JP2906506B2 - X-ray spectroscopy for thin film determination - Google Patents
X-ray spectroscopy for thin film determinationInfo
- Publication number
- JP2906506B2 JP2906506B2 JP2004208A JP420890A JP2906506B2 JP 2906506 B2 JP2906506 B2 JP 2906506B2 JP 2004208 A JP2004208 A JP 2004208A JP 420890 A JP420890 A JP 420890A JP 2906506 B2 JP2906506 B2 JP 2906506B2
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- Prior art keywords
- thin film
- intensity ratio
- ray intensity
- sample
- ray
- Prior art date
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Description
本発明は、コンピュータシミュレーションを用いて測
定するX線分光法による薄膜定量法に関する。The present invention relates to a thin film quantification method based on X-ray spectroscopy measured using computer simulation.
メッキ等により基板に薄膜を形成した試料の薄膜の膜
厚や薄膜元素の組成比を非破壊的に測定できる方法は少
ない。通常は、表面層を分析する装置を用い、表面層を
エッチング等で削除しながら、表面層の組成比を測定す
ることで、薄膜の膜厚や組成比を測定しているが、この
ような方法では、測定試料が破壊されてしまうので、破
壊出来ない試料は測定することができない。また、非破
壊的な測定方法としては、EPMAで分析可能深さが、電子
線加速電圧によって変わることを利用する方法がある
が、分析精度が低いと云う問題がある。There are few methods for non-destructively measuring the thickness of a thin film and the composition ratio of thin film elements of a sample in which a thin film is formed on a substrate by plating or the like. Usually, the thickness and composition ratio of a thin film are measured by measuring the composition ratio of the surface layer while removing the surface layer by etching or the like using an apparatus for analyzing the surface layer. In the method, since the measurement sample is destroyed, a sample that cannot be destroyed cannot be measured. As a non-destructive measurement method, there is a method utilizing the fact that the depth that can be analyzed by EPMA changes depending on the electron beam acceleration voltage, but there is a problem that the analysis accuracy is low.
本発明は、測定試料の薄膜厚さ及び各元素濃度の両方
が不明の時にでも、簡単に定量測定ができるようにする
ことを目的とする。An object of the present invention is to make it possible to easily perform quantitative measurement even when both the thickness of a thin film of a measurement sample and the concentration of each element are unknown.
X線分光法による薄膜定量法として、或る適当な加速
電圧で加速した電子ビームで励起された試料の薄膜から
放射される成分元素の特性X線強度と、上記と同じ加速
電子ビームで励起された成分元素の単体標準試料から放
射される特性X線強度とのX線強度比から試料の薄膜の
各成分元素濃度を仮定し、仮定した成分元素濃度を有す
る試料モデルについて、膜厚を変えてコンピュータシミ
ュレーションで一つの成分元素のX線強度比を計算し、
この計算によるX線強度比と前記実測による同元素のX
線強度比とが適当に一致するような膜厚を仮定し、上記
仮定した薄膜元素濃度と薄膜厚さでコンピュータシミュ
レーションを行い、計算による各成分元素のX線強度比
を求め、同計算によるX線強度比が上記測定によるX線
強度比に等しくなるように,各成分元素濃度を修正し、
上記修正した薄膜元素濃度を仮定濃度として上記と同じ
コンピュータシミュレーションを行い、以下同様の計算
の繰返しにより、逐次近似的に薄膜組成および膜厚を決
定するようにした。As a thin film quantitative method by X-ray spectroscopy, the characteristic X-ray intensity of the component elements emitted from the thin film of the sample excited by the electron beam accelerated at a certain appropriate accelerating voltage, and the same Assuming the concentration of each component element in the thin film of the sample from the X-ray intensity ratio with the characteristic X-ray intensity radiated from the simple standard sample of the component element, and changing the film thickness for the sample model having the assumed component element concentration Calculate the X-ray intensity ratio of one component element by computer simulation,
The X-ray intensity ratio by this calculation and the X
Assuming a film thickness such that the line intensity ratio appropriately matches, a computer simulation is performed using the assumed thin film element concentration and the thin film thickness, the X-ray intensity ratio of each component element is calculated by calculation, and the X Correcting each component element concentration so that the line intensity ratio becomes equal to the X-ray intensity ratio obtained by the above measurement,
The same computer simulation as described above was performed using the corrected thin film element concentration as the assumed concentration, and the same calculation was repeated to determine the thin film composition and the film thickness successively and approximately.
