JP2936768B2 - Semiconductor processing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a runner-shaped resin piece which remains and adheres to a lead frame when a plurality of packages, particularly a QFP (quad flat package) are manufactured by resin molding in a semiconductor assembly facility. The present invention relates to a semiconductor processing apparatus for peeling off.

[0002]

2. Description of the Related Art Generally, in a semiconductor assembly facility, when a plurality of packages are manufactured on a lead frame by resin molding, a runner-shaped resin piece remaining on and adhered to the lead frame is peeled off in a subsequent process. There is a need. This is usually called degate or cull break. Therefore, hereinafter, the above processing is simply referred to as degate.

[0003] This degate typically has a plate butting method and a pin butting method. As shown in FIG. 4A, the former plate pushing method is performed by resin molding.
The resin 23 protruding upward from the runner-shaped resin piece 21 formed together with the package PK through the degate hole 22 of the lead frame RF (see FIG. 5) 22 is pressed from above by a pusher 24 to peel off the resin piece 21. It is to be removed.

[0004] On the other hand, in the latter method of pushing a pin, as shown in FIG. 4B, a part of a resin piece 21 exposed upward from the degate hole 22 is lowered by a plurality of pins 25 provided on the lower surface of a pusher 24. , The resin piece 2
1 is removed and removed. In both cases, the degate is performed by holding the lead frame RF and the package PK on the pallet 26.

[0005] In particular, as shown in FIG. 7, the degate by the plate thrust method is, as shown in FIG. The degate is performed so that the package PK on the lead frame RF is held substantially horizontally when pressed by the pusher 24.

[0006]

The above-mentioned degate has the following disadvantages depending on the type of package to be formed.

That is, a flat DIP (flat dup) in which outer leads are led out to two opposing sides of the package.
In the case of al in-line package, there is no problem, but a QFP (quad flat page) in which outer leads are led out to all four sides of the package.
Cage), as shown in FIG. 6, a resin (hereinafter simply referred to as a gate) 2 corresponding to a gate of a runner.
There is a problem that 1a remains.

[0008] In the above plate pushing method,
When the pusher 24 is lowered and the resin piece 21 is pressed,
As shown in FIG. 7B, the package PK is held in a substantially horizontal direction on the pallet 26.
As shown in FIG. 8, the peeling starts from the resin (hereinafter simply referred to as frame cull) 21b at the portion corresponding to the runner of the runner, and finally the gate 21a is peeled off. If the degate is performed in a state where 21 is not sufficiently cured, the gate 21a will remain in the lead frame RF. Since the gate 21a is very thin, its curing is fast. However, if there is an uncured portion between the gate 21a and the frame cull 21b, the gate 21a is cut at that portion, and as a result, the gate 21a remains on the lead frame RF. .

[0009] The above-mentioned gate residue causes inconvenience of causing resin to adhere to the outer lead surface and damaging the punch and die used for the shape processing in the subsequent step, for example, the lead shape processing step. Therefore, reducing the above gate residue leads to improvement in QFP quality and prevention of manufacturing accidents.

Therefore, conventionally, after the above-mentioned degate, the remaining gate is found, for example, visually, and the found gate 21a is mechanically cut off, for example, manually. Further, in order to reduce the probability of remaining gates, during the degate process, air blow is performed to accelerate the curing of the resin pieces 21.

However, it is very troublesome to visually find out the remaining gate, and manually shaving off the gate 21a causes a complicated manufacturing process, resulting in an increase in manufacturing cost in the future. There is an inconvenience. The same applies to the air blow, which requires equipment and process management for performing the air blow, which leads to an increase in manufacturing cost.

The present invention has been made in view of such a problem, and an object of the present invention is to remove a runner-shaped resin piece without generating a gate residue on a lead frame at the time of degate processing on a QFP. It is an object of the present invention to provide a semiconductor processing apparatus capable of improving the quality of a semiconductor device, simplifying a manufacturing process, and reducing a manufacturing cost.

