JP2917066B2 - Abrasive composition - Google Patents
Abrasive compositionInfo
- Publication number
- JP2917066B2 JP2917066B2 JP3036265A JP3626591A JP2917066B2 JP 2917066 B2 JP2917066 B2 JP 2917066B2 JP 3036265 A JP3036265 A JP 3036265A JP 3626591 A JP3626591 A JP 3626591A JP 2917066 B2 JP2917066 B2 JP 2917066B2
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- alumina
- composition
- aluminum
- nitrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は研磨剤組成物に関するも
のである。詳しくは、研磨能率がよく、すぐれた研磨表
面を形成することができる研磨剤組成物に関するもので
ある。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an abrasive composition. More specifically, the present invention relates to a polishing composition having good polishing efficiency and capable of forming an excellent polishing surface.
【０００２】[0002]
【従来の技術】近年、工業的規模の生産が飛躍的に増加
したシリコン及び化合物半導体基板、各種の磁気メモリ
ーハードディスク、レーザー部品等の材料の精密研磨加
工においては、特に加工面の平滑度、無欠陥性（スクラ
ッチ、オレンジピール、ピット、ノジュール、クラック
等の欠陥がない事）に対する要求水準が、過去の研磨加
工技術水準に比して遥かに高度化すると共に、他方、生
産、検査設備等に多額の投資が必要な為、生産スピード
の向上、不良欠陥ロスの低減に依るコストカットも重要
な課題となっている。従って、これらの分野で使用され
る研磨剤に就いても加工精度及び研磨速度の向上に対す
る要望が極めて強いものとなっている。従来、この種の
研磨にはアルミナを砥粒とする研磨剤が一般に用いられ
ている。しかし、水とアルミナからなる研磨剤組成物は
研磨速度が十分でなく、研磨速度を上げる目的でアルミ
ナの粒径を大きくすると、研磨表面に荒れが生ずるよう
になり、研磨速度と表面状態の両方を満足するものとは
言えなかった。2. Description of the Related Art In recent years, the precision polishing of materials such as silicon and compound semiconductor substrates, various magnetic memory hard disks, and laser parts, for which the production on an industrial scale has increased dramatically, has particularly been demanded on the smoothness of the processed surface and the lack of smoothness. The required level of defectivity (the absence of defects such as scratches, orange peels, pits, nodules, cracks, etc.) has become much more advanced than the level of past polishing technology, and on the other hand, production and inspection equipment, etc. Since a large amount of investment is required, it is also important to cut costs by improving production speed and reducing loss of defective defects. Accordingly, there is an extremely strong demand for an improvement in the processing accuracy and the polishing rate even for abrasives used in these fields. Heretofore, for this type of polishing, an abrasive containing alumina as abrasive grains has been generally used. However, the polishing composition comprising water and alumina does not have a sufficient polishing rate, and if the particle size of alumina is increased for the purpose of increasing the polishing rate, the polished surface becomes rough, and both the polishing rate and the surface state are increased. Was not satisfactory.
【０００３】そこで、研磨速度、表面状態を改良するた
めに、例えば、硝酸アルミニウム、硫酸アルミニウム、
塩化アルミニウム等の水溶性アルミニウム塩よりなる研
磨促進剤を添加する方法が提供されている（特開昭５４
−８９３８９）。しかし、硫酸アルミニウム又は塩化ア
ルミニウムを用いた場合は、研磨速度が硝酸アルミニウ
ムの場合に比べて低く実用的とはいえなかった。一方、
研磨物の表面状態に関しては研磨促進剤として硫酸アル
ミニウムや塩化アルミニウムを用いた方が良好な場合が
ある。従って硫酸アルミニウム又は塩化アルミニウムを
研磨促進剤として用いた場合でも表面状態を低下させる
ことなく研磨速度が十分高くなる研磨剤が要望されてい
た。Therefore, in order to improve the polishing rate and the surface condition, for example, aluminum nitrate, aluminum sulfate,
There has been provided a method of adding a polishing accelerator comprising a water-soluble aluminum salt such as aluminum chloride (Japanese Patent Application Laid-Open No. 54-1979).
