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JP2943001B2 - Joining method of nitride ceramics - Google Patents
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JP2943001B2 - Joining method of nitride ceramics - Google Patents

Joining method of nitride ceramics

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Publication number
JP2943001B2
JP2943001B2 JP15547290A JP15547290A JP2943001B2 JP 2943001 B2 JP2943001 B2 JP 2943001B2 JP 15547290 A JP15547290 A JP 15547290A JP 15547290 A JP15547290 A JP 15547290A JP 2943001 B2 JP2943001 B2 JP 2943001B2
Authority
JP
Japan
Prior art keywords
nitride
joining
nitride ceramics
ceramics
strength
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP15547290A
Other languages
Japanese (ja)
Other versions
JPH0450180A (en
Inventor
孝宏 山川
修 花岡
信之 南
秀人 吉田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiheiyo Cement Corp
Original Assignee
Taiheiyo Cement Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiheiyo Cement Corp filed Critical Taiheiyo Cement Corp
Priority to JP15547290A priority Critical patent/JP2943001B2/en
Publication of JPH0450180A publication Critical patent/JPH0450180A/en
Application granted granted Critical
Publication of JP2943001B2 publication Critical patent/JP2943001B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、接合強度の優れた窒化部系セラミックスの
接合方法に関するものである 〔従来の技術〕 従来、窒化物系セラミックスの接合は、Ti、Zrなどの
活性金属を含むろう材(Ag−Cu系、Ni−Cu系など)を用
いて、真空中で該ろう材の融点以上に加熱して行なわれ
ていた。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method for bonding nitride-based ceramics having excellent bonding strength. [Prior Art] Conventionally, a method for bonding nitride-based ceramics is Ti And a brazing material (Ag-Cu-based, Ni-Cu-based, etc.) containing an active metal such as Zr or the like, and heated in a vacuum to a temperature equal to or higher than the melting point of the brazing material.

この接合原理としては、窒化物系セラミックスと活性
金属が反応して漏れ性が向上するためであるといわれて
いる。
It is said that this bonding principle is due to the fact that the nitride ceramics and the active metal react with each other to improve the leakage.

〔発明が解決しようとする課題〕[Problems to be solved by the invention]

従来の方法は、他の接合方法と比べれば接合強度は高
いものの、例えば素材強度が100kg/mm2の窒化ケイ素ど
うしを接合した場合、その接合強度は約40kg/mm2で、素
材強度の40%程度のものした得られず、セラミックス素
材の特徴を充分生かしきれなかった。
Conventional methods, although the bonding strength compared with other joining methods high, for example if the material strength by joining silicon nitride to each other of 100 kg / mm 2, in that the bonding strength of about 40 kg / mm 2, the material strength 40 %, And the characteristics of the ceramic material could not be fully utilized.

〔課題を解決するための手段〕[Means for solving the problem]

発明者らは、接合強度をセラミックス自体の素材強度
に近づけるべく研究を重ねた結果、窒化物系セラミック
スの接合面を予め窒素イオン注入処理することによっ
て、活性金属含有ろう材による接合強度を高めることに
成功し、本発明を完成した。
The inventors have conducted research to bring the joining strength close to the material strength of the ceramic itself. As a result, the joint surface of the nitride-based ceramics was subjected to nitrogen ion implantation beforehand to increase the joining strength of the active metal-containing brazing material. And completed the present invention.

すなわち本発明は、窒化物系セラミックスを活性金属
含有ろう材を用いて接合するに際し、窒化物系セラミッ
クスの接合面に予め窒素をイオン注入しておくことを特
徴とする窒化物系セラミックスの接合方法である。
That is, the present invention provides a method for joining nitride-based ceramics, which comprises, before joining nitride-based ceramics with an active metal-containing brazing material, implanting nitrogen ions in advance in a joint surface of the nitride-based ceramics. It is.

