JP2906945B2 - Manufacturing method of laminated board - Google Patents
Manufacturing method of laminated boardInfo
- Publication number
- JP2906945B2 JP2906945B2 JP26049993A JP26049993A JP2906945B2 JP 2906945 B2 JP2906945 B2 JP 2906945B2 JP 26049993 A JP26049993 A JP 26049993A JP 26049993 A JP26049993 A JP 26049993A JP 2906945 B2 JP2906945 B2 JP 2906945B2
- Authority
- JP
- Japan
- Prior art keywords
- glass
- epoxy resin
- laminate
- hydrolyzable chlorine
- woven fabric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Description
【0001】[0001]
【産業上の利用分野】本発明は、エポキシ樹脂を含浸し
たガラス織布を表面層、無機充填剤含有エポキシ樹脂を
含浸したガラス不織布を芯材層として加熱加圧成形する
積層板(CEM−3積層板)の製造法に関し、殊に、プ
リント配線板の用途に適した積層板の製造法に関するも
のである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminate (CEM-3) formed by heating and pressing a glass woven fabric impregnated with an epoxy resin as a surface layer and a glass nonwoven fabric impregnated with an epoxy resin containing an inorganic filler as a core material layer. More particularly, the present invention relates to a method for producing a laminated board suitable for use in a printed wiring board.
【0002】[0002]
【従来の技術】近年、電子機器の軽薄短小化、高密度化
に伴い、これに組み込んで使用されるプリント配線板の
材料としてCEM−3積層板が急伸している。中でも、
薄型化、高密度化したプリント配線板の材料に対して
は、耐湿絶縁特性向上、プリント配線板のスルーホール
間の耐マイグレーション性向上の要求が強くなってい
る。従来のCEM−3積層板は、表面層のガラス織布に
含浸するエポキシ樹脂として、液状エポキシ樹脂、ノボ
ラックエポキシ樹脂、ビスフェノールA、ブロム化エポ
キシ樹脂を混合し、硬化剤としてジシアンジアミドを配
合した樹脂組成物が用いられている。この樹脂組成物に
は、加水分解性塩素が200〜300ppm含まれてい
る。一方、芯材のガラス不織布は、カップリング剤によ
る処理としてエポキシシラン処理を施したものが用いら
れている。2. Description of the Related Art In recent years, as electronic devices have become lighter, thinner, shorter, and have higher densities, CEM-3 laminates have been rapidly growing as materials for printed wiring boards used by incorporating them. Among them,
With respect to thinner and higher-density printed wiring board materials, there is a strong demand for improved moisture-resistant insulation properties and improved migration resistance between through holes of the printed wiring board. The conventional CEM-3 laminate has a resin composition obtained by mixing a liquid epoxy resin, a novolak epoxy resin, bisphenol A, and a brominated epoxy resin as an epoxy resin impregnating a glass woven fabric of a surface layer, and blending dicyandiamide as a curing agent. Things are used. This resin composition contains 200 to 300 ppm of hydrolyzable chlorine. On the other hand, the glass nonwoven fabric used as the core material has been subjected to an epoxysilane treatment as a treatment with a coupling agent.
【0003】[0003]
【発明が解決しようとする課題】しかし、上記従来のC
EM−3積層板は、プリント配線板に使用したとき、耐
湿絶縁特性およびスルーホール間の耐マイグレーション
性が十分でない。本発明が解決しようとする課題は、C
EM−3積層板において、表面層のガラス織布に含浸す
るエポキシ樹脂と芯材層のガラス不織布のカップリング
剤処理を工夫して、耐湿絶縁特性およびスルーホール間
の耐マイグレーション性を向上させることである。However, the conventional C
When used for a printed wiring board, the EM-3 laminate has insufficient moisture-resistant insulation properties and migration resistance between through holes. The problem to be solved by the present invention is:
In the EM-3 laminate, the coupling agent treatment of the epoxy resin impregnating the glass woven fabric of the surface layer and the glass nonwoven fabric of the core material layer is devised to improve the moisture resistance insulation property and the migration resistance between the through holes. It is.
