JP2943050B2 - Vibration pickup microphone - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vibration pickup microphone used for an ear microphone or the like.

[0002]

2. Description of the Related Art An ear microphone used in a case in which an ear tip portion of a case accommodating a vibration pickup microphone is inserted into an external auditory canal may be lightweight because the entire weight is supported by a frictional force of the case against the external ear canal. As desired, the overall dimensions need to be smaller. By the way, in a vibration pickup microphone, a piezoelectric bimorph element is often used as a vibration sensing element. Since the output impedance of this piezoelectric bimorph element does not match the input impedance of generally used audio equipment, a circuit is required between the piezoelectric bimorph element and an amplifier to convert and match the impedance.

As an impedance conversion circuit for this purpose, for example, an FET (Field Effect Transistor) is used. However, where to arrange the FET and its peripheral parts is a problem. That is, usability as an ear microphone is impaired depending on the location.

[0004] As a prior art of a vibration pickup microphone, there is one described in Japanese Utility Model Publication No. 53-44423 and Japanese Utility Model Publication No. 54-44507. The former one is only for the transmitting side that takes out the vibration caused by bone conduction and converts it to an electric signal, and the latter one is for the receiving side that converts an external audio signal into voice in addition to the transmitting side. In addition.

[0005]

Since the former publication does not mention anything about the impedance conversion circuit, the impedance conversion circuit is provided outside the case of the vibration pickup microphone, and this is connected to the vibration element by an electric wire. Can be inferred. On the other hand, the latter publication discloses a case in which an impedance conversion circuit is incorporated in a case and this is directly attached to a vibration-acoustic signal converter.

In the structure in which the impedance conversion circuit is provided outside the case of the vibration pickup microphone, the case of the impedance conversion circuit is provided in the middle of the cord from the case inserted into the external auditory canal, so that the usability is significantly impaired. Become. In the case where the impedance conversion circuit is directly attached to the vibration / acoustic signal converter, the overall length becomes large, and as a device to be inserted into the ear canal, there is still a problem in terms of usability.

An object of the present invention is to provide a vibration pickup microphone in which a structure for supporting a piezoelectric bimorph element is improved together with a structure for incorporating an impedance conversion circuit.

[0008]

According to the present invention, as a means for solving the above-mentioned problems, first, the invention described in claim 1 uses a piezoelectric bimorph element as a vibration sensing element and the piezoelectric bimorph element. In a vibration pickup microphone in which an impedance conversion circuit is connected to an output side of an element, a substrate whose one end of a rectangular portion protrudes laterally is provided, and the piezoelectric bimorph element is flush with the rectangular portion and Arranged in parallel , a rectangular on the top surface of the substrate
Extends from the base of the part to the part protruding laterally
Attach a connection fitting, and connect the piezoelectric
The base of the morph element is sandwiched .

Further, according to the invention described in claim 2, the vibration
The use of piezoelectric bimorph elements as sensing elements
In addition, an impedance change occurs on the output side of the piezoelectric bimorph element.
Vibration pickup microphone connected with a conversion circuit
Then, a substrate with one end of the rectangular part protruding sideways is provided,
The piezoelectric bimorph element is disposed in parallel with the rectangular portion.
And project laterally from the base of the rectangular portion of the substrate.
Solder on the upper surface of the part, and apply the piezoelectric bimol
The base of the element is fixed vertically to the protrusion of the substrate.
And features .

[0010]

According to the first aspect of the present invention, the base of the piezoelectric bimorph element is connected to the connection fitting attached to the substrate.
The plate is held between the
Move. Therefore, when vibration is received from the ear canal by inserting the case into the ear canal, the entire case vibrates to generate electricity. This voltage is impedance-converted by the impedance conversion circuit and output to the outside.

According to the second aspect of the present invention, the base of the piezoelectric bimorph element is fixed by solder mounted on the substrate.
Since it is worn, the part oscillates as a fulcrum. this
In some cases, the base of the piezoelectric bimorph element is an L-shaped base.
The case is attached to the outer ear
When receiving vibration from the ear canal by inserting it into the way,
It vibrates in the direction crossing that of the first aspect of the invention to generate electromotive force.
I do. This voltage is supplied to the impedance conversion circuit
Dance conversion is performed and output to the outside.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to FIGS. A vibration pickup microphone unit 1 uses a piezoelectric bimorph element as a vibration sensing element and connects an impedance conversion circuit to an output side of the piezoelectric bimorph element. The unit 1 is housed in a case (not shown) and inserted into the ear canal. 2 is a substrate. The substrate 2 has an L-shape in which one end of a rectangular portion 3 is protruded to the side to form a protrusion 4.

Electronic components 5 and 6 constituting an impedance conversion circuit are mounted on the rectangular portion 3, and lead wires 7 from the electronic component 6 are connected to external devices. Reference numeral 8 denotes a piezoelectric bimorph element having a predetermined length and width, and having a thickness that is about a fraction of the width. The piezoelectric bimorph element 8 is disposed on the same plane as the rectangular portion 3 of the substrate 2 so as to extend in parallel.