(窒化物系セラミックス) 本発明の接合方法は、Si3N4、AlNの他、サイアロンな
ど、従来窒化物系セラミックスとして使用されているも
のに一般的に適用できる。
(Nitride Ceramics) The bonding method of the present invention can be generally applied to Si 3 N 4 , AlN, sialon, and other materials conventionally used as nitride ceramics.

(イオン注入) 窒化物系セラミックスの接合面への窒素イオンの注入
(イオン打込み)は、従来、金属面への窒素注入などに
用いられるイオン注入装置が用いられる。
(Ion Implantation) Injection (ion implantation) of nitrogen ions into the joint surface of the nitride-based ceramics is performed by using an ion implantation apparatus used for nitrogen implantation on a metal surface.

イオン注入量は、窒化物系セラミックスや焼結助剤の
種類などにより最適量が異なるため限定はできないが、
おおむね1013〜1018ion/cm2の範囲が好ましい。イオン
注入量が少なすぎると接着効果は減少し、いまた、多す
ぎるセラミックスが破壊され易くなる。
The amount of ion implantation can not be limited because the optimum amount varies depending on the type of nitride ceramics and sintering aid, etc.
A range of about 10 13 to 10 18 ions / cm 2 is preferred. If the amount of ion implantation is too small, the adhesive effect is reduced, and too much ceramic is easily broken.

(ろう材及び接合方法) 結合に用いられるろう材は、窒化物系セラミックスの
接合に従来から使用されている活性金属含有ろう材で、
Ti−Ag−CuやTi−Ni−Cuなどの市販品が用いられ、ま
た、銀ろう箔とTi箔を重ねるなど、従来公知の接合材が
用いられる。
(Brazing material and joining method) The brazing material used for joining is an active metal-containing brazing material conventionally used for joining of nitride ceramics.
A commercially available product such as Ti-Ag-Cu or Ti-Ni-Cu is used, and a conventionally known bonding material such as laminating a silver brazing foil and a Ti foil is used.

ろう材は、通常その活性ろう材の液相温度より50〜10
0℃高い温度で数分〜数時間、1×10-4Torr以下の真空
下又はArやHeなどの不活性ガス雰囲気内で加熱する。
The brazing material is usually 50 to 10 degrees below the liquidus temperature of the active brazing material.
The substrate is heated at a high temperature of 0 ° C. for several minutes to several hours under a vacuum of 1 × 10 −4 Torr or less or in an atmosphere of an inert gas such as Ar or He.

〔作用〕[Action]

本発明における窒化物系セラミックスのろう付けにお
ける接合面の窒素注入処理の効果について、その作用は
必ずしも明らかではないが、以下に述べるようなもので
あろうと思われる。
Regarding the effect of the nitrogen implantation treatment on the joint surface in brazing the nitride ceramics in the present invention, the effect is not necessarily clear, but it is considered as follows.

すなわち、例えばSi3N4をTi含有ろうを用いて接合す
ると、Si3N4+9Ti→4TiN+Si3Ts5の反応が起こり、この
反応により漏れ性が向上して接合が行なわれることが知
られている。
That is, for example, when Si 3 N 4 is joined using a Ti-containing solder, a reaction of Si 3 N 4 +9 Ti → 4 TiN + Si 3 Ts 5 occurs, and it is known that this reaction improves the leakiness and performs the joining. I have.

ところが、上記式により生成するSi3Ti5は低強度で、
かつ、脆いと言われており、多量に生成すると、接合強
度は低下してゆくと考えられる。
However, Si 3 Ti 5 produced by the above formula has low strength,
And it is said that it is brittle, and it is considered that when formed in a large amount, the bonding strength decreases.

一方、本発明においては、Tiは注入した窒素と優先的
に反応し、Si3N4の分解に伴うSi3Ti5の生成が抑えら
れ、結果としてSi3Ti5による接合強度の低下が少なく、
窒素注入を行わない場合に比べて接合強度が向上するも
のと推定される。
On the other hand, in the present invention, Ti reacts preferentially with the implanted nitrogen, the generation of Si 3 Ti 5 accompanying the decomposition of Si 3 N 4 is suppressed, and as a result, the decrease in bonding strength due to Si 3 Ti 5 is small. ,
It is estimated that the joining strength is improved as compared with the case where nitrogen implantation is not performed.

