JP2901364B2 - Semiconductor device manufacturing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device manufacturing apparatus and, more particularly, to a single wafer type etching apparatus for performing etching by spraying a chemical solution onto a semiconductor wafer in a shower shape.

[0002]

2. Description of the Related Art As shown in FIG. 3, a conventional single-wafer type etching apparatus rotates a semiconductor wafer 3 adsorbed on a rotating unit 4 in a semiconductor wafer processing chamber 2 to form a shower nozzle 1.
A chemical solution is ejected in a shower shape, and the semiconductor wafer 3 is etched with the ejected chemical solution 5.

At this time, the exhaust of the semiconductor wafer processing chamber 2 is performed from an exhaust pipe 6 on the side of the semiconductor wafer processing chamber 2. In addition, the amount of exhaust is set in the semiconductor wafer processing chamber 2
The static exhaust measuring device 15 provided in the exhaust pipe 13 connecting the manual damper 14 and the manual damper 14 is visually observed. FIG. 4 is a flowchart showing a series of operations of the related art.

[0004]

In this conventional single-wafer etching apparatus, if the source pressure of exhaust gas fluctuates during etching, the amount of exhaust gas in the semiconductor wafer processing chamber also fluctuates, and the etching rate fluctuates. As a result, there is a problem that variations in etching pattern dimensions occur.

[0005] When the pattern size of the semiconductor wafer varies and the pattern becomes abnormal, the yield and reliability of the semiconductor device are reduced.

In recent years, with the miniaturization of semiconductor devices, improvement in uniformity of pattern dimensions within a semiconductor wafer and between semiconductor wafers has greatly contributed to the quality of semiconductor devices.

An object of the present invention is to provide an apparatus for manufacturing a semiconductor device in which fluctuations in the amount of exhaust in a semiconductor wafer processing chamber are suppressed.

[0008]

In order to achieve the above object, an apparatus for manufacturing a semiconductor device according to the present invention has a measuring mechanism, an opening / closing mechanism, and a control mechanism. by jetting apparatus for producing a semiconductor device for performing an etching process, the measurement mechanism, I mechanism der to measure the exhaust velocity of a semiconductor wafer processing chamber, the semiconductor
Place it near the side of the semiconductor wafer in the wafer processing chamber
The opening / closing mechanism is a mechanism for adjusting the opening / closing degree of the exhaust pipe , and the control mechanism controls the opening / closing degree of the exhaust pipe by the opening / closing mechanism based on the exhaust wind speed value from the measurement mechanism, The exhaust amount is controlled to be steady while the gas is jetted in a shower shape.

[0009]

A mechanism for measuring the exhaust air velocity of the semiconductor wafer processing chamber, adjusting the degree of opening and closing of the exhaust pipe from the exhaust air velocity to an arbitrary value, and controlling the degree of opening and closing of the exhaust pipe of the semiconductor wafer processing chamber. is there.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings. FIG. 1 is a schematic sectional view showing an embodiment of the present invention. In the figure, 1 is a shower nozzle, 2 is a semiconductor wafer processing chamber, 3 is a semiconductor wafer, 4 is a rotating part, and 6 is an exhaust pipe. 13 is an exhaust pipe, and 12 is an automatic damper. Further, the present invention provides a wind speed sensor 7 and a reference input unit 8.
, A control unit 9, a motor drive unit 10, and a step motor 11.

The semiconductor wafer 3 is carried into the rotating part 4 of the semiconductor wafer processing chamber 2, and the wafer 3 is etched with the chemical solution 5 ejected from the shower nozzle 1.

On the other hand, the inside of the semiconductor wafer processing chamber 2 is exhausted from an exhaust pipe 6. At this time, the exhaust wind speed in the semiconductor wafer processing chamber 2 is measured by a wind speed sensor installed on the side surface of the semiconductor wafer processing chamber 2, and a measured value of the wind speed by the wind speed sensor 7 and a set value preset by the reference input unit 8. Are compared by the control unit 9, and when a certain deviation value is reached, the control unit 9
Sends an output signal to the motor drive unit 10.

The motor drive unit 10 includes a step motor 11
To automatically adjust the opening / closing degree of the auto damper 12 provided in the exhaust pipe 13.

After completion of the etching, the semiconductor wafer 3 is
It is carried out from the rotating unit 4. The above operation is sequentially repeated.

FIG. 2 is a flowchart showing a series of operations in the embodiment.

[0016]

As described above, the present invention measures the exhaust air velocity in the semiconductor wafer processing chamber and automatically opens and closes the damper so as to obtain the optimum exhaust air velocity. This has the effect that it becomes possible to reduce the variation in the etching rate due to the variation in the exhaust amount.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view showing an embodiment of the present invention.

FIG. 2 is a flowchart showing a series of operations in one embodiment of the present invention.

FIG. 3 is a schematic sectional view showing a conventional example.

FIG. 4 is a flowchart showing the operation of the conventional example.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 shower nozzle 2 semiconductor wafer processing chamber 3 semiconductor wafer 4 rotating part 5 ejected chemical liquid 6 exhaust pipe 7 wind speed sensor 8 reference input part 9 control part 10 motor drive part 11 step motor 12 auto damper 13 exhaust pipe 14 manual damper 15 static exhaust measurement vessel

Claims (1)

(57) [Claims] An apparatus for manufacturing a semiconductor device having a measurement mechanism, an opening / closing mechanism, and a control mechanism, and performing an etching process by ejecting a chemical solution onto a semiconductor wafer in a shower shape, wherein the measurement mechanism comprises a semiconductor wafer. What mechanism der to measure the exhaust wind speed of the processing chamber, a semiconductor wafer processing chamber of a semiconductor weblog
Are those disposed in the vicinity of the side surface of Doha, opening and closing mechanism is a mechanism for adjusting the opening degree of the exhaust pipe, the control mechanism, the exhaust pipe by the opening and closing mechanism on the basis of the exhaust wind velocity from the measurement mechanism An apparatus for manufacturing a semiconductor device, wherein an opening / closing degree is controlled and an exhaust amount is controlled steadily while a chemical solution is jetted in a shower shape.