本発明は、本願出願人が出願した特願昭63−45287号
におけるコンピュータシミュレーションによるX線強度
計算方法を用いて、試料の薄膜の各元素濃度C及び薄膜
厚さZを測定しようとするものである。上記コンピュー
タシミュレーションは、電子ビームの加速電圧Eと各元
素濃度Cと薄膜厚さZと試料基板組成とから、X線強度
を計算するものである。本発明は、上記設定条件におい
て、薄膜厚さZと各元素濃度Cが不明である試料におけ
る測定データから、上記コンピュータシミュレーション
計算により、薄膜厚さZと各元素濃度CA,CB,Ccを求め
るものである。 薄膜の成分元素A,B,C,……の組成比が一定であって
も、各元素の特性X線の強度の相互比率は膜厚によって
変化する。もし、上記X線強度の相互比が膜厚によって
変わらないから、試料の各成分元素特性X線強度の相互
比から直ちに組成比が求まり、膜厚については成分中の
一元素の特性X線強度の膜厚による変化から膜厚を求め
ることができ、成分比と膜厚は互いに独立して決定でき
る。 しかし、上述したように、各成分元素の特性X線強度
の相互比は、膜厚により変化するので、上のように膜厚
と組成比とを相互独立に決めることができない。しか
し、多成分系の薄膜の場合、膜厚による特性X線強度の
変化が、元素毎に異なるので、逐次近似法により、膜厚
と組成比を決定することが可能となる。まず、言葉の定
義を明らかにしておく。試料の成分元素A,B,C,……の各
単体標準試料の特性X線強度に対する、試料の各元素の
特性X線強度の比を、その成分元素のX線強度比と云
う。 薄膜成分元素の濃度を決めたとき、各成分のX線強度
比の膜厚による変化は、後述するように計算により求ま
る。試料と各成分標準試料との実測から、各成分の実測
X線強度比KA0,KB0,……を求める。この強度比から比
較的に各成分の第1近似濃度CA1,CB1,……を決める。
試料の組成を上のように決めたときは、膜厚による一つ
の成分AのX線強度比の変化が上述したように計算でき
る。この計算から、膜厚の第1近似値Z1が求まる。即ち
本発明の特徴は、まず成分元素の濃度の近似値を求め、
それを用いて薄膜の厚さの近似値を求めると云う二作業
により逐次近似の一段の作業を終わると云う所にある。 上のようにして、第1近似のCA1,CB1,……およびZ1
が求まるので、この場合の各成分のX線強度比KA1,
KB1,……を計算できる。この強度比は、成分Aを除い
て実測とは一致しないことが多い。そこで一つの成分A
以外の元素B,C,……の濃度を、 CB2=CB1×KB0/KB1 等により修正する。但し、CA2+CB2+……=1であるか
ら、元素Aの濃度もCA2に修正される。 上記CA2,CB2,……の成分比のもとで、元素AのX線
強度比が実測と合う膜厚Z2を求める。この膜厚および成
分組成で、各元素のX線強度比を求める。以下上述と同
じ手順を繰返し、逐次近似して行く。 薄膜の組成と膜厚が与えられると、各成分元素の特性
X線の強度比は、後述のコンピュータシミュレーション
により計算できる。即ち、各成分単体標準試料に対する
特性X線の上記計算法による計算値と、膜厚および組成
を設定したときの各元素の特性X線強度との計算値との
比が、各元素のX線強度比である。この計算の詳細は、
本願出願人が出願した特願昭63−45287号に記載されて
いる。The present invention intends to measure the element concentration C and the film thickness Z of a thin film of a sample by using an X-ray intensity calculation method by computer simulation in Japanese Patent Application No. 63-45287 filed by the present applicant. is there. In the computer simulation, the X-ray intensity is calculated from the acceleration voltage E of the electron beam, the concentration C of each element, the thickness Z of the thin film, and the composition of the sample substrate. According to the present invention, the thin film thickness Z and the respective element concentrations C A , C B , and C c are obtained from the measurement data of the sample in which the thin film thickness Z and the respective element concentrations C are unknown under the above set conditions by the computer simulation calculation. Is what you want. Even when the composition ratio of the constituent elements A, B, C,... Of the thin film is constant, the mutual ratio of the characteristic X-ray intensity of each element changes depending on the film thickness. If the mutual ratio of the X-ray intensities does not change with the film thickness, the composition ratio can be immediately obtained from the mutual ratio of the characteristic X-ray intensities of the constituent elements of the sample. The film thickness can be determined from the change due to the film thickness, and the component ratio and the film thickness can be determined independently of each other. However, as described above, since the mutual ratio of the characteristic X-ray intensities of the component elements changes depending on the film thickness, the film thickness and the composition ratio cannot be determined independently as described above. However, in the case of a multi-component thin film, the change in characteristic X-ray intensity depending on the film thickness differs for each element, so that the film thickness and the composition ratio can be determined by the successive approximation method. First, let's clarify the definition of words. The ratio of the characteristic X-ray intensity of each element of the sample to the characteristic X-ray intensity of each single reference sample of the component elements A, B, C,... Of the sample is referred to as the X-ray intensity ratio of the component element. When the concentrations of the thin film component elements are determined, a change in the X-ray intensity ratio of each component depending on the film thickness is obtained by calculation as described later. The actual X-ray intensity ratios K A0 , K B0 ,... Of each component are determined from the actual measurement of the sample and each component standard sample. The first approximate concentrations C A1 , C B1 ,... Of each component are relatively determined from this intensity ratio.
