JP2933032B2 - Pad data extraction method for specified parts - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of extracting pad data of a designated component, and more particularly to a method of extracting pad data of a designated component used for extracting pad data of a designated component from CAD data of a printed wiring board or the like. Things.

[0002]

2. Description of the Related Art A conventional technique will be specifically described with reference to the drawings.

FIG. 5 is a block diagram of an apparatus used for implementing a conventional method of extracting pad data of a designated component, and FIG. 6 is a flowchart of a processing block B4 in FIG. In FIG. 5, the board design CAD data file B
1 and a memory B2 for storing data necessary for processing
In addition, component pin data B3 extracted from the board design CAD data file B1, correction data input B5 required for pad data output, and pad data B6 as a processing result are connected to a processing block B4. As shown in FIG.
In the conventional pad data extraction method for a designated component, component mounting data is saved from the board design CAD data on the extraction memory B2, and pin data of the component is extracted and saved in the pin data file B3. Step BS2 for reading the expanded component mounting data as a processing target one by one, determining step BS3 for determining whether all the component mounting data expanded on the memory B2 have been processed, and using the component name of the component mounting data as a key. A step BS4 for reading the pin data of the corresponding part, a determination step BS5 for determining completion of the reading of the pin data,
A step BS6 for determining whether the center can be calculated from the shape attached to the read pin data, and a pin position creation step for actually calculating the center of the figure and setting the position from the origin of the component in the component mounting data BS7,
An offset value input step BS8 for inputting data for position correction of output data after processing of all component mounting data is completed, and a correction output step BS9 for correcting and outputting pad data based on the input offset value. . At this time, in the case of the components arranged on the back surface, since the CAD data of the board design is designed with the perspective data from the first layer surface, in order to output the data viewed from the back surface, it is necessary to determine which point is the temporary origin. Considering the direction in which the object is to be rotated and turned in the opposite direction, the offset values are manually input and the correction process is performed to finally create necessary data.

[0004]

In designing a printed wiring board or the like, the wiring board is designed in a state where the wiring board is viewed from the front, so that the data on the back surface is created by the perspective data from the front surface. However, since the data of the component pins is used for the position of the solder at the time of component mounting, the data of the continuity test, and the like, even when the component mounting position on the substrate is the back surface, the data as viewed from the surface is required. In the conventional method, in order to create data on the back surface, it is necessary to specify a rotation direction such as where to rotate the substrate when turning over the substrate, but this rotation direction is necessary in the design of the substrate. Since there is no data, it is necessary to manually input data that does not exist in the board design data. Also, regarding the position of the pad, the pad is registered as shape data in the board design data, and the center data of the pad required for output is not registered, so the position is calculated from the pad figure, In the case of a pin having a pad shape whose center cannot be specified, the position cannot be output.

An object of the present invention is to provide a pad data extracting method for a specific component which can output a position even in the case of a pin having a pad shape whose center cannot be specified without having to manually input data.

[0006]

Pad data extraction method specified components of the present invention, in order to solve the problems] includes a board design CAD data file containing substrate design CAD data, the component as an output condition
Output condition file in which the name of the
Files and data extracted during the processing are temporarily stored
Memory, component dimensions, and component pins relative to the component origin
Information on the location and land and pads associated with component pins
Library files containing registered data and extraction
The name of the part corresponds to the dimension and part origin of the corresponding part.
Pin locations and lands / patterns attached to component pins
Component library for registering
And a processing step in the processing block.
As the output condition set in the output condition file,
Output condition expansion step for reading and expanding on the memory
And the mounted components from the board design CAD data file
Name, mounting surface on board, mounting position, component rotation angle
Components that extract component information including degrees and store them in the memory
Information extraction step, and component name data from the component information.
Read the data and use the live
From the library file group to the corresponding parts library.
Data retrieval step for retrieving and storing data
And the data registered in the part library and the
Compare with the output condition expanded on the memory
Data selection step to extract only the data
Before the pin data extracted in the pin data selection step
Correction by the rotation angle of the corresponding part extracted from the part information
And outputting the pin position data as pin position data .

According to the present invention, while only the board design CAD data file has been conventionally searched,
In addition, parts library files used for design are also searched. Also, by registering the output conditions of the pad shape you want to output to a separate file,
It becomes possible to extract and output only the data of the pad satisfying a specific condition.

[0008]

Embodiments of the present invention will now be described with reference to the drawings.

FIG. 1 is a block diagram for explaining a method of extracting pad data of a designated component according to a first embodiment of the present invention.
Is a flowchart for explaining the outline of the steps of the processing block of FIG. 1, and FIG. 3 is a flowchart for realizing the processing block of FIG. As shown in FIG. 1, the method for extracting pad data of a designated component according to the embodiment of the present invention uses a board design CAD data file 1 storing board design CAD data and whether or not data being processed satisfies a condition. Output condition file 2 which stores data used for the determination of the condition and the conditions described in the output condition file 2 and for storing the component information and the board information extracted from the board design CAD data file. Memory 3;
The shape of the component, the position of the component pin relative to the component origin, the shape of the pad, and the like are registered, and are referred to when the data of the corresponding component library 5 is extracted from the board design CAD data file 1 using the name of the extracted component as a key. The present invention is applied to a CAD system including a library file group 4, a corresponding component library 5 composed of only data relating to the extracted components, and a processing block 7 for outputting extracted and corrected pad data 6. .

