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JP2900541B2 - Board connection structure - Google Patents
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JP2900541B2 - Board connection structure - Google Patents

Board connection structure

Info

Publication number
JP2900541B2
JP2900541B2 JP2170707A JP17070790A JP2900541B2 JP 2900541 B2 JP2900541 B2 JP 2900541B2 JP 2170707 A JP2170707 A JP 2170707A JP 17070790 A JP17070790 A JP 17070790A JP 2900541 B2 JP2900541 B2 JP 2900541B2
Authority
JP
Japan
Prior art keywords
substrate
conductor
printed circuit
board
connection structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2170707A
Other languages
Japanese (ja)
Other versions
JPH0458585A (en
Inventor
義之 水藻
明和 古匠
明則 木俣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Minolta Co Ltd
Original Assignee
Minolta Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=15909908&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JP2900541(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Minolta Co Ltd filed Critical Minolta Co Ltd
Priority to JP2170707A priority Critical patent/JP2900541B2/en
Publication of JPH0458585A publication Critical patent/JPH0458585A/en
Application granted granted Critical
Publication of JP2900541B2 publication Critical patent/JP2900541B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/325Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits

Landscapes

  • Combinations Of Printed Boards (AREA)

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は、電気機器において、基板どうしを互いに電
気接続するための接続構造に関する。
Description: TECHNICAL FIELD The present invention relates to a connection structure for electrically connecting boards to each other in an electric device.

(従来の技術) 従来、第5図に示す如く、プリント基板(25)とプリ
ント基板(24)間で互いに接続すべき複数対の導体部分
(25a),(24a)を各プリント基板の夫々において中心
点に対しほぼ回転対象的に、かつ相互同形に配置し、対
をなす導体部分(25a),(24a)を一致させてプリント
基板(24),(25)を重ね、プリント基板上に押板を当
て、上記中心点において一本のねじ(21)でプリント基
板(24),(25)弾性部材(23)、押板(22),(26)
を締結してなるプリント基板の電気回路的接続構造が知
られている。
(Prior Art) Conventionally, as shown in FIG. 5, a plurality of pairs of conductor portions (25a) and (24a) to be connected to each other between a printed board (25) and a printed board (24) are formed on each of the printed boards. The printed circuit boards (24) and (25) are placed almost symmetrically about the center point and in the same shape, and the conductor parts (25a) and (24a) forming a pair are aligned with each other. The board is applied, and the printed board (24), (25) elastic member (23), push plate (22), (26) at the center point with one screw (21)
There is known an electric circuit connection structure of a printed circuit board formed by fastening the above.

(発明が解決しようとする課題) しかしながら、上述の接続構造では、2枚のプリント
基板の接続しかできず、1枚のプリント基板に2枚以上
のプリント基板を接続する場合、上記接続構造を2つ以
上持たなければならなかった。
(Problems to be Solved by the Invention) However, in the above connection structure, only two printed circuit boards can be connected. When two or more printed circuit boards are connected to one printed circuit board, the connection structure is changed to two. I had to have more than one.

本発明は、1枚の基板に複数の基板を接続するのに適
した接続構造を提供することを目的としている。
An object of the present invention is to provide a connection structure suitable for connecting a plurality of substrates to one substrate.

(課題を解決するための手段) 上記課題を提供するため、本発明の接続構造は、第1
の導体部と該第1の導体部に隣接する第2の導体部とを
有する第1基板と、導体部を有する第2基板と、導体部
を有する第3基板と、上記第1基板の第1の導体部と上
記第2の基板の導体部が接続し、且つ上記第1基板の第
2の導体部と上記第3の基板の導体部が接続する状態
で、上記第1基板の一方の面に上記第2及び第3基板を
配置し、第1基板と第2及び第3基板とを一体に挟持す
る挟持部材とを備えたことを特徴とする。
(Means for Solving the Problems) In order to provide the above-mentioned problems, the connection structure of the present invention has a
A first substrate having a first conductor portion and a second conductor portion adjacent to the first conductor portion; a second substrate having a conductor portion; a third substrate having a conductor portion; One conductor of the first substrate is connected to the conductor of the second substrate, and the conductor of the third substrate is connected to the second conductor of the first substrate. The second and third substrates are arranged on a surface, and a holding member for integrally holding the first substrate and the second and third substrates is provided.

