JP2919425B2 - Ink jet head and method of manufacturing the same - Google Patents
Ink jet head and method of manufacturing the sameInfo
- Publication number
- JP2919425B2 JP2919425B2 JP9048944A JP4894497A JP2919425B2 JP 2919425 B2 JP2919425 B2 JP 2919425B2 JP 9048944 A JP9048944 A JP 9048944A JP 4894497 A JP4894497 A JP 4894497A JP 2919425 B2 JP2919425 B2 JP 2919425B2
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- conductive thin
- ink jet
- jet head
- resist mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title description 8
- 239000010409 thin film Substances 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 13
- 238000005192 partition Methods 0.000 claims description 6
- 229920002120 photoresistant polymer Polymers 0.000 claims description 6
- 238000004544 sputter deposition Methods 0.000 claims description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 4
- 239000001301 oxygen Substances 0.000 claims description 4
- 229910052760 oxygen Inorganic materials 0.000 claims description 4
- 238000000151 deposition Methods 0.000 claims description 3
- 238000001312 dry etching Methods 0.000 claims description 3
- 238000009832 plasma treatment Methods 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 238000007740 vapor deposition Methods 0.000 claims description 3
- 238000001039 wet etching Methods 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 2
- 239000010408 film Substances 0.000 description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920000052 poly(p-xylylene) Polymers 0.000 description 1
- 239000012487 rinsing solution Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/10—Finger type piezoelectric elements
Landscapes
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明はインクジェットヘッ
ド及びその製造方法、特に、圧電駆動式のインクジェッ
トヘッド及びその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ink jet head and a method of manufacturing the same, and more particularly, to a piezoelectrically driven ink jet head and a method of manufacturing the same.
【０００２】[0002]
【従来の技術】従来のインクジェットヘッド及びその製
造方法について図面を参照して詳細に説明する。2. Description of the Related Art A conventional ink jet head and a method of manufacturing the same will be described in detail with reference to the drawings.
【０００３】図３は、従来の一例を示す断面図である。
図３に示すインクジェットヘッドは、貫通したインク流
路２４を有する圧電性基板２１の溝２４ａ内部に電極膜
１０を形成し、その上に順次パリレン膜１２，酸化シリ
コン膜１４を堆積後、酸化シリコン膜１４の表面を酸素
を含むガス雰囲気中でイオンボンバードする。（例え
ば、特開平６−２８６１５０号公報参照）ダイヤモンド
ブレードカッタにより微細溝加工を施した圧電性基板２
１に、スパッタリング法によって下層をクロム、上層を
金とする電極膜を形成する。溝の代表的な寸法は、幅１
００ミクロン、深さ４００ミクロン、長さ１０ミリメー
トルである。この圧電性基板２１の表面を研磨すること
によって電極膜１０を残す。FIG. 3 is a sectional view showing an example of the related art.
In the ink jet head shown in FIG. 3, an electrode film 10 is formed inside a groove 24a of a piezoelectric substrate 21 having a penetrated ink flow path 24, and a parylene film 12 and a silicon oxide film 14 are sequentially deposited thereon. The surface of the film 14 is ion bombarded in a gas atmosphere containing oxygen. (See, for example, Japanese Patent Application Laid-Open No. 6-286150) Piezoelectric substrate 2 that has been subjected to fine groove processing by a diamond blade cutter
First, an electrode film having a lower layer of chromium and an upper layer of gold is formed by a sputtering method. Typical dimensions of the groove are width 1
00 microns, 400 microns deep, 10 millimeters long. The electrode film 10 is left by polishing the surface of the piezoelectric substrate 21.
【０００４】図４は図３の一使用例を示す斜視図であ
る。圧電性基板２１に厚さ約１ミリメートルのガラス蓋
２２を接着することによって、インク流路２４ｂが形成
される。そして表面にテフロン膜をコーテイングしたニ
ッケル製のノズル板２３をインク流路２４ｂ端部に接着
し、電極膜１０を駆動回路に接続することによって、イ
ンクジェットプリンターヘッドが構成される。FIG. 4 is a perspective view showing an example of use of FIG. By bonding a glass lid 22 having a thickness of about 1 mm to the piezoelectric substrate 21, an ink flow path 24b is formed. Then, a nozzle plate 23 made of nickel having a surface coated with a Teflon film is adhered to the end of the ink flow path 24b, and the electrode film 10 is connected to a drive circuit, thereby forming an ink jet printer head.