〔実施例〕〔Example〕

実施例 (株)日本セラテック社のSi3N4、サイアロン及びAlN
を用い、4×5×20mmの試料を作製し、接合面に62keV
の粒子エネルギーで1016ion/cm2の窒素を注入した。活
性ろう材としてTi−Ag−Cuろう(田中貴金属社製)を用
い、それぞれ同種セラミックスどうしの接合を行った。
Examples Si 3 N 4 , Sialon and AlN of Japan Ceratech Co., Ltd.
A 4 × 5 × 20 mm sample was prepared using
10 16 ions / cm 2 of nitrogen were implanted at a particle energy of. Using Ti-Ag-Cu brazing (manufactured by Tanaka Kikinzoku Co., Ltd.) as the active brazing material, the same ceramics were joined to each other.

得られた各接合体について、それぞれ接合面がまん中
になるようにして3×4×40mmの形状に加工し、JIS−
R−1601に準じて曲げ試験を行った。結果を表−1に示
す。
Each of the obtained joined bodies was processed into a shape of 3 × 4 × 40 mm so that the joining surface was in the middle, and the JIS-
A bending test was performed according to R-1601. The results are shown in Table 1.

比較例 窒素を注入しなかった以外は実施例と同様に操作を行
った。結果を表−1に示す。
Comparative Example The same operation as in the example was performed except that nitrogen was not injected. The results are shown in Table 1.

〔発明の効果〕 本発明により窒化物系セラミックス接合体の強度が向
上し、今まで接合強度が低いため利用できなかった部分
にも接合体として用いることが可能となった。
[Effects of the Invention] According to the present invention, the strength of a nitride-based ceramics joined body has been improved, and it has become possible to use as a joined body even a part which could not be used due to its low joining strength.

フロントページの続き (58)調査した分野(Int.Cl.6,DB名) C04B 37/00 C04B 41/80 Continuation of front page (58) Field surveyed (Int.Cl. 6 , DB name) C04B 37/00 C04B 41/80

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】窒化物系セラミックスを活性金属含有ろう
材を用いて接合するに際し、窒化物系セラミックスの接
合面に予め窒素をイオン注入しておくことを特徴とする
窒化物系セラミックスの接合方法。
1. A method for joining nitride ceramics, comprising: before joining nitride ceramics using an active metal-containing brazing material, implanting nitrogen ions in advance into a joint surface of the nitride ceramics. .
JP15547290A 1990-06-15 1990-06-15 Joining method of nitride ceramics Expired - Lifetime JP2943001B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15547290A JP2943001B2 (en) 1990-06-15 1990-06-15 Joining method of nitride ceramics

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15547290A JP2943001B2 (en) 1990-06-15 1990-06-15 Joining method of nitride ceramics

Publications (2)

Publication Number Publication Date
JPH0450180A JPH0450180A (en) 1992-02-19
JP2943001B2 true JP2943001B2 (en) 1999-08-30

Family

ID=15606803

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15547290A Expired - Lifetime JP2943001B2 (en) 1990-06-15 1990-06-15 Joining method of nitride ceramics

Country Status (1)

Country Link
JP (1) JP2943001B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3769030B2 (en) * 1993-08-10 2006-04-19 株式会社 神崎高級工機製作所 Hydraulic transmission
JP4492989B2 (en) 2000-09-18 2010-06-30 株式会社 神崎高級工機製作所 Shifting operation mechanism
US6869007B2 (en) * 2001-01-26 2005-03-22 Lucent Technologies Inc. Oxidation-resistant reactive solders and brazes

Also Published As

Publication number Publication date
JPH0450180A (en) 1992-02-19

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