JP2933696B2 - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JP2933696B2 JP2933696B2 JP23258890A JP23258890A JP2933696B2 JP 2933696 B2 JP2933696 B2 JP 2933696B2 JP 23258890 A JP23258890 A JP 23258890A JP 23258890 A JP23258890 A JP 23258890A JP 2933696 B2 JP2933696 B2 JP 2933696B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- weight
- parts
- resin
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000003822 epoxy resin Substances 0.000 title claims description 25
- 229920000647 polyepoxide Polymers 0.000 title claims description 25
- 239000000203 mixture Substances 0.000 title claims description 10
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 claims description 16
- 229920003986 novolac Polymers 0.000 claims description 13
- 229920005989 resin Polymers 0.000 claims description 13
- 239000011347 resin Substances 0.000 claims description 13
- 239000007800 oxidant agent Substances 0.000 claims description 9
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 7
- 239000011342 resin composition Substances 0.000 claims description 7
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000000654 additive Substances 0.000 claims description 4
- 238000005538 encapsulation Methods 0.000 claims description 4
- 239000011256 inorganic filler Substances 0.000 claims description 4
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 4
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 6
- 239000003063 flame retardant Substances 0.000 description 6
- 238000000465 moulding Methods 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 4
- 239000006229 carbon black Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000005350 fused silica glass Substances 0.000 description 3
- 229910052736 halogen Inorganic materials 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 2
- LJCFOYOSGPHIOO-UHFFFAOYSA-N antimony pentoxide Chemical compound O=[Sb](=O)O[Sb](=O)=O LJCFOYOSGPHIOO-UHFFFAOYSA-N 0.000 description 2
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 2
- 229910052794 bromium Inorganic materials 0.000 description 2
- 239000004203 carnauba wax Substances 0.000 description 2
- 235000013869 carnauba wax Nutrition 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 230000002542 deteriorative effect Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 150000004715 keto acids Chemical class 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 150000002978 peroxides Chemical class 0.000 description 2
- 239000012286 potassium permanganate Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical compound [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 description 2
- 239000001993 wax Substances 0.000 description 2
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- 244000223760 Cinnamomum zeylanicum Species 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 235000017803 cinnamon Nutrition 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- YADSGOSSYOOKMP-UHFFFAOYSA-N dioxolead Chemical compound O=[Pb]=O YADSGOSSYOOKMP-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- -1 halogen ions Chemical class 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 150000002903 organophosphorus compounds Chemical class 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910001923 silver oxide Inorganic materials 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical group C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は高集積度IC封止用樹脂組成物に適する高温保
管特性及び耐燃性に優れたエポキシ樹脂組成物に関する
ものである。The present invention relates to an epoxy resin composition excellent in high-temperature storage characteristics and flame resistance suitable for a highly integrated IC sealing resin composition.
従来より集積回路等の電子部品は熱硬化樹脂で封止さ
れているが、その使用される環境は低温から高温、乾燥
状態から多湿までその範囲は多岐にわたっている。2. Description of the Related Art Conventionally, electronic components such as integrated circuits are sealed with a thermosetting resin, but the environment in which they are used is wide-ranging from low to high temperatures and from dry to humid.
その中で自動車等に使用される上述電子部品は最も苛
酷な条件に晒されており、特に高温下における信頼性の
低下の問題が最近特に取り挙げられている。即ち、上述
電子部品はチップとリード等より成るが、このチップと
リードを繋ぐリードワイヤーが断線するためとの実証例
も数多く。Among them, the above-mentioned electronic components used in automobiles and the like are exposed to the most severe conditions, and the problem of deterioration in reliability particularly at high temperatures has recently been particularly raised. That is, the above-mentioned electronic component is composed of a chip and a lead, and there are many verification examples that a lead wire connecting the chip and the lead is broken.
断線の原因として、成形時の樹脂の注入によるリード
ワイヤーの変形、しいては断線という現象を除いてチッ
プ上のAl線とリードワイヤー（Au線）のボンディング部
分の腐食が高じたものと考えられている。The cause of the disconnection is thought to be the increased corrosion of the bonding part between the Al wire and the lead wire (Au wire) on the chip, excluding the deformation of the lead wire due to resin injection during molding, and excluding the phenomenon of disconnection. ing.