【０００５】[0005]
【発明が解決しようとする課題】上述した従来のインク
ジェットヘッド及びその製造方法は、隔壁の上表面の不
用な導電性薄膜を研磨加工により除去するため、導電性
薄膜のバリが発生し、後工程で平板を隔壁上面に接着す
る際に隙間が生じ、駆動時にインク流路内部に適切な圧
力が発生せず、インク滴速の低下やインク滴の吐出周波
数の低下という問題がある。さらに、導電性薄膜を保護
するための絶縁膜も、バリにより被覆性が低下し、導電
性薄膜に電圧を印加すると電流がリークするという欠点
があった。In the above-described conventional ink jet head and the method of manufacturing the same, the unnecessary conductive thin film on the upper surface of the partition is removed by polishing, so that burrs of the conductive thin film are generated and the post-process is performed. Therefore, a gap is generated when the flat plate is adhered to the upper surface of the partition wall, so that an appropriate pressure is not generated inside the ink flow path during driving, which causes a problem that the ink droplet speed decreases and the ink droplet ejection frequency decreases. Further, the insulating film for protecting the conductive thin film also has a disadvantage that the coating property is reduced due to burrs, and a current leaks when a voltage is applied to the conductive thin film.
【０００６】[0006]
【課題を解決するための手段】第１の発明のインクジェ
ットヘッド製造方法は、予じめ溝を設けた圧電セラミッ
ク基板に導電性薄膜を蒸着，スバッタリングまたはメッ
キ等により成膜する工程と、前記導電性薄膜の上にフォ
トレジストを塗布する工程と、所定のパターンのフォト
マスクを介して露光，現像させて隔壁上面が露出するレ
ジストマスクを形成する工程と、ウエットエッチンクま
たはドライエッチングにより前記導電性薄膜の露出部分
を除去し、駆動電極を形成する工程と、前記レジストマ
スクを剥離液または酸素プラズマ処理等により剥離する
工程と、を含んで構成される。According to a first aspect of the present invention, there is provided a method of manufacturing an ink jet head, comprising the steps of: depositing a conductive thin film on a piezoelectric ceramic substrate provided with advance grooves by vapor deposition, sputtering or plating; A step of applying a photoresist on the conductive thin film, a step of exposing and developing through a photomask of a predetermined pattern to form a resist mask in which the upper surface of the partition is exposed, and a step of performing wet etching or dry etching. The method includes a step of forming a drive electrode by removing an exposed portion of the conductive thin film, and a step of stripping the resist mask by a stripping solution or an oxygen plasma treatment.
【０００７】[0007]
【０００８】[0008]
【０００９】[0009]
【発明の実施の形態】次に、本発明について図面を参照
して詳細に説明する。Next, the present invention will be described in detail with reference to the drawings.
【００１０】図１（ａ）〜（ｅ）は本発明の第１の実施
形態を工程順に説明するための断面図である。図１に示
すインクジェットヘッドの製造方法は、予じめ溝６を設
けた圧電セラミック基板１に導電性薄膜２を蒸着，スパ
ッタリングまたはメッキ等により成膜する工程（図１
（ａ））と、導電性薄膜２の上にフォトレジスト４を塗
布する工程（図１（ｂ））と、所定のパターンのフォト
マスクを介して露光，現像させて隔壁上面が露出するレ
ジストマスク５を形成する工程（図１（ｃ））と、ウエ
ットエッチンクまたはドライエッチングにより導電性薄
膜２の露出部分を除去し、駆動電極３を形成する工程
（図１（ｄ））と、レジストマスク５を剥離液または酸
素プラズマ処理等により剥離する工程（図１（ｅ））
と、を含んで構成される。FIGS. 1A to 1E are cross-sectional views for explaining a first embodiment of the present invention in the order of steps. In the method of manufacturing the ink jet head shown in FIG. 1, a step of depositing a conductive thin film 2 on a piezoelectric ceramic substrate 1 provided with a groove 6 in advance by vapor deposition, sputtering or plating (FIG. 1)
(A)), a step of applying a photoresist 4 on the conductive thin film 2 (FIG. 1 (b)), and a resist mask that exposes and develops through a photomask of a predetermined pattern to expose the upper surface of the partition wall 5 (FIG. 1C), a step of removing the exposed portion of the conductive thin film 2 by wet etching or dry etching to form the drive electrode 3 (FIG. 1D), and a resist mask Step of stripping 5 by stripping liquid or oxygen plasma treatment (FIG. 1 (e))
And is comprised.