【0004】[0004]
【課題を解決するための手段】上記課題を解決するため
に、本発明に係るCEM−3積層板の製造法において
は、ガラス不織布は、カップリング剤による処理として
カチオニックシラン処理を施したものを使用する。そし
て、ガラス織布に含浸するエポキシ樹脂は、下記(A)
〜(C)成分の触媒下での反応生成物にジシアンジアミ
ド(硬化剤)を配合したものを使用し、(A)及び
(B)成分は前記予備反応生成物中の加水分解性塩素が
100ppm以下になる様に選択することを特徴とす
る。 (A)ノボラックエポキシ樹脂 (B)多価フェノールのグリシジルエーテルまたはその
アルキルあるいはハロゲン誘導体 (C)多価フェノールまたはそのアルキルあるいはハロ
ゲン誘導体 ガラス不織布に施すカチオニックシラン処理は、カチオ
ニックシランによるガラス繊維自体の処理およびガラス
繊維同士を結合するバインダへカチオニックシランを配
合することの両方を行なうのが望ましい。また、製造す
るCEM−3積層板は、少なくとも一方の表面に金属箔
を一体化したものであってもよい。In order to solve the above-mentioned problems, in a method for manufacturing a CEM-3 laminate according to the present invention, a glass nonwoven fabric is subjected to cationic silane treatment as a treatment with a coupling agent. Use And the epoxy resin impregnated in the glass woven fabric is the following (A)
To (C) a reaction product in the presence of a catalyst in the presence of a catalyst, and dicyandiamide (curing agent) mixed therein, wherein the components (A) and (B) have a hydrolyzable chlorine in the preliminary reaction product of 100 ppm or less. Is selected. (A) novolak epoxy resin (B) glycidyl ether of polyhydric phenol or its alkyl or halogen derivative (C) polyhydric phenol or its alkyl or halogen derivative The cationic silane treatment applied to the glass nonwoven fabric is performed by using the cationic silane glass fiber itself. It is desirable to carry out both the treatment of the above and the incorporation of cationic silane into the binder that binds the glass fibers together. The CEM-3 laminate to be manufactured may be one in which a metal foil is integrated on at least one surface.
【0005】[0005]
【作用】電気絶縁用エポキシ樹脂には、その製造過程で
加水分解性塩素が含まれる。この加水分解性塩素は、電
気絶縁性に悪影響を及ぼす。従って、できるだけ加水分
解性塩素を減少する必要がある。従来は、表面層のガラ
ス織布に含浸するエポキシ樹脂が、2〜3種類のエポキ
シ樹脂を混合した組成物であり、加水分解性塩素含有量
は200〜300ppmである。加熱加圧成形した積層
板には、この塩素が未反応物として残っている。前記組
成物をガラス織布に含浸して加熱加圧成形した積層板
は、樹脂の架橋が密な部分と疎の部分ができやすいの
で、多量の加水分解性塩素のイオン化の問題と相俟っ
て、表面層におけるマイグレーションを助長しているも
のと推測される。そこで、表面層のガラス織布に含浸す
るエポキシ樹脂は、予備反応させて分子量を均一化して
おくと共に加水分解性塩素含有量を100ppm以下の
少ない量にしておくことにより、加熱加圧成形した積層
板の樹脂の架橋に密な部分と粗な部分がなくなり(均一
になり)、加水分解性塩素の量も少ないので耐マイグレ
ーション性を向上させることができる。The epoxy resin for electrical insulation contains hydrolyzable chlorine during the production process. This hydrolyzable chlorine has an adverse effect on electrical insulation. Therefore, it is necessary to reduce hydrolyzable chlorine as much as possible. Conventionally, the epoxy resin impregnating the glass woven fabric of the surface layer is a composition in which two or three types of epoxy resins are mixed, and the hydrolyzable chlorine content is 200 to 300 ppm. This chlorine remains as an unreacted material in the laminate formed by heating and pressing. A laminated board obtained by impregnating the composition with a glass woven fabric and pressing under pressure is likely to have a dense portion and a sparse portion of resin cross-linking, which is coupled with a problem of ionization of a large amount of hydrolyzable chlorine. Thus, it is presumed that this promotes migration in the surface layer. Therefore, the epoxy resin impregnated into the glass woven fabric of the surface layer is preliminarily reacted to make the molecular weight uniform, and the hydrolyzable chlorine content is reduced to a small amount of 100 ppm or less, so that the heat-pressed laminate is formed. There are no dense and rough portions due to cross-linking of the resin of the plate (it becomes uniform), and the amount of hydrolyzable chlorine is small, so that migration resistance can be improved.