-89389). However, when aluminum sulfate or aluminum chloride was used, the polishing rate was lower than that of aluminum nitrate and was not practical. on the other hand,
Regarding the surface condition of the polished material, it is sometimes better to use aluminum sulfate or aluminum chloride as the polishing accelerator. Therefore, there has been a demand for a polishing agent which can sufficiently increase the polishing rate without deteriorating the surface state even when aluminum sulfate or aluminum chloride is used as the polishing accelerator.
【０００４】[0004]
【発明が解決しようとする課題】本発明は硫酸アルミニ
ウム又は塩化アルミニウムを研磨促進剤として使用した
場合における研磨速度を向上させ、しかも表面状態の優
れた研磨物を得ることのできる研磨剤組成物を提供する
ことを目的とするものである。DISCLOSURE OF THE INVENTION The present invention provides a polishing composition which can improve the polishing rate when using aluminum sulfate or aluminum chloride as a polishing accelerator and can obtain a polished product having an excellent surface condition. It is intended to provide.
【０００５】[0005]
【課題を解決するための手段】本発明者は、かかる目的
を満足するよりすぐれた研磨剤組成物を得る為、研磨速
度を改良しようと鋭意研究を重ねた結果、硫酸アルミニ
ウム又は塩化アルミニウムに特定の酸化剤を併用すれ
ば、表面状態を低下させることなく研磨速度が著しく向
上する事を見出した。すなわち、本発明の要旨は、水性
媒体中に、アルミナを分散させた研磨剤において、研磨
促進剤として硫酸アルミニウム又は塩化アルミニウム
過酸化物、硝酸、硝酸塩、亜硝酸塩及び芳香族ニトロ
化合物から選ばれた少なくとも１種の水溶性酸化剤を配
合してなる研磨剤組成物に存する。Means for Solving the Problems The inventors of the present invention have conducted intensive studies to improve the polishing rate in order to obtain a more excellent polishing composition satisfying the above object. It has been found that when the oxidizing agent is used in combination, the polishing rate is significantly improved without lowering the surface state. That is, the gist of the present invention is that, in an abrasive in which alumina is dispersed in an aqueous medium, aluminum sulfate or aluminum chloride peroxide as a polishing accelerator, nitric acid, nitrate, nitrite and aromatic nitro compound are selected. An abrasive composition comprising at least one water-soluble oxidizing agent.
【０００６】以下、本発明を更に詳細に説明する。本発
明の研磨剤組成物は水性媒体中にアルミナを分散させた
ものであり、このアルミナとしてはγ−アルミナ、θ−
アルミナ、α−アルミナ等種々のアルミナを使用するこ
とが出来、特に限定されるものではないが、研磨速度を
考慮するとα−アルミナが望ましい。アルミナの量は、
通常、組成物全量に対して１〜３０重量％、好ましくは
２〜１５重量％である。あまりに少ないと研磨速度が小
さくなり、逆にあまりに多いと均一分散が保てなくな
り、かつ、スラリー粘度が過大となって取扱いが困難と
なる。また、アルミナの粒子径は加工精度及び研磨速度
を考慮すると通常、平均粒径で０．１〜１０μｍ、好ま
しくは０．１〜３μｍである。Hereinafter, the present invention will be described in more detail. The abrasive composition of the present invention is obtained by dispersing alumina in an aqueous medium. Examples of the alumina include γ-alumina and θ-alumina.
Various aluminas such as alumina and α-alumina can be used, and are not particularly limited, but α-alumina is desirable in consideration of the polishing rate. The amount of alumina is
Usually, it is 1 to 30% by weight, preferably 2 to 15% by weight, based on the total amount of the composition. If the amount is too small, the polishing rate will decrease. Conversely, if the amount is too large, uniform dispersion cannot be maintained, and the viscosity of the slurry will be excessive, making handling difficult. The particle diameter of alumina is usually 0.1 to 10 μm, preferably 0.1 to 3 μm in average particle diameter in consideration of processing accuracy and polishing rate.
