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JP2925332B2 - Quality control method in semiconductor manufacturing - Google Patents
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JP2925332B2 - Quality control method in semiconductor manufacturing - Google Patents

Quality control method in semiconductor manufacturing

Info

Publication number
JP2925332B2
JP2925332B2 JP40039390A JP40039390A JP2925332B2 JP 2925332 B2 JP2925332 B2 JP 2925332B2 JP 40039390 A JP40039390 A JP 40039390A JP 40039390 A JP40039390 A JP 40039390A JP 2925332 B2 JP2925332 B2 JP 2925332B2
Authority
JP
Japan
Prior art keywords
semiconductor
information
manufacturing
quality control
product
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP40039390A
Other languages
Japanese (ja)
Other versions
JPH0653104A (en
Inventor
達郎 刀▲る▼館
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP40039390A priority Critical patent/JP2925332B2/en
Publication of JPH0653104A publication Critical patent/JPH0653104A/en
Application granted granted Critical
Publication of JP2925332B2 publication Critical patent/JP2925332B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/30Computing systems specially adapted for manufacturing

Landscapes

  • General Factory Administration (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、半導体製造における品
質管理方法に関するもので、特に品質トラブル時や、製
品の製造履歴の調査を目的として使用されるものであ
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a quality control method in the manufacture of semiconductors, and more particularly to a quality control method used for the purpose of investigating a manufacturing history of a product at the time of quality trouble.

【0002】[0002]

【従来の技術】従来、半導体製造に際しては、ロット毎
にトラベルシ−トを付加し、そのトラベルシ−トに工程
毎の製造条件、使用した装置、部材名、部材ロット番号
等を記入していた。また、全工程の終了時に、そのトラ
ベルシ−トを保管しておき、トラブル発生時には、人手
によって膨大な量のトラベルシ−トの中から該当する情
報を探しだし、かかるトラブルに対応していた。
2. Description of the Related Art Conventionally, when manufacturing semiconductors, a travel sheet is added for each lot, and the manufacturing conditions for each process, the equipment used, the name of the member, the member lot number, and the like are written on the travel sheet. Was. Also, at the end of all the processes, the travel sheet was stored, and when a trouble occurred, the corresponding information was searched manually from an enormous amount of travel sheets to deal with such trouble. .

【0003】しかしながら、人手によって、膨大な量の
トラベルシ−トの中から該当する情報を探しだしていた
ため、必要とする情報を迅速に取り出すことが不可能で
あり、又、取り出せたとしても情報に漏れがあることが
多く、トラブルの根源を正確に把握することができなか
った。
[0003] However, since the corresponding information is searched out from a huge amount of travel sheets by hand, it is impossible to quickly retrieve the necessary information. There were many leaks, and the source of the trouble could not be accurately grasped.

【0004】[0004]

【発明が解決しようとする課題】このように、従来は、
半導体製造における品質管理にトラベルシ−トを用いて
いたため、トラブル発生時には、人手によって膨大な量
のトラベルシ−トの中から該当する情報を探しだす必要
があり、このため迅速性や正確性に欠けるという欠点が
あった。
As described above, conventionally,
Since travel sheets are used for quality control in semiconductor manufacturing, when trouble occurs, it is necessary to manually search for the corresponding information from a vast amount of travel sheets, which results in speed and accuracy. There was a disadvantage of lacking.

【0005】本発明は、上記欠点を解決すべくなされた
ものであり、必要な情報を必要なときに迅速かつ正確に
得ることが可能な半導体製造における品質管理方法を提
供することを目的とする。
SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned drawbacks, and has as its object to provide a quality control method in semiconductor manufacturing capable of obtaining necessary information quickly and accurately when required. .

【0006】[0006]

【課題を解決するための手段】上記目的を達成するため
に、本発明の半導体製造における品質管理方法は、半導
体製品の製造に関して、前記半導体製品の製品名及び前
記半導体製品の各製造工程で使用する各製造装置の処理
条件を含む前記半導体製品に関する情報を逐次蓄積して
おき、完成した前記半導体製品にトラブルが発生したと
きに、前記半導体製品に関する情報のうち特定の情報か
ら前記半導体製品に関する情報を検索し、前記トラブル
の原因を究明するというものである。
In order to achieve the above-mentioned object, a quality control method in semiconductor manufacturing according to the present invention is disclosed.
For the manufacture of integrated products, the product name and
Processing of each manufacturing equipment used in each manufacturing process of semiconductor products
Accumulate information on the semiconductor products including conditions
When trouble occurs in the completed semiconductor product
The information on the semiconductor product
Information about the semiconductor product
Is to determine the cause.

【0007】[0007]

【作用】上記の品質管理方法によれば、半導体製造の各
工程において使用する各設備での様々な情報、例えば
製品名、処理条件部材名等を逐次ホストコンピュー
タに記録するようにしている。このため、完成した製品
にトラブルが発生したとき等においても、必要な情報を
迅速かつ正確に検索することが可能となる。
According to the above-described quality control method , various information in each facility used in each process of semiconductor manufacturing, for example ,
Product name, process conditions, the member name, etc., are to be sequentially recorded in the host computer. Therefore, even when a trouble occurs in a completed product, it is possible to quickly and accurately search for necessary information.

