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JP2927208B2 - Storage structure of memory IC substrate for electronic equipment - Google Patents
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JP2927208B2 - Storage structure of memory IC substrate for electronic equipment - Google Patents

Storage structure of memory IC substrate for electronic equipment

Info

Publication number
JP2927208B2
JP2927208B2 JP7145226A JP14522695A JP2927208B2 JP 2927208 B2 JP2927208 B2 JP 2927208B2 JP 7145226 A JP7145226 A JP 7145226A JP 14522695 A JP14522695 A JP 14522695A JP 2927208 B2 JP2927208 B2 JP 2927208B2
Authority
JP
Japan
Prior art keywords
memory
substrate
rom
board
lid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP7145226A
Other languages
Japanese (ja)
Other versions
JPH08316666A (en
Inventor
哲也 宮武
清治 吉田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PATO RAITO KK
Original Assignee
PATO RAITO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PATO RAITO KK filed Critical PATO RAITO KK
Priority to JP7145226A priority Critical patent/JP2927208B2/en
Publication of JPH08316666A publication Critical patent/JPH08316666A/en
Application granted granted Critical
Publication of JP2927208B2 publication Critical patent/JP2927208B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Credit Cards Or The Like (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、電子機器のメモリIC
基板収納構造に関し、より詳しくはメモリICを交換す
る際にメモリIC基板を電子機器に着脱するための電子
機器のメモリIC基板収納構造に関する。電子機器とし
ては、音声合成報知器、電子音報知器、文字表示器等が
あり、ROM、RAM等のメモリICを内蔵し、各種信
号を音声や文字、図形等で表示するものである。以下で
は、電子機器の例として音声合成報知器を用い、メモリ
IC基板、メモリICの例としてROM基板、ROMを
用いて、具体的構成を説明する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a memory IC for electronic equipment.
More particularly, the present invention relates to a memory IC board storage structure of an electronic device for attaching and detaching a memory IC substrate to and from an electronic device when replacing a memory IC. The electronic apparatus, speech synthesizer alarm, electronic sound alarm, there is a character display or the like, in which a built-ROM, and a memory IC such as a RAM, and displays various signals voice and text, in figures, and the like. Hereinafter, a specific configuration will be described using a speech synthesis alarm as an example of an electronic device, a ROM board and a ROM as an example of a memory IC board, and a memory IC.

【0002】[0002]

【従来の技術】音声合成報知器は、例えば自動機械機
器、ロボット、生産ライン、駐車場等に適宜設置して、
部品の不足、危険表示、注意喚起等の信号を音声で報知
し、作業員等利用者の安全保持や自動機械機器等のメン
テナンス用として利用される。
2. Description of the Related Art Speech synthesis alarms are appropriately installed in, for example, automatic machinery, robots, production lines, parking lots, and the like.
Signals such as parts shortage, danger display, alert, etc. are notified by voice, and are used for maintaining the safety of users such as workers and for maintenance of automatic machinery and the like.

【0003】音声合成報知器は、音声メッセージを格納
したROMを内蔵している。ROMは通常、基板に装着
されているため、音声合成報知器の使用者は、ROMの
老朽化の他、ある音声メッセージを格納したROMを他
の音声メッセージのROMに取り替えたい場合等に、R
OMが装着された基板を音声合成報知器に着脱する必要
性が生じる。
[0003] The voice synthesis alarm has a built-in ROM that stores voice messages. Since the ROM is usually mounted on the board, the user of the voice synthesizing annunciator may be required to replace the ROM storing a certain voice message with the ROM of another voice message in addition to the aging of the ROM.
A need arises for attaching and detaching the board on which the OM is mounted to and from the speech synthesis alarm.

【0004】まず、従来、音声合成報知器の箱体そのも
のを分解して、ROM基板を音声合成報知器に着脱する
方法があった。
[0004] First, there has conventionally been a method of disassembling the box itself of the speech synthesis alarm and attaching and detaching the ROM board to and from the speech synthesis alarm.

【0005】ところが、この方法は、音声合成報知器の
箱体そのものを分解しなければならないためROM基板
の着脱に時間がかかり、音声合成報知器の箱体を破損し
やすかった。また、この方法は、音声合成報知器の設置
場所によっては、音声合成報知器を自動機械機器等の設
置場所から取り外さなければならない不便があった。
However, in this method, it is necessary to disassemble the box itself of the speech synthesis alarm, so it takes time to attach and detach the ROM board, and the box of the speech synthesis alarm is easily damaged. In addition, this method has the inconvenience that the voice synthesis alarm must be removed from the installation site of the automatic mechanical device or the like depending on the installation location of the voice synthesis alarm.