【０００７】研磨促進剤の成分として用いられる塩化
アルミニウム又は硫酸アルミニウムは無水塩、含水塩の
いずれを用いても良い。あるいは又、例えば、りん酸ア
ルミニウムと塩酸又は硫酸を併用し研磨剤系中で塩化ア
ルミニウム又は硫酸アルミニウムを形成させても良い。
塩化アルミニウム又は硫酸アルミニウムの量は、通常、
組成物全量に対して、ＡｌＣｌ3 又はＡｌ2 （ＳＯ4 ）
3 として、０．０１〜２０重量％、好ましくは０．１〜
１０重量％である。Aluminum chloride or aluminum sulfate used as a component of the polishing accelerator may be either an anhydrous salt or a hydrated salt. Alternatively, for example, aluminum phosphate or hydrochloric acid or sulfuric acid may be used in combination to form aluminum chloride or aluminum sulfate in an abrasive system.
The amount of aluminum chloride or aluminum sulfate is usually
AlCl 3 or Al 2 (SO 4 ) based on the total amount of the composition
3 , 0.01 to 20% by weight, preferably 0.1 to
10% by weight.
【０００８】研磨促進剤の成分として用いられる水溶
性酸化剤としては、過酸化物、硝酸、硝酸塩、亜硝酸塩
及び芳香族ニトロ化合物から選ばれた少なくとも１種の
化合物である。過酸化物としては、例えば、過酸化水
素、過酸化ナトリウム、ペルオキソ炭酸ナトリウム、ペ
ルオキソ硼酸ナトリウム、ペルオキソ燐酸ナトリウム、
ペルオキソ硫酸ナトリウム、ペルオキソ硫酸カリウム等
の無機過酸化物、又はｔｅｒｔ−ブチルヒドロペルオキ
シド、過蟻酸、過酢酸等の有機過酸化物が挙げられる。
特に過酸化水素等の無機過酸化物を使用した場合には、
硝酸アルミニウムを研磨促進剤として使用した場合以上
の研磨速度が得られ、好ましい。硝酸塩としては例えば
硝酸ナトリウム、硝酸カリウム、硝酸カルシウム、硝酸
マグネシウム、硝酸鉄（II）、硝酸鉄（III ）等が挙げ
られる。亜硝酸塩としては例えば、亜硝酸ナトリウム、
亜硝酸カリウム、亜硝酸カルシウム、亜硝酸マグネシウ
ム等が挙げられる。また、芳香族ニトロ化合物として
は、ｍ−ニトロベンゼンスルホン酸ソーダ、２，４ジニ
トロフェノール等のニトロ化合物が挙げられる。水溶性
酸化剤の使用量は、通常、組成物全量に対して、０．０
１〜１０重量％好ましくは０．１〜５重量％である。ま
た、硫酸アルミニウム又は塩化アルミニウムに対して
は、通常０．０５〜２重量倍、好ましくは０．１〜１重
量倍である。この量があまりに少ないと硫酸アルミニウ
ム又は塩化アルミニウムの場合の欠点である研磨速度を
改善する事ができず、逆にあまりに多くても、添加効果
が向上する事もなく、経済的でない。The water-soluble oxidizing agent used as a component of the polishing accelerator is at least one compound selected from peroxide, nitric acid, nitrate, nitrite and aromatic nitro compound. As the peroxide, for example, hydrogen peroxide, sodium peroxide, sodium peroxocarbonate, sodium peroxoborate, sodium peroxophosphate,
Examples include inorganic peroxides such as sodium peroxosulfate and potassium peroxosulfate, and organic peroxides such as tert-butyl hydroperoxide, formic acid, and peracetic acid.
Especially when an inorganic peroxide such as hydrogen peroxide is used,
A polishing rate higher than the case where aluminum nitrate is used as a polishing accelerator is obtained, which is preferable. Examples of the nitrate include sodium nitrate, potassium nitrate, calcium nitrate, magnesium nitrate, iron (II) nitrate, and iron (III) nitrate. As nitrite, for example, sodium nitrite,
Potassium nitrite, calcium nitrite, magnesium nitrite and the like can be mentioned. Examples of the aromatic nitro compound include nitro compounds such as sodium m-nitrobenzenesulfonate and 2,4-dinitrophenol. The amount of the water-soluble oxidizing agent is usually 0.0% based on the total amount of the composition.
It is 1 to 10% by weight, preferably 0.1 to 5% by weight. The amount is usually 0.05 to 2 times by weight, preferably 0.1 to 1 time by weight, relative to aluminum sulfate or aluminum chloride. If the amount is too small, the polishing rate, which is a disadvantage in the case of aluminum sulfate or aluminum chloride, cannot be improved. Conversely, if the amount is too large, the effect of addition will not be improved, and it is not economical.