When the composition of the sample is determined as described above, the change in the X-ray intensity ratio of one component A depending on the film thickness can be calculated as described above. From this calculation, it is obtained first approximation Z 1 of film thickness. That is, the feature of the present invention is to first obtain an approximate value of the concentration of the component element,
The two steps of obtaining an approximate value of the thickness of the thin film by using it are one step of the successive approximation. As above, the first approximations C A1 , C B1 ,... And Z 1
, The X-ray intensity ratio K A1 ,
K B1 , ... can be calculated. This intensity ratio often does not coincide with the actual measurement except for the component A. So one component A
The concentrations of the other elements B, C,... Are corrected by C B2 = C B1 × K B0 / K B1 or the like. However, since C A2 + C B2 +... = 1, the concentration of the element A is also corrected to C A2 . The C A2, C B2, under the component ratio of ......, X-ray intensity ratio of the element A is determined the thickness Z 2 fit with the measured. The X-ray intensity ratio of each element is determined from the film thickness and the component composition. Hereinafter, the same procedure as described above is repeated to successively approximate. Given the composition and thickness of a thin film, the intensity ratio of characteristic X-rays of each component element can be calculated by computer simulation described later. That is, the ratio between the calculated value of the characteristic X-rays for each component standard sample and the calculated value of the characteristic X-ray intensity of each element when the film thickness and composition are set is the X-ray value of each element. It is an intensity ratio. The details of this calculation are
It is described in Japanese Patent Application No. 63-45287 filed by the present applicant.
第1図及び第2図に本発明の一実施例のフローチャー
トを示す。第1図は第1段階を、第2図は第2段階のフ
ローチャートを示す。第1図において、測定前に測定試
料の表面層(薄膜)及び基板の構成元素を調査してお
く、適当な加速電圧E0による電子ビームを試料Sに照射
し、薄膜の各元素A,B,CのX線強度IAS,IBS,IcSを測定
し(ア)、各元素A,B,Cの純品標準試料のX線強度IAK,
IBK,IcKを測定し、薄膜と標準試料における各元素のX
線強度比KA0,KB0,Kc0を計算する(イ)。各元素濃度C
A1,CB1,Cc1を、CA1;CB1;Cc1=KA0;KB0;Kc0,CA1
+CB1+Cc1=1となるように設定し、電子ビームの加速
電圧をE0とし、薄膜厚みZを変化させて、コンピュータ
シミュレーションを行い、薄膜厚みZと強度比KAとの検
量線を作成する(ウ)作成した検量線を用い、測定によ
る強度比KA0に対応する薄膜厚さZ1を1回目の薄膜厚さ
設定値として設定する(エ)。加速電圧をE0とし、各元
素濃度をCA1,CB1,Cc1、薄膜厚さZ1の試料と、各元素
の標準試料のコンピュータシミュレーションを行い、強
度比KA1,KB1,Kc1を計算する(オ)。各元素A,B,Cの濃
度CAi,CBi,Cciを、 CAi′=CAi-i×KA0/KAi-i CBi′=CBi-i×KB0/KBi-i Cci′=Cci-i×Kc0/Kci-i CAi=CAi′/(CAi′+CBi′+Cci′) CBi=CBi′/(CAi′+CBi′+Cci′) Cci=Cci′/(CAi′+CBi′+Cci′) として設定する(カ)。但し、iは逐次近似計算の回数
で、初回(i=1)は動作(ウ)ですでに仮定されてい
るので、上記計算式には、i=2,3,…が用いられる。加
速電圧E0、各元素濃度CAi,CBi,Cciとし、薄膜厚さZ
を変化させてコンピュータシミュレーションを行い、薄
膜厚みZと強度比KAとの検量線を作成する(キ)。、作
成した検量線を用い、測定による強度比KA0に対応する
薄膜厚さZ1を求め、加速電圧E0、各元素濃度KAi,KBi,
Kci、薄膜厚さZiする試料のコンピュータシミュレーシ
ョンを行い、強度比KAi,KBi,Kciを計算する(ク)。
求められた強度比KAi,KBi,Kciが測定で求められた強
度比KA0,KB0,Kc0と一致するか否か判定する(ケ)、
一致すれば、(カ)のステップで設定した膜厚および各
成分濃度の値が求める値として、分析動作を終る。この
実施例では、上記(ケ)のステップで決まった各値につ
いて正否確認のため、更に電子加速電圧を変えて、上記
と同じ動作を行う。第2図にその動作を示す。一致しな
