JP2914201B2 - Mounting structure of multilayer dielectric substrate and coaxial connector - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure of a multilayer dielectric substrate and a coaxial connector formed on a multilayer dielectric substrate constituting a composite microwave circuit module for extracting a high-frequency output of a microwave circuit or the like.

[0002]

2. Description of the Related Art A case where a high-frequency output of a conventional multilayer dielectric substrate 1 is extracted will be described.

FIG. 5 is a perspective view of an output extracting structure of a conventional composite microwave circuit module. The multilayer dielectric substrate 1 is soldered to a metal plate called a base plate 23 such as brass. In this case, the center of the multilayer dielectric substrate 1 is aligned and mounted with reference to the center of the mounting hole 24 on the base plate 23, but the alignment is performed using a jig. . Further, the multi-layer dielectric substrate 1 aligned and attached to the base plate 23 has a high-frequency cover 26 having an output terminal receiving side with reference to the hole 24 of the base plate 23.
Is fastened with a flathead screw to electrically connect the high-frequency output pattern 2 of the multilayer dielectric substrate 1 to the high-frequency output terminal 25 on the high-frequency cover 26 side. The center conductor 27 of the high-frequency output terminal 25 is provided with a spring for making contact with the high-frequency output pattern with low resistance, and pressure is always applied to the contact. In addition, a shim is interposed between the outer conductor ground and the multilayer dielectric substrate to make good contact with the ground.

[0004]

In the case of such a structure, it is necessary to precisely align the high-frequency output pattern of the multilayer dielectric substrate with the high-frequency output terminal of the high-frequency cover. In particular, aiming at miniaturization of microwave circuits, the shape of the high-frequency output pattern of the integrated multilayer dielectric substrate is about 1 mm in size, and there is a need for a technology for connecting with a positioning of about 0.1 mm here. come. The same precision is required in the height direction. Therefore, a multilayer dielectric substrate, a base
The precision of each component such as a plate and a high-frequency cover must be made with good accuracy, and at the time of assembling, the work must be performed while paying attention to the mounting tolerance, and the assemblability is not good.

With such a structure, the contact between the central conductor of the high-frequency output terminal of the high-frequency cover and the high-frequency output pattern of the multilayer dielectric substrate is obstructed by the outer conductor or the like.
There is no way to confirm whether the connection has been made normally unless a continuity test is performed because it cannot be visually confirmed. In particular, there is a possibility that a product whose electrical characteristics vary due to a position shift due to an assembly tolerance.

Further, when an attempt is made to extract high-frequency output using a normal connector, the shape of the connector is large, so that it is not suitable for use in a multilayer dielectric substrate aiming at miniaturization. Also, the use of the connector increases the cost.

SUMMARY OF THE INVENTION An object of the present invention is to provide a low-cost and small-sized mounting structure for a high-frequency output unit and a coaxial connector of a multilayer dielectric substrate.

[0008]

In order to achieve the above object, the present invention comprises a female contact pin planted at the center of a high-frequency output pattern formed on the surface of a substrate and provided with a notch at its tip. Then, a multilayer dielectric substrate provided with arc-shaped holes at a plurality of locations around the female contact pins, a male connector screw and a connector pedestal inserted into the arc-shaped holes of the multilayer dielectric substrate are integrally formed. A coaxial connector having a male contact pin projecting from the tip of a semi-rigid cable inserted and fixed in a hole formed in the center thereof, and a male contact pin inserted through an arc-shaped hole of the multilayer dielectric substrate. A multi-layer dielectric substrate comprising: a female screw for a connector for fixing the coaxial connector to the multi-layer dielectric substrate by being brought into contact with the female contact pins and screwing into a male connector screw protruding from the back surface of the substrate; In the mounting structure of the coaxial connector.

According to the present invention, a female contact pin planted at the center of the high-frequency output pattern of the multilayer dielectric substrate is planted in a hole formed from the surface layer of the substrate to the high-frequency pattern layer and fixed by soldering. Another feature is that a hole formed from the high-frequency pattern layer to the surface of the substrate is tapped into a recess formed from the substrate back layer to the high-frequency pattern layer, and is fixed by tapping.

Still another object of the present invention is to form a concave / convex portion for positioning on a part of the back surface of the connector pedestal of the coaxial connector and a part of the surface of the multilayer dielectric substrate corresponding to the part.