【０００９】本発明の研磨剤組成物の調製は、前記各成
分を水性媒体中で混合撹拌すればよく、混合順序等も特
に制限されるものではない。又、この研磨剤組成物の調
製に際しては、被加工物の種類、加工条件等の研磨加工
上の必要条件に応じて、各種の公知の添加剤を加えても
よい。これらの添加剤としては、例えば、アルキルベン
ゼンスルホン酸ソーダ、ナフタリンスルホン酸のホルマ
リン縮合物、リグニンスルホン酸塩、カルボキシメチル
セルロース塩、ポリアクリル酸塩、セルロース、ヒドロ
キシエチルセルロース、ベーマイトなどの分散安定剤等
が挙げられる。尚、本発明の研磨剤組成物のpHは、１〜
６、好ましくは２〜５である。pH６を超えた場合は研磨
剤としての効果が低下するので好ましくない。本発明の
研磨剤組成物の調製方法は、あらかじめ、全ての成分を
混合しても良いし、或いは、例えば、酸化剤とそれ以外
を別々に調製し、使用時に両者を混合して本発明の組成
物としても良い。また、本発明の研磨剤組成物は、比較
的高濃度の原液を調製し、実際の研磨加工時に希釈して
使用することも可能である。前述の濃度範囲は、実際の
研磨加工時に好ましい濃度範囲である。本発明の研磨剤
組成物は、金属、ガラス、プラスチック等の研磨に使用
されるが、欠陥のない研磨表面が得られることから、メ
モリーハードディスク等の研磨に特に好適である。The abrasive composition of the present invention can be prepared by mixing and stirring the above components in an aqueous medium, and the order of mixing is not particularly limited. In preparing the abrasive composition, various known additives may be added according to the necessary polishing conditions such as the type of the workpiece and the processing conditions. Examples of these additives include sodium alkylbenzene sulfonate, formalin condensate of naphthalenesulfonic acid, lignin sulfonate, carboxymethyl cellulose salt, polyacrylate, cellulose, hydroxyethyl cellulose, and dispersion stabilizers such as boehmite. Can be The pH of the polishing composition of the present invention is 1 to
6, preferably 2-5. If the pH exceeds 6, the effect as an abrasive is reduced, which is not preferable. The method for preparing the abrasive composition of the present invention may be carried out in advance, or all the components may be mixed, or, for example, an oxidizing agent and the other components may be separately prepared, and both may be mixed at the time of use to obtain the polishing composition of the present invention. It may be a composition. In addition, the polishing composition of the present invention can be used by preparing a stock solution having a relatively high concentration and diluting it during actual polishing. The above-described concentration range is a preferable concentration range during actual polishing. The polishing composition of the present invention is used for polishing metals, glass, plastics and the like, but is particularly suitable for polishing memory hard disks and the like because a polishing surface free from defects can be obtained.
【００１０】[0010]
【実施例】以下、実施例によって本発明を具体的に説明
するが、本発明はその要旨を超えない限り以下の実施例
に限定されるものではない。 実施例１〜１１、比較例１〜３ （研磨剤組成物の調製）α−アルミナ（平均粒子径１．
５μｍ、最大粒子径１０μｍ）をα−アルミナに対して
１０％の結晶セルロース（旭化成（株）製アビセル（商
標名））の存在下に高速ミキサーを用いて水に分散させ
てα−アルミナ濃度８重量％のスラリーを調製した。こ
れに研磨促進剤として硫酸アルミニウム又は塩化アルミ
ニウム、及び第１表又は第２表に示す水溶性酸化剤を添
加、混合して研磨剤組成物を調製した。 （研磨試験）被加工物としてアルミニウム基板にニッケ
ル・リンの無電解メッキ（ニッケル９０〜９２％、リン
１０〜８％の合金メッキ層）を施した３．５インチメモ
リハードディスク（外径約９５mm）の基板を使用した。
研磨は、両面研磨機（定盤径φ６４０mm）を使用して行
なった。研磨機の上下定盤にはスエードタイプの研磨パ
ッド（第１レース（株）製ドミテックス２５−６）を貼
りつけ、ディスク５枚を装填して３分間研磨した。研磨
条件は加工圧力１００ｇ／cm2 、下定盤回転数４０rpm
、研磨剤供給量１００cc／分とした。研磨後、ディス
クを洗浄、乾燥し重量減から平均研磨速度を求めた。ま
た、目視検査に依り表面欠陥の有無程度を評価した。こ
の試験結果を表１及び表２に示す。EXAMPLES The present invention will be described below in detail with reference to examples, but the present invention is not limited to the following examples unless it exceeds the gist. Examples 1 to 11, Comparative Examples 1 to 3 (Preparation of Abrasive Composition) α-Alumina (average particle diameter of 1.