さらに、前記第1基板、第2基板、第3基板は位置決
め用の穴を有し、前記挟持部材は位置決め用の穴を貫通
する突起を有することを特徴としている。
Further, the first substrate, the second substrate, and the third substrate have holes for positioning, and the holding member has a projection penetrating the holes for positioning.

(作用) 第1基板の第1導体部と第2基板の導体部とを接続さ
せ、且つ第1基板の第2導体部と第3基板の導体部とを
接続させるように、挟持部材で一体に挟持するから、1
箇所で一枚のプリント基板に複数のプリント基板を接続
することが可能となる。
(Operation) The holding member is integrated so as to connect the first conductor portion of the first substrate and the conductor portion of the second substrate, and to connect the second conductor portion of the first substrate and the conductor portion of the third substrate. 1
It becomes possible to connect a plurality of printed boards to one printed board at a location.

(実施例) 以下、図面に基づいて、本発明の実施例を説明する。(Example) Hereinafter, an example of the present invention will be described with reference to the drawings.

第1図および第2図において、第1フレキシブルプリ
ント基板6は、4つの位置決め用穴(6b)と、中心円形
穴(6c)と、円形穴(6c)の周囲に配列された複数の導
体パターン部(6a)とを有している。第2のフレキシブ
ルプリント基板(4)は、2つの位置決め用穴(4b)
と、基板端部に形成された半円形穴(4c)と、半円形穴
(4c)の周囲において、各導体パターン部(6a)の略半
分と重合するよう配設された複数の導体パターン(4a)
とを有している。第3のフレキシブルプリント基板
(5)は2つの位置決め用穴(5b)と半円形穴(4c)と
で略円形穴を形成するよう基板端部に設けられた半円形
穴(5c)と、導体パターン部(6a)のうち導体パターン
(4a)と重合しない導体パターン(6a)と重合するよう
配設された複数の導体パターン(5a)とを有している。
In FIGS. 1 and 2, the first flexible printed circuit board 6 has four positioning holes (6b), a center circular hole (6c), and a plurality of conductor patterns arranged around the circular hole (6c). (6a). The second flexible printed circuit board (4) has two positioning holes (4b)
And a plurality of conductor patterns (4 c) formed at the end of the substrate, and a plurality of conductor patterns (4 c) arranged around the semi-circle hole (4 c) so as to overlap substantially half of each conductor pattern portion (6 a). 4a)
And The third flexible printed circuit board (5) has a semi-circular hole (5c) provided at an end of the substrate so as to form a substantially circular hole with two positioning holes (5b) and a semi-circular hole (4c), and a conductor. The pattern portion (6a) has a plurality of conductor patterns (5a) arranged so as to overlap with the conductor pattern (6a) which does not overlap with the conductor pattern (4a).

台板(7)は、位置決め用穴(4b)(5b)(6b)が嵌
込まれる位置決め用突起(7b)と、中心にビス用穴を有
し、外周に円形穴(6c)、半円形(4c)および(5c)が
嵌込まれるボス部(7c)とを有している。
The base plate (7) has a positioning projection (7b) into which the positioning holes (4b), (5b) and (6b) are fitted, and a screw hole at the center, a circular hole (6c) on the outer periphery, and a semicircle. A boss portion (7c) into which (4c) and (5c) are fitted.

