for punching the strip into pieces.

In the above manufacturing equipment, the most remarkable thing is that the substrate is taken in one by one by suction and the substrate is positioned in a strip shape, and the board is punched in a strip shape. And a strip take-out device for removing the punched strips from the first press by extruding the held strip-shaped substrates from the upper die and dropping them.

As a first press for holding the strip in the upper mold, there is, for example, a device for holding the strip by contact resistance between the side surface of the upper die and the substrate.

[Action]

In the manufacturing method according to the present invention, the printed circuit board is manufactured according to the following procedure.

That is, first, the substrates are set in a stack. Next, the substrates are taken in one by one by suction, and are positioned for punching them in a strip shape. Next, the substrate is punched in a strip shape, and the strip substrate is held in an upper mold. Then, take out the punched strip. Next, positioning for punching the strip into individual pieces is performed. Next, the inside of the strip is punched out into individual pieces by a second press.

 Thereafter, the substrate is subjected to a process such as cleaning.

On the other hand, a printed circuit board manufacturing apparatus is used for automatically manufacturing the printed circuit board.

[Effects] As described above, according to the present invention, a printed circuit board can be manufactured automatically and easily.

Therefore, it is possible to provide a method and an apparatus for manufacturing a printed circuit board, which can be automatically manufactured without causing damage or dirt on the printed circuit board.

〔Example〕

First Embodiment A manufacturing method according to this embodiment will be described with reference to FIGS.

That is, as shown in FIGS. 2 to 4, the manufacturing method of this embodiment is to punch the sheet-like substrate 1 into strips 11 and to punch the strip 11 into a state in which the individual substrates 120 are held. Is what you do. The substrate 1 is, as shown in FIG.
A number of individual substrates 120 are arranged side by side, and have sprockets 10 at four corners. The strips 11 are each formed by arranging four individual substrates 120 in a line, and have a rectangular shape. Further, as shown in FIG. 4, the individual substrate 120 is formed by cutting the upper and lower edges 111 of the processed substrate 12 punched into an “I” shape 125.
Is supported through the leg 121.

That is, as shown in FIG. 1, the manufacturing method of the present embodiment includes a substrate setting step A for setting the substrates 1 in a stacking manner, and a substrate positioning for sucking and ordering the substrates 1 and performing positioning for punching them into strips. Step B, a first pressing step C in which the substrate 1 is punched in a strip shape and held in an upper mold,
A strip removing process D for taking out the punched strips 11, and a strip positioning process E for positioning for punching into individual pieces.
And a second pressing step F for punching the strip 11 into the processed substrate 12 having the individual substrates 120.

In the substrate setting step A, an operator sets the stacked sheet-like substrates 1 on the substrate setting table 101 and moves the substrate 1 to the substrate loading table 102 together with the substrate setting table 101. As shown in FIG. 1, the substrate 1 has sprockets (holes) 10 for positioning at four corners. Therefore, when the substrates 1 are stacked on the substrate setting table 101 and the substrate loading table 102, the sprockets 10 are inserted into the positioning pins 103 provided upright on both tables.

Next, in the substrate positioning step B, positioning for punching the substrate 1 into a strip shape is performed. That is, as shown in FIG. 1, the positioning is performed by sucking the substrate 1 on the substrate loading table 102 by the suction pad 211 provided in the suction machine 21 and reciprocating in the H direction. Then, the substrate 1 is placed at a predetermined position on the substrate positioning table 2 by inserting it into the sprocket 20.

Next, in the first pressing step C, the substrate 1
Is punched in a strip shape by the first press machine 3 and held. That is, as shown in FIG. 5, the substrate 1 is automatically transferred into the first press 3 from the substrate positioning step B. Then, as shown in FIG. 6, the punching of the substrate 1 is performed in a state where the first press 3 is clamped by the upper die 31 and the lower die 32. That is, the upper die 31 descends to the substrate 1 placed on the lower die 32. Thereby, as shown in FIGS. 2 and 3, the sheet-like substrate 1 is cut into three elongated strips 11 in the first press machine 3.