5 μm, maximum particle diameter 10 μm) was dispersed in water using a high-speed mixer in the presence of 10% crystalline cellulose (Avicel (trade name) manufactured by Asahi Kasei Corporation) with respect to α-alumina, and the α-alumina concentration was 8 A weight percent slurry was prepared. To this, aluminum sulfate or aluminum chloride as a polishing accelerator and a water-soluble oxidizing agent shown in Table 1 or 2 were added and mixed to prepare a polishing composition. (Polishing test) 3.5 inch memory hard disk (outer diameter of about 95 mm) obtained by subjecting an aluminum substrate to electroless plating of nickel and phosphorus (an alloy plating layer of 90 to 92% of nickel and 10 to 8% of phosphorus) as an object to be processed. Substrate was used.
Polishing was performed using a double-side polishing machine (platen diameter 640 mm). A suede-type polishing pad (Domitex 25-6 manufactured by Daiichi Race Co., Ltd.) was attached to the upper and lower platens of the polishing machine, and five disks were loaded and polished for 3 minutes. The polishing conditions were a processing pressure of 100 g / cm 2 and a lower platen rotation speed of 40 rpm.
And the abrasive supply rate was 100 cc / min. After polishing, the disc was washed and dried, and the average polishing rate was determined from the weight loss. In addition, the presence or absence of surface defects was evaluated by visual inspection. The test results are shown in Tables 1 and 2.
【表１】 [Table 1]
【表２】 [Table 2]
【００１１】[0011]
【発明の効果】本発明の研磨剤組成物によれば、研磨促
進剤として硫酸アルミニウム又は塩化アルミニウムを使
用し、特定の水溶性酸化剤を併用したことにより、研磨
促進効果を高めることができ、硝酸アルミニウムを研磨
促進剤として使用した場合と同レベルまたは、それ以上
の研磨速度となり、極めて良好な研磨が可能となる。According to the polishing composition of the present invention, aluminum sulfate or aluminum chloride is used as a polishing accelerator, and a specific water-soluble oxidizing agent is used in combination, whereby the polishing promoting effect can be enhanced. The polishing rate is equal to or higher than the case where aluminum nitrate is used as a polishing accelerator, and extremely good polishing is possible.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 森永 均 北九州市八幡西区大字藤田2447番地の１ 三菱化成株式会社黒崎工場内 (56)参考文献 特開 昭54−89389（ＪＰ，Ａ) 特開 昭63−45118（ＪＰ，Ａ) (58)調査した分野(Int.Cl.6，ＤＢ名) C09K 3/14 B24B 37/00 ＷＰＩ／Ｌ（ＱＵＥＳＴＥＬ)──────────────────────────────────────────────────続 き Continuation of the front page (72) Inventor Hitoshi Morinaga 2447 Fujita, Yawatanishi-ku, Kitakyushu-shi 1 Kurosaki Plant of Mitsubishi Kasei Corporation (56) References JP-A-54-89389 (JP, A) JP-A Sho 63-45118 (JP, A) (58) Fields investigated (Int. Cl. 6 , DB name) C09K 3/14 B24B 37/00 WPI / L (QUESTEL)
Claims (1)
つ、研磨促進剤として、硫酸アルミニウム及び塩化ア
ルミニウムから選ばれる少くとも１種、及び過酸化
物、硝酸、硝酸塩、亜硝酸塩及び芳香族ニトロ化合物か
ら選ばれる少くとも１種の水溶性酸化剤を配合してなる
研磨剤組成物。1. A dispersion of alumina in an aqueous medium and at least one selected from aluminum sulfate and aluminum chloride as a polishing accelerator, and peroxide, nitric acid, nitrate, nitrite and aromatic nitro compound. An abrasive composition comprising at least one water-soluble oxidizing agent selected from the group consisting of:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3036265A JP2917066B2 (en) | 1991-03-01 | 1991-03-01 | Abrasive composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3036265A JP2917066B2 (en) | 1991-03-01 | 1991-03-01 | Abrasive composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04275387A JPH04275387A (en) | 1992-09-30 |