【0006】一方、芯材層のガラス不織布のカップリン
グ剤処理として、従来はエポキシシランによる処理が行
なわれてきたが、本発明に係る方法では、カチオニック
シランによる処理を採用している。エポキシシランはエ
ポキシ基(オキシラン環)が水の作用で樹脂に対する反
応性を失なうので、ガラス繊維とマトリックス樹脂であ
るエポキシ樹脂及びガラス繊維同士を結合しているバイ
ンダ樹脂との接着強度が弱くなる。このような状態では
樹脂とガラス繊維の界面に水分が侵入しやすいので、耐
湿絶縁特性が低下し隣合うスルーホールの壁間の耐マイ
グレーション性が悪くなるのであるが、カチオニックシ
ランは水が存在しても樹脂との反応性が確保されてい
る。このように、CEM−3積層板の表面層と芯材層の
両方に工夫を施すことにより初めて、耐湿絶縁特性の向
上と耐マイグレーションの向上をはかることができる。On the other hand, as a coupling agent treatment of the glass nonwoven fabric of the core material layer, a treatment with epoxysilane has been conventionally performed, but in the method according to the present invention, a treatment with cationic silane is employed. Epoxysilane has a weak adhesive strength between the glass fiber and the epoxy resin as the matrix resin and the binder resin connecting the glass fibers to each other because the epoxy group (oxirane ring) loses reactivity with the resin due to the action of water. Become. In such a state, moisture easily penetrates into the interface between the resin and the glass fiber, so that the moisture-resistant insulation properties are reduced and the migration resistance between the walls of the adjacent through holes is deteriorated, but water is present in cationic silane. Even so, the reactivity with the resin is ensured. As described above, it is possible to improve the moisture-proof insulation property and the migration-proof property only by devising both the surface layer and the core material layer of the CEM-3 laminate.
【0007】[0007]
【実施例】以下、本発明を実施例に基づき詳細に説明す
る。ガラス不織布の処理に使用するカップリング剤とし
て、実施例で使用したカチオニックシランは、(化1)
のスチリル系アミノシラン(日本ユニカー製「AZ−6
131」)と(化2)のフェニル系アミノシラン(日本
ユニカー製「Y−9138」)である。比較例および従
来例で使用したものは、(化3)のエポキシシラン(日
本ユニカー製「A−187」)である。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail based on embodiments. Cationic silane used in Examples as a coupling agent used for treatment of a glass nonwoven fabric is represented by the following chemical formula (1).
Styryl aminosilane (“AZ-6” manufactured by Nippon Unicar)
131 ") and (Chemical Formula 2) phenylaminosilane (" Y-9138 "manufactured by Nippon Unicar). The epoxy silane of Chemical Formula 3 ("A-187" manufactured by Nippon Unicar) was used in the comparative example and the conventional example.