A connection fitting 9 extending from the base of the rectangular portion 3 toward the protruding portion 4 is attached to the upper surface of the substrate 2 with solder 10 at the base of the rectangular portion 3. As shown in FIG. 2, the connection fitting 9 is bent at the protruding portion 4 side, and the portion is in contact with the upper surface of the piezoelectric bimorph element 8 and sandwiches it. In order to impart durability to the sandwiching, the lower surface of the piezoelectric bimorph element 8 and the substrate 2 are soldered to each other.
0, and the upper surface and the back surface of the connection fitting 9 are also soldered. Further, by connecting the connection fitting 9 and the solder 10 on the back surface of the piezoelectric bimorph element 8 to the electronic component 5, both poles of the piezoelectric bimorph element 8 are electrically connected to the substrate 2 and the electronic component 5.

The thus constructed vibration pickup microphone uses a case (not shown) inserted into the ear canal. When the vibration of the bone generated when the user utters is transmitted from the ear canal to the case, the vibration is transmitted from the case to the substrate 2 and causes the piezoelectric bimorph element 8 to vibrate. The vibration is performed in the thickness direction. An output signal generated by the vibration is input to an impedance conversion circuit including the electronic components 5 and 6, subjected to impedance conversion, and flows from the lead wire 7 to an external device such as an amplifier.

FIGS. 3 and 4 show another embodiment of the present invention. In this case, the piezoelectric bimorph element 8 is arranged in parallel along the rectangular portion 3, and the base of the piezoelectric bimorph element 8 is fixed vertically to the projection 4 of the substrate 2. This fixation is performed by laying solder 10 on the upper surface of the protruding portion 4 from the base of the rectangular portion 3 of the substrate 2. In this embodiment, the solder 10 on both sides of the piezoelectric bimorph element 8 is connected to the electronic component 5.

This embodiment functions similarly to the previous embodiment except that the vibration direction of the piezoelectric bimorph element 8 is different. Structurally, the fixing of the piezoelectric bimorph element 8 is performed by the solder 10 laid on the upper surface of the protruding portion 4 from the base of the rectangular portion 3 of the substrate 2, so that there is an advantage that a connection fitting is not required.

When the vibration pickup microphone is used as an ear microphone, the shape of the external auditory canal is generally a vertically long, substantially elliptical shape. Considering that it is preferable to mount the element in the horizontal direction from the viewpoint of efficiency, the overall It can be said that this embodiment, which can be manufactured with a thinner shape, is superior to the previous embodiment.

[0019]

According to the present invention, there is provided a vibration pickup microphone constructed as described above. The arrangement of the piezoelectric bimorph element, which is an element, is devised so as not to be affected by other parts , Bimorphine
Claims because the support structure of the base of the child is improved.
According to the invention described in 1, the rectangular portion on the upper surface of the substrate
Connection extending from the base of the
Structure in which the base of the piezoelectric bimorph element is sandwiched between the bracket and the substrate
The two electrodes of the piezoelectric bimorph element and the lead wires.
It can be fixed to the substrate without using it.

According to the second aspect of the present invention,
For example, the part protruding sideways from the base of the rectangular part of the substrate
Solder on the top surface of the
Is fixed vertically to the protruding part of the board.
Hold the imorph element vertically with the jig,
It can be applied to the substrate by being fixed to the plate.

As a result, a piezoelectric bimorph element having a maximum size can be used. In addition, it is possible to obtain a vibration pickup microphone that can reduce the overall size and does not hinder insertion into the ear canal.

[Brief description of the drawings]

FIG. 1 is a plan view of an embodiment of the present invention.

FIG. 2 is a sectional view taken along line AA of FIG.

FIG. 3 is a plan view of another embodiment of the present invention.

FIG. 4 is a sectional view taken along line BB of FIG. 3;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Unit 2 Substrate 3 Rectangular part 4 Projection part 8 Piezoelectric bimorph element 9 Connection fitting 10 Solder

──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int. Cl. ⁶ , DB name) H04R 17/02

Claims (2)

(57) [Claims] In a vibration pickup microphone using a piezoelectric bimorph element as a vibration sensing element and an impedance conversion circuit connected to an output side of the piezoelectric bimorph element, one end of a rectangular portion protrudes laterally.
To the the provided substrate, wherein the piezoelectric bimorph element is arranged in parallel and flush with the rectangular portion, the upper surface of the substrate,
To the part protruding sideways from the base of the rectangular part
Attach a connection fitting that extends, and apply the pressure to the connection fitting and the substrate.
A vibration pickup microphone having a base of an electric bimorph element sandwiched therebetween . 2. A piezoelectric bimorph element as a vibration sensing element.
And the output side of the piezoelectric bimorph element.
Vibration pickup machine connected to impedance conversion circuit
In the microphone, one end of the rectangular part protrudes to the side
Substrate is provided, and the piezoelectric bimorph element is
Arranged in parallel with the base, the base of the rectangular part of the substrate
Pour solder on the upper surface of the part protruding to the side from
The base of the piezoelectric bimorph element is connected to the protrusion of the substrate.
A vibration pickup microphone fixed vertically .