[0011]

According to the structure of the present invention, the male connector screw formed on the coaxial connector is inserted into the arc-shaped hole formed in the multilayer dielectric substrate, and the male contact pin of the coaxial connector is connected to the female connector of the dielectric substrate. At the point where the contact pin comes into contact with the contact pin, the female screw for the connector is screwed into the male screw for the connector protruding from the back surface of the board, and the coaxial connector is attached to the multilayer dielectric board. Thereby, the high-frequency pattern layer of the substrate is electrically connected to the semi-rigid cable of the coaxial connector through the contact of the female and male contact pins.

[0012]

FIG. 1 is a perspective view showing the structure of an embodiment of the present invention.
FIG. 2 is a sectional view showing the structure of the embodiment.

As shown in FIG. 1, the coaxial connector structure of the present embodiment mainly comprises a multilayer dielectric substrate 1 having female contact pins 3 and holes 4 connected to a high-frequency pattern, a semi-rigid cable 12 and a connector male screw. And a female connector screw 13 for fixing the coaxial connector 6 to the multilayer dielectric substrate 1.

As shown in the sectional view of FIG. 2, a multilayer dielectric substrate 1 composed of a multilayer ceramic substrate has a high-frequency pattern 21 in an inner layer of the substrate.
A hole having the same diameter as that of the contact pin 3 is made up to 1. This hole is the center for connecting the connector,
Here, the female contact pins 3 are set up by soldering. With such a structure, the positional accuracy of the female contact pins 3 is improved. The female contact pin 3 is cut at the center in order to have a structure in which the male contact pin 9 can be inserted, and has a divided end, and is plated with gold to reduce contact resistance. FIG. 3 is a schematic view showing another embodiment of the mounting method of the female contact pin 3. As shown in FIG. FIG. 3A shows a structure in which a high-frequency pattern 21 is provided in the inner layer of the multilayer dielectric substrate 1 and is electrically connected to the high-frequency output pattern 2 on the surface via the via 20. The female contact pin 3 is set up at the center of 2 by soldering. Although the pin position accuracy is not very good, it is easy to mount. FIG. 3B shows a structure in which a female contact pin set at the center of the high-frequency output pattern 2 of the multilayer dielectric substrate is used as a mechanical tapping insertion pin. High frequency pattern 2 from the back of multilayer dielectric substrate 1
1 to form a cavity structure 22 in which holes are made in advance during the manufacture of the substrate so that the female contact pins 3 pass from the high-frequency pattern 21 to the surface layer,
Here, a pin is hit to fix the contact pin 3. Since there is no soldering, workability is good, but it is difficult to replace pins.

A GND pattern 5 is formed around the high frequency output pattern 2 on the surface of the substrate. The multilayer dielectric substrate 1 has an arc-shaped hole 4 through which the male screw 10 of the coaxial connector passes. The hole 4 is made as small as possible in consideration of the strength of the substrate.

The coaxial connector 6 has a single structure of a connector pedestal 7 and a connector male screw 10, and has a hole at the center thereof. A semi-rigid cable 12 is inserted into the hole and fixed by soldering. The center conductor is exposed at the end of the semi-rigid cable 12, and the male contact pins 9 are soldered thereto. The connector male screw 10 is divided into a plurality of arc-shaped portions having split grooves, and a screw is carved on the outer periphery thereof. A shim 8 is attached to the back surface of the connector base 7 in order to improve the contact with the ground pattern 5 on the surface layer of the multilayer dielectric substrate 1.

The male and female contact pins are connected by passing the male screw 10 of the coaxial connector 6 having such a structure through the arc-shaped hole 4 of the multilayer dielectric substrate 1 described above. At this time, the male screw 10 protruding from the back surface of the multilayer dielectric substrate 1 is connected to the female screw 13 for connector through the washer 14.
Tighten by. When the coaxial connector 6 is fixed, three portions of the rear surface of the connector pedestal 7 protrude, and conversely, a part of the multilayer dielectric substrate corresponding to the portion is dented,
Each is just engaged with each other, so that the coaxial connector and the multilayer dielectric substrate 1 can be easily positioned.

In order to disperse the stress applied to the substrate, the pedestal 7 and the washer 14 of the coaxial connector should be as large as possible. In particular, in the case of the embodiment shown in the cross-sectional view of FIG. 4, a base plate 23 is adhered to the back surface of the multilayer dielectric substrate 1 and the coaxial connector 6 is tightened on the back surface of the base plate 23 with the female screw 13 so as to be added to the substrate. A method for reducing the stress is also conceivable.