【0008】[0008]
【化1】 Embedded image
【0009】[0009]
【化2】 Embedded image
【0010】[0010]
【化3】 Embedded image
【0011】表面層のガラス織布に含浸するエポキシ樹
脂組成物の予備反応において、(A)成分は、フェノー
ルノボラックエポキシ樹脂、クレゾールノボラックエポ
キシ樹脂等である。(B)成分は、ビスフェノールA、
臭素化ビスフェノールA、ビスフェノールF等多価フェ
ノールのジグリシジルエーテル、または、そのアルキル
あるいはハロゲン誘導体である。(C)成分は、ビスフ
ェノールA、臭素化ビスフェノールA、ビスフェノール
F等多価フェノール、または、そのアルキルあるいはハ
ロゲン誘導体である。(A)、(B)および(C)成分
の予備反応過程は公知であり、骨格の異なる(A)、
(B)成分のエポキシ樹脂を100℃で溶融混合し、
(C)成分を配合して120℃前後で撹拌することによ
り透明な溶融混合物を得る。これに触媒を投入して14
0℃で反応を行なう。反応は、必要に応じ溶媒で希釈し
て行なう。反応の終点は、エポキシ当量の経時変化を測
定し所定の点とする。この予備反応に使用する触媒は、
アルカリ性水酸化物およびハロゲン化物、トリメチルア
ミン、トリエチルアミン等の第3級アミンおよびその塩
酸塩類、塩化テトラメチルアンモニウム、臭化テトラメ
チルアンモニウム等の第4級アンモニウム塩、イミダゾ
ール、2−エチル4−メチルイミダゾール等のイミダゾ
ール類、トリフェニルホスホニウム等の酸性リン系化合
物である。In the preliminary reaction of the epoxy resin composition impregnating the glass woven fabric of the surface layer, the component (A) is a phenol novolak epoxy resin, a cresol novolak epoxy resin, or the like. The component (B) is bisphenol A,
Diglycidyl ethers of polyhydric phenols such as brominated bisphenol A and bisphenol F, or alkyl or halogen derivatives thereof. The component (C) is a polyhydric phenol such as bisphenol A, brominated bisphenol A, bisphenol F, or an alkyl or halogen derivative thereof. The pre-reaction process of the components (A), (B) and (C) is known, and the components (A),
Melting and mixing the epoxy resin (B) at 100 ° C.
By mixing the component (C) and stirring at about 120 ° C., a transparent molten mixture is obtained. Add the catalyst to this and add 14
Perform the reaction at 0 ° C. The reaction is carried out, if necessary, after dilution with a solvent. The end point of the reaction is determined to be a predetermined point by measuring the change over time of the epoxy equivalent. The catalyst used for this preliminary reaction is
Alkaline hydroxides and halides, tertiary amines such as trimethylamine and triethylamine and their hydrochlorides, quaternary ammonium salts such as tetramethylammonium chloride and tetramethylammonium bromide, imidazole, 2-ethyl-4-methylimidazole and the like Acidic phosphorus compounds such as imidazoles and triphenylphosphonium.
【0012】実施例1 撹拌機、冷却管、窒素ガス導入装置および温度計を備え
た四ッ口フラスコに、クレゾールノボラック型エポキシ
樹脂(油化シェルエポキシ製「E−180」,エポキシ
当量210g/eq,加水分解性塩素200ppm)2
00g、ビスフェノールA型エポキシ樹脂(油化シェル
エポキシ製「Ep−828」,エポキシ当量187g/
eq,加水分解性塩素30ppm)600g、ビスフェ
ノールA200gを2−エチル4−メチルイミダゾール
(2E4MEZ)0.08gの存在下に140℃で3時
間反応させ、予備反応物Aを得た(エポキシ等量405
g/eq,加水分解性塩素60ppm)。予備反応物A
に0.5等量のジシアンジアミド(DICY)を添加
し、2E4MEZ(硬化促進剤)を添加し170℃のゲ
ル化時間を4分とした(樹脂組成物A)。樹脂組成物A
を、ガラス織布(旭シュエーベル製「G7195/AS
633AV」)に含浸乾燥してガラス織布プリプレグを
得た。一方、「AZ−6131」で処理したガラス繊維
を、「Y−9138」配合バインダで結合して製造した
ガラス不織布に、無機充填剤(水酸化アルミニウムおよ
びタルク)含有エポキシ樹脂を含浸乾燥してガラス不織
布プリプレグを得た。上記ガラス織布プリプレグを両表
面層に各1枚使用し、芯材層には上記ガラス不織布プリ
プレグを使用し、最表面には銅箔を載置して、これを温
度160℃、圧力40Kgf/cm2で60分間加熱加圧成
形して、1.6厚mmの両面銅張り積層板を製造した。Example 1 In a four-necked flask equipped with a stirrer, a condenser, a nitrogen gas introducing device and a thermometer, a cresol novolak type epoxy resin (“E-180” manufactured by Yuka Shell Epoxy, epoxy equivalent 210 g / eq) was used. , Hydrolyzable chlorine 200ppm) 2
00 g, bisphenol A type epoxy resin (“Ep-828” manufactured by Yuka Shell Epoxy, epoxy equivalent: 187 g /
eq, hydrolyzable chlorine 30 ppm), and 600 g of bisphenol A were reacted at 140 ° C. for 3 hours in the presence of 0.08 g of 2-ethyl 4-methylimidazole (2E4MEZ) to obtain a pre-reacted product A (epoxy equivalent 405).