It should be noted here that the cut strip 11
As shown in the figure, it is to be fitted and held in the die part 30 provided inside the upper die 31. That is, the substrate 1 held by the upper die 31 is held in the die portion 30 of the upper die 31 by contact resistance between the side surface of the die portion 30 and the substrate 1 as shown in FIG. As a result, as shown in FIG. 8, the die unit 30 holds the strip 11 in the die unit 30 while holding the strip 11 in the die unit 30.
Ascends with 31.

In the strip removing step D, the punched strip 11 is removed from the first press machine 3. That is, when removing the strip 11, as shown in FIG. 9, the belt conveyor 4 is moved between the upper die 31 and the lower die 32 opened vertically.

Then, the strip 11 held by the upper die 31 is dropped onto the belt conveyor 4. That is, the pusher 34 is pushed out of the die unit 30 by the hydraulic cylinder 33. Thus, the strip 11 held by the upper die 31 is dropped onto the elastic belt conveyor 4 without being damaged.
Next, the strip 11 is, as shown in FIG.
1. It is moved to the left by the belt conveyor 4 from inside the lower mold 32.

Next, in the strip positioning step E, positioning for punching the strip into pieces is performed. Here, the positioning is performed by positioning the strip 11 on the belt conveyor 4 by a suction pad 51 provided on the suction machine 5 as shown in FIGS. 1 and 12 and a strip positioning table 6 on which a roll conveyor 62 is disposed. After moving to. That is, the strip positioning table 6 having the substrate pusher 61, the alignment guide 63, and the stopper 64 is arranged on the roll conveyor 62. As a result, the strip 11 is automatically adjusted to a predetermined position on the strip positioning table 6.

That is, the traveling direction T of the strip 11 is aligned by the substrate pusher 61 and the stopper 64. The alignment guide 63 aligns the strip 11 in a direction perpendicular to the traveling direction T. The stopper 64 is moved up and down by a cylinder (not shown).
Ascend upward.

Next, in the second pressing step F, the inside of the strip 11 is punched by the second pressing machine 7 into a processed substrate 12 having an individual substrate 120. That is, as shown in FIG. 1, the strip 11 is clamped (not shown) from above the strip positioning table 6 to form an upper die 71 and a lower die 72 of the second press 7.
To move between. Then, by operating the second press machine 7, first, the inside of the strip 11 is punched into an “D” shape 125. Thereby, as shown in FIG. 4, the strip 11 is punched into a processing substrate 12 having an individual substrate 120.

The punched plate 12 is automatically conveyed by the roll conveyor 8 to the next washing step.

As described above, according to the manufacturing method of this example, a printed circuit board can be automatically and continuously manufactured.

Therefore, the printed circuit board is not damaged or stained. In addition, it is possible to reduce the defect of the printed circuit board and save labor.

Second Embodiment A manufacturing apparatus according to this embodiment will be described with reference to FIGS.

That is, as shown in FIG. 11, the manufacturing apparatus of this embodiment includes a substrate setting device P for setting the stacked substrates 1 and a substrate positioning device S for punching the substrate 1 in a strip shape.
And a first pressing machine 3 for punching the substrate 1 in a strip shape;
A strip take-out device Q for taking out the punched strips 11 from the first press machine 3, a strip positioning device R for positioning the inside of the strips 11 in the shape of the individual substrates 120, and an individual piece inside the strips 11 And a second press machine 7 for punching into a shape.

As shown in FIG. 13, the substrate setting apparatus P includes a substrate setting table 101 for stacking the substrates 1 and a substrate loading table 102 for moving the substrates 1 in the J direction and stacking them. In the substrate setting table 101 and the substrate loading table 102, positioning pins 103 are respectively provided at four corners.