現在までにAuとAl界面の剥離を報告している報分はBe
ll研（L.G.Feinstein）（1980）など幾つかあるが、樹
脂組成物に含まれる不純物、特にハロゲンイオンによる
ものとの見方が多く、高温にさらされた場合それが顕著
に表れている。To date, reports of Au-Al interface delamination are from Be
There are several sources, such as Ill Lab (LGFeinstein) (1980), but there are many views that impurities are contained in the resin composition, especially due to halogen ions, and this is noticeable when exposed to high temperatures.
ハロゲンを多分に含むものとして難燃剤と呼ばれる耐
熱特性に寄与するハロゲン化エポキシ樹脂を挙げること
ができる。通常難燃剤として、上述のハロゲン化エポキ
シ樹脂の他に三酸化アンチモンとを組み合わせて使用さ
れることが多い。A halogenated epoxy resin that contributes to heat resistance, which is called a flame retardant, may be mentioned as one containing a large amount of halogen. Usually, in combination with the above-mentioned halogenated epoxy resin, antimony trioxide is often used as a flame retardant.
耐燃性の向上に対しては、難燃剤の添加量を増やすこ
とを行ってきた。しかし単に添加量の増量は工業規制の
問題ばかりでなく高温保管特性を低下させる不都合な現
象が生じるため、両者の両立の可能な樹脂組成物系を得
ることは困難であった。To improve the flame resistance, the amount of the flame retardant added has been increased. However, simply increasing the amount of addition is not only a problem of industrial regulations, but also causes an undesired phenomenon of deteriorating high-temperature storage characteristics, so that it has been difficult to obtain a resin composition system that can achieve both.
その目的とするところは耐熱性及び成形性を劣化させ
ることなく、高温保管特性に優れた半導体封止用エポキ
シ樹脂組成物を提供することにある。An object of the present invention is to provide an epoxy resin composition for semiconductor encapsulation which is excellent in high-temperature storage characteristics without deteriorating heat resistance and moldability.
本発明はエポキシ樹脂、フェノールノボラック樹脂硬
化剤、硬化促進剤、三酸化アンチモン、ハロゲン化エポ
キシ樹脂、無機充填材及びその他添加剤からなる組成物
100重量部に対して、0.01〜10重量部の酸化剤を添加す
ることを特徴とする半導体封止用樹脂組成物である。The present invention provides a composition comprising an epoxy resin, a phenol novolak resin curing agent, a curing accelerator, antimony trioxide, a halogenated epoxy resin, an inorganic filler and other additives.
A resin composition for encapsulating a semiconductor, characterized in that 0.01 to 10 parts by weight of an oxidizing agent is added to 100 parts by weight.
エポキシ樹脂としてはビスフェノールＡ型エポキシ樹
脂、フェノールノボラック型エポキシ樹脂、複素環型エ
ポキシ樹脂及びこれらの変性樹脂がある。ハロゲン化エ
ポキシ樹脂には臭素化ビスフェノールＡ型エポキシ樹
脂、臭素化ノボラック型エポキシ樹脂等がある。フェノ
ールノボラック樹脂硬化剤はフェノールノボラック樹
脂、クレゾールノボラック樹脂及びこれらの変性樹脂等
がある。硬化促進剤としては第３級アミン、イミダゾー
ル、有機リン化合物を挙げることができる。Examples of the epoxy resin include bisphenol A type epoxy resin, phenol novolak type epoxy resin, heterocyclic type epoxy resin, and modified resins thereof. Examples of the halogenated epoxy resin include a brominated bisphenol A type epoxy resin and a brominated novolak type epoxy resin. Phenol novolak resin curing agents include phenol novolak resins, cresol novolak resins, and modified resins thereof. Examples of the curing accelerator include a tertiary amine, imidazole, and an organic phosphorus compound.
無機充填材としては溶融シリカ、結晶シリカがある。
その他の添加剤としては天然ワックス類、合成ワックス
類等の離型剤カーボンブラック、シランカップリング剤
その他熱可塑性樹脂等がある。Inorganic fillers include fused silica and crystalline silica.
Other additives include release agents such as natural waxes and synthetic waxes such as carbon black, silane coupling agents and other thermoplastic resins.
次に本発明において使用される酸化剤は過酸化物とオ
キソ酸等があり、過酸化物としては過酸化水素、酸化
銀、酸化銅、酸化マンガン（MnO2）四酸化シンチモン、
五酸化アンチモン、酸化鉛（PbO2）、オキソ酸としては
過マンガン酸、クロム酸等が望ましい。Next, the oxidizing agent used in the present invention includes peroxides and oxo acids, and the peroxides include hydrogen peroxide, silver oxide, copper oxide, manganese oxide (MnO 2 ) cinnamon tetroxide,
As antimony pentoxide, lead oxide (PbO 2 ), and oxo acid, permanganic acid, chromic acid and the like are desirable.