g / eq, hydrolyzable chlorine 60 ppm). Preliminary reactant A
Was added with 0.5 equivalent of dicyandiamide (DICY), 2E4MEZ (curing accelerator) was added, and the gel time at 170 ° C. was 4 minutes (resin composition A). Resin composition A
To a glass woven cloth (G7195 / AS manufactured by Asahi Schwebel)
633AV ”) to obtain a woven glass prepreg. On the other hand, a glass nonwoven fabric produced by bonding glass fibers treated with “AZ-6131” with a binder blended with “Y-9138” is impregnated with an epoxy resin containing an inorganic filler (aluminum hydroxide and talc) and dried. A non-woven prepreg was obtained. One glass woven prepreg is used for each surface layer, the glass nonwoven prepreg is used for the core material layer, and a copper foil is placed on the outermost surface. The copper foil is placed at a temperature of 160 ° C. and a pressure of 40 kgf /. 60 minutes heating and pressure molding at cm 2, and to produce double-sided copper clad laminate of 1.6 thick mm.
【0013】実施例2 撹拌機、冷却管、窒素ガス導入装置および温度計を備え
た四ッ口フラスコに、クレゾールノボラック型エポキシ
樹脂(油化シェルエポキシ製「E−180」,エポキシ
当量210g/eq,加水分解性塩素200ppm)2
00g、ビスフェノールA型エポキシ樹脂(油化シェル
エポキシ製「Ep−828」,エポキシ当量187g/
eq,加水分解性塩素80ppm)600g、ビスフェ
ノールA200gを2E4MEZ0.08gの存在下に
140℃で3時間反応させ、予備反応物Bを得た(エポ
キシ等量415g/eq,加水分解性塩素100pp
m)。予備反応物Bに0.5等量のDICYを添加し、
2E4MEZを添加し170℃のゲル化時間を4分とし
た(樹脂組成物B)。樹脂組成物Bを、実施例1と同様
のガラス織布に含浸乾燥してガラス織布プリプレグを得
た。上記ガラス織布プリプレグと実施例1のガラス不織
布プリプレグを用いて、以下実施例1と同様にして1.
6mmの両面銅張り積層板を製造した。Example 2 A four-necked flask equipped with a stirrer, a condenser, a nitrogen gas introducing device and a thermometer was charged with a cresol novolak type epoxy resin (“E-180” manufactured by Yuka Shell Epoxy, epoxy equivalent 210 g / eq). , Hydrolyzable chlorine 200ppm) 2
00 g, bisphenol A type epoxy resin (“Ep-828” manufactured by Yuka Shell Epoxy, epoxy equivalent: 187 g /
eq, hydrolyzable chlorine (80 ppm), and 600 g of bisphenol A were reacted at 140 ° C. for 3 hours in the presence of 0.08 g of 2E4MEZ to obtain a preliminary reaction product B (epoxy equivalent: 415 g / eq, hydrolyzable chlorine: 100 pp).
m). Add 0.5 equivalents of DICY to Pre-Reaction B,
2E4MEZ was added to set the gel time at 170 ° C. to 4 minutes (resin composition B). The resin composition B was impregnated and dried in the same glass woven fabric as in Example 1 to obtain a glass woven prepreg. Using the glass woven fabric prepreg and the glass nonwoven fabric prepreg of Example 1, the same procedure as in Example 1 was followed.