【0006】そこで、図6に示す第1の従来例は、RO
Mが組み込まれたROMボックス62を音声合成報知器
61の箱体に設けた開口部63に挿入し、開口部63の
奥底の壁部に設けた雌コネクタ64に組み付ける構成を
採用する。この構成により、ROMボックス62を開口
部63から取り出し、さらにROM基板をROMボック
ス62から取り出すことにより、ROMを交換すること
ができる。
Therefore, the first conventional example shown in FIG.
A configuration is adopted in which a ROM box 62 in which M is incorporated is inserted into an opening 63 provided in a box body of the voice synthesis alarm 61, and is assembled to a female connector 64 provided on a wall at the bottom of the opening 63. With this configuration, the ROM can be replaced by removing the ROM box 62 from the opening 63 and further removing the ROM board from the ROM box 62.

【0007】また、図7に示す第2の従来例は、ROM
73をROM基板74上に設置し、ROM基板74を蓋
体75に螺子等で固定し、蓋体75を音声合成報知器7
1の箱体に設けられた開口部72に挿入し、ROM基板
74の一方端上に設置された雄コネクタ78を音声合成
報知器71内の開口部72の奥に設けられた雌コネクタ
に嵌合する。蓋体75を音声合成報知器71の箱体に固
定する方法としては、螺子76、77により、蓋体75
の左右に設けられた螺子穴751、752、開口部72
の左右に設けられた螺子穴711、712にて螺子止め
される。ROM73を交換するには、螺子76、77を
外し、蓋体75の一方表面に設けられた取手部753を
指で引いて、雄コネクタ78を雌コネクタから取り外
し、蓋体75を開口部72から引き出し、ROM基板7
4を蓋体75から取り外すことにより、ROM73を交
換することができる。
A second conventional example shown in FIG.
73 is mounted on a ROM board 74, the ROM board 74 is fixed to a lid 75 with screws or the like, and the lid 75 is
The male connector 78 provided on one end of the ROM board 74 is inserted into a female connector provided at the back of the opening 72 in the voice synthesis alarm 71. Combine. As a method of fixing the lid 75 to the box of the voice synthesis alarm 71, screws 76, 77
Screw holes 751, 752, opening 72 provided on the left and right of
Are screwed in screw holes 711 and 712 provided on the left and right sides of the. To replace the ROM 73, remove the screws 76, 77, pull the handle 753 provided on one surface of the lid 75 with a finger, remove the male connector 78 from the female connector, and remove the lid 75 from the opening 72. Drawer, ROM board 7
By removing the cover 4 from the cover 75, the ROM 73 can be replaced.

【発明が解決しようとする課題】[Problems to be solved by the invention]

【0008】然しながら、上記第1の従来例は、ROM
ボックス62が別部品として必要であるためにコストが
高くなるという欠点がある。また、上記第1の従来例
は、ROM基板をROMボックス62から取り外さなけ
れば、ROMを交換できないため手間がかかる。次に、
上記第2の従来例は、ROM基板74を蓋体75に螺子
等で固定しなければならなず、蓋体75を螺子76、7
7で音声合成報知器71の箱体に固定しなければならな
いため、螺子等の別部品が必要であり、音声合成報知器
71の組立工数も多くなるという欠点がある。そして、
第1の従来例、第2の従来例ともに、ROMボックス6
2や蓋体75を手で引き出すことになるが、この場合、
雄コネクタが雌コネクタから抜けにくくなっていたり、
真っ直ぐ手前に引き出しにくいため、雄コネクタと雌コ
ネクタが曲がって破損しやすいという問題があった。さ
らに、第1の従来例、第2の従来例ともに、ROMボッ
クス62や蓋体75を手で引き出すことになるため、雄
コネクタと雌コネクタを強く嵌合すると、雄コネクタと
雌コネクタが抜けなくなってしまうことがある。従っ
て、使用者は、雄コネクタと雌コネクタを強く嵌合しな
いことが多いが、雄コネクタと雌コネクタを強く嵌合し
ない場合、ROM基板と音声合成報知器の接続が不十分
となりやすく、信頼性に欠ける欠点があった。
[0008] However, the first conventional example is a ROM.
The disadvantage is that the cost is high because the box 62 is required as a separate part. Further, in the first conventional example, the ROM cannot be replaced unless the ROM board is removed from the ROM box 62, so that it is troublesome. next,
In the second conventional example, the ROM board 74 must be fixed to the lid 75 with screws or the like.
Since the voice synthesizing alarm 71 must be fixed to the box of the voice synthesizing alarm 71, separate parts such as screws are required, and there is a disadvantage that the number of assembling steps of the voice synthesizing alarm 71 increases. And
In both the first conventional example and the second conventional example, the ROM box 6
2 and the lid 75 will be pulled out by hand. In this case,
If the male connector is difficult to remove from the female connector,
There is a problem that the male connector and the female connector are easily bent and damaged because it is difficult to pull straight out. Furthermore, in both the first conventional example and the second conventional example, since the ROM box 62 and the lid 75 are pulled out by hand, if the male connector and the female connector are strongly fitted, the male connector and the female connector will not come off. Sometimes. Therefore, the user often does not strongly fit the male connector and the female connector. However, if the male connector and the female connector are not strongly fitted, the connection between the ROM board and the voice synthesizing annunciator tends to be insufficient, and the reliability is low. Had a shortcoming.