難燃剤として用いられるハロゲン化エポキシ樹脂と三
酸化アンチモンはその組合せによって大きく難燃化の相
乗効果を発揮させることが可能である。The combination of the halogenated epoxy resin and antimony trioxide used as a flame retardant can greatly exhibit a synergistic effect of flame retardation.
しかしながら、ハロゲン化エポキシ樹脂は高温時にお
いてハロゲンが遊離しやすく腐食の原因ともなるという
問題を有していた。However, the halogenated epoxy resin has a problem that halogen is easily released at a high temperature and causes corrosion.
しかし、この問題は酸化剤との組み合わせでクリアす
ることが可能である。However, this problem can be solved by a combination with an oxidizing agent.
酸化剤は難燃剤である三酸化アンチモンとハロゲン化
エポキシ樹脂の反応を促進し難燃効果を上げるために添
加するものである。The oxidizing agent is added to promote the reaction between antimony trioxide, which is a flame retardant, and a halogenated epoxy resin to enhance the flame retardant effect.
その量は組成物100重量部に対し0.01〜10重量部の範
囲が望ましい。10重量部を越えると封止成形後の不純物
となり、様々な不良の要因となる。0.01重量部未満だと
十分にその性能を引き出すことができない。The amount is preferably in the range of 0.01 to 10 parts by weight per 100 parts by weight of the composition. If it exceeds 10 parts by weight, it becomes an impurity after sealing molding and causes various defects. If the amount is less than 0.01 part by weight, the performance cannot be sufficiently brought out.
実施例１ 溶融シリカ70重量部、オルソクレゾールノボラックエ
ポキシ樹脂（エポキシ当量200、難化点70℃）18重量
部、フェノールノボラック樹脂（水酸基当量105、軟化
点110℃）９重量部、２−メチルイミダゾール2 0.5重量
部、三酸化アンチモン３重量部、臭素化ビスフェノール
Ａ型エポキシ樹脂（エポキシ当量370、軟化点70℃、臭
素含有率37％）２重量部、カルナバワックス２重量部、
カーボンブラック0.3重量部、酸化剤として過マンガン
酸カリウム８重量部を常温で十分に混合し、更に95〜10
0℃でコニーダ等により混練し、冷却後粉砕して成形材
料とし、これをタブレット化して半導体封止用樹脂組成
物を得た。Example 1 70 parts by weight of fused silica, 18 parts by weight of ortho-cresol novolak epoxy resin (epoxy equivalent: 200, difficulty point: 70 ° C.), 9 parts by weight of phenol novolak resin (hydroxyl equivalent: 105, softening point: 110 ° C.), 2-methylimidazole 2 0.5 parts by weight, antimony trioxide 3 parts by weight, brominated bisphenol A type epoxy resin (epoxy equivalent 370, softening point 70 ° C, bromine content 37%) 2 parts by weight, carnauba wax 2 parts by weight,
0.3 parts by weight of carbon black and 8 parts by weight of potassium permanganate as an oxidizing agent were sufficiently mixed at room temperature, and 95 to 10 parts were further mixed.
The mixture was kneaded at 0 ° C. with a kneader or the like, cooled and pulverized to obtain a molding material, which was tabletted to obtain a resin composition for semiconductor encapsulation.
得られた材料を金型温度175℃、硬化時間２分の成形
で硬化させ、得られた成形品を175℃、８時間で後硬化
した。The obtained material was cured by molding at a mold temperature of 175 ° C and a curing time of 2 minutes, and the obtained molded article was post-cured at 175 ° C for 8 hours.
このように、得られた成形品を180〜220℃の高温釜に
放置、50時間毎に取り出し成形品リードピン間の高温抵
抗変化率を調べた。この結果長時間抵抗特性を変化させ
ることなく、良好な高温保管特性を示した。結果を第１
表に示す。The molded product thus obtained was left in a high-temperature oven at 180 to 220 ° C., taken out every 50 hours, and the high-temperature resistance change between the molded product lead pins was examined. As a result, good high-temperature storage characteristics were exhibited without changing the long-term resistance characteristics. First result
It is shown in the table.