A 6 mm double-sided copper clad laminate was produced.
【0014】比較例1 撹拌機、冷却管、窒素ガス導入装置および温度計を備え
た四ッ口フラスコに、フェノールノボラック型エポキシ
樹脂(油化シェルエポキシ製「E−154」,エポキシ
当量176g/eq,加水分解性塩素200ppm)2
00g、ビスフェノールA型エポキシ樹脂(油化シェル
エポキシ製「Ep−828」,エポキシ当量187g/
eq,加水分解性塩素60ppm)500g、テトラブ
ロモビスフェノールA300gを投入し、80℃で溶解
混合し冷却する。これにDICY27gと2E4MEZ
3.6gを配合し樹脂組成物Cを得た(加水分解性塩素
200ppm)。樹脂組成物Cを実施例1と同様のガラ
ス織布に含浸乾燥してガラス織布プリプレグを得た。上
記ガラス織布プリプレグと実施例1のガラス不織布プリ
プレグを用いて、以下実施例1と同様にして1.6mmの
両面銅張り積層板を製造した。Comparative Example 1 A four-necked flask equipped with a stirrer, a condenser, a nitrogen gas introducing device and a thermometer was charged with a phenol novolak type epoxy resin ("E-154" manufactured by Yuka Shell Epoxy Co., Ltd., epoxy equivalent 176 g / eq.). , Hydrolyzable chlorine 200ppm) 2
00 g, bisphenol A type epoxy resin (“Ep-828” manufactured by Yuka Shell Epoxy, epoxy equivalent: 187 g /
eq, hydrolyzable chlorine (60 ppm), 500 g, and tetrabromobisphenol A, 300 g, are dissolved at 80 ° C., mixed and cooled. This is DICY27g and 2E4MEZ
3.6 g was blended to obtain a resin composition C (200 ppm of hydrolyzable chlorine). The resin composition C was impregnated and dried in the same glass woven fabric as in Example 1 to obtain a glass woven prepreg. Using the glass woven prepreg and the glass nonwoven prepreg of Example 1, a 1.6 mm double-sided copper-clad laminate was produced in the same manner as in Example 1 below.
【0015】比較例2 実施例1において、ガラス不織布を構成するガラス繊維
の処理に「AZ−6131」に代えて「A−187」を
使用し、ガラス繊維同士を結合するバインダにも「Y−
9138」に代えて「A−187」を配合して、その他
は実施例1と同様にして1.6mmの両面銅張り積層板を
製造した。Comparative Example 2 In Example 1, "A-187" was used instead of "AZ-6131" for the treatment of the glass fibers constituting the glass nonwoven fabric, and "Y-
The same procedure as in Example 1 was carried out except that "A-187" was used instead of "9138" to produce a 1.6 mm double-sided copper-clad laminate.
【0016】比較例3 撹拌機、冷却管、窒素ガス導入装置および温度計を備え
た四ッ口フラスコに、フェノールノボラック型エポキシ
樹脂(油化シェルエポキシ製「E−154」,エポキシ
当量176g/eq,加水分解性塩素200ppm)2
00g、ビスフェノールA型エポキシ樹脂(油化シェル
エポキシ製「Ep−828」,エポキシ当量187g/
eq,加水分解性塩素150ppm)500g、テトラ
ブロモビスフェノールA300gをトリフェニルホスホ
ニウム0.08gの存在下に140℃で3時間反応さ
せ、予備反応物Dを得た(エポキシ等量370g/e
q,加水分解性塩素120ppm)。予備反応物Dに
0.5等量のDICYを添加し、2E4MEZを添加し
170℃のゲル化時間を4分とした(樹脂組成物D)。
樹脂組成物Dを、実施例1と同様のガラス織布に含浸、
乾燥してガラス織布プリプレグを得た。上記ガラス織布
プリプレグと実施例1のガラス不織布プリプレグを用い
て、以下実施例1と同様にして1.6mmの両面銅張り積
層板を製造した。Comparative Example 3 A four-necked flask equipped with a stirrer, a condenser, a nitrogen gas introducing device and a thermometer was charged with a phenol novolak type epoxy resin (“E-154” manufactured by Yuka Shell Epoxy, epoxy equivalent 176 g / eq.). , Hydrolyzable chlorine 200ppm) 2
00 g, bisphenol A type epoxy resin (“Ep-828” manufactured by Yuka Shell Epoxy, epoxy equivalent: 187 g /
eq, 150 g of hydrolyzable chlorine) and 300 g of tetrabromobisphenol A were reacted at 140 ° C. for 3 hours in the presence of 0.08 g of triphenylphosphonium to obtain a preliminary reaction product D (epoxy equivalent: 370 g / e).