【0009】そこで本発明の目的は上述の技術的課題を
解決し、簡単で、コストが安く、手を傷つけず、コネク
タを破損しにくい電子機器のメモリIC基板収納構造を
提供することである。
SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned technical problems and to provide a memory IC substrate housing structure for electronic equipment which is simple, inexpensive, does not hurt the hand, and does not easily damage the connector.

【0010】[0010]

【課題を解決するための手段および作用】上記の目的を
達成するための請求項1記載の電子機器のメモリIC基
板収納構造は、メモリIC基板へメモリICを着脱自在
に装着するとともに、ケースの開口部より該メモリIC
基板をメイン基板へ着脱自在に組み付け、別体の蓋体で
該開口部を施蓋して成る電子機器のメモリIC基板収納
構造において、上記メモリIC基板上部に左右一対の引
掛部を設け、施蓋する際に蓋体を支持する段部を上記開
口部の左右周縁辺に沿って設け、上記蓋体の一方端には
引掛部に対応する引掛脚を左右一対に突出して設け、
引掛脚先端には引掛部を引っ掛けうる引掛片が設け
られるとともに、略中程外側に段部を形成する支点部を
それぞれ設けて構成し、上記メモリIC基板は上記蓋体
により着脱自在としたことを特徴とする。
According to a first aspect of the present invention, there is provided a memory IC board housing structure for an electronic device, wherein a memory IC is removably mounted on a memory IC board and a case is provided. Opening the memory IC
Assembling the substrate detachably to the main board, the memory IC substrate housing structure of an electronic device formed by lidding the opening, in the memory IC substrate upper left and right pair of hook portions provided in the lid of separate, facilities Steps for supporting the lid when closing are provided along the left and right peripheral edges of the opening , and one end of the lid is provided at one end of the lid.
Protrudes the hooking legs corresponding to the hook portion to right and left, upper
Catching piece that can hook the hook portion is provided at the distal end of the serial引掛Ashi
In together when used, configured by providing the fulcrum portion to form a stepped portion on the outside substantially middle of each of the memory IC substrate is characterized in that the detachable by the lid.

【0011】上記の構成によれば、メモリIC基板交換
の際に、上記引掛脚は、上記引掛部を引っ掛け、段部を
形成する上記支点部を上記開口部の左右周縁辺に沿って
設けられた段部に当接し、上記蓋体を下方に軽く押さえ
ればメモリIC基板は、てこの原理により、上記メイン
基板から外れ、上記開口部から取り出せる。また、メモ
リIC基板を電子機器に組み付けるには、上記蓋体で上
記開口部を施蓋する際に、上記蓋体の裏面でメモリIC
基板の頭部を軽く押さえれば、メモリIC基板は、簡単
に電子機器内のメイン基板へ着脱自在に組み付けられ
る。
According to the above configuration, when the memory IC board is replaced, the hook leg hooks the hook portion, and the step portion is
Form the fulcrum part along the left and right peripheral edges of the opening.
The memory IC substrate can be detached from the main substrate by the principle of leverage and can be taken out from the opening by abutting on the step provided and lightly pressing the lid downward. Also, in order to assemble the memory IC substrate to the electronic device, when covering the opening with the lid, the memory IC board is placed on the back surface of the lid.
If the head of the board is lightly pressed, the memory IC board can be easily and detachably assembled to the main board in the electronic device.

【0012】次に、請求項2記載の電子機器のメモリI
C基板収納構造は、上記開口部の段部より垂下するガイ
ド片を左右に対向して設け、該ガイド片の内面に2条の
畝状突起を設け、上記メモリIC基板着脱時の案内とし
たことを特徴とする。上記の構成によれば、メモリIC
基板着脱時に、上記ガイド片の内面に設けた2条の畝状
突起は、メモリIC基板の案内となり、鉛直方向にメモ
リIC基板を着脱できる。
Next, the memory I of the electronic equipment according to claim 2
In the C substrate housing structure, a guide piece hanging down from the step of the opening is provided to face left and right, and two ridge-shaped protrusions are provided on the inner surface of the guide piece to serve as a guide when the memory IC board is attached and detached. It is characterized by the following. According to the above configuration, the memory IC
When the substrate is attached or detached, the two ridge-shaped projections provided on the inner surface of the guide piece serve as a guide for the memory IC substrate, and the memory IC substrate can be attached or detached in the vertical direction.