[0013]

According to the present invention, a lead frame RF in which a plurality of packages PK are arranged and formed by resin molding is put between a pusher 3 and a pallet 5, and a lead is pressed by the pusher 3 to thereby form a lead. In the semiconductor processing apparatus A in which the runner-shaped resin pieces 1 remaining and adhered to the frame RF are peeled off, each package PK is inclined on the upper surface of the pallet 5 when pressed by the pusher 3. (A concave portion 7 and a stepped portion 8) are provided in correspondence with the above.

[0014]

According to the configuration of the present invention described above, steps (recesses 7) corresponding to each package PK are provided on the upper surface of the pallet 5 so that each package PK is inclined when pressed by the pusher 3.
And the stepped portion 8), the peeling state of the runner-shaped resin piece 1 formed together with the package PK in the resin molding process, particularly the portion of the gate 2a,
Peeling starts from the gate 2a, and finally the frame
The portion of the cull 2 will be peeled off.

Therefore, even if the resin piece 1 is not sufficiently cured, the resin piece 1 is peeled off from the gate 2a, which cures quickly, so that the resin piece 1 is not cut in the vicinity of the gate 2a in the middle of peeling. At the time of degate, no gate remains on the lead frame RF. as a result,
Conventionally, it is possible to prevent the resin from adhering to the outer lead surface in the lead shape processing process, which is caused by the remaining gate, and to prevent the punch and die used for the shape processing from being damaged, thereby improving the quality of the semiconductor device. , And the manufacturing process can be simplified and the manufacturing cost can be reduced.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. FIG. 1 shows a semiconductor processing apparatus according to the present embodiment, in particular, when a package (especially QFP) PK is formed on a lead frame RF by resin molding, a runner-shaped resin piece 1 attached to the lead frame RF is removed. FIG. 1 is a configuration diagram showing a resin stripping device for the purpose, that is, a degate device A.

The degate device A performs degate by a plate butting method. For example, a lead frame RF in which a large number of packages PK are arranged in two rows is used.
In a runner-shaped resin piece 1 simultaneously formed by the above-mentioned resin molding, a space corresponding to a portion corresponding to a runner of a runner, that is, a space for accommodating a work W in a form of being laterally connected and connected by a frame cull 2. Above the accommodation space, two pushers 3 are respectively arranged corresponding to the lead frame RF, and one pusher 3 is provided between the pushers 3.
The two pallets 5 are arranged below the accommodation space in correspondence with the lead frames RF, respectively.
One cull presser 6 is disposed therebetween.

In this embodiment, the pallet 5 is provided with a recess 7 and a step 8 on the upper surface thereof. The concave portion 7 is formed by a package PK formed on the lead frame RF.
The medium PK is provided at a position corresponding to the package PK disposed on the frame cull 2 side, that is, the inside thereof, and has a vertical (length in a direction perpendicular to the paper surface in the drawing) vertical direction in the package PK. Is approximately the same as or slightly longer than the length a, and the width a is about 1 /
The length is 3 to 2/3 (1/2 length in this example).

The step portion 8 is provided at a position corresponding to the package PK disposed outside, and has a size similar to that of the concave portion 7 in the vertical direction (in the drawing, the direction perpendicular to the paper surface). Length) is substantially the same as or slightly longer than the vertical length of the package PK, and the horizontal width c is approximately 1/3 to 2/3 of the horizontal length b of the package PK (in this example, 1/2 length).

The arrangement relationship between the recess 7 and the step 8 will be described in more detail. The inner end d of the recess 7 is located closer to the center than the inner end e of the corresponding package PK. The outer end f is located outside the outer end g of the corresponding package PK.

The operation of the degate device A according to this embodiment will be specifically described. First, the work W that has been subjected to the resin molding is put between the pallet 5 and the pusher 3, and the package PK formed on each lead frame RF is transferred to the pallet 5
Put on top. After that, the cull pusher 4 is lowered, and the frame cull 2 is pressed by the cull pusher 4.

