JP2913319B2 - Method for forming vacuum deposited metal thin film with high adhesion strength on stainless steel surface - Google Patents
Method for forming vacuum deposited metal thin film with high adhesion strength on stainless steel surfaceInfo
- Publication number
- JP2913319B2 JP2913319B2 JP13415690A JP13415690A JP2913319B2 JP 2913319 B2 JP2913319 B2 JP 2913319B2 JP 13415690 A JP13415690 A JP 13415690A JP 13415690 A JP13415690 A JP 13415690A JP 2913319 B2 JP2913319 B2 JP 2913319B2
- Authority
- JP
- Japan
- Prior art keywords
- stainless steel
- thin film
- steel surface
- adhesion strength
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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- Physical Vapour Deposition (AREA)
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は、ステンレス鋼表面に密着強度の高い金属薄
膜を真空蒸着する方法で、特にステンレス鋼表面に金属
蒸着薄膜を形成した電子材料等の製造に好適な方法であ
る。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention is a method for vacuum-depositing a metal thin film having a high adhesion strength on a stainless steel surface, and particularly for an electronic material having a metal-deposited thin film formed on a stainless steel surface. This is a suitable method for manufacturing.
（従来技術とその問題点） 真空蒸着による金属薄膜の形成は材料に新たな機能を
付与する簡単なメッキ方法として、プラスチック、ガラ
ス、金属など幅広い分野で用いられている。しかし、ス
テンレス鋼にこの方法を用いても、ステンレス鋼表面に
不動態皮膜と呼ばれる極めて薄い金属酸化物が存在する
ため、蒸着金属薄膜とステンレス鋼との密着性が乏し
く、簡単に剥がれてしまい、密着性を要求する用途、例
えば電気部品などに使用することが困難であった。(Prior art and its problems) The formation of a metal thin film by vacuum deposition is used in a wide range of fields such as plastic, glass and metal as a simple plating method for imparting a new function to a material. However, even if this method is used for stainless steel, there is a very thin metal oxide called a passivation film on the surface of the stainless steel, so the adhesion between the deposited metal thin film and the stainless steel is poor, and the stainless steel is easily peeled off. It has been difficult to use it for applications requiring adhesiveness, for example, for electric parts.
本発明者らは、この不動態皮膜を除去あるいは密着性
への悪影響を小さくするための手段として、真空蒸着中
あるいは真空蒸着に先立って電子シャワーをステンレス
鋼表面に浴びせることが有効であることを見い出し、本
発明を完成したものである。The present inventors have found that it is effective to take an electron shower on the stainless steel surface during or prior to vacuum deposition as a means for removing this passivation film or reducing the adverse effect on adhesion. It has been found that the present invention has been completed.
（発明の目的） 本発明の目的は、簡易なメッキ法としての真空蒸着に
よる金属薄膜のステンレス鋼への密着強度を向上させ、
電気接点その他の幅広い用途に利用できる方法を提供す
るにある。(Object of the Invention) An object of the present invention is to improve the adhesion strength of a metal thin film to stainless steel by vacuum evaporation as a simple plating method,
An object of the present invention is to provide a method that can be used for electrical contacts and other wide applications.
（発明の構成） 本発明の要旨は次のとおりである。(Constitution of the Invention) The gist of the present invention is as follows.
ステンレス鋼表面に金属を真空蒸着するに際し、蒸着
金属源とステンレス鋼との間に熱電子源用のカソードを
置き、真空蒸着に先立って、該熱電子源用カソードから
電子シャワーをステンレス鋼表面に浴びせ、次いで電子
シャワー照射と併用して蒸着金属源からステンレス鋼表
面に金属真空蒸着することによって、ステンレス鋼表面
の不動態皮膜にイオン結合層を形成し、ステンレス鋼表
面に密着強度の高い真空蒸着薄膜を形成する方法。When vacuum-depositing a metal on a stainless steel surface, a cathode for a thermionic source is placed between the deposited metal source and the stainless steel, and before the vacuum deposition, an electron shower is applied from the cathode for the thermionic source to the stainless steel surface. Bathing, then vacuum evaporation of metal from the metal source to the stainless steel surface in combination with electron shower irradiation to form an ion bonding layer on the passivation film on the stainless steel surface, and vacuum deposition with high adhesion strength on the stainless steel surface A method of forming a thin film.