【0013】そして、請求項3記載の電子機器のメモリ
IC基板収納構造は、上記開口部の段部には、上記蓋体
の支点部を保持する切欠きが設けられていることを特徴
とする。上記の構成によれば、メモリIC基板交換の際
に、上記切欠きが上記支点部を保持し、支点部の位置
が、切欠きから外れることはない。
According to a third aspect of the present invention, the step of the opening is provided with a notch for holding the fulcrum of the lid. . According to the above configuration, when replacing the memory IC board, the notch holds the fulcrum, and the position of the fulcrum does not deviate from the notch.

【0014】[0014]

【実施例】本発明の一実施例を以下、図面に従って詳細
に説明する。図1は、本発明の1実施例を示す音声合成
報知器の斜視図である。図1(a)は、蓋体でケースを
施蓋した状態を、図1(b)は、蓋体でROM基板を取
り外す状態を、各々示す。図2は、上記ROM基板の正
面図である。図3は、上記ROM基板の組み付け状態を
示す(a)正面図、(b)平面図である。図4は、上記
蓋体の(a)平面図、(b)底面図、及び(c)側面図
である。図5は、上記ROM基板を音声合成報知器から
取り出す状態を示す要部断面図である。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a perspective view of a voice synthesizing alarm according to an embodiment of the present invention. FIG. 1A shows a state in which the case is covered with the lid, and FIG. 1B shows a state in which the ROM board is removed with the lid. FIG. 2 is a front view of the ROM board. 3A is a front view and FIG. 3B is a plan view showing an assembled state of the ROM board. FIG. 4 is (a) a plan view, (b) a bottom view, and (c) a side view of the lid. FIG. 5 is a cross-sectional view of a main part showing a state where the ROM board is taken out from the speech synthesis alarm.

【0015】ROM基板201は、薄板形状を呈する基
板である。ROM基板201の一方表面側の略中央部に
はROMソケット等により構成される支持手段241
が、設けられている。また、ROM基板201の一方表
面側の下部には、雄コネクタ25が設けられる。ROM
基板202は、ROM基板201の構成と同じであるた
め説明を省略する。また、ROM基板の数は、3枚以上
とすることが可能であり、この場合のROM基板の構成
についても、ROM基板201と同じである。
The ROM substrate 201 is a substrate having a thin plate shape. At a substantially central portion on one surface side of the ROM substrate 201, a support means 241 constituted by a ROM socket or the like is provided.
Are provided. Further, a male connector 25 is provided at a lower portion on one surface side of the ROM board 201. ROM
The substrate 202 has the same configuration as that of the ROM substrate 201, and a description thereof will be omitted. The number of ROM boards can be three or more, and the configuration of the ROM board in this case is the same as that of the ROM board 201.

【0016】そして、ROM基板201の上部両端に
は、左右一対の引掛部21、22が設けられる。引掛部
21、22は、略正方形状の穴等として構成される。引
掛部21、22の構成は、図示したもの以外にも様々な
構成が可能である。例えば、引掛部を設ける箇所とし
て、左右一対以外に略中程に一箇所設けたり四箇所以上
設けることも可能である。また、穴以外にも先端に突出
した部分を形成しその部分を折り曲げて形成することも
可能である。そして、穴の形状としても円形状、楕円形
状、逆三角形状等他の構成が可能である。
A pair of left and right hooks 21 and 22 are provided at both upper ends of the ROM board 201. The hooks 21 and 22 are configured as substantially square holes or the like. Various configurations are possible for the configuration of the hooking portions 21 and 22 other than those illustrated. For example, it is also possible to provide a hook portion at one location in the middle of the center, or at four or more locations, in addition to the left and right pairs. In addition, it is also possible to form a protruding portion at the tip other than the hole and bend the portion. Further, other configurations such as a circular shape, an elliptical shape, and an inverted triangular shape are also possible as the shape of the hole.

【0017】ROM231は、音声メッセージ等を格納
するメモリICである。ROM231は支持手段241
に挿入され、ROM基板201に着脱自在に装着され
る。ROM基板201の裏面側には、ROM231の先
端が突出しており、ROM231は該先端を半田等によ
り処理されるのが通常である。
The ROM 231 is a memory IC for storing voice messages and the like. The ROM 231 is provided with support means 241
And is detachably mounted on the ROM board 201. The tip of the ROM 231 protrudes from the back side of the ROM substrate 201, and the tip of the ROM 231 is usually processed by soldering or the like.

【0018】音声合成報知器1は、略直方体等の形状の
箱体から成るケース11を有する。ケース11の上部に
は開口部12が、設けられる。開口部12は、略直方体
等の形状に穿設された穴として形成される。
The voice synthesizing alarm 1 has a case 11 formed of a box having a substantially rectangular parallelepiped shape. An opening 12 is provided in an upper part of the case 11. The opening 12 is formed as a hole formed in a substantially rectangular parallelepiped or the like.