Next, the cull presser 6 is raised, and the frame cull 2 is clamped and fixed between the cull pusher 4 and the cull presser 6. Next, the pusher 3 is lowered to press the resin piece 1 downward. This pressing is performed twice consecutively. When pressed by the pusher 3, each package PK
As shown in FIG. 2, the state is obliquely inclined by the concave portion 7 and the step portion 8 formed on the upper surface of the pallet 5. That is, each package PK is in an inclined state with the outer end h of the concave portion 7 or the inner end i of the stepped portion 8 as a fulcrum and the upper surface directed toward the center. Therefore, as shown in FIG. 3, the resin piece 1 begins to peel off from the gate 2a first, then the frame cull 2 peels off, and finally the lead frame R
Peeled from F. Next, the carpusher 4 is further lowered to push the separated resin piece 1 away from the lead frame RF. At this time, the cull presser 6 also lowers at the same time.

By following the above operation sequence, the runner-shaped resin piece 1 formed together with the package PK by resin molding is peeled off and removed from the lead frame RF. Thereafter, the lead frame RF is supplied to the next lead shape processing step, and the lead frame RF is pressed into a desired outer lead shape.

As described above, according to this embodiment, the recesses 7 having a width smaller than the width b of the package PK corresponding to each package PK are formed on the upper surface of the pallet 3 so that each package PK is inclined when pressed by the pusher 3. Since the stepped portion 8 is provided, the peeling state of the runner-shaped resin piece 1 starts from the gate 2a, and then the frame cull 2 is peeled.

Therefore, even if the resin piece 1 is not sufficiently cured, the resin piece 1 is peeled off from the gate 2a, which cures quickly, so that the resin piece 1 does not break near the gate 2a during the peeling process. At the time of degate, no gate remains on the lead frame RF. as a result,
Conventionally, it is possible to prevent the resin from adhering to the outer lead surface in the lead shape processing process, which is caused by the remaining gate, and to prevent the punch and die used for the shape processing from being damaged, thereby improving the quality of the semiconductor device. Can be achieved.
In addition, since there is no need to perform a conventional air blow process or a mechanical shaving operation to eliminate the gate residue, the manufacturing process can be simplified and the manufacturing cost can be reduced.

[0026]

According to the semiconductor processing apparatus of the present invention,
At the time of degate processing for the QFP, the runner-shaped resin piece can be peeled off without generating a gate residue on the lead frame, so that the quality of the semiconductor device can be improved, and the manufacturing process is simplified and the manufacturing cost is reduced. Can be reduced.

[Brief description of the drawings]

FIG. 1 is a configuration diagram illustrating a semiconductor processing apparatus according to an embodiment, particularly, a degate apparatus.

FIG. 2 is an operation diagram showing a degate by the degate device according to the embodiment.

FIG. 3 is an explanatory view showing a peeled state of a resin piece according to the embodiment.

FIG. 4A is a configuration diagram showing a degate device using a plate butting method according to a conventional example. FIG. 1B is a configuration diagram showing a degate device using a pin butting method according to a conventional example.

FIG. 5 is a plan view of a main part showing a lead frame.

FIG. 6 is a plan view of a main part showing a gate remaining;

FIG. 7 is an operation diagram showing a degate by a conventional plate butting method.

FIG. 8 is an explanatory view showing a peeled state of a resin piece according to a conventional example.

[Explanation of symbols]

 Reference Signs List A Degate device 1 Runner-shaped resin piece 2 Frame / cull 3 Pusher 4 Kulpusher 5 Pallet 6 Cull retainer 7 Recess 8 Stepped portion W Work RF Lead frame PK package

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-63-124426 (JP, A) JP-A-2-194439 (JP, A) Jpn. Field (Int.Cl. ⁶ , DB name) H01L 21/56

Claims (1)

(57) [Claims] A lead frame in which a plurality of packages are arranged and formed by resin molding is put between a pusher and a pallet, and a runner-shaped resin piece remaining on and adhered to the lead frame is pressed by the pusher. A semiconductor processing apparatus, wherein a step is provided on an upper surface of the pallet so as to incline the respective packages when pressed by the pusher, the steps corresponding to the respective packages.