い場合は、動作(カ)に戻る。第2図において、加速電
圧を第1段階とは異なる適当な値E1に変化し、薄膜の各
元素A,B,CのX線強度IAS′,IBS′,IcS′を測定し
(あ)、各元素A,B,Cの標準試料のX線強度IAK′,
IBK′,IcK′を測定し薄膜と標準試料における各元素の
X線強度比KA0′,KB0′,Kc0′を計算する(い)。電
子ビームの加速電圧をE1とし、各元素濃度CAi,CBi,C
ci、薄膜厚さZ1の試料と、各元素の標準試料におけるコ
ンピュータシミュレーションを行い、強度比KAi′,
KBi′,Kci′を計算する(う)。計算で求められた強度
比KAi′,KBi′,Kci′が測定で求められた強度比
KA0′,KB0′,Kc0′と等しいかどうかを判定する
(え)。等しい場合は、濃度CAi,CBi,Cciを試料の組
成元素A,B,Cの濃度として、Z1を薄膜厚さとしてCRT等に
表示する。等しくない場合は、各元素濃度CAi,CBi,C
ciを CAi′=CAi-1×KA0′/KAi-1′ CBi′=CBi-1×KB0′/KBi-1′ Cci′=Cci-1×Kc0′/Kci-1′ CAi=CAi′/(CAi′+CBi′+Cci′) CBi=CBi′/(CAi′+CBi′+Cci′) Cci=Cci′/(CAi′+CBi′+Cci′) として設定し(か)、第1図の動作(キ)に戻る。1 and 2 show a flowchart of one embodiment of the present invention. FIG. 1 shows a flowchart of the first stage, and FIG. 2 shows a flowchart of the second stage. In Figure 1, previously investigated surface layer (thin film) and the constituent elements of the substrate of the measurement sample before the measurement, the electron beam is irradiated to the sample S by a suitable acceleration voltage E 0, each element A thin film, B , C, the X-ray intensities I AS , I BS , and I cS were measured (A), and the X-ray intensities I AK ,
I BK and I cK were measured, and X of each element in the thin film and the standard sample was measured.
The line intensity ratios K A0 , K B0 , and K c0 are calculated (A). Each element concentration C
A1, a C B1, C c1, C A1 ; C B1; C c1 = K A0; K B0; K c0, C A1
+ C B1 + C c1 = 1, set the acceleration voltage of the electron beam to E 0 , change the thin film thickness Z, perform computer simulation, and create a calibration curve between the thin film thickness Z and the intensity ratio K A to using a calibration curve prepared (c), to set the film thickness Z 1 corresponding to the intensity ratio K A0 by measuring a first film thickness set value (d). The acceleration voltage is set to E 0 , the concentration of each element is C A1 , C B1 , C c1 , the thickness of the thin film Z 1 , and the standard sample of each element are computer-simulated, and the intensity ratios K A1 , K B1 , K c1 Is calculated (E). The concentrations C Ai , C Bi , and C ci of the elements A, B, and C are represented by C Ai ′ = C Ai-i × K A0 / K Ai-i C Bi ′ = C Bi-i × K B0 / K Bi− i C ci '= C ci-i × K c0 / K ci-i C Ai = C Ai ' / (C Ai '+ C Bi ' + C ci ') C Bi = C Bi ' / (C Ai '+ C Bi ' + C ci ′) Set as C ci = C ci ′ / (C Ai ′ + C Bi ′ + C ci ′) (f). Here, i is the number of successive approximation calculations, and the first time (i = 1) has already been assumed in the operation (c). Therefore, i = 2, 3,... Acceleration voltage E 0 , each element concentration C Ai , C Bi , C ci , thin film thickness Z
Is changed and computer simulation is performed to create a calibration curve between the thin film thickness Z and the intensity ratio K A (g). , Using a calibration curve prepared obtains the film thickness Z 1 corresponding to the intensity ratio K A0 by measuring an acceleration voltage E 0, the element concentration K Ai, K Bi,
A computer simulation is performed on the sample with K ci and the thin film thickness Z i to calculate the intensity ratios K Ai , K Bi , and K ci (h).