q, hydrolyzable chlorine 120 ppm). To the preliminary reaction product D, 0.5 equivalent of DICY was added, and 2E4MEZ was added to set the gel time at 170 ° C. to 4 minutes (resin composition D).
Impregnating resin composition D into the same glass woven fabric as in Example 1,
It dried and obtained the glass woven fabric prepreg. Using the glass woven prepreg and the glass nonwoven prepreg of Example 1, a 1.6 mm double-sided copper-clad laminate was produced in the same manner as in Example 1 below.
【0017】従来例 表面層には比較例1のガラス織布プリプレグを、芯材層
には比較例2のガラス不織布プリプレグを使用して、以
下実施例1と同様にして1.6mmの両面銅張り積層板を
製造した。Conventional Example The glass woven prepreg of Comparative Example 1 was used for the surface layer, and the glass nonwoven fabric prepreg of Comparative Example 2 was used for the core material layer. A laminated board was manufactured.
【0018】表1に、上記実施例、比較例および従来例
の仕様を簡単にまとめて示した。Table 1 briefly summarizes the specifications of the above embodiment, comparative example, and conventional example.
【0019】[0019]
【表1】 [Table 1]
【0020】上記実施例、比較例および従来例における
積層板をプレッシャークッカー処理(121℃−2気
圧)に供し、処理時間と絶縁抵抗の関係を図1に示し
た。これより、実施例の積層板は耐湿絶縁特性が優れて
いることが分かる。また、実施例、比較例および従来例
における積層板に穴壁間隔0.3mmで銅めっきスルーホ
ールを設け、85℃−85%RHでスルーホール間にD
C100Vを印加する処理に供した。処理時間と試料数
50個におけるスルーホール間の累積ショート発生率の
関係を図2に示した。これより実施例の積層板は、耐マ
イグレーション性が優れていることが分かる。The laminates in the above Examples, Comparative Examples and Conventional Examples were subjected to a pressure cooker treatment (121 ° C.-2 atm), and the relationship between the treatment time and the insulation resistance is shown in FIG. This indicates that the laminates of the examples have excellent moisture-resistant insulation properties. Further, copper plated through holes were provided on the laminates of the examples, comparative examples and conventional examples with a hole wall interval of 0.3 mm, and D between the through holes at 85 ° C.-85% RH.
The sample was subjected to a process of applying C100V. FIG. 2 shows the relationship between the processing time and the cumulative short-circuit occurrence rate between through holes in 50 samples. This indicates that the laminates of the examples have excellent migration resistance.
【0021】[0021]
【発明の効果】図1及び図2から明かなように本発明に
係る方法によれば、耐マイグレーション性及び耐湿絶縁
抵抗が優れたCEM−3積層板を製造することができ
る。特に耐マイグレーション性は、1000h後でも不
良率0%ないし0%に近い。このことは、今後更にスル
ーホール基板の高密度化が進展する中、工業的利用価値
は非常に大なるものである。As is apparent from FIGS. 1 and 2, according to the method of the present invention, it is possible to manufacture a CEM-3 laminate having excellent migration resistance and moisture-resistant insulation resistance. In particular, the migration resistance is 0% to 0% even after 1000 hours. This means that the value of industrial use will be very large as the density of through-hole substrates further increases in the future.