Next, the processing block 7 will be described with reference to a flowchart. As shown in FIG. 2, in the pad data extracting method according to the embodiment of the present invention, when an output condition is set, an output condition expanding step S1 for reading the output condition and expanding the output condition on a memory; A component information extraction step S2 for extracting component names and component mounting position information from the data file 1, a component data search step S3 for searching the library file group 4 for information such as actual dimensions of the extracted component names, and A pin data selection step S4 in which the pin information included in the component information is compared with a condition developed in the memory 3 and only when the condition is satisfied is determined as an extraction target, and a necessary correction is made to the selected pin information. There is a correction step S5.

As shown in FIG. 3, in an output condition development step S1, an output condition file S11 for confirming whether an output condition file exists is referred to as an output condition development S12 for developing conditions on a memory 3 when a file exists. Has functions. Board information CAD
It has a component information extraction S21 of a function of extracting information on a name, a mounting surface, a position, and a rotation angle of the component from the data file 1 and registering the data in the memory 3. Next, in a component data search step S3, a component name read S31 for reading the component name data in the component information expanded in the memory 3 in the component information extraction step S2, and the board design CAD data file 1 is used as an index key.
A component library data extraction S32 for extracting the dimensions of the component and the distance of each pin from the origin of the component from the library file group 4 specified in the library file 4, and a pin having a function of reading information on lands and pads associated with each pin It has data reading S33. Pin data selection step S
Step 4 is executed only when the output condition is specified. In this step, it is determined whether or not the data of the pin to be processed satisfies the condition expanded on the memory.
41, if not, read the information of the next pin and return to the component data search step S3, and proceed to the correction step S5 only if the condition is satisfied. The correction step S5 includes, from the mounting information of the component extracted in the component information extraction step S2 and expanded in the memory, S51 for correcting the pin information based on the rotation angle of the component and S52 for outputting as pin position data. Have been. This is because the data handled in the pin data selection step S4 is the position of the pin viewed from the component origin without considering the rotation of the component. The process ends when all the related data has been processed.

FIG. 4 is a flowchart of a component extracting step according to the second embodiment of the present invention. The method for extracting pad data of a designated component according to the second embodiment of the present invention differs from the first embodiment as shown in FIG. 4 in a component information extracting step S2. In the method for extracting pad data of a designated component according to the second embodiment of the present invention, the name of the component and the shape name of the pad are registered in the output condition file 2,
The condition is that the data is developed in the memory 3 in the output condition developing step S1. In the component information extracting step S2 of the pad data extracting method for the designated component according to the second embodiment of the present invention, the board design CAD data is read in, and from SS21, it is determined whether or not the data is related to the component.
Judge at 2. Here, in the case of the component information, it is confirmed whether there is a condition developed in the output condition developing step S1 and SS23. If the output condition is set, it is determined whether or not the condition is satisfied. SS24, the condition is satisfied. In this case, information on the name of the component, the mounting surface, the position, and the rotation angle of the component is extracted, and the data is developed in the memory 3 in the component information development SS2.
5 is provided. The following processes are performed in the same manner as in the first embodiment, and the corrected pad data is output.

[0013]

According to the present invention, by designating a library file group used in the design in addition to the board design CAD data file as data in which it is difficult to refer to the pin position, the position of the pin from the component origin is specified. Can be easily taken out, so that the pin position data of the component with the origin of the component as the origin can be created without particularly considering the front / rear surfaces. Further, there is no restriction on the output by the pad figure. By describing the conditions in the output condition file, it is possible to selectively output only specific information.

[Brief description of the drawings]

FIG. 1 is a block diagram illustrating a method for extracting pad data of a designated component according to a first embodiment of the present invention.

FIG. 2 is a flowchart illustrating an outline of steps of a processing block in FIG. 1;

FIG. 3 is a flowchart for realizing the processing blocks of FIG. 1;

FIG. 4 is a flowchart of a component extraction step according to the second embodiment of this invention.

FIG. 5 is a block diagram illustrating a conventional pad data extraction method.

FIG. 6 is a flowchart of a processing block of FIG. 5;

[Explanation of symbols]

1 Board design CAD data file 2 Output condition file 3 Memory 4 Library file group 5 Corresponding component library 6 Pad data 7 Processing block S1 Output condition development step S2 Component information extraction step S3 Component data search step S4 Pin data selection step S5 Correction step B1 Board design CAD data file B2 Memory B3 Pin data B4 Processing block B5 Correction data B6 Pad data BS1 Information extraction step from board design CAD data BS2 Component information reading step BS3 Component completion determination step BS4 Pin data reading step BS5 Pin data completion determination step BS6 Figure determination step BS7 Pin position creation step BS8 Offset value input step BS9 Correction output step

Claims (1)

(57) [Claims] 1. A board design CAD data file storing board design CAD data, and component names and pad shape names are registered as output conditions.
Memo to temporarily store the output condition file and the data extracted during the process
And part dimensions, part pin position relative to part origin, and part
Data including land and pad information attached to pins is registered.
Recorded library files, extracted component names, corresponding component dimensions, component origin
Pin position and run associated with the component pin
De, and the corresponding component library for registering the information of the pad, and a processing block as the processing steps in the processing block, reading the set output condition in the output condition file
And an output condition expanding step for expanding on the memory, and a name of a mounted component from the board design CAD data file.
Name, mounting surface on the board, mounting position, and component rotation angle.
Component information to extract component information including and store in the memory
Extracting the part name data from the part information,
Previous from the library file group using the name of the product as a key
Search the data to be registered in the corresponding parts library
Searching for part data to be stored, data registered in the corresponding part library and the memo
Compare the output condition expanded on the
A pin data selection step for extracting only data,
The pin data extracted in the
Correction based on the rotation angle of the corresponding part extracted from the product information
And a correction step of outputting the data as pin position data .