Further, as shown in FIG. 1, the substrate set table 101 has an engagement hole for fitting into an engagement protrusion standing upright on the substrate loading table 102. And the above board set table
The substrate 101 and the substrate loading table 102 are overlapped with each other by the engagement protrusions and the engagement holes.

Further, when the substrate 1 on the substrate set table 101 disappears,
The position is replaced with one of the two substrate loading tables 102 provided in the J0 direction.

That is, the positioning pins 103 are attached to the sprocket 1
0 (see FIG. 2), whereby the substrates 1 are stacked on the substrate setting table 101 and the substrate loading table 102.

The substrate positioning device S has a suction pad above it.
An adsorber 21 having 211 is provided.

The adsorber 21 is disposed on the rail 213 so as to be slidable in the H direction. Further, the suction device 21 is provided with a first driving device 2 so as to slide on the rail 213.
With 12. The board positioning table 2 has positioning pins 20 at four corners as shown in FIG. And
The substrate 1 stacked on the substrate loading table 102 is moved to the substrate positioning table 2. That is, the adsorber 21
Reciprocate between directions. Thus, the substrate 1 can be automatically moved from the substrate loading table 102 onto the substrate positioning table 2.

The first press machine 3 includes an upper die 31, a lower die 32, and a crank press 33.

That is, the first press machine 3 is an apparatus for punching the substrate 1 into a strip shape and holding the strip substrate on the upper die 31 (see FIG. 5).

Then, an oil feed pipe 301 for returning oil from the hydraulic machine 33 is connected to the die section 30 (see FIG. 7).
It should be noted here that the punched strip 11 is automatically held by the die unit 30 in the upper die and moves upward as the upper die 31 rises.

Further, as shown in FIG. 15, the first press 3 has a fixing clamp section 34 and a constant pitch feed section 35 operated by a servomotor. Note that reference numeral 32 in the figure denotes a mold.

The strip positioning device R includes a belt conveyor 4 and
It comprises a strip positioning table 6 and an adsorber 5 reciprocating above the two. The belt conveyor 4 is disposed so as to slide in the direction L of the first three presses.

That is, as shown in FIG.
Has a guide 42 for sliding on a rail 41 in the L direction below. Above the belt conveyor 4, a rail 51 is provided for the adsorber 5 to slide in the M direction. The suction machine 5 has a suction pad 52 below and a guide 53 above. The strip positioning table 6 is arranged on a roll conveyor 62. That is, the strip positioning table 6 is arranged on the roll conveyor 62 so that the strip 11 positioned on the strip positioning table 6 is automatically conveyed to the second press 7 in the next step.

The second press 7 comprises an upper die 71, a lower die 72, and a crank press 73 as shown in FIG. That is, the second
The press machine 7 is for punching the strip 11 into the shape of an individual substrate 120 (see FIG. 4). Then, the second press machine 7 raises and lowers the upper die 71 by the operation of the hydraulic machine 73, and moves the strip 11 into individual substrates.
It is configured to be stamped into 120 shapes.

And, as shown in FIG. 11, a roll conveyor 8 is provided behind the second press machine 7 so as to automatically transfer the processed substrate 12 to the washing machine 9 in the next step.

 Next, the function and effect will be described.

That is, in the manufacturing apparatus of this embodiment, the substrate set table 101
13, the substrates 1 stacked on the substrate setting table 101 are moved in the J direction, and are moved onto the substrate loading table 102 as shown in FIG.

Further, as shown in FIG. 12, the above-stacked substrates 1 are automatically and continuously moved back and forth in the H direction by the operation of the first driving device 212 to automatically and continuously move the substrate positioning table 2. Moved up. Thus, the substrate 1 is positioned on the substrate positioning table 2.

Thus, as shown in FIG. 15, the substrate 1 is automatically and continuously supplied in a state where the substrate 1 is positioned on the first press machine 3 in the next step. That is, since the first press 3 has the constant pitch feed section 35 in the front-rear direction, the substrate 1 is automatically and continuously supplied into the press 3.