【0019】開口部12の周縁辺の一方端略中央部に、
凹部31が形成され、凹部31の対向辺縁に段部34
が、形成される。開口部12の左右には、開口部12の
周縁辺に沿って段部32、33が、各々形成される。段
部32、33、34は、後に述べるように蓋体4が開口
部12を施蓋する際に、蓋体4を支持する。
At approximately the center of one end of the peripheral edge of the opening 12,
A concave portion 31 is formed, and a step portion 34 is formed on an opposite edge of the concave portion 31.
Is formed. Steps 32 and 33 are formed on the left and right of the opening 12 along the peripheral edge of the opening 12, respectively. The steps 32, 33, and 34 support the lid 4 when the lid 4 covers the opening 12 as described later.

【0020】また、ガイド片151は、段部32より垂
下して設けられる。ガイド片152は、ガイド片151
に対向して、段部33より垂下して設けられる。ガイド
片151、ガイド片152は、内面に2条の畝状突起が
設けられ、ROM基板201を音声合成報知器1から着
脱する時の案内とされるため、ROM基板201の着脱
は鉛直方向になされる。ガイド片151、152は、R
OM基板201の左辺を長く右辺を短く構成するのに対
応して、ガイド片151を長く、ガイド片152を短く
構成してあるため、ROM基板201を左右逆に挿入す
ることを防止できる。
The guide piece 151 is provided to hang down from the step portion 32. The guide piece 152 includes the guide piece 151.
, And is provided to hang down from the step portion 33. The guide piece 151 and the guide piece 152 are provided with two ridge-shaped protrusions on the inner surface, and are used as a guide when the ROM board 201 is attached to and detached from the speech synthesis alarm 1, so that the attachment and detachment of the ROM board 201 are performed in the vertical direction. Done. The guide pieces 151 and 152 are R
Since the guide piece 151 is long and the guide piece 152 is short in correspondence with the left side of the OM board 201 being long and the right side being short, it is possible to prevent the ROM board 201 from being inserted left and right reversed.

【0021】ガイド片153、154は、ガイド片15
1、152と同じ構成であるため説明を省略する。ま
た、ガイド片の組数は、ROM基板の数に応じて、3組
以上とすることが可能であり、この場合のガイド片の構
成も、ガイド片151、152について述べたところと
同じである。
The guide pieces 153 and 154 are
Since the configuration is the same as that of Nos. 1 and 152, the description is omitted. The number of sets of guide pieces can be three or more according to the number of ROM boards, and the configuration of the guide pieces in this case is the same as that described for the guide pieces 151 and 152. .

【0022】そして、切欠き131が、段部32に設け
られ、切欠き132が、切欠き131に対向して、段部
33に設けられる。切欠き131、132は、略逆三角
形状や半円形状等、様々な形状とすることが可能であ
る。
A notch 131 is provided in the step 32, and a notch 132 is provided in the step 33 so as to face the notch 131. The notches 131 and 132 can have various shapes such as a substantially inverted triangular shape or a semicircular shape.

【0023】切欠き141、142は、切欠き131、
132と同じ構成である。また、切欠きの組数は、RO
M基板の数に応じて、3組以上とすることが可能であ
り、この場合の切欠きの構成も、切欠き131、132
について述べたところと同じである。
Notches 141 and 142 are notches 131,
132 has the same configuration. The number of notches is RO
Depending on the number of M substrate, it is possible to three or more, notch configuration in this case also, notches 131, 132
Is the same as described above.

【0024】さらに、開口部12の略底部には、メイン
基板27が、設置される。メイン基板27の上に雌コネ
クタ26が設けられる。ROM基板201は、雄コネク
タ25を雌コネクタ26に嵌合することによってメイン
基板27へ着脱自在に組み付けられる。
Further, a main board 27 is provided substantially at the bottom of the opening 12. The female connector 26 is provided on the main board 27. The ROM board 201 is detachably attached to the main board 27 by fitting the male connector 25 to the female connector 26.

【0025】蓋体4は、薄板形状を呈し、開口部12を
施蓋するもである。蓋体4の一方端より、左右一対の
引掛脚41、42が、突出して形成される。引掛脚4
1、42は、根元が太く、先端は細く構成されるため、
適度の弾性を有し、また折れにくく、蓋体4でROM基
板201取り出す際に好適である。引掛脚41、42
の先端には引掛片411、412が形成される。引掛脚
41、42の略中程外側には支点部43、44が、形成
される。
The lid 4 exhibits a thin plate shape, is the also lidding the opening 12. A pair of left and right hooking legs 41 and 42 project from one end of the lid 4. Hook leg 4
1, 42 are thicker at the base and thinner at the tip,
It has appropriate elasticity and is hard to be broken, and is suitable for taking out the ROM substrate 201 with the lid 4. Hook legs 41, 42
Hook pieces 411 and 412 are formed at the tip of the. The fulcrum portions 43 and 44 are formed substantially outside the hook legs 41 and 42 in the approximate middle.