It is determined whether or not the obtained intensity ratios K Ai , K Bi , and K ci match the intensity ratios K A0 , K B0 , and K c0 obtained by the measurement (q).
If they match, the analysis operation ends as the values of the film thickness and the concentration of each component set in step (f). In this embodiment, the same operation as described above is performed by further changing the electron acceleration voltage in order to confirm the correctness of each value determined in the above step (v). FIG. 2 shows the operation. If they do not match, the process returns to operation (f). In FIG. 2, the acceleration voltage varied to different appropriate values E 1 and the first stage, each element A thin film, B, X-ray intensity I AS of C ', I BS', to measure the I cS ' (A), X-ray intensities I AK ′ of standard samples of each element A, B, C
I BK ′ and I cK ′ are measured, and the X-ray intensity ratios K A0 ′, K B0 ′, and K c0 ′ of each element in the thin film and the standard sample are calculated (i). The accelerating voltage of the electron beam and E 1, the element concentration C Ai, C Bi, C
ci, a sample of the film thickness Z 1, performs a computer simulation in a standard sample of each element, the intensity ratio K Ai ',
Calculate K Bi ′ and K ci ′ (U). The calculated intensity ratios K Ai ′, K Bi ′, and K ci ′ are the intensity ratios obtained by measurement.
It is determined whether they are equal to K A0 ′, K B0 ′, and K c0 ′ (E). If they are equal, the concentrations C Ai , C Bi , and C ci are displayed on a CRT or the like as the concentrations of the constituent elements A, B, and C of the sample, and Z 1 is the thin film thickness. If not equal, each element concentration C Ai , C Bi , C
Let ci be C Ai '= C Ai-1 × K A0 ' / K Ai-1 'C Bi ' = C Bi-1 × K B0 '/ K Bi-1 ' C ci '= C ci-1 × K c0 ' / K ci-1 'C Ai = C Ai ' / (C Ai '+ C Bi ' + C ci ') C Bi = C Bi ' / (C Ai '+ C Bi ' + C ci ') C ci = C ci ' / ( C Ai ′ + C Bi ′ + C ci ′), and returns to the operation (g) in FIG.
本発明によれば、2つの異なる加速電圧によるコンピ
ュータシミュレーションによって、各元素の測定による
強度比と計算による強度比が等しくなる各元素濃度と薄
膜厚さを求めることが可能になり、各元素濃度と薄膜厚
さの両方が不明なものでもX線による定性分析を行うこ
とができるようになった。According to the present invention, it is possible to obtain the concentration of each element and the thickness of a thin film in which the measured intensity ratio and the calculated intensity ratio of each element are equal by computer simulation using two different acceleration voltages. Qualitative analysis by X-rays can be performed even when both of the thin film thickness are unknown.