プリント基板(4)および(5)は、それぞれの端部
が突合わされ、半円形穴(4c)および(5c)が略円形穴
を形勢するような状態で、プリント基板(6)の上に重
ねられ、さらにプリント基板(4),(5)および
(6)が台板(7)上に載置されている。位置決め用穴
(4b)(5b)および(6b)が台板(7)の位置決め用突
起(7b)に嵌込まれ、且つ円形穴(6c)、半円形穴(4
c)および(5c)がボス部(7c)に係合することによ
り、各導体パターン部(6a)と、各導体パターン部(4
a)及び(5a)が互いに重合されている。これらの部材
(4)(5)(6)(7)は導体パターン部の上方に設
けられるリング状の弾性部材(3)と、中心穴2cを有し
弾性部材(3)上に載置される押え板(2)とともに、
台板(7)のボス部(7c)に結合されるビス(1)によ
って締結されている。これによって各導体パターン(6
a)が導体パターン(4a)または(5a)に圧接されて互
いの電気接続がなされている。
The printed circuit boards (4) and (5) are overlapped on the printed circuit board (6) with their respective ends abutting and the semicircular holes (4c) and (5c) forming substantially circular holes. Further, printed boards (4), (5) and (6) are mounted on a base plate (7). The positioning holes (4b), (5b) and (6b) are fitted into the positioning projections (7b) of the base plate (7), and the circular holes (6c) and the semi-circular holes (4
(c) and (5c) are engaged with the boss (7c), so that each conductor pattern (6a) and each conductor pattern (4
a) and (5a) are polymerized with each other. These members (4), (5), (6) and (7) are mounted on the ring-shaped elastic member (3) provided above the conductor pattern portion and the elastic member (3) having the center hole 2c. Together with the presser plate (2)
It is fastened by a screw (1) coupled to the boss (7c) of the base plate (7). This allows each conductor pattern (6
a) is pressed against the conductor pattern (4a) or (5a) to make an electrical connection with each other.

なお、この実施例に用いられるプリント基板は硬質基
板であっても良く、さらに、台板(7)に直接導体パタ
ーンが形成されているものであっても良い。また、円周
上に配列された導体パターンを3つ以上に分割し、一枚
のプリント基盤に3枚以上のプリント基板を1箇所で接
続しても良い。さらに、プリント基板(6)に相当する
プリント基板も2枚以上に分割しても良い。
The printed board used in this embodiment may be a hard board, or may be a board having a conductive pattern formed directly on the base plate (7). Further, the conductor pattern arranged on the circumference may be divided into three or more, and three or more printed boards may be connected to one printed board at one place. Further, the printed circuit board corresponding to the printed circuit board (6) may be divided into two or more.

第3図及び第4図に示した実施例は、第1図および第
2図に示した実施例におけるプリント基板の変形例を示
しており、他の構成は第1図および第2図と共通してい
る。
The embodiment shown in FIGS. 3 and 4 shows a modified example of the printed circuit board in the embodiment shown in FIGS. 1 and 2, and other configurations are the same as those in FIGS. 1 and 2. doing.

第3図において、プリント基板(6)の複数の導体パ
ターン(6a)の一部がプリント基板(5)の導体パター
ン(5a)に、他部がプリント基板(14)の導体パターン
(14a)に、さらに他部がプリント基板(24)の導体パ
ターン(24a)にそれぞれ重合されるように構成されて
いる。プリント基板(14)および(24)に台板(7)の
位置決め用突起(7b)に嵌合する位置決め用穴(14a)
および(24a)と、ボス部(7c)に係合する4分の1円
形穴(14c)および(24c)がそれぞれ形成されている。
In FIG. 3, a part of the plurality of conductor patterns (6a) of the printed board (6) is a conductor pattern (5a) of the printed board (5), and the other part is a conductor pattern (14a) of the printed board (14). The other part is configured to be superimposed on the conductor pattern (24a) of the printed circuit board (24). Positioning holes (14a) that fit into the positioning projections (7b) of the base plate (7) on the printed circuit boards (14) and (24)
And (24a), and quarter circular holes (14c) and (24c), which engage with the boss (7c), respectively.

第4図において、プリント基板(4),(5)の導体
パターン(4a)(5a)の各一部には、プリント基板(1
6)(26)の導体パターン(16a)(26a)の各一部が、
それぞれ重合されるように構成されている。プリント基
板(16)および(26)には、台板(7)の位置決め用突
起(7b)に嵌合する位置決め用穴(16a)および(26a)
と、ボス部(7c)に係合する半円形穴(16c)および(2
6c)がそれぞれ形成されている。
In FIG. 4, a part of each of the conductor patterns (4a) and (5a) of the printed circuit boards (4) and (5) is
6) Each part of the conductor pattern (16a) (26a) of (26)
Each is configured to be polymerized. The printed circuit boards (16) and (26) have positioning holes (16a) and (26a) that fit into the positioning projections (7b) of the base plate (7).
And semicircular holes (16c) and (2
6c) are respectively formed.