【0008】[0008]

【実施例】以下、図面を参照しながら本発明の一実施例
について詳細に説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below in detail with reference to the drawings.

【0009】図1は、本発明の一実施例に係わる半導体
製造における品質管理システムの基本構成図を示してい
る。図1において、111〜119は、半導体装置の製
造におけるペレット製造から組立までの各工程で使用す
る製造装置である。製造装置118,119は、ブロッ
クコンピュ−タ121に連結されている。また、製造装
置111〜117は、互いにロ−カルエリアネットワ−
ク131により連結されると共に、ブロックコンピュ−
タ122に連結されている。ブロックコンピュ−タ12
1,122…は、製造装置111〜119での製造にお
ける処理条件、部材情報等の管理を行うものである。さ
らに、ブロックコンピュ−タ121,122…は、ネッ
トワ−クシステム132を介して本システムの主機能を
受け持つホストコンピュ−タ14に有機的に連結されて
いる。このホストコンピュ−タ14は、製造単位(ロッ
ト)毎に、下記に示すような情報を、逐次、製造装置1
11〜119からブロックコンピュ−タ121,122
…を介して収集できる機能を有している。 (a) 各工程,各製造装置における処理条件(製品名とロ
ット番号を含む) (b) 各工程において用いられた部材名及び部材ロット番
号 (c) 各工程の通過日時 なお、ホストコンピュ−タ14内の記憶部における情報
蓄積に際しては、例えば図2に示すようなフォ−マット
を使用することができる。
FIG. 1 shows a basic configuration diagram of a quality control system in semiconductor manufacturing according to one embodiment of the present invention. In FIG. 1, reference numerals 111 to 119 denote manufacturing apparatuses used in each step from the manufacture of pellets to the assembly in the manufacture of semiconductor devices. The manufacturing apparatuses 118 and 119 are connected to the block computer 121. The manufacturing apparatuses 111 to 117 are mutually connected to a local area network.
Connected by the block 131 and the block computer
Connected to the terminal 122. Block computer 12
1, 122... Manage processing conditions, member information, and the like in manufacturing by the manufacturing apparatuses 111 to 119. Are organically connected via a network system 132 to a host computer 14 which is responsible for the main functions of the present system. The host computer 14 sequentially transmits the following information for each manufacturing unit (lot),
11 to 119 to block computers 121 and 122
Has a function that can be collected via. (a) Processing conditions (including product name and lot number) in each process and each manufacturing equipment (b) Material name and material lot number used in each process (c) Date and time of passage in each process Host computer When information is stored in the storage unit 14, for example, a format as shown in FIG. 2 can be used.

【0010】また、ホストコンピュ−タ14には、ネッ
トワ−クシステム132を介して所定の端末15が連結
されている。端末15では、所定の情報に基づいて、任
意の情報、例えば製品名、ロット番号、部材名、部材ロ
ット番号等を必要に応じてホストコンピュ−タ14の記
憶部から検索可能となっている。つまり、端末15で
は、ある所定の情報に関連する任意の情報の引き出し
や、参照を行うことができるようになっている。
A predetermined terminal 15 is connected to the host computer 14 via a network system 132. In the terminal 15, based on predetermined information, arbitrary information such as a product name, a lot number, a member name, a member lot number, and the like can be searched from the storage unit of the host computer 14 as necessary. That is, the terminal 15 can extract or refer to arbitrary information related to certain predetermined information.

【0011】このような構成によれば、従来、ロット毎
にトラベルシ−トを付加し製品を流していた場合と比較
し、ホストコンピュ−タ14がそのような管理を行うた
め、トラブル発生時にも迅速かつ正確に必要な情報を得
ることが可能となった。
According to such a configuration, the host computer 14 performs such management as compared with the case where a travel sheet is added to each lot and products are conventionally flown. It has become possible to quickly and accurately obtain necessary information.

【0012】なお、ホストコンピュ−タ14に管理され
ている様々な情報は、所定の情報(例えば工程Nの部材
名)をキ−として検索され、又、当該様々な情報は全て
ホストコンピュ−タ14から出力される。一方で、ブロ
ックコンピュ−タ121,122…に、ホストコンピュ
−タ14の機能をロ−カル的に持たせても構わない。さ
らに、当該機能は、ホストコンピュ−タの端末15以外
の例えばブロックコンピュ−タ12からでも検索可能で
あっても良い。
Incidentally, various information managed by the host computer 14 is searched using predetermined information (for example, the member name of the process N) as a key, and all of the various information is retrieved from the host computer. 14 is output. On the other hand, the block computers 121, 122,... May locally have the function of the host computer 14. Furthermore, the function may be retrievable from, for example, the block computer 12 other than the terminal 15 of the host computer.

