JP2947644B2 - Resin composition - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a resin composition having excellent heat resistance and crack resistance. In other words, it relates to a resin composition for improving heat resistance and crack resistance as an insulating material, a laminate material, and a resin sealing material in the fields of electronic and electric components, semiconductors, etc., and is particularly required to have solder crack resistance. The present invention relates to a resin composition suitable for sealing a semiconductor device.

[0002]

2. Description of the Related Art In recent years, resin compositions having excellent heat resistance and crack resistance have been demanded in the fields of electronic and electric parts and semiconductors. For example, in the field of electric and electronic components, especially semiconductors, the mounting density on a wiring board on which components are mounted tends to increase as devices and devices using the components become smaller and thinner. It tends to be multifunctional. As a material for encapsulating the resin, there is a strong demand for the development of a resin composition having excellent heat resistance to high-temperature solder in a step of soldering to a wiring board. Conventionally, as a resin composition for such an application, a so-called resin composition for semiconductor encapsulation, an epoxy resin represented by an O-cresol novolak type epoxy resin, and a phenol novolak resin and silica as main components as a curing agent thereof. Resin compositions are excellent in moldability and reliability, and have become the mainstream in this field.

[0003] However, with respect to the resin-encapsulated semiconductor device, it has been changed to a surface-mounted semiconductor device due to the flow of high-density mounting described above. In such a surface-mount type semiconductor device, unlike a conventional insertion type semiconductor device, the entire semiconductor device becomes 200
Exposure to soldering temperatures above ℃. At this time, cracks occur in the sealing resin, and a problem has arisen that reliability of the semiconductor device is significantly reduced. Cracks during this soldering are caused by moisture absorbed during storage of semiconductor devices.
Explosive expansion occurs at a temperature of not less than ° C., and stress is generated. When the stress exceeds the strength of the sealing resin, cracks are generated. At this time, the stress applied to the resin is approximately expressed by the following equation. σ = k · p · a ² / t ² where σ: stress applied to resin k: constant p: water vapor pressure a: length of short side of die pad t: thickness of resin under die pad Therefore, glass of sealing resin Imide-based resins have been studied for the purpose of increasing the transition temperature and providing sufficient resin strength to overcome the stress generated by the expansion of water. However, a cured product of an imide resin tends to have an increased water absorption rate, and considering the above formula, it is impossible to utilize the high strength characteristic of the imide resin by increasing the stress applied to the resin. Therefore, reducing the water vapor pressure during soldering by reducing the water absorption is an effective means for suppressing the occurrence of cracks.

[0004]

SUMMARY OF THE INVENTION An object of the present invention is to provide a resin composition having excellent heat resistance and crack resistance, which can be applied to a resin-encapsulated semiconductor device requiring solder crack resistance during mounting. It is to provide. A second object of the present invention is to provide a resin composition which improves the heat resistance and crack resistance of insulating materials, laminates and the like, and can be widely applied to electronic and electric parts.

[0005]

Means for Solving the Problems The inventors of the present invention have conducted intensive studies to solve the above-mentioned problems, and as a result, using a polymaleimide which can be cured at a relatively low temperature as an imide resin,
Furthermore, by using a phenol aralkyl resin having a low water absorption together, the strength was greatly improved without increasing the water absorption of the sealing resin, and the present invention was completed. That is, the present invention provides an organic component containing a polymaleimide represented by the general formula (1) and a phenol aralkyl resin represented by the general formula (2), or an organic component further containing an epoxy resin, and an inorganic filler. And a resin composition containing More specifically, as the component (A), (a) a general formula (1);

Embedded image (Wherein R ₁ represents an m-valent organic group having at least 2 carbon atoms, and m represents an integer of 2 or more) and (b) a general formula (2);

Embedded image (Where X is

Embedded image Or

Embedded image Wherein n is an integer of 0 to 100), or an organic component containing a phenol aralkyl resin represented by the formula (I):
As a component, a resin composition containing an inorganic filler,
Alternatively, as the component (A), the above-mentioned polymaleimide compound (a) and (b) a phenol aralkyl resin or a mixture of these resins and phenols, and (c) an organic component containing an epoxy resin and (B) ) A resin composition containing an inorganic filler as a component, and particularly a resin composition for semiconductor encapsulation having excellent solder crack resistance and suitable for semiconductor encapsulation.