【００１１】図１（ａ）において、幅６０μｍの溝６を
設けた厚さ１ｍｍのＰＺＤ基板の表面に２μｍのアルミ
ニウム薄膜をスパッタリング装置で成膜する。In FIG. 1A, a 2 μm aluminum thin film is formed on a surface of a 1 mm thick PZD substrate provided with a groove 6 having a width of 60 μm by a sputtering apparatus.
【００１２】図１（ｂ）において、基板表面に２５０ｃ
ｐのフォトレジスト４（商品名ＯＭＲ８３）を回転数７
００ｒｐｍで２０秒間スピン塗布し、１２０℃のオーブ
ンで１時間ベークする。In FIG. 1 (b), 250 c
p photoresist 4 (trade name: OMR83) at rotation speed 7
Spin at 00 rpm for 20 seconds and bake in oven at 120 ° C. for 1 hour.
【００１３】図１（ｃ）において、隔壁上部が暗パター
ンのフォトマスクで５００ｍＪ／ｃｍ２の紫外線で露光
し、指定の現像液，リンス液で現像し、レジストマスク
５を形成する。In FIG. 1C, the upper part of the partition is exposed to ultraviolet light of 500 mJ / cm 2 using a photomask having a dark pattern, and is developed with a specified developing solution and rinsing solution to form a resist mask 5.
【００１４】図１（ｄ）において、基板を燐酸，酢酸，
硝酸，水を１６，２，１，１の容量比で混合した液に１
２分間浸漬することにより、露出したアルミニウムをエ
ッチングする。In FIG. 1D, the substrate is made of phosphoric acid, acetic acid,
Nitric acid and water are mixed at a volume ratio of 16,2,1,1 to 1
The exposed aluminum is etched by immersion for 2 minutes.
【００１５】図１（ｅ）において、基板を１００℃に加
熱したクリーンストップＨＰ（商品名）に１０分間浸漬
後、ストリップリンス（商品名）、２−プロパノールで
洗浄し、レジストマスク５を剥離することにより駆動電
極３が形成される。In FIG. 1E, the substrate is immersed in a clean stop HP (trade name) heated to 100 ° C. for 10 minutes, washed with strip rinse (trade name) and 2-propanol, and the resist mask 5 is peeled off. Thereby, the drive electrode 3 is formed.
【００１６】図２（ａ）〜（ｅ）は本発明の第１の実施
形態を工程順に説明するための断面図である。図２
（ａ）〜（ｅ）に示すインクジェットヘッドの製造方法
は、図２（ａ）において、厚さ１ｍｍのＰＺＴ基板の表
面にフォトレジスト４（商品名ＰＭＥＲ Ｐ−ＡＲ９０
００）を回転数７５０ｒｐｍで２０秒間スピン塗布し、
１１０℃のホットプレートで５分間ベークする。FIGS. 2A to 2E are sectional views for explaining the first embodiment of the present invention in the order of steps. FIG.
In the method of manufacturing the ink jet head shown in FIGS. 2A to 2E, a photoresist 4 (trade name: PMER P-AR90) is formed on the surface of a PZT substrate having a thickness of 1 mm in FIG.
00) at 750 rpm for 20 seconds.
Bake on a hot plate at 110 ° C. for 5 minutes.
【００１７】図２（ｂ）において、フォトマスクを介し
て４５０ｍＪ／ｃｍ２の紫外線で露光し、所望のパター
ンのレジストマスク５を形成する。Referring to FIG. 2B, the resist mask 5 having a desired pattern is formed by exposing to ultraviolet light of 450 mJ / cm 2 through a photomask.
【００１８】図２（ｃ）において、基板１の表面に幅６
０μｍの溝６を形成する。In FIG. 2C, the surface of the substrate 1 has a width of 6 mm.
A groove 6 of 0 μm is formed.
【００１９】図２（ｄ）において、レジストマスク５お
よび溝６の内部に２μｍのアルミニウム薄膜をスパッタ
リング装置で成膜する。In FIG. 2D, a 2 μm aluminum thin film is formed inside the resist mask 5 and the groove 6 by a sputtering device.
【００２０】図２（ｄ）において、超音波を付加したア
セトン槽に１０分間浸漬し、レジストマスク５とその上
部のアルミニウム薄膜を剥離し駆動電極３を形成する。In FIG. 2D, the resist mask 5 and the aluminum thin film on the resist mask 5 are peeled off to form a drive electrode 3 by immersion in an acetone bath to which ultrasonic waves have been applied.
【００２１】[0021]
【発明の効果】本発明のインクジェットヘッドは、駆動
電極をフォトリソグラフイーにより形成するので、バリ
の発生が防止できるため、基板とトッププレートまたは
ノズルプレートとの接着性および絶縁膜の被覆性が向上
できるという効果がある。According to the ink jet head of the present invention, since the drive electrodes are formed by photolithography, the occurrence of burrs can be prevented, so that the adhesion between the substrate and the top plate or the nozzle plate and the covering property of the insulating film are improved. There is an effect that can be.
【図１】（ａ）〜（ｅ）は本発明の第１の実施形態を工
程順に説明するための断面図である。FIGS. 1A to 1E are cross-sectional views for explaining a first embodiment of the present invention in the order of steps.
【図２】（ａ）〜（ｅ）は本発明の第２の実施形態を工
程順に説明するための断面図である。FIGS. 2A to 2E are cross-sectional views for explaining a second embodiment of the present invention in the order of steps.
【図３】従来の一例を示す断面図である。FIG. 3 is a cross-sectional view showing an example of the related art.
【図４】図３の一使用例を示す斜視図である。FIG. 4 is a perspective view showing one usage example of FIG. 3;
１ 圧電セラミック基板 ２ 導電性薄膜 ３ 駆動電極 ４ フォトレジスト ５ レジストマスク ６ 溝 DESCRIPTION OF SYMBOLS 1 Piezoelectric ceramic board 2 Conductive thin film 3 Drive electrode 4 Photoresist 5 Resist mask 6 Groove
Claims (1)
電性薄膜を蒸着，スバッタリングまたはメッキ等により
成膜する工程と、 前記導電性薄膜の上にフォトレジストを塗布する工程
と、 所定のパターンのフォトマスクを介して露光，現像させ
て隔壁上面が露出するレジストマスクを形成する工程
と、 ウエットエッチンクまたはドライエッチングにより前記
導電性薄膜の露出部分を除去し、駆動電極を形成する工
程と、 前記レジストマスクを剥離液または酸素プラズマ処理等
により剥離する工程と、 を含むことを特徴とするインクジェットヘッド製造方
法。A step of depositing a conductive thin film on a piezoelectric ceramic substrate provided with a preliminary groove by vapor deposition, sputtering, plating, or the like; and a step of applying a photoresist on the conductive thin film. Exposing and developing through a photomask of a predetermined pattern to form a resist mask exposing the upper surface of the partition wall, and removing the exposed portion of the conductive thin film by wet etching or dry etching to form a drive electrode. And a step of stripping the resist mask by a stripping liquid or an oxygen plasma treatment or the like.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9048944A JP2919425B2 (en) | 1997-03-04 | 1997-03-04 | Ink jet head and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9048944A JP2919425B2 (en) | 1997-03-04 | 1997-03-04 | Ink jet head and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10244668A JPH10244668A (en) | 1998-09-14 |
| JP2919425B2 true JP2919425B2 (en) | 1999-07-12 |
Family
ID=12817396
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9048944A Expired - Fee Related JP2919425B2 (en) | 1997-03-04 | 1997-03-04 | Ink jet head and method of manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2919425B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4473532B2 (en) * | 2002-10-10 | 2010-06-02 | 日本碍子株式会社 | Piezoelectric / electrostrictive device and manufacturing method |
| JP6573825B2 (en) | 2015-11-27 | 2019-09-11 | エスアイアイ・プリンテック株式会社 | Liquid ejecting head and liquid ejecting apparatus |
-
1997
- 1997-03-04 JP JP9048944A patent/JP2919425B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH10244668A (en) | 1998-09-14 |
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