JP2917402B2 - Tape polishing equipment - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tape polishing apparatus, and more particularly to a tape polishing apparatus capable of controlling a thickness of a tape with high accuracy.

[Conventional technology]

A conventional tape polishing apparatus includes a rotary table, a contact roller, and a pressure adjusting screw block.

 Next, a conventional example will be described with reference to the drawings.

 FIG. 7 is a partially cutaway side view showing an example of the prior art.

The tape polishing apparatus shown in FIG.
A rotary table 2 for fixing and rotating at a constant speed, a contact roller 4 for pressing the abrasive grain holding surface of the wrapping tape 3 against a workpiece, an inner peripheral shaft end 41 of a center shaft 40 of the contact roller 4 and an outer periphery Support frame 23 supporting shaft end 42
And a pressure adjusting screw block 20 for pressing the support frame 23 to press the tape.

The pressure adjusting screw block 20 includes a pressure adjusting screw 21, a cylinder 30, and a coil spring housed in the cylinder 30 and to which pressure is applied when the pressure adjusting screw 20 is rotated. The contact roller 4 is compressed and repelled by the support frame 23 through the support frame 23.
The inner shaft end 41 and the outer shaft end 42 of the center shaft 40 are simultaneously pressed.

FIG. 8 is a top view for explaining a polishing region in the conventional example shown in FIG. 7, and a contact roller 4 is provided on a polishing region of the workpiece 1 placed on the turntable 2.
Is formed between the inner peripheral area A and the outer peripheral area B as the rotary table rotates.

The contact roller 4 has a center shaft 40 having an inner shaft end 41 and an outer shaft end 42, as shown in the sectional view shown in detail in FIG. 9, and a hard rubber formed around the center shaft 40. And a roller rubber 24 composed of

Next, an example of polishing using a conventional tape polishing apparatus will be described.

The workpiece 1 is rotated by the rotary table 2 and rotated at 300 rpm, and is moved from the inner peripheral area A to the outer peripheral area B of the polishing area F shown in FIG.
The wrapping tape 3 is continuously fed at a speed of 90 mm / min while the wrapping tape 3 is pressed by a roller rubber 24 forming the circumferential surface of the contact roller 4 with the wrapping tape 3 having a width of 75 mm and the contact roller 4. The wrapping tape 3 is made of WA # 800 (abrasive grain size 20 μm), and the roller rubber 24 is made of hard rubber having a rubber hardness of 90 °. The pressure adjusting screw block 20 for pressurizing the wrapping tape 3 tightens the pressure adjusting screw 21 by 10 mm to form the contact roller 4.
3.2 Kgf on each of the inner shaft end 41 and the outer shaft end 42 of the center shaft 40
Is under pressure.

The inner peripheral area A to the outer peripheral area B when polished for 30 minutes in this state
As shown in FIG. 10, the polishing amount decreased from the inner peripheral area A to the outer peripheral area B, and the plate thickness was not uniform in the polishing area F of the workpiece 1.

Further, the roughness became 1.0 μm in the maximum roughness (Rmax) in the inner peripheral area A and 0.5 μm in the outer peripheral area B, and became coarser from the outer peripheral area B toward the inner peripheral area A.

In addition, the mechanism for adjusting the processing force was a mechanism that adjusted the coil spring 22 with the contracted length, so that the pressure could not be changed continuously or intermittently while polishing, and the fine adjustment of the pressing force was not possible. Lapping tape (WA
# 2000, WA # 4000) and it was necessary to grind in three stages.

[Problems to be solved by the invention]

However, such a conventional tape polishing apparatus as described above cannot make the thickness and roughness uniform over the entire polishing region of the workpiece, and can continuously change the pressing force of the contact roller, Because it cannot be adjusted, it is not possible to obtain the required roughness without changing the lapping tape with a small degree of abrasiveness many times and performing the operations at each stage, so the process becomes complicated and it takes time and man-hours was there.

Further, since the table rotation speed is constant, the amount of polishing per unit time cannot be increased, so that there is a disadvantage that a workpiece with a large amount of polishing cannot be polished.

[Means for solving the problem]

The tape polishing apparatus of the present invention is a press mechanism that presses both ends of a shaft of a contact roller that presses an abrasive grain holding surface of a lapping tape on a rotating workpiece, and independently and continuously applies a pressing force. And a controllable tape pressure control mechanism.