蒸着金属としては以下の実施例では銅を用いている
が、原理的にはどのような金属を蒸着する場合にも有効
である。電子シャワーをステンレス鋼表面に浴びせる方
法としては実施例では電子を発生させるカソードとして
赤熱させたタングステンフィラメントを蒸着金属源とス
テンレス鋼との間に置いている。しかし、カソード材と
してはタングステンに限らずその他の材料も有効であ
る。熱電子をステンレス鋼に浴びせるにはカソードとス
テンレス鋼との間に電圧をかければ良く、実施例では50
0V程度をかけている。このときの電子シャワーの電流を
コントロールするため、実施例の装置ではアノードをカ
ソードとステンレス鋼との間に置いた。以下実施例によ
り本発明を詳細に説明する。Although copper is used as a metal to be deposited in the following embodiments, it is effective in principle when depositing any metal. In the embodiment, as a method of showering an electron shower on the stainless steel surface, a red-heated tungsten filament as a cathode for generating electrons is placed between the vapor deposition metal source and the stainless steel. However, the cathode material is not limited to tungsten, and other materials are also effective. To apply thermoelectrons to stainless steel, a voltage may be applied between the cathode and stainless steel.
About 0V is applied. In order to control the current of the electron shower at this time, in the device of the embodiment, the anode was placed between the cathode and stainless steel. Hereinafter, the present invention will be described in detail with reference to examples.
（実施例） 下地材（２）として10mm×10mm×厚さ3mmのSUS316ス
テンレス鋼を用意した。これを＃4000研磨紙により研磨
した後、中性洗剤による洗浄とアセトンによる超音波洗
浄を行った。(Example) 10 mm x 10 mm x 3 mm thick SUS316 stainless steel was prepared as a base material (2). After this was polished with # 4000 abrasive paper, cleaning with a neutral detergent and ultrasonic cleaning with acetone were performed.
第１図は真空蒸着装置で、タングステンボード（１）
上には蒸着用金属としてCuをおき、下地材（２）との間
にタングステンフィラメント（３）、アノード（４）を
介在させた。下地材（２）とタングステンフィラメント
（３）との距離は5cmとした。まず、はじめに、タング
ステンフィラメント（３）を加熱して熱電子を作って、
それを500Vで加速することによりできた電子シャワー
（５）（電流密度約8.0A/m2）をステンレス鋼（２）に
５〜６分間浴びせた後、銅を蒸発させ、この電子シャワ
ー中を通すことでイオン化した銅を該ステンレス鋼
（２）に蒸着させた。また比較として、電子シャワーを
全く浴びせない真空蒸着も実施した。両方法の真空蒸着
条件を第１表に示す。ここに示されるように５〜６分間
の電子シャワーにより、下地材の温度が約300℃まで上
昇していた。Fig. 1 shows a vacuum evaporation system, tungsten board (1)
Cu was placed as a metal for vapor deposition on the upper surface, and a tungsten filament (3) and an anode (4) were interposed between the substrate and the base material (2). The distance between the base material (2) and the tungsten filament (3) was 5 cm. First, the tungsten filament (3) is heated to produce thermoelectrons,
An electron shower (5) (current density of about 8.0 A / m 2 ) produced by accelerating it at 500 V is immersed in stainless steel (2) for 5 to 6 minutes, and then copper is evaporated. The copper ionized by passing through was deposited on the stainless steel (2). For comparison, vacuum deposition without any electron shower was also performed. Table 1 shows the vacuum deposition conditions for both methods. As shown here, the temperature of the base material was increased to about 300 ° C. by the electron shower for 5 to 6 minutes.
電子シャワーを浴びせた場合と浴びせない場合両方と
も蒸着金属膜厚は400〜500オングストロームであった。
しかし、密着強度には大きなへだたりがあり、本発明で
は強固な蒸着薄膜がえられたが、後者は容易に剥がれ
た。密着強度を正確に測るため、第２図に示すように、
ステンレス鋼（２）の表面にCuの薄膜（６）を蒸着した
試料の両面をエポキシ樹脂（７）（７）に接着した後引
張試験を行い、剥離するときの引張強度を求めた。各10
個の剥離試験の結果は第２表の通りで、通常の真空蒸着
膜に比較し、本発明法による蒸着薄膜は接合強度が２桁
高くなることを確認した。なお、予備照射なしで電子シ
ャワーを蒸着と同時に浴びせた場合でも従来法よりも密
着強度は１桁程度上昇していた。The film thickness of the deposited metal was 400 to 500 angstroms in both cases where the electron shower was performed and when the electron shower was not performed.
However, the adhesion strength had a large settling, and a strong vapor-deposited thin film was obtained in the present invention, but the latter easily peeled off. In order to measure the adhesion strength accurately, as shown in FIG.
A sample in which a thin film of Cu (6) was vapor-deposited on the surface of stainless steel (2) was bonded to epoxy resins (7) and (7), and a tensile test was performed to determine the tensile strength at the time of peeling. 10 each
The results of the peeling test are shown in Table 2, and it was confirmed that the bonding strength of the vapor-deposited thin film according to the present invention was two orders of magnitude higher than that of a normal vacuum-deposited film. In addition, even when the electron shower was immersed simultaneously with the deposition without preliminary irradiation, the adhesion strength was increased by about one digit compared with the conventional method.
（発明の効果） 本発明によれば、ステンレス鋼に真空蒸着させた金属
薄膜の密着強度を大巾に向上させることができ、電子部
品、その他の機能材料としてのステンレス鋼の新しい用
途を開くことが可能である。 (Effects of the Invention) According to the present invention, the adhesion strength of a metal thin film vacuum-deposited on stainless steel can be greatly improved, and new applications of stainless steel as electronic components and other functional materials are opened. Is possible.
第１図は、実施例で使用した真空蒸着装置の説明図。第
２図は、蒸着金属膜の剥離試験法の説明図。 １……タングステンボード ２……ステンレス鋼 ３……タングステンフィラメント ４……アノード ５……電子シャワー ６……金属薄膜 ７……エポキシ樹脂FIG. 1 is an explanatory view of a vacuum evaporation apparatus used in an embodiment. FIG. 2 is an explanatory view of a peeling test method of a deposited metal film. DESCRIPTION OF SYMBOLS 1 ... Tungsten board 2 ... Stainless steel 3 ... Tungsten filament 4 ... Anode 5 ... Electron shower 6 ... Metal thin film 7 ... Epoxy resin
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.6，ＤＢ名) C23C 14/00 - 14/58 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. 6 , DB name) C23C 14/00-14/58
Claims (1)
際し、蒸着金属源とステンレス鋼との間に熱電子源用の
カソードを置き、真空蒸着に先立って、該熱電子源用カ
ソードから電子シャワーをステンレス鋼表面に浴びせ、
次いで電子シャワー照射と併用して蒸着金属源からステ
ンレス鋼表面に金属真空蒸着することによって、ステン
レス鋼表面の不動態皮膜にイオン結合層を形成し、ステ
ンレス鋼表面に密着強度の高い真空蒸着薄膜を形成する
方法。When a metal is vacuum-deposited on a surface of a stainless steel, a cathode for a thermionic source is placed between the metallization source and the stainless steel, and an electron shower is formed from the cathode for the thermionic source prior to the vacuum deposition. On a stainless steel surface,
Next, a vacuum deposition thin film having a high adhesion strength is formed on the stainless steel surface by forming an ion bonding layer on the passivation film on the stainless steel surface by performing metal vacuum deposition on the stainless steel surface from a deposition metal source in combination with electron shower irradiation. How to form.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13415690A JP2913319B2 (en) | 1990-05-25 | 1990-05-25 | Method for forming vacuum deposited metal thin film with high adhesion strength on stainless steel surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13415690A JP2913319B2 (en) | 1990-05-25 | 1990-05-25 | Method for forming vacuum deposited metal thin film with high adhesion strength on stainless steel surface |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0428853A JPH0428853A (en) | 1992-01-31 |
| JP2913319B2 true JP2913319B2 (en) | 1999-06-28 |
Family
ID=15121780
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13415690A Expired - Fee Related JP2913319B2 (en) | 1990-05-25 | 1990-05-25 | Method for forming vacuum deposited metal thin film with high adhesion strength on stainless steel surface |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2913319B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6014199B2 (en) * | 2015-04-28 | 2016-10-25 | 日本発條株式会社 | Manufacturing method of laminate |
| CN113025948B (en) * | 2021-03-08 | 2022-12-27 | 安徽寒锐新材料有限公司 | Preparation method of anti-sticking boat for reducing cobalt powder and recycling method of boat cleaning material |
-
1990
- 1990-05-25 JP JP13415690A patent/JP2913319B2/en not_active Expired - Fee Related
Non-Patent Citations (1)
| Title |
|---|
| Ｎａｎｏ Ｔｅｃｈｎｏｌｏｇｙ，２（１９９１）ｐ３９−４２（英） |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0428853A (en) | 1992-01-31 |
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