Next, the positioned substrate 1 is punched with the four corners fixed by the fixing clamp part 34. As a result, the substrate 1 is punched into strips 11 (third strip).
See figure).

In addition, the strip 11 thus punched is moved along with the rise of the upper die 31 in the same manner as described in the first embodiment.
31 (see FIGS. 6 and 7).

Next, in the strip positioning device Q, the belt conveyor 4 slides in the L direction by the operation of the guide 42 (see FIG. 8). Then, the belt conveyor 4 stops between the upper die 31 and the lower die 32 (see FIG. 9). Next, the strips 11 dropped onto the belt conveyor 4 are automatically and continuously conveyed in the M direction by the operation of the guides 42 and the substrate pushers 61 (see FIG. 10).

At this time, the strip 11 comes into contact with the stopper 64. The alignment guide 63 contacts the side surface of the strip 11. Thereby, the strips 11 are aligned in the traveling direction T and the direction orthogonal thereto.

Next, the strip 11 is positioned on the strip positioning table 6 for punching the inside of the strip 11 into individual pieces.

The strip 11 in the positioned state is punched by the second press machine 7 into a processing substrate 12 having an individual substrate 120. Thus, the processing substrate 12 is obtained (see FIG. 4). Next, the processed substrate 12 is supplied to the cleaning machine 9 by the roll conveyor 8.

As described above, according to this example, a printed circuit board can be manufactured automatically, continuously and easily. for that reason,
According to the manufacturing apparatus of this embodiment, the same effects as in the first embodiment can be obtained.

[Brief description of the drawings]

1 to 10 show a method for manufacturing a printed circuit board according to the first embodiment, FIG. 1 is a process diagram of the method for manufacturing a printed circuit board, FIG. 2 is a plan view of a sheet-like substrate, and FIG. FIG. 4 is a plan view of a processing board, FIGS. 5 to 10 are explanatory diagrams of the operation of the first press machine, and FIGS. 11 to 15 show a manufacturing apparatus according to the second embodiment. , FIG. 11 is a perspective view thereof, FIG. 12 is a side view thereof, FIG. 13 is a perspective view of a substrate setting device, FIG.
FIG. 15 is a perspective view of the substrate positioning table, and FIG. 15 is a plan view showing a fixed state of the substrate in the first press. DESCRIPTION OF SYMBOLS 1 ... board | substrate, 101 ... board setting stand, 102 ... board loading stand, 103 ... positioning pin, 11 ... strip, 12 ... processed board, 120 ... individual piece board, 2
... Substrate positioning table, 20 ... Positioning pin, 3 ... First press,
30… die part, 31… upper type, 32… lower type, 4… belt conveyor, 5
... Suction machine, 6 ... Strip positioning table, 7 ... Second press machine,

Claims (2)

(57) [Claims] 1. A substrate setting step of setting substrates in a stack, a substrate positioning step of taking in substrates one by one by suction, and positioning to punch the substrates into strips, and a step of punching the substrates into strips. A first pressing step for holding the strip-shaped substrate in the upper die, a strip-out process for extracting the punched strips by extruding the held strip-shaped substrate from the upper die and dropping the strip-shaped substrate into individual pieces. A method for manufacturing a printed circuit board, comprising: a strip positioning step of performing positioning for punching; and a second pressing step of punching the strip into individual pieces. 2. A substrate setting device for inputting substrates and setting them in a stack, a substrate positioning device for taking in the substrates by suction and punching the substrates into strips, and a substrate punching and stripping the substrates into strips. A first press for holding the upper die, a strip removing device for extracting the punched strips from the first press by extruding and holding the held strip-shaped substrate from the upper die, and an individual piece in the strip. A printed circuit board manufacturing apparatus, comprising: a strip positioning device for performing positioning for punching into a strip; and a second press machine for punching the strip into individual pieces.