Further, a control mechanism capable of controlling the table rotation speed in conjunction with the pressurizing mechanism is provided.

Further, in the tape polishing apparatus of the present invention, the contact roller for pressing the abrasive holding surface of the lapping tape against the rotating workpiece is constituted by a center shaft, a roller rubber, and a pressure adjusting valve, and the center shaft and the roller rubber Are arranged so that the distribution of the polishing amount of the workpiece can be controlled by varying the pressure in the space.

〔Example〕

Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a partially cutaway side sectional view showing a first embodiment of the present invention.

The tape polishing apparatus shown in FIG. 1 is characterized by a tape pressure control mechanism. The pressure control mechanism presses the abrasive holding surface of the lapping tape 3 against the rotating workpiece 1 fixed to the rotary table 2. Two sets of pressurized cylinders 51 and 52 connected to the contact roller 4 and the inner peripheral shaft end 41 and the outer peripheral shaft end 42 of the center shaft 40 of the contact roller 4, and compressed air is supplied to the pressurized cylinders 51 and 52. The compressors 61 and 62 for sending, the pressure sensors 71 and 72 for measuring the pressure of the inserted air, and the inner peripheral pressure signal c and the outer peripheral pressure signal d from the pressure sensors 71 and 72 are monitored to a preset pressure. Become compressor 6
The pressure controller 8 outputs an inner peripheral pressure control signal e for operating the first and second control valves 62 and an outer peripheral pressure control signal f.

Next, an example of polishing using the tape polishing apparatus shown in FIG. 1 will be described.

The workpiece 1 is fixed to the turntable 2 and rotated at 300 rpm, and the inner peripheral area A to the outer peripheral area B of the polishing area F shown in FIG.
The lapping tape 3 having a width of 75 mm was polished while being pressed by the contact roller 4. Wrapping tape 3 is WA
The feed rate was 90 mm / min with # 800 (abrasive grain size 20 μm).
The roller rubber of the contact roller 4 is made of hard rubber having a rubber hardness of 90 °. The pressing force at both ends of the center shaft 40 of the contact roller 4 is 4.8 kgf at the inner peripheral shaft end 41 and the outer peripheral shaft end 42 at the initial stage of polishing.
Is set to 7.2 kgf, the final stage of polishing is 0.32 kg at the inner peripheral shaft end 41
f, the pressure was set to 0.48 kgf at the outer peripheral shaft end 42, and the pressure controller 8 was set so that the pressing force changed linearly from the initial stage of polishing to the final stage of polishing in a polishing time of 30 minutes. At this time, the polishing amount from the inner peripheral region A to the outer peripheral region B is uniform as shown in FIG. 2, and the thickness distribution is to be within +1 μm in the polishing region F from the inner peripheral region A to the outer peripheral region B. Was completed. Further, the roughness was able to be set to Rmax0.1 μm for both the inner peripheral area A and the outer peripheral area B. Since the roughness can be controlled by the abrasiveness and the pressing force, the tape polishing apparatus of the present invention can control and finish the surface roughness over a wide range by one-step polishing.

In this embodiment, the pressurization is performed by air pressure, but a pressurizing mechanism using other pressurizing means such as a hydraulic pressure can be used.

FIG. 3 is a partially cutaway side sectional view showing a second embodiment of the present invention.

The tape polishing apparatus shown in FIG. 3 includes a rotation mechanism 9 for making the number of rotations of the turntable 2 variable in the tape polishing apparatus shown in FIG. 1, and controls the rotation mechanism 9 and the pressure mechanism in conjunction with each other. And a controller 10 that can be used. The controller 10 monitors the inner peripheral pressure signal c and the outer peripheral pressure signal d from the pressure sensors 71 and 72, and controls the number of revolutions to control the number of revolutions to a preset number of revolutions and pressure.
g, an inner pressure control signal e for operating the compressor 6 and an outer pressure control signal f.

In order to increase the amount of polishing per unit time, the number of rotations of the turntable 2 in the initial stage of polishing is increased, and in the final stage of polishing, the number of rotations of the turntable is reduced in order to make the roughness uniform. At that time, if the rotary table 2 is rotated at a high speed, the linear velocity is high, so that the abrasive grains of the wrapping tape 3 float and cannot be polished. Therefore, it is necessary to increase the pressing force at both ends of the center shaft 40 of the contact roller 4. If the number of rotations of the contact roller 4 is different, it is necessary to change the ratio of the pressing force at both ends of the center shaft 40 of the contact roller 4 in order to make the polishing amount from the inner peripheral area A to the outer peripheral area B uniform.

Next, an example of polishing using the tape polishing apparatus shown in FIG. 3 will be described.

The rotation speed of the turntable 2 is set to 1000 rpm in the initial stage of polishing, and to 300 rpm in the final stage of polishing. When the pressing force at both ends of the center shaft 40 of the contact roller 4 and the rotation speed of the rotary table 2 are polished under the conditions shown in FIG. 4, the polishing amount (FIG. 2) and the roughness are the same as those of the embodiment shown in FIG. Can be obtained in a short time.

In the above-described embodiment, the polishing length is made uniform. However, by changing the pressing force at both ends of the shaft of the contact roller 4 and the setting condition of the number of revolutions of the rotary table, the thickness of the workpiece and the thickness of the workpiece are changed. The roughness can be controlled freely.

In the embodiment shown in FIGS. 1 and 3 described above, the example using the contact roller shown in FIG. 9 has been described. However, if the contact and the wrapping tape become larger with an increase in the radius of the workpiece, slackening occurs. Cause a phenomenon.

For example, the workpiece is fixed on a rotary table and rotated at 300 rpm, and a width of 150 m covering an inner peripheral area to an outer peripheral area of the polishing area.
With the wrapping tape and contact roller of m, the wrapping tape is continuously fed at 90 mm / min while pressing the wrapping tape on the cylindrical surface of the contact roller, and the wrapping tape is used for the contact roller with WA # 800 (abrasive grain size 20μm). The rubber roller used is hard rubber with a rubber hardness of 90 mm.
A pressure of 2 kgf is applied to the end of the outer peripheral shaft at 7.2 kgf. 30 in this state
The amount of polishing from the inner peripheral region to the outer peripheral region at the time of partial polishing is smaller in the central portion than in the inner peripheral region and the outer peripheral region, and the plate thickness is not uniform in the polishing region of the workpiece.

Therefore, it is necessary to eliminate such a sagging phenomenon.

The contact roller shown in FIG. 5 is one example for eliminating the sagging phenomenon described above. The contact roller is constituted by a center shaft 40, a roller rubber 25 and a pressure regulating valve 27, and a space is provided between the center shaft 40 and the roller rubber 25. The pressure control valve 27 is used to change the pressure in the space 28 so that the shape of the pressing surface of the contact roller can be changed.

An example of polishing the contact roller shown in FIG. 5 using a tape polishing device will be described below.

The workpiece was fixed on a rotary table, rotated at 300 rpm, and polished while pressing a 150 mm wide wrapping tape covering the inner peripheral end to the outer peripheral end of the polishing area with a contact roller. Wrapping tape WA # 800 (Abrasive grain size 20μm)
At a feed rate of 90 mm / min. The roller rubber 35 of the contact roller is a hard rubber having a rubber thickness of 10 mm and a rubber hardness of 90 °. The pressure at both ends of the center axis of the contact roller is
Is set to 3.2 kgf and the outer peripheral end 42 is set to 7.2 kgf, and polishing is performed for 30 minutes. Under the above conditions, the air pressure in the space 28 is 0.8 kgf / cm ² , 1.0
Kgf / cm ^2, the polishing amount from the inner peripheral zone to the outer zone at a 1.2 kgf / cm ^2, the polishing of the inner peripheral zone pressure plate thickness distribution when a 1.0 Kgf / cm ² the space 28 to the outer circumferential region In the region, it could be within ± 1 μm.

Further, at 0.8 kgf / cm ^2, the polishing amount is smaller at the center than at both ends, and at 1.2 kgf / cm ² , the polishing amount is larger at the center than at both ends.

In other words, by varying the pressure in the space, it is possible to change the polishing amount of the workpiece from the ratio between the both ends and the center.

Although the example of pressurizing the space by air pressure was shown,
Pressurization by other pressures such as oil pressure is also possible.

Another example of a contact roller for eliminating such a slack phenomenon will be described below.

The contact roller shown in FIG. 6 includes a rubber layer 26 and a net-like steel layer 29. The net-like steel layer 29 suppresses a change in the diameter of the roller rubber 26 due to the internal pressure of the roller rubber 26, and allows fine control of the polishing amount in order to maintain uniformity in the entire diameter of the roller rubber 26.

Next, polishing using the contact roller shown in FIG. 6 will be described.

The pressing force at both ends of the center shaft 40 of the contact roller shown in FIG. 6 is set to 3.2 kgf at the inner peripheral shaft end 41 and 7.2 kgf at the outer peripheral shaft end 42, and polished for 30 minutes, and the air pressure in the space 28 is reduced to 1.5 kgf. / cm ²
By doing so, the thickness distribution can be kept within ± 1 μm in the polishing region from the inner peripheral region to the outer peripheral region.

Further, by increasing or decreasing the air pressure of the space 28 by 0.2 kgf / cm ² , the difference in the amount of polishing between both ends and the central part can be made 1 μm,
By increasing or decreasing the air pressure of the space 28 by 0.4 kgf / cm ² , the difference in the amount of polishing between both ends and the center can be made 2 μm.

That is, by making the pressure in the space variable, it is possible to control the amount of polishing at both ends and the center of the workpiece in units of 1 μm or less.

In the contact roller shown in FIG. 6, a net-like steel layer was used. However, if the contact roller is parallel to the axial direction of the contact roller, the same applies to a contact roller in which a hard material such as a steel plate or an acrylic plate is embedded in roller rubber. Can be obtained.

〔The invention's effect〕

The tape polishing apparatus of the present invention has an effect that uniform polishing can be performed by first having a mechanism for independently controlling the both ends of the shaft of the contact roller that presses the polishing tape.

Further, by controlling the table rotation speed and the pressurizing mechanism in conjunction with each other, there is an effect that it is possible to perform a polishing process for making the plate thickness and the roughness uniform in a short time.

Furthermore, by adding a means for preventing the deformation of the roller rubber of the contact roller, there is also an effect that the sagging phenomenon can be eliminated and the plate thickness can be made uniform.

[Brief description of the drawings]

FIG. 1 is a partially cutaway side sectional view showing a first embodiment of the present invention. FIG. 2 is a graph for explaining the amount of tape polishing when the embodiment shown in FIG. 1 is used. Is the second of the present invention.
FIG. 4 is a graph for explaining setting conditions in the embodiment shown in FIG. 3, and FIG. 5 is a sectional view of the contact roller shown in FIG. 1 and FIG. 2, FIG. 6 is a sectional view showing a third example of the contact roller shown in FIG. 1 and FIG. 2, FIG. FIG. 8 is a top view for explaining a polishing region in the conventional example shown in FIG. 7,
FIG. 9 is a sectional view showing details of the contact roller shown in FIG. 7, and FIG. 10 is a graph showing tape polishing when the embodiment shown in FIG. 7 is used. DESCRIPTION OF SYMBOLS 1 ... Workpiece, 2 ... Rotary table, 3 ... Wrapping tape, 4 ... Contact roller, 51, 52 ... Press cylinder, 61, 62 ... Compressor, 71, 72 ... Pressure sensor, 8 …… Pressure controller, 9… Rotation mechanism, 10 ……
Controller, 40 ... Center axis, 41 ... Inner shaft end, 42 ...
… Outer shaft end, 20… Pressure adjustment screw block, 30 …… Cylinder, 21 …… Pressure adjustment screw, 22 …… Coil spring, 23 ……
Support frame, 24, 25, 26… roller rubber, 27… pressure regulating valve,
28 …… space, 29 …… steel layer. F: polishing region, A: inner peripheral region, B: outer peripheral region. c ... inner pressure signal, d ... outer pressure signal, e ... inner pressure control signal, f ... outer pressure control signal, g ... rotation speed control signal, r ... radius, m ... polishing amount , P ... rotational speed,
t: polishing time, s: pressure.

Claims (4)

(57) [Claims] 1. A rotary table for fixing a workpiece, a contact roller for pressing an abrasive holding surface of a lapping tape against the workpiece, and one end and the other end of a shaft of the contact roller having independent sizes. And a pressurizing mechanism for pressurizing with a pressure of: 2. The tape polishing apparatus according to claim 1, further comprising a control mechanism for controlling said pressure mechanism. 3. A control mechanism according to claim 1, further comprising a control mechanism for independently and continuously controlling the pressing force of said pressing mechanism at one end and the other end of the shaft of said contact roller. Tape polishing equipment. 4. The tape polishing apparatus according to claim 1, further comprising a control mechanism for controlling the rotation speed of said rotary table and said pressurizing mechanism in conjunction with each other.