In the composition of the present invention, the organic component (A)
The component (a) used is a polymaleimide compound represented by the general formula (1). The polymaleimide compound represented by the general formula (1) is a compound having two or more maleimide groups in one molecule. Examples of such a polymaleimide compound include, for example, N, N′-ethylenebismaleimide, N, N′-hexamethylenebismaleimide, N, N′-
(1,3-phenylene) bismaleimide, N, N '-(1,4-phenylene) bismaleimide, bis (4-maleimidophenyl)
Methane, bis (4-maleimidophenyl) ether, bis
(3-chloro-4-maleimidophenyl) methane, bis (4-
(Maleimidophenyl) sulfone, bis (4-maleimidocyclohexyl) methane, 1,4-bis (4-maleimidophenyl) cyclohexane, 1,4-bis (maleimidomethyl) cyclohexane, 1,4-bis (maleimidomethyl) benzene, 1 , 3-bis (4-maleimidophenoxy) benzene, 1,
3-bis (3-maleimidophenoxy) benzene, bis [4-
(3-maleimidophenoxy) phenyl] methane, bis [4- (4-maleimidophenoxy) phenyl] methane, 1,
1-bis [4- (3-maleimidophenoxy) phenyl] ethane, 1,1-bis [4- (4-maleimidophenoxy) phenyl] ethane, 1,2-bis [4- (3-maleimidophenoxy)
Phenyl] ethane, 1,2-bis [4- (4-maleimidophenoxy) phenyl] ethane, 2,2-bis [4- (3-maleimidophenoxy) phenyl] propane, 2,2-bis [4- (4 -Maleimidophenoxy) phenyl] propane, 2,2-bis [4- (3-maleimidophenoxy) phenyl] butane, 2,
2-bis [4- (4-maleimidophenoxy) phenyl] butane, 2,2-bis [4- (3-maleimidophenoxy) phenyl] -1,1,1,3,3,3-hexafluoropropane, 2 , 2-bis [4- (4-maleimidophenoxy) phenyl] -1,1,1,3,
3,3-hexafluoropropane, 4,4'-bis (3-maleimidophenoxy) biphenyl, 4,4'-bis (4-maleimidophenoxy) biphenyl, bis [4- (3-maleimidophenoxy) phenyl] ketone, Bis [4- (4-maleimidophenoxy) phenyl] ketone, bis [4- (3-maleimidophenoxy) phenyl] sulfide, bis [4- (4-maleimidophenoxy) phenyl] sulfide, bis [4- (3
-Maleimidophenoxy) phenyl] sulfoxide, bis [4- (4-maleimidophenoxy) phenyl] sulfoxide, bis [4- (3-maleimidophenoxy) phenyl]
Sulfone, bis [4- (4-maleimidophenoxy) phenyl] sulfone, bis [4- (3-maleimidophenoxy) phenyl] ether, bis [4- (4-maleimidophenoxy) phenyl] ether, polymaleimidophenylmethylene, and General formula (5):

Embedded image (Wherein, 1 is an average of 0 to 10). These polymaleimide compounds may be used alone or as a mixture of two or more.

The component (b) used as the organic component (A) in the composition of the present invention is a phenol aralkyl resin represented by the general formula (2) or a mixture of the resin and a phenol: The phenol aralkyl resin represented by the general formula (2) may be used alone or in combination with a compound having two or more phenolic hydroxyl groups in one molecule. In the present invention, the phenol aralkyl resin represented by the general formula (2) is represented by the general formula (2-A)

Embedded image (Wherein, n represents an integer of 0 to 100) or a phenylphenol aralkyl resin represented by the general formula (2-B):

Embedded image (Where n represents an integer of 0 to 100) is a naphthol aralkyl resin. A phenol aralkyl resin having a low softening point and a good flowability is preferred when n is an integer of 0 to 5 in the formula (2). These phenol aralkyl resins have the general formula (6)

Embedded image (Wherein, R ₄ represents a hydrogen atom or an alkyl group having 4 or less carbon atoms) aralkyl alcohol derivative represented by phenylphenol or general formula (7);

Embedded image By reacting naphthol represented by the following formula in the presence of an acid catalyst.

The aralkyl alcohol derivatives represented by the general formula (6) include α, α'-dihydroxy
-p-xylene, α, α'-dimethoxy-p-xylene, α,
α'-diethoxy-p-xylene, α, α'-di-n-propoxy-p-xylene, α, α'-diisopropoxy-p-xylene, α, α'-di-n-butoxy-p- Xylene, α, α'-di-
sec-butoxy-p-xylene, α, α'-diisobutoxy-
p-xylene and the like. The phenylphenol used in the present invention is o-phenylphenol, m-phenylphenol and p-phenylphenol.
Further, the naphthol represented by the general formula (7) used in the present invention includes α-naphthol and β-naphthol.

In the reaction of the aralkyl alcohol derivative with naphthol or phenylphenol, naphthol or phenylphenol is used in an amount of usually 1.3 to 20 mol, preferably 1.5 to 10 mol, per mol of the aralkyl alcohol derivative. The reaction is carried out by heating at 110 ° C. or higher, preferably 130 to 180 ° C. in the presence of an acid catalyst. As the acid catalyst, inorganic or organic acids, for example, mineral acids such as hydrochloric acid, sulfuric acid, phosphoric acid, zinc chloride,
Friedel-Crafts type catalysts such as aluminum chloride, stannic chloride, and ferric chloride; organic sulfonic acids such as methanesulfonic acid and p-toluenesulfonic acid; sulfates such as dimethyl sulfate and diethyl sulfate; trifluoromethanesulfonic acid And super-strong acids such as boron trifluoride are used alone or in combination. The amount of the catalyst used is about 0.0001 to 10% by weight, preferably about 0.001 to 1% by weight, based on the total weight of the naphthol or phenylphenol and the aralkyl alcohol derivative. As the reaction proceeds, the generated hydrogen halide, water or alcohol is distilled out of the system. After completion of the reaction, unreacted naphthol or phenylphenol may be removed by any method such as vacuum distillation.