実施例２ 溶融シリカ70重量部、オルソクレゾールノボラックエ
ポキシ樹脂（エポキシ当量200、軟化点70℃）18重量
部、クレゾールノボラック樹脂（水酸基当量120、軟化
点115℃）９重量部、トリフェニルホスフィン0.5重量
部、三酸化アンチモン３重量部、臭素化ノボラック型エ
ポキシ樹脂（エポキシ当量270、軟化点85℃、臭素含有
率36％）２重量部、カルナバワックス２重量部、カーボ
ンブラック0.3重量部、酸化剤として過酸化水素８重量
部の組成とし、以下の混合、成形評価は実施例１と同様
に行った。結果を第１表に示す。Example 2 70 parts by weight of fused silica, 18 parts by weight of ortho-cresol novolak epoxy resin (epoxy equivalent: 200, softening point: 70 ° C.), 9 parts by weight of cresol novolak resin (hydroxyl equivalent: 120, softening point: 115 ° C.), 0.5 part by weight of triphenylphosphine Parts, antimony trioxide 3 parts by weight, brominated novolak type epoxy resin (epoxy equivalent 270, softening point 85 ° C, bromine content 36%) 2 parts by weight, carnauba wax 2 parts by weight, carbon black 0.3 part by weight, as oxidizing agent The composition was 8 parts by weight of hydrogen peroxide, and the following mixing and molding evaluations were performed in the same manner as in Example 1. The results are shown in Table 1.
比較例１ 酸化剤として過マンガン酸カリウムを添加しない以外
は実施例１と同一の組成とし、以下の混合、成形、評価
は実施例１と同様に行った。結果を第１表に示す。Comparative Example 1 The same composition as in Example 1 was used except that potassium permanganate was not added as an oxidizing agent. The following mixing, molding, and evaluation were performed in the same manner as in Example 1. The results are shown in Table 1.
〔発明の効果〕 本発明のエポキシ樹脂、フェノールノボラック樹脂効
果剤、硬化促進剤、三酸化アンチモン、ハロゲン化エポ
キシ樹脂、無機充填材、その他添加物及び酸化剤を必須
成分とする半導体封止用樹脂組成物は耐熱性、成形性に
も優れ、更に高温保管特性では従来法なら150hであった
ものが400hをクリアでき極めてバランスのとれた樹脂組
成物であるため封止用樹脂組成物として非常に信頼性の
高いものである。 [Effect of the Invention] The resin for semiconductor encapsulation containing the epoxy resin of the present invention, a phenol novolak resin effect agent, a curing accelerator, antimony trioxide, a halogenated epoxy resin, an inorganic filler, other additives and an oxidizing agent as essential components. The composition is excellent in heat resistance and moldability.In addition, the high temperature storage property is 150h in the conventional method, but it can clear 400h, and it is a very well-balanced resin composition. It is highly reliable.
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.6，ＤＢ名) C08L 63/00 - 63/10 C08K 3/22 C08G 59/62 H01L 23/29 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int. Cl. 6 , DB name) C08L 63/00-63/10 C08K 3/22 C08G 59/62 H01L 23/29
Claims (1)
重量部 に対して0.01〜10重量部の酸化剤を添加することを特徴
とする半導体封止用樹脂組成物。1. An epoxy resin, (B) a phenol novolak resin curing agent, (C) a curing accelerator, (D) antimony trioxide, (E) a halogenated epoxy resin, (F) an inorganic filler and other additives. Composition 100
A resin composition for semiconductor encapsulation, wherein 0.01 to 10 parts by weight of an oxidizing agent is added to parts by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23258890A JP2933696B2 (en) | 1990-09-04 | 1990-09-04 | Epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23258890A JP2933696B2 (en) | 1990-09-04 | 1990-09-04 | Epoxy resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04114028A JPH04114028A (en) | 1992-04-15 |
| JP2933696B2 true JP2933696B2 (en) | 1999-08-16 |
Family
ID=16941717
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23258890A Expired - Fee Related JP2933696B2 (en) | 1990-09-04 | 1990-09-04 | Epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2933696B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2726213B2 (en) * | 1993-03-19 | 1998-03-11 | 住友ベークライト株式会社 | Resin composition for semiconductor encapsulation |
-
1990
- 1990-09-04 JP JP23258890A patent/JP2933696B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04114028A (en) | 1992-04-15 |
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