第1図は本発明一実施例の第1段階のフローチャート、
第2図は上記実施例の第2段階のフローチャートであ
る。FIG. 1 is a flowchart of a first step of an embodiment of the present invention;
FIG. 2 is a flowchart of the second stage of the above embodiment.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭60−244844(JP,A) 特開 平1−219550(JP,A) 特開 平3−209148(JP,A) 特開 平4−42037(JP,A) 特開 平4−2956(JP,A) 特開 平4−43944(JP,A) (58)調査した分野(Int.Cl.6,DB名) G01N 23/22 - 23/227 ──────────────────────────────────────────────────続 き Continuation of front page (56) References JP-A-60-244844 (JP, A) JP-A-1-219550 (JP, A) JP-A-3-209148 (JP, A) JP-A-4- 42037 (JP, A) JP-A-4-2956 (JP, A) JP-A-4-43944 (JP, A) (58) Fields investigated (Int. Cl. 6 , DB name) G01N 23/22-23 / 227
Claims (1)
ムで励起された試料の薄膜から放射される各成分元素A,
B…の特性X線強度と、上記と同じ加速電子ビームで励
起された上記各成分元素A,B…の単体標準試料から放射
される各元素の特性X線強度とのX線強度比KA0,KB0…
から試料の薄膜の各成分元素の第一近似濃度CA1,CB1…
を仮定し、上記仮定した各成分元素濃度を有し、膜厚を
変えた試料モデルによってコンピュータシミュレーショ
ンで一つの成分元素AのX線強度比KAを計算し、この計
算値と前記実測X線強度比KA0とが一致するような第1
近似膜厚Z1を求め、上記仮定した薄膜元素の第1近似濃
度CA1,CB1…と上記仮定した薄膜厚さZ1を有する試料モ
デルでコンピュータシミュレーションを行い、計算によ
るX線強度比KA1,KB1…を求め、同計算によるX線強度
比が上記測定によるX線強度比KA0,KB0…に等しくなる
ように,各成分元素濃度を修正し、上記修正した第2近
似の薄膜元素濃度CA2,CB2…を仮定濃度とし、膜厚を変
えて上記と同じコンピュータシミュレーションを行っ
て、一つの成分元素Aの計算によるX線強度比が前記K
A0と一致する第2近似の膜厚Z2を求め、上記CA2,CB2…
とこのZ2を用いて、前記と同様のコンピュータシミュレ
ーションを行い、計算による各成分元素のX線強度比が
実測のX線強度比KA0,KB0…と等しくなるよう各成分元
素濃度を修正して第3近似濃度を得ると言う計算を逐次
近似的に繰返すことにより、薄膜組成および膜厚を決定
することを特徴とするX線分光法による薄膜定量法。1. A certain suitable accelerating voltage each component element A is radiated from the thin film of the excited sample at an accelerated electron beam at E 0,
X-ray intensity ratio K A0 between the characteristic X-ray intensity of B ... and the characteristic X-ray intensity of each element emitted from the single reference sample of each of the above-mentioned component elements A, B ... excited by the same accelerated electron beam as above. , K B0 …
From the first approximation concentration C A1 , C B1 of each element of the sample thin film
The X-ray intensity ratio K A of one component element A is calculated by computer simulation using a sample model having the respective assumed component element concentrations and varying film thicknesses, and the calculated value and the measured X-ray First such that the intensity ratio K A0 matches
Obtains an approximate thickness Z 1, first approximation concentration C A1 of the assumed thin film elements, C B1 ... and performs a computer simulation in a sample model having a film thickness Z 1 described above assumption, X-rays intensity ratio K by computing A1 , K B1 ... are obtained, and the component element concentrations are corrected so that the X-ray intensity ratio obtained by the same calculation becomes equal to the X-ray intensity ratio K A0 , K B0 . The thin film element concentrations C A2 , C B2 ... Are assumed concentrations, the film thickness is changed, and the same computer simulation as above is performed.
A0 and second seek thickness Z 2 approximate matching, the C A2, C B2 ...
Using this Z 2 and the same computer simulation as above, the concentration of each component element is corrected so that the calculated X-ray intensity ratio of each component element becomes equal to the actually measured X-ray intensity ratio K A0 , K B0 . A thin film quantification method by X-ray spectroscopy, wherein a thin film composition and a film thickness are determined by successively and approximately repeating a calculation of obtaining a third approximate concentration.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004208A JP2906506B2 (en) | 1990-01-10 | 1990-01-10 | X-ray spectroscopy for thin film determination |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004208A JP2906506B2 (en) | 1990-01-10 | 1990-01-10 | X-ray spectroscopy for thin film determination |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03209147A JPH03209147A (en) | 1991-09-12 |
| JP2906506B2 true JP2906506B2 (en) | 1999-06-21 |
Family
ID=11578219
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004208A Expired - Fee Related JP2906506B2 (en) | 1990-01-10 | 1990-01-10 | X-ray spectroscopy for thin film determination |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2906506B2 (en) |
-
1990
- 1990-01-10 JP JP2004208A patent/JP2906506B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03209147A (en) | 1991-09-12 |
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