In the composition of the present invention, phenol compounds having two or more phenolic hydroxyl groups in one molecule which can be used in combination with the phenol aralkyl resin represented by the general formula (2) include phenol and / or substituted phenol and aldehyde. General formula (3) which is a reaction product with a compound

Embedded image (Wherein, R ₂ represents a hydrogen atom, a hydroxyl group or an alkyl group having 1 to 9 carbon atoms, and r is an integer of 1 or more), and a novolak-type phenol resin represented by the following formula is most preferably used. Phenolic compounds, such as general formulas (8) and (9);

Embedded image (In the formula, q represents an integer of 0 to 100)

Embedded image Wherein q is an integer of 0 to 100, particularly a resin having excellent fluidity and a low softening point wherein q is an integer of 0 to 5 in the above formula, and trihydroxyphenylmethane , Tetrahydroxyphenylethane,
And polyhydric phenols such as alkanetetrakisphenol.

When the phenol compound is used in combination with the phenol aralkyl resin represented by the general formula (2), the ratio of the phenol compound to the phenol aralkyl resin is preferably in the range of 0 to 100 parts by weight with respect to 100 parts by weight of the former. preferable. Further, when the component (c) is contained as the organic component (A), the epoxy resin used as the component (c) is a reaction product of phenol and / or a substituted phenol with an aldehyde in view of heat resistance and electric properties. General formula (4) derived from a certain novolak type phenol resin;

Embedded image (Wherein, R ₃ represents a hydrogen atom or an alkyl group having 1 to 9 carbon atoms, and p represents an integer of 1 or more). Any one having an epoxy group can be used. Specifically, an epoxy resin derived from a compound having two or more active hydrogens in one molecule, for example, bisphenol A, bisphenol F, resorcin, bishydroxydiphenyl ether, bishydroxybiphenyl, tetrabromobisphenol A, trihydroxy Polyhydric phenols such as phenylmethane, tetrahydroxyphenylethane, and alkanetetrakisphenol; ethylene glycol, neopentyl glycol, glycerin, trimethylolpropane, pentaerythritol,
Polyhydric alcohols such as diethylene glycol and polypropylene glycol; amines such as ethylenediamine, aniline and bis (4-aminophenyl) methane; polyhydric carboxylic acids such as adipic acid, phthalic acid and isophthalic acid and epichlorohydrin or 2-methylepichlorohydrin. An epoxy resin obtained by the reaction;
0) (11):

Embedded image (Where x represents an integer of 0 to 100)

Embedded image (Wherein, x represents an integer of 0 to 100), preferably an epoxy resin having a low softening property and good fluidity, wherein x is an integer of 0 to 5 in the above formula. It is listed as. One or two of these epoxy resins
More than types are used. Further, the epoxy resin,
It can be used after being modified with a silicone compound such as an oil or rubber. For example, as disclosed in JP-A-62-270617 and JP-A-62-273222, a silicone-modified epoxy resin produced by dispersing fine particles of a silicone polymer in a reaction product of an epoxy resin and a vinyl polymer. It is.

In the composition of the present invention, the component (A) includes a polymaleimide compound represented by the general formula (1) of the component (a) and a phenol represented by the general formula (2) of the component (b). The amount of the aralkyl resin or the mixture of the resin and the phenol is usually 10 to 500 parts by weight, preferably 25 to 30 parts by weight, per 100 parts by weight of the component (a).
It is in the range of 0 parts by weight. In the composition of the present invention, when the component (A) contains the component (c), the component (a) is a polymaleimide compound represented by the general formula (1),
The blending amounts of the phenol aralkyl resin represented by the general formula (2) of the component (b) or the mixture of the resin and the phenol and the epoxy resin of the component (c) are as follows.
The total amount of component (b) and component (c) is 10 parts by weight.
~ 500 parts by weight, preferably 25-300 parts by weight,
The phenol aralkyl resin represented by the general formula (2) of the component (b) or the epoxy resin of the component (c) is equivalent to the mixture of the resin and the phenol in an equivalent ratio of 0.1 to 10, preferably 0.5 to 10%. 2.0 range. In the present invention, the resin composition may be blended and kneaded as usual, or the polymaleimide compound may be previously dissolved in part or all of the component (b) or the mixture of the components (b) and (c). They may be left as they are, or they may be used as a prepolymer obtained by reacting them.

The inorganic filler used as the component (B) in the composition of the present invention may be an inorganic powder or a fibrous material. Examples of the inorganic filler include crystalline silica, fused silica, alumina and silicon nitride. , Silicon carbide, talc, calcium silicate, calcium carbonate, mica, clay, titanium white and other powders; glass fiber, