JP2934331B2 - High frequency amplifier - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-frequency amplifier which is supplied with power from the outside and is driven.

[0002]

2. Description of the Related Art Conventionally, a high-frequency amplifier is provided in a shielded internal space in which a case body and a case cover formed of a conductive material or the like are combined and a power is supplied from the outside to the high-frequency amplifier. There is. In this high-frequency amplifier, the power supply wiring is inserted through a power supply hole provided in the case body and connected to the high-frequency amplifier circuit.

[0003]

By the way, even if the high-frequency amplifier circuit is arranged in the shielded high-frequency amplifier inside space, if the high-frequency component from the high-frequency amplifier circuit is superimposed on the power supply line, the power supply line And leaks to the outside and is transmitted as unnecessary radiation.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problem, and an object of the present invention is to provide a high-frequency amplifier which is driven by being supplied with power from the outside, wherein a high-frequency component is supplied to a power supply wiring. It is an object of the present invention to provide a high-frequency amplifier that prevents the propagation of the noise and eliminates unnecessary radiation to the outside.

[0005]

In order to solve the above-mentioned problems, a high frequency amplifying circuit is provided in a shielded internal space in which a case body and a case cover are combined, and the high frequency amplifying circuit is externally provided to the high frequency amplifying circuit. A high-frequency amplifier to which power is supplied and driven, which is communicated with a power supply hole provided in the case main body and partitioned into the internal space by a wall surface having at least one open surface integrated with the case main body. The formed power supply unit, an inner lid formed of a conductive material so as to cover and shield the entire opening surface of the power supply unit, and a pair of through capacitors in which an external electrode is connected to the inner lid or the wall surface. A power supply wiring inserted into the power supply unit from the power supply hole and connected to the high-frequency amplifier circuit via a center electrode of the feedthrough capacitor ;
Separately from the internal space in which the high-frequency amplifier circuit is provided,
The power supply section is
The external electrode and the power supply line connected to the core electrode;
It is characterized by shielding .

[0006]

The power supply unit communicates with a power supply introduction hole provided in the case main body, and the case main body and the case cover are combined to form a shielded internal space with a wall surface having at least one open surface integrated with the case main body. It is formed by partitioning. The inner lid is formed of a conductive material so as to cover and shield the entire opening surface of the power supply unit. Further, the pair of feedthrough capacitors has external electrodes connected to the inner lid or the wall surface of the case body, respectively. The power supply wiring is inserted from the power supply hole into the power supply unit, and supplies power to a high-frequency amplifier circuit disposed in the internal space via the center electrode of the feedthrough capacitor to drive the high frequency amplifier circuit. In this way, the power supply section is also composed of the case body and inner lid in the shielded internal space where the case body and case cover are combined.
Separately sealed and shielded. Then, the high-frequency component radiated from the high-frequency amplifier circuit disposed in the internal space and superimposed on the power supply wiring is reliably short-circuited (bypassed) by a through capacitor in which an external electrode is connected to a wall integral with the inner lid or the case body. Will be done.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to specific embodiments.

FIG. 1 is a front view showing the appearance of a high-frequency amplifier 100 according to the present invention, FIG. 2 is a right side view of FIG. 1, and FIG. 3 is a bottom view of FIG. FIG. 4 is a front view showing a state where the case cover 50 is removed from the high-frequency amplifier 100 according to the embodiment, and FIG. 5 is a front view showing a state where the middle panel 40 is removed from FIG. FIG. 6 is a longitudinal sectional view of the high-frequency amplifier 100 according to the embodiment.

In the high-frequency amplifier 100, a case body 10 and a case cover 50 are combined so as to be openable and closable at hinge portions 11, 51, respectively. The case body 10 is formed by aluminum die-casting, which is a conductive material. A high-frequency amplifier circuit 3 is provided in an internal space 10a of the case body 10.
0 and a power transformer 31 are provided. The power supply unit 15 is partitioned into an inner space 10a of the case body 10 by a wall surface 10b integral with the case body 10, and sealed by the wall surface 10b and an inner lid 25 made of a conductive material.
Are formed. Also, the inner space 10 of the case body 10
The middle panel 40 is assembled so as to cover a. The middle panel 40 is made of a conductive material having a spring property.
The middle panel 40 has a fitting dimension slightly larger than the dimension of the inner surface of the side wall of the case body 10 and the outer peripheral end face is
It has a groove 41 formed in a U-shaped gutter shape all around so as to be in a direction opposite to the direction of insertion into zero. The outer peripheral end surface of the groove 41 is in contact with the entire periphery of the inner surface of the side wall of the case body 10. Further, a shield plate 60 made of a conductive material is attached to the inner surface of the resin molded case cover 50 so as to face and cover the middle panel 40 when the case cover 50 is closed. The shield plate 60 is bent so that the outer peripheral surface having the spring property is in contact with the periphery of the middle panel 40 over the entire periphery.

A cord 20, which is a power supply line for supplying 100V AC as a household power supply, is inserted into the case main body 10 through a power supply introduction hole 16 provided on the lower right side of the case main body 10. At this time, the tip of the cord 20 is located in the power supply unit 15, and the cord 20 is fixed to the case body 10 by a bushing 21 provided integrally. The tip of the cord 20 is soldered to the center electrode of the feedthrough capacitor 26 to which the external electrode is soldered and connected to the inner lid 25. The cord 20 is connected to the case main body 1 via the center electrode of the feedthrough capacitor 26.
0 is connected to a high frequency amplifier circuit 30 disposed in the internal space 10a. In practice, the high-frequency amplifier circuit 30 is supplied with 100 V AC, transformed into 20 V AC by a power transformer 31, and driven at 15 V DC after passing through a rectifier circuit and a stabilized power circuit (not shown).

Next, the operation will be described. In the internal space 10 a of the case main body 10 of the high-frequency amplifier 100, high-frequency components are normally emitted by driving the high-frequency amplifier circuit 30. Here, as described above, the inner space 10a of the case body 10 is covered with the middle panel 40. As shown in FIG. 4, external adjustment holes 40a, 40b, and 40c are provided in the middle panel 40 at positions corresponding to portions such as the variable resistor of the high-frequency amplifier circuit 30. That is, the structure is such that the adjustment work can be performed from the holes 40a, 40b, 40c only by opening the case cover 50. For this reason, the inner space 10a of the case main body 10 is not completely sealed only by the middle panel 40. Therefore, when the case body 10 and the case cover 50 are closed, a shield plate 60 is disposed on the inner surface of the case cover 50 so as to be in contact with the entire periphery of the middle panel 40. That is, the holes 40a, 40 of the middle panel 40
High frequency components leaking from b and 40c are also completely shielded by the shield plate 60. Therefore, the internal space 10a of the case main body 10 is completely shielded.

As described above, the high-frequency amplifier circuit 30
The power supply unit 15 for supplying power to the power supply is sealed and shielded by a wall surface 10 b integral with the case body 10 and an inner lid 25. That is, even if a high-frequency component radiated by driving the high-frequency amplifier circuit 30 is superimposed on the wiring line of the cord 20, the through-capacitor 26 connected to the inner lid 25 connects to the inner lid 25.
And the case body 10 is short-circuited.

The high-frequency amplifier 10 constructed as described above
At 0, a leakage test for high frequency was performed. The conditions for this leak test were an output level of 98 dBμ and a measurement frequency of 220 MH.
z, and the measurement distance was 1 m. Here, with the middle panel 40 and the shield plate 60 removed, the inner lid 25 of the power supply unit 15 is also removed, and the cord 20 is directly connected to the high-frequency amplifier circuit 30 of the case body 10, the horizontal direction is 38.2 dBμ.
V / m and 47.2 dBμV / m in the vertical direction. Next, in the case where the inner lid 25 is attached with the middle panel 40 and the shield plate 60 removed, and the cord 20 is connected to the high-frequency amplifier circuit 30 of the case body 10 via the feedthrough capacitor 26,
The horizontal direction was 16.2 dBμV / m and the vertical direction was 12.2 dBμV / m. That is, the inner lid 2 to which the feedthrough capacitor 26 is connected
By assembling 5 to the power supply unit 15, in the horizontal direction, 10 ^{[(38.2-16.2) / 20]} ≒ 12.6, and unnecessary radiation is about 1 /
Improved to 10 or less. In the vertical direction, 10
^{[(47.2-12.2) / 20]} ≒ 56.2, and unnecessary radiation was ^{reduced to} about 1/50 or less. Furthermore, the measurement results when the middle panel 40, the shield plate 60, and the inner lid 25 were attached were determined to be below the measurement limit in both the horizontal and vertical directions and that there was no unnecessary radiation. That is, in the high-frequency amplifier 100 of the present invention, the leakage of the high-frequency component from the internal space 10a of the case body 10 to the outside due to the propagation of the cord 20 or the like is completely prevented.

FIG. 7 is a longitudinal sectional view showing a case where the external electrodes of the feedthrough capacitor 26 in the high-frequency amplifier 100 are screwed to the wall surface 10b integral with the case body 10 and are electrically connected. As described above, the case body 10 is formed by aluminum die casting. That is, the external electrodes of the feedthrough capacitor 26 cannot be soldered to the wall surface 10b of the case body 10. Therefore, in this case, the feedthrough capacitor 26 having a screw on the external electrode is used, and the screw portion 1 provided on the wall surface 10b of the case body 10 is used.
It is electrically connected by directly screwing into 0c.
Further, when a not-shown hole is provided in the wall surface 10b of the case body 10, an external electrode having a screw of the feedthrough capacitor 26 is inserted into the hole, and the other side is inserted through a spring washer or the like from the opposite side. Tightening with a nut results in electrical connection.

Here, similarly to the above-described embodiment, the power supply unit 15 for supplying power to the high-frequency amplifier circuit 30 is connected to the case body 1.
The inner wall 25 and the inner cover 25 are hermetically sealed and shielded. Therefore, even if a high frequency component radiated by driving the high frequency amplifier circuit 30 is superimposed on the wiring line of the cord 20, the feedthrough capacitor 2 connected to the wall surface 10b thereof
6 is short-circuited via the wall surface 10b and the case body 10.

[0016]

According to the present invention, there is provided a power supply part which is communicated with a power supply introduction hole provided in a case main body and is formed by partitioning the internal space with a wall having at least one open surface integral with the case main body; An inner lid formed of a conductive material so as to cover and shield the entire opening surface of the power supply unit, a pair of feedthrough capacitors having external electrodes connected to the inner lid or the wall surface, and a power supply hole to the power supply unit. And a power supply wiring which is inserted and connected to the high-frequency amplifier circuit via the center electrode of the feedthrough capacitor . As a result, the high-frequency amplifier circuit
In the power supply section shielded separately from the internal space
Power supply line connected to the center electrode of the feedthrough capacitor
Can be shielded. Therefore, the high-frequency component superimposed on the power supply wiring radiated from the high-frequency amplifier circuit is short-circuited through the inner lid or the wall surface by the feedthrough capacitor connected to the wall surface integral with the inner lid or the case body. Therefore, the high-frequency amplifier of the present invention has an effect that high-frequency components do not leak from the power supply unit to the outside and unnecessary radiation from the power supply wiring exposed to the outside from the high-frequency amplifier is eliminated.

[Brief description of the drawings]

FIG. 1 is a front view showing the appearance of a high-frequency amplifier according to a specific embodiment of the present invention.

FIG. 2 is a side view of FIG.

FIG. 3 is a bottom view of FIG. 1;

FIG. 4 is a front view showing a state where a case cover of the high-frequency amplifier according to the embodiment is removed.

FIG. 5 is a front view showing a state where a middle panel is removed from FIG. 4;

FIG. 6 is a longitudinal sectional view of the high-frequency amplifier according to the embodiment.

FIG. 7 is a longitudinal sectional view showing a case where external electrodes of a feedthrough capacitor in a high-frequency amplifier according to the present invention are screwed into a wall surface of a case body and electrically connected thereto.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10-Case main body 10a-Internal space 10b-Wall surface 11-Hinge part 15-Power supply part 16-Power supply introduction hole 20-Cord (power supply wiring) 21-Bushing 25-Inner lid 26-Penetrating capacitor 30-High frequency amplifier circuit 31- Power transformer 40-middle panel 40a, 40b, 40c-hole 4
1-Groove 50-Case cover 51-Hinge 60-Shield plate 100-High frequency amplifier

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H05K 9/00 H01P 1/00

Claims (1)

(57) [Claims] 1. A high-frequency amplifier in which a case main body and a case cover are combined and a high-frequency amplifier circuit is provided in a shielded internal space, and power is supplied from an external source to the high-frequency amplifier circuit to be driven. A power supply unit which is communicated with a power supply introduction hole provided in the power supply unit and is formed by partitioning the internal space with a wall surface having at least one surface integrated with the case body and having an opening surface; and covering the entire opening surface of the power supply unit. An inner lid formed of a conductive material so as to shield; a pair of feedthrough capacitors in which an external electrode is connected to the inner lid or the wall surface; and the feedthrough capacitor inserted into the power supply unit from the power supply hole. Power supply wiring connected to the high-frequency amplifier circuit through a center electrode of the high-frequency amplifier circuit.
The power supply shielded separately from the internal space
At the source, connected to the center electrode of the feedthrough capacitor
A high frequency amplifier, wherein the power supply line is shielded .