【0013】[0013]

【発明の効果】以上、説明したように、本発明の半導体
製造における品質管理方法によれば、次のような効果を
奏する。
As described above, according to the quality control method in semiconductor manufacturing of the present invention, the following effects can be obtained.

【0014】半導体製造時の各工程における処理条件や
部材情報等を逐次ホストコンピュ−タに記録しているた
め、製品にトラブルが発生したとき等に、必要な情報が
迅速に検索可能である。従って、トラブル発生の原因追
及及びその対策を迅速かつ正確に行うことができる。
Since the processing conditions and member information in each step of semiconductor manufacturing are sequentially recorded in the host computer, necessary information can be quickly retrieved when a trouble occurs in the product. Therefore, the cause of the occurrence of the trouble and the countermeasure can be quickly and accurately performed.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の半導体製造における品質管理方法が適
用されるシステムの基本構成を示すブロック図。
FIG. 1 is a diagram illustrating a quality control method according to the present invention;
FIG. 1 is a block diagram showing a basic configuration of a system used .

【図2】図1のホストコンピュ−タ内での情報蓄積に際
し使用するフォ−マットの一例を示す図。
FIG. 2 is a view showing an example of a format used for storing information in the host computer of FIG. 1;

【符号の説明】[Explanation of symbols]

111〜119…製造装置、121〜123…ブロック
コンピュ−タ、131…ロ−カルエリアネットワ−ク、
132…ネットワ−クシステム、14…ホストコンピュ
−タ、15…端末。
111 to 119: manufacturing apparatus, 121 to 123: block computer, 131: local area network,
132: Network system, 14: Host computer, 15: Terminal.

Claims (4)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 半導体製品の製造に関して、前記半導体
製品の製品名及び前記半導体製品の各製造工程で使用す
る各製造装置の処理条件を含む前記半導体製品に関する
情報を逐次蓄積しておき、完成した前記半導体製品にト
ラブルが発生したときに、前記半導体製品に関する情報
のうち特定の情報から前記半導体製品に関する情報を検
索し、前記トラブルの原因を究明することを特徴とする
半導体製造における品質管理方法。
1. The method of manufacturing a semiconductor product, comprising:
The product name of the product and the
The semiconductor product including the processing conditions of each manufacturing apparatus.
Information is stored sequentially, and the completed semiconductor products
Information about the semiconductor product when a problem occurs
Information on the semiconductor products from specific information
Searching for the cause of the trouble
Quality control method in semiconductor manufacturing.
【請求項2】 前記半導体製品に関する情報は、各製造
装置を管理する少なくとも1つのブロックコンピュータ
又は前記少なくとも1つのブロックコンピュータにネッ
トワークを介して接続されるホストコンピュータに蓄積
され、前記ネットワークに接続される端末により検索さ
れることを特徴とする請求項1記載の半導体製造におけ
る品質管理方法。
2. The information on the semiconductor product is provided in each manufacturing
At least one block computer for managing the device
Or a network connection to the at least one block computer.
Stored on a host computer connected via a network
And searched by a terminal connected to the network.
2. The semiconductor manufacturing method according to claim 1, wherein
Quality control methods.
【請求項3】 前記特定の情報は、各製造工程における
部材名であることを特徴とする請求項1又は2記載の半
導体製造における品質管理方法。
3. The method according to claim 1, wherein the specific information is used in each manufacturing process.
3. The half according to claim 1, wherein the name is a member name.
Quality control method in conductor production.
【請求項4】 前記半導体製品に関する情報は、前記半
導体製品のロット番号及び各製造工程における部材名及
び部材ロット番号を含んでいることを特徴とする請求項
1又は2記載の半導体製造における品質管理方法。
4. The information on the semiconductor product is stored in the semiconductor device.
Lot number of conductor products, name of parts in each manufacturing process and
And a component lot number.
3. The quality control method in semiconductor manufacturing according to 1 or 2.
JP40039390A 1990-12-04 1990-12-04 Quality control method in semiconductor manufacturing Expired - Lifetime JP2925332B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP40039390A JP2925332B2 (en) 1990-12-04 1990-12-04 Quality control method in semiconductor manufacturing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP40039390A JP2925332B2 (en) 1990-12-04 1990-12-04 Quality control method in semiconductor manufacturing

Publications (2)

Publication Number Publication Date
JPH0653104A JPH0653104A (en) 1994-02-25
JP2925332B2 true JP2925332B2 (en) 1999-07-28

Family

ID=18510307

Family Applications (1)

Application Number Title Priority Date Filing Date
JP40039390A Expired - Lifetime JP2925332B2 (en) 1990-12-04 1990-12-04 Quality control method in semiconductor manufacturing

Country Status (1)

Country Link
JP (1) JP2925332B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020187478A (en) * 2019-05-13 2020-11-19 株式会社日立製作所 Quality control equipment, quality control methods and quality control programs

Also Published As

Publication number Publication date
JPH0653104A (en) 1994-02-25

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