【0026】引掛脚41、42の構成は、上記ROM基
201の引掛部21、22の構成に対応して形成され
る。例えば、引掛脚41、42を設ける箇所は、引掛部
21、22を設ける箇所に対応して、左右一対以外に略
中程に一箇所設けたり、四箇所以上設けることも可能で
ある。また引掛片411、412は、図示のように鍵状
に形成する他、引掛脚41、42の先端を略直角あるい
は鋭角に折り曲げる等、上記ROM基板201の引掛部
21、22を引っ掛けうる形状であればよい。そして支
点部43、44は、図示のように段部として形成する
他、凸部を形成する等、蓋体4でROM基板201を取
り出す際に支点となりうる形状であればよい。
The configuration of the hooking legs 41 and 42 is formed corresponding to the configuration of the hooking portions 21 and 22 of the ROM substrate 201 . For example, the place where the hooking legs 41 and 42 are provided is a hooking portion.
It is also possible to provide one portion at about the center other than the pair of right and left, or four or more portions, in correspondence with the location where 21 and 22 are provided. The hook pieces 411 and 412 are formed in a key shape as shown in the figure, and the hook portions of the ROM board 201 are bent by bending the tips of the hook legs 41 and 42 at a substantially right angle or an acute angle.
Any shape can be used as long as 21 and 22 can be hooked. The fulcrum portions 43 and 44 may be formed as steps as shown in the drawing, or may be formed in a shape that can serve as a fulcrum when the ROM substrate 201 is taken out with the lid 4, such as forming a convex portion.

【0027】蓋体4の上部中央には、弾性を有する側面
U字形状の係止爪45が、形成される。蓋体4の裏面の
左右周縁辺には、係止部46、47が、形成される。蓋
体4の裏面の係止爪45の対向周縁辺には、係止部48
が形成される。
At the center of the upper part of the lid 4, a locking U-shaped engaging claw 45 is formed. Locking portions 46 and 47 are formed on the left and right peripheral sides of the back surface of the lid 4. A locking portion 48 is provided on the back side of the lid 4 on the periphery of the locking claw 45 facing the locking claw 45.
Is formed.

【0028】蓋体4は、係止部46が、上記開口部12
の段部33にて支持され、係止部47が、上記開口部1
2の段部32にて支持される。また、係止部48が、段
部34にて支持される。そして、蓋体4で開口部12を
施蓋することにより、蓋体4がROM基板201の押さ
えとなるため、ROM基板201が、メイン基板27か
ら外れてしまうということはない。
The lid 4 is provided with the locking portion 46 that is
Of the opening 1
It is supported by the second step 32. Further, the locking portion 48 is supported by the step portion 34. Since the cover 4 covers the ROM board 201 by covering the opening 12 with the cover 4, the ROM board 201 does not come off the main board 27.

【0029】ここで、音声合成報知器1からROM基板
201を取り外す方法について説明する。まず蓋体4
を、開口部12の凹部31から係止爪45の上端に指を
かけて、ケース11から外す。次に、蓋体4を裏返し蓋
体4の引掛片411、412をROM基板201の引掛
部21、22に各々、引っ掛ける。そして、蓋体4の支
点部43、44を開口部12の切欠き131、132に
載置して保持する。この際、支点部43、44は、切欠
き131、132により、保持されるため、支点部4
3、44の位置は、切欠き131、132からずれるこ
とはない。従って、ROM基板201の取り外しが、よ
り確実にできる。さらに、蓋体4を下向き(矢印方向)
に軽く押さえるとROM基板201は、支点部43、4
4を支点とするてこの原理により、容易に雄コネクタ2
5が、雌コネクタ26から外れ、音声合成報知器1から
取り外せる。この際、ガイド片151、152が、RO
M基板201を鉛直方向に案内するため雄コネクタ2
5、雌コネクタ26が破損することはない。
Here, a method of removing the ROM board 201 from the speech synthesis alarm 1 will be described. First, lid 4
Is put on the upper end of the locking claw 45 from the concave portion 31 of the opening 12 by a finger, and is removed from the case 11. Next, the cover 4 is turned over, and the hook pieces 411 and 412 of the cover 4 are hooked on the hooks 21 and 22 of the ROM board 201, respectively. Then, the fulcrum portions 43 and 44 of the lid 4 are placed and held in the notches 131 and 132 of the opening 12. At this time, since the fulcrum portions 43 and 44 are held by the notches 131 and 132,
The positions of 3 and 44 do not shift from the notches 131 and 132. Therefore, the ROM board 201 can be more reliably removed. Further, the lid 4 is directed downward (in the direction of the arrow).
When pressed lightly on the ROM board 201, the fulcrum portions 43, 4
4 as a fulcrum, the male connector 2
5 can be detached from the female connector 26 and detached from the voice synthesizing alarm 1. At this time, the guide pieces 151 and 152
Male connector 2 to guide M board 201 in vertical direction
5. The female connector 26 is not damaged.