In this embodiment, a multilayer dielectric substrate is taken as an example, but it goes without saying that a similar structure can be applied to a general printed circuit board.

Although a semi-rigid cable is provided from the coaxial connector, it is also possible to integrate a passive element such as a low-pass filter above the coaxial connector.

[0021]

According to the present invention, by adopting the above-mentioned structure, it is not necessary to pay much attention to the tolerance during assembly and the dimensional tolerance of parts as in the prior art, and the dimensional tolerance at the time of manufacturing each part is relaxed. In addition, the workability at the time of assembly is improved, so that the cost can be reduced.

Further, since the electrical connection is reliably performed, the characteristics of the connection portion are improved, and a reduction in loss can be expected. Further, a stable product having no variation in the mounting position at the time of manufacturing and no variation in the electrical characteristics due to assembly tolerance can be obtained.

Further, the female side of the coaxial connector does not require any components other than the contact pins and has a simple structure, so that the cost is low.

[Brief description of the drawings]

FIG. 1 is a perspective view showing the structure of an embodiment of the present invention.

FIG. 2 is a sectional view showing the structure of the embodiment of the present invention.

FIGS. 3A and 3B are conceptual diagrams showing examples of mounting contact pins.

FIG. 4 is a sectional view showing the structure of another embodiment of the present invention.

FIG. 5 is a perspective view of an output extraction structure of a conventional composite microwave circuit module.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Multilayer dielectric substrate 2 High frequency output pattern 3 Female contact pin 4 Hole 5 GND pattern 6 Coaxial connector 7 Connector pedestal 8 Shim 9 Male contact pin 10 Connector male screw 11 Solder 12 Semi-rigid cable 13 Female screw for connector 14 Washer 15 Center conductor 16 Outer conductor (GND) 17 Dielectric 18 Positioning protrusion 19 Positioning recess 20 Via 21 High frequency pattern 22 Cavity 23 Base plate 24 Reference mounting hole 25 High frequency output terminal 26 High frequency cover 27 Central conductor on high frequency cover side

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H01R 17/04-17/12 H01R 9/00 H01P 1/00

Claims (5)

(57) [Claims] 1. A high-frequency output pattern electrically connected to a high-frequency pattern layer in an inner layer of a substrate.
A multilayer dielectric substrate having a female contact pin provided with a notch at the tip thereof and having arc-shaped holes provided at a plurality of locations around the female contact pin, and an arc-shaped hole in the multilayer dielectric substrate. A coaxial connector in which a male connector screw to be inserted and a connector pedestal are integrally formed, and a male contact pin protrudes from a tip of a cable inserted and fixed in a hole formed in the center thereof, and the multilayer dielectric substrate. A multi-layer dielectric comprising a female screw for a connector for inserting a male contact pin into a female contact pin through an arcuate hole and screwing the male screw into a connector male screw projecting from the rear surface of the board to fix the coaxial connector to the multilayer dielectric board. Mounting structure of body board and coaxial connector. 2. A female contact pin planted at the center of a high-frequency output pattern of a multilayer dielectric substrate is planted in a recess formed from a surface layer of the substrate to a high-frequency pattern layer in an inner layer of the substrate and fixed by soldering. 2. The mounting structure for a multilayer dielectric substrate and a coaxial connector according to claim 1, wherein: 3. A female contact pin planted at the center of a high-frequency output pattern of a multilayer dielectric substrate is opened from the high-frequency pattern layer to the surface of the substrate in a recess formed from the back layer of the substrate to the high-frequency pattern layer in the inner layer of the substrate. 2. The mounting structure for a multilayer dielectric substrate and a coaxial connector according to claim 1, wherein the mounting is performed by tapping and fixing the hole into the hole. 4. The multi-layer dielectric substrate according to claim 1, wherein a male screw of the coaxial connector is fixed by a female screw for the connector via a metal base plate on a rear surface of the multi-layer dielectric substrate. Mounting structure for coaxial connectors. 5. A coaxial connector according to claim 1, wherein a part of the back surface of the connector pedestal and a part of the surface of the multi-layer dielectric substrate corresponding to the part are formed with concave and convex portions for alignment. 5. A mounting structure for the multilayer dielectric substrate and the coaxial connector according to any one of claims 4 to 4.