(発明の効果) 上述の如く本発明によれば、挟持部材による挟持によ
り、1枚のプリント基板に対して複数のプリント基板を
電気接続することができ、コンパクトで安価に提供でき
る接続構造が得られる。
(Effects of the Invention) As described above, according to the present invention, a plurality of printed boards can be electrically connected to one printed board by being sandwiched by the sandwiching member, and a connection structure that can be provided at a compact size and at a low cost is obtained. Can be

【図面の簡単な説明】[Brief description of the drawings]

第1図および第2図は本発明の一実施例を示しており、
第1図は分解斜視図、第2図は組立断面図である。第3
図は本発明の別の実施例を示す分解斜視図である。第4
図は本発明のさらに別の実施例を示す分解斜視図であ
る。第5図は従来例を示す分解斜視図である。 (6),(16),(26)……第1プリント基板 (5)……第2プリント基板 (4),(14),(24)……第3プリント基板 (6a),(16a),(26a)……第1導体パターン (5a)……第2導体パターン (4a),(14a),(24a)……第3導体パターン
1 and 2 show one embodiment of the present invention,
FIG. 1 is an exploded perspective view, and FIG. 2 is an assembled sectional view. Third
The figure is an exploded perspective view showing another embodiment of the present invention. 4th
The figure is an exploded perspective view showing still another embodiment of the present invention. FIG. 5 is an exploded perspective view showing a conventional example. (6), (16), (26): First printed circuit board (5): Second printed circuit board (4), (14), (24): Third printed circuit board (6a), (16a) , (26a) ... first conductor pattern (5a) ... second conductor pattern (4a), (14a), (24a) ... third conductor pattern

───────────────────────────────────────────────────── フロントページの続き 審査官 鈴木 毅 (56)参考文献 実開 昭62−51777(JP,U) 実開 昭63−197379(JP,U) (58)調査した分野(Int.Cl.6,DB名) H05K 1/14 ──────────────────────────────────────────────────続 き Continuing from the front page Examiner Takeshi Suzuki (56) References Japanese Utility Model Sho 62-51777 (JP, U) Japanese Utility Model Sho 63-197379 (JP, U) (58) Fields investigated (Int. Cl. 6) , DB name) H05K 1/14

Claims (2)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】第1の導体部と該第1の導体部に隣接する
第2の導体部とを有する第1基板と、 導体部を有する第2基板と、 導体部を有する第3基板と、 上記第1基板の第1の導体部と上記第2の基板の導体部
が接続し、且つ上記第1基板の第2の導体部と上記第3
の基板の導体部が接続する状態で、上記第1基板の一方
の面に上記第2及び第3基板を配置し、第1基板と第2
及び第3基板とを一体に挟持する挟持部材と を備えたことを特徴とする基板接続構造。
A first substrate having a first conductor portion and a second conductor portion adjacent to the first conductor portion; a second substrate having a conductor portion; and a third substrate having a conductor portion. The first conductor of the first substrate is connected to the conductor of the second substrate, and the second conductor of the first substrate is connected to the third conductor.
The second and third substrates are arranged on one surface of the first substrate in a state where the conductor portions of the first substrate are connected, and the first substrate and the second substrate are connected to each other.
And a sandwiching member for integrally sandwiching the third board and the third board.
【請求項2】前記第1基板、第2基板、第3基板は位置
決め用の穴を有し、前記挟持部材は位置決め用の穴を貫
通する突起を有することを特徴とする請求項1記載の基
板接続構造。
2. The apparatus according to claim 1, wherein said first, second, and third substrates have holes for positioning, and said holding member has a projection penetrating said holes for positioning. Board connection structure.
JP2170707A 1990-06-27 1990-06-27 Board connection structure Expired - Fee Related JP2900541B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2170707A JP2900541B2 (en) 1990-06-27 1990-06-27 Board connection structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2170707A JP2900541B2 (en) 1990-06-27 1990-06-27 Board connection structure

Publications (2)

Publication Number Publication Date
JPH0458585A JPH0458585A (en) 1992-02-25
JP2900541B2 true JP2900541B2 (en) 1999-06-02

Family

ID=15909908

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2170707A Expired - Fee Related JP2900541B2 (en) 1990-06-27 1990-06-27 Board connection structure

Country Status (1)

Country Link
JP (1) JP2900541B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018128157A1 (en) 2017-01-05 2018-07-12 株式会社村田製作所 Electronic device

Also Published As

Publication number Publication date
JPH0458585A (en) 1992-02-25

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