【図1】積層板のプレッシャークッカー処理時間と絶縁
抵抗の変化の関係を示す曲線図である。FIG. 1 is a curve diagram showing a relationship between a pressure cooker processing time of a laminate and a change in insulation resistance.
【図2】スルーホール間への電圧印加時間と累積ショー
ト発生率の関係を示す曲線図である。FIG. 2 is a curve diagram showing a relationship between a voltage application time between through holes and a cumulative short circuit occurrence rate.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平1−152138(JP,A) 特開 昭64−48832(JP,A) (58)調査した分野(Int.Cl.6,DB名) C08J 5/08,5/24 B32B 27/04,27/38 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-1-152138 (JP, A) JP-A-64-48832 (JP, A) (58) Fields investigated (Int. Cl. 6 , DB name) C08J 5 / 08,5 / 24 B32B 27 / 04,27 / 38
Claims (3)
層、無機充填剤含有エポキシ樹脂を含浸したガラス不織
布を芯材層として加熱加圧成形する積層板の製造におい
て、 ガラス不織布はカチオニックシラン処理を施したもので
あり、 ガラス織布に含浸するエポキシ樹脂は下記(A)〜
(C)成分の触媒下での反応生成物にジシアンジアミド
(硬化剤)を配合したものであり、(A)及び(B)成
分は前記予備反応生成物中の加水分解性塩素が100p
pm以下になる様に選択することを特徴とする積層板の
製造法。 (A)ノボラックエポキシ樹脂 (B)多価フェノールのグリシジルエーテルまたはその
アルキルあるいはハロゲン誘導体 (C)多価フェノールまたはそのアルキルあるいはハロ
ゲン誘導体1. A method of manufacturing a laminate, wherein a glass woven fabric impregnated with an epoxy resin is used as a surface layer, and a glass nonwoven fabric impregnated with an epoxy resin containing an inorganic filler is used as a core material layer in a heat-pressed laminate. The epoxy resin to be impregnated into the glass woven fabric is the following (A)-
The reaction product of the component (C) under the catalyst is a mixture of dicyandiamide (curing agent), and the components (A) and (B) contain 100 p of hydrolyzable chlorine in the preliminary reaction product.
pm or less. (A) novolak epoxy resin (B) glycidyl ether of polyhydric phenol or its alkyl or halogen derivative (C) polyhydric phenol or its alkyl or halogen derivative
理が、カチオニックシランによるガラス繊維自体の処理
およびガラス繊維同士を結合するバインダへカチオニッ
クシランを配合することである請求項1記載の積層板の
製造法。2. The laminated board according to claim 1, wherein the cationic silane treatment applied to the glass nonwoven fabric comprises treating the glass fiber itself with the cationic silane and blending the cationic silane into a binder for binding the glass fibers. Manufacturing method.
化される請求項1または2に記載の積層板の製造法。3. The method according to claim 1, wherein a metal foil is integrated with at least one outermost surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26049993A JP2906945B2 (en) | 1993-10-19 | 1993-10-19 | Manufacturing method of laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26049993A JP2906945B2 (en) | 1993-10-19 | 1993-10-19 | Manufacturing method of laminated board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07113016A JPH07113016A (en) | 1995-05-02 |
| JP2906945B2 true JP2906945B2 (en) | 1999-06-21 |
Family
ID=17348823
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26049993A Expired - Fee Related JP2906945B2 (en) | 1993-10-19 | 1993-10-19 | Manufacturing method of laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2906945B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6562153B2 (en) * | 2017-04-18 | 2019-08-21 | 三菱ケミカル株式会社 | FIBER-REINFORCED COMPOSITE MOLDED ARTICLE AND METHOD FOR PRODUCING THE SAME |
-
1993
- 1993-10-19 JP JP26049993A patent/JP2906945B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07113016A (en) | 1995-05-02 |
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