【0030】上記とは逆に、音声合成報知器1にROM
基板201組み付けるには、次に述べる方法による。ま
ず、ROM基板201をガイド片151、152の内面
に設けられた2条の畝状突起により、鉛直方向に案内さ
せる。次に、蓋体4で開口部12を施蓋する際に、蓋体
4の裏面でROM基板201の頭部を軽く押さえる。こ
れにより、雄コネクタ25は、簡単に雌コネクタ26に
嵌合され、ROM基板201は、音声合成報知器1内の
メイン基板27に着脱自在に組み付けられる。この際、
ガイド片151、152が、ROM基板201を鉛直方
向に案内するため、雄コネクタ25、雌コネクタ26が
破損することはない。
Contrary to the above, the voice synthesizing alarm 1 has a ROM
To assemble the substrate 201, the following method is used. First, the ROM board 201 is guided vertically by two ridge-shaped protrusions provided on the inner surfaces of the guide pieces 151 and 152. Next, when covering the opening 12 with the lid 4, the head of the ROM board 201 is lightly pressed by the back surface of the lid 4. As a result, the male connector 25 is easily fitted into the female connector 26, and the ROM board 201 is detachably attached to the main board 27 in the voice synthesis alarm 1. On this occasion,
Since the guide pieces 151 and 152 guide the ROM board 201 in the vertical direction, the male connector 25 and the female connector 26 are not damaged.

【0031】ROM基板202を音声合成報知器1に着
脱する場合、又はROM基板が3枚以上ある場合に音声
合成報知器1に着脱する場合も、上記のROM基板20
1の着脱方法と同じである。
When the ROM board 202 is attached to and detached from the voice synthesizing annunciator 1, or when there are three or more ROM boards, it is possible to attach and detach the ROM synthesizing annunciator 1.
This is the same as the mounting / dismounting method of No. 1.

【0032】本発明の実施例の説明は以上のとおりであ
るが、本発明は上記の実施例に限られるものではなく、
本発明の要旨を変更しない範囲で、種々の設計変更が可
能である。
Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments.
Various design changes are possible without changing the gist of the present invention.

【0033】[0033]

【発明の効果】本発明によれば、電子機器にメモリIC
基板を着脱する際に、電子機器のケースを分解しなくて
もよいし、専用の工具も不要で、メモリIC基板をメモ
リICボックスや蓋体等他の部材から外す工程も不要と
なるため、極めて簡単にメモリIC基板を取り外せ、メ
モリICを交換しやすくなる。また、雄コネクタと雌コ
ネクタとを強く嵌合しても容易にメモリIC基板を取り
外せるため、雄コネクタと雌コネクタとを常に強く嵌合
でき、電子機器の信頼性が向上する。次に、メモリIC
基板を収容するための特別なメモリICボックス等の部
材が不要であるため、電子機器のコストが安価になる。
また、電子機器にメモリIC基板を着脱するのに、手で
直接、メモリIC基板に触れなくてもよいため、不良を
発生させることもなく、使用者が怪我をすることがなく
なった。そして、ガイド片により、鉛直方向にメモリI
C基板を着脱できるため、メモリIC基板着脱の際にメ
モリIC基板の雄コネクタ、メイン基板の雌コネクタを
破損することがなくなった。さらに、切欠きが、支点部
を保持し、支点部の位置が、切欠きに定まるため、支点
部がずれるがなく、てこの原理によるメモリIC基板の
取り外しがより確実にできるようになった。
According to the present invention, a memory IC is provided in an electronic device.
When attaching and detaching the board, the case of the electronic device does not need to be disassembled, a special tool is not required, and a step of removing the memory IC board from other members such as the memory IC box and the lid becomes unnecessary. The memory IC substrate can be removed very easily, and the memory IC can be easily replaced. Further, since the memory IC board can be easily removed even when the male connector and the female connector are strongly fitted, the male connector and the female connector can always be firmly fitted, and the reliability of the electronic device is improved. Next, the memory IC
Since a member such as a special memory IC box for accommodating the substrate is not required, the cost of the electronic device is reduced.
In addition, the user does not have to directly touch the memory IC board by hand when attaching or detaching the memory IC board to or from the electronic device, so that no failure occurs and the user is not injured. Then, the memory I is vertically set by the guide piece.
Since the C board can be attached and detached, the male connector of the memory IC board and the female connector of the main board are not damaged when attaching or detaching the memory IC board. Furthermore, the notch holds the fulcrum, and the position of the fulcrum is determined by the notch, so that the fulcrum does not shift and the memory IC substrate can be more reliably removed by the leverage principle.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の1実施例を示す音声合成報知器の斜視
図である。
FIG. 1 is a perspective view of a voice synthesizing alarm according to an embodiment of the present invention.

【図2】上記ROM基板の正面図である。FIG. 2 is a front view of the ROM substrate.