| JP2917066B2 true JP2917066B2 (en) | 1999-07-12 |
Family
ID=12464941
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3036265A Expired - Lifetime JP2917066B2 (en) | 1991-03-01 | 1991-03-01 | Abrasive composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2917066B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2019138846A1 (en) | 2018-01-11 | 2019-07-18 | 株式会社フジミインコーポレーテッド | Polishing composition |
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| JP2690847B2 (en) * | 1993-05-31 | 1997-12-17 | 株式会社神戸製鋼所 | Abrasive composition for mirror finish polishing of carbon substrate and polishing method |
| KR100314642B1 (en) * | 1998-12-07 | 2001-12-28 | 이터널 케미칼 컴퍼니 리미티드 | Chemical mechanical polishing compositions for use in semiconductor processing |
| US6280490B1 (en) * | 1999-09-27 | 2001-08-28 | Fujimi America Inc. | Polishing composition and method for producing a memory hard disk |
| TW591089B (en) | 2001-08-09 | 2004-06-11 | Cheil Ind Inc | Slurry composition for use in chemical mechanical polishing of metal wiring |
| US6953389B2 (en) | 2001-08-09 | 2005-10-11 | Cheil Industries, Inc. | Metal CMP slurry compositions that favor mechanical removal of oxides with reduced susceptibility to micro-scratching |
| US20080057386A1 (en) | 2002-10-15 | 2008-03-06 | Polyplus Battery Company | Ionically conductive membranes for protection of active metal anodes and battery cells |
| US7645543B2 (en) | 2002-10-15 | 2010-01-12 | Polyplus Battery Company | Active metal/aqueous electrochemical cells and systems |
| US9368775B2 (en) | 2004-02-06 | 2016-06-14 | Polyplus Battery Company | Protected lithium electrodes having porous ceramic separators, including an integrated structure of porous and dense Li ion conducting garnet solid electrolyte layers |
| US7282295B2 (en) | 2004-02-06 | 2007-10-16 | Polyplus Battery Company | Protected active metal electrode and battery cell structures with non-aqueous interlayer architecture |
| KR20090002506A (en) | 2007-06-29 | 2009-01-09 | 제일모직주식회사 | Phase change memory device polishing CMP slurry composition and polishing method using the same |
| EP2301105A4 (en) | 2008-06-16 | 2013-06-19 | Polyplus Battery Co Inc | AQUEOUS LITHIUM / AIR BATTERIES |
| WO2013028574A2 (en) | 2011-08-19 | 2013-02-28 | Polyplus Battery Company | Aqueous lithium air batteries |
| US9660265B2 (en) | 2011-11-15 | 2017-05-23 | Polyplus Battery Company | Lithium sulfur batteries and electrolytes and sulfur cathodes thereof |
| US8932771B2 (en) | 2012-05-03 | 2015-01-13 | Polyplus Battery Company | Cathode architectures for alkali metal / oxygen batteries |
-
1991
- 1991-03-01 JP JP3036265A patent/JP2917066B2/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019138846A1 (en) | 2018-01-11 | 2019-07-18 | 株式会社フジミインコーポレーテッド | Polishing composition |
| KR20200108022A (en) * | 2018-01-11 | 2020-09-16 | 가부시키가이샤 후지미인코퍼레이티드 | Polishing composition |
| JPWO2019138846A1 (en) * | 2018-01-11 | 2021-01-28 | 株式会社フジミインコーポレーテッド | Polishing composition |
| US11339311B2 (en) | 2018-01-11 | 2022-05-24 | Fujimi Incorporated | Polishing composition |
| JP7373403B2 (en) | 2018-01-11 | 2023-11-02 | 株式会社フジミインコーポレーテッド | polishing composition |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04275387A (en) | 1992-09-30 |
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