【図3】上記ROM基板の組み付け状態を示す、(a)
正面図、(b)平面図である。
FIG. 3 (a) shows an assembled state of the ROM board.
It is a front view, (b) Top view.

【図4】上記蓋体の(a)平面図、(b)底面図、及び
(c)側面図である。
4A is a plan view, FIG. 4B is a bottom view, and FIG. 4C is a side view of the lid.

【図5】上記ROM基板を音声合成報知器から取り外す
状態を示す要部断面図である。
FIG. 5 is a sectional view of a main part showing a state in which the ROM board is detached from a speech synthesis alarm .

【図6】第1の従来例を示す斜視図である。FIG. 6 is a perspective view showing a first conventional example.

【図7】第2の従来例を示す斜視図である。FIG. 7 is a perspective view showing a second conventional example.

【符号の説明】[Explanation of symbols]

1 電子機器 11 ケース 12 開口部 131 切欠き 132 切欠き 151 ガイド片 152 ガイド片 201 ROM基板 21 引掛部 22 引掛部 231 ROM 27 メイン基板 32 段部 33 段部 4 蓋体 41 引掛脚 42 引掛脚 411 引掛片 412 引掛片 43 支点部 44 支点部DESCRIPTION OF SYMBOLS 1 Electronic device 11 Case 12 Opening 131 Notch 132 Notch 132 Notch 151 Guide piece 152 Guide piece 201 ROM board 21 Hook part 22 Hook part 231 ROM 27 Main board 32 Step part 33 Step part 4 Lid 41 Hook leg 42 Hook leg 411 Hook 412 Hook 43 fulcrum 44 fulcrum

Claims (3)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】メモリIC基板へメモリICを着脱自在に
装着するとともに、ケースの開口部より該メモリIC基
板をメイン基板へ着脱自在に組み付け、別体の蓋体で該
開口部を施蓋して成る電子機器のメモリIC基板収納構
造において、 上記メモリIC基板上部に左右一対の引掛部を設け、
蓋する際に蓋体を支持する段部を上記開口部の左右周縁
辺に沿って設け、上記蓋体の一方端には引掛部に対応す
る引掛脚を左右一対に突出して設け、上記引掛脚先端
は引掛部を引っ掛けうる引掛片が設けられるととも
に、略中程外側に段部を形成する支点部をそれぞれ設け
て構成し、上記メモリIC基板は上記蓋体により着脱自
在としたことを特徴とする電子機器のメモリIC基板収
納構造。
1. A memory IC is detachably mounted on a memory IC substrate.
Attach the memory IC base through the opening of the case.
The board is detachably attached to the main board, and the cover is
Memory IC substrate storage structure for electronic equipment having an opening
In the structure, a pair of left and right hooks is provided on the upper part of the memory IC substrate,Out
When supporting the lid,Left and right of the openingMargin
Along the sideProvided, the lidCorresponds to the hook at one end
HookLeft and right pairProtruding intoProvided,the aboveHook legoftip
ToCan catch the hookHookIs provided
To the middleForm a stepSupport points are provided
The memory IC substrate is attached and detached by the lid.
Memory IC substrate of electronic equipment
Delivery structure.
【請求項2】上記開口部の段部より垂下するガイド片を
左右に対向して設け、該ガイド片の内面に2条の畝状突
起を設け、上記メモリIC基板着脱時の案内としたこと
を特徴とする請求項1記載の電子機器のメモリIC基板
収納構造。
2. A guide piece hanging down from the step of the opening is provided to face left and right, and two ridge-shaped projections are provided on an inner surface of the guide piece to provide a guide when the memory IC substrate is attached and detached. The storage structure for a memory IC substrate of an electronic device according to claim 1, wherein:
【請求項3】上記開口部の段部には、上記蓋体の支点部
を保持する切欠きが設けられていることを特徴とする請
求項1または請求項2記載の電子機器のメモリIC基板
収納構造。
3. A memory IC board for an electronic device according to claim 1, wherein a notch for holding a fulcrum of said lid is provided in a step of said opening. Storage structure.
JP7145226A 1995-05-19 1995-05-19 Storage structure of memory IC substrate for electronic equipment Expired - Fee Related JP2927208B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7145226A JP2927208B2 (en) 1995-05-19 1995-05-19 Storage structure of memory IC substrate for electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7145226A JP2927208B2 (en) 1995-05-19 1995-05-19 Storage structure of memory IC substrate for electronic equipment

Publications (2)

Publication Number Publication Date
JPH08316666A JPH08316666A (en) 1996-11-29
JP2927208B2 true JP2927208B2 (en) 1999-07-28

Family

ID=15380267

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7145226A Expired - Fee Related JP2927208B2 (en) 1995-05-19 1995-05-19 Storage structure of memory IC substrate for electronic equipment

Country Status (1)

Country Link
JP (1) JP2927208B2 (en)

Also Published As

Publication number Publication date
JPH08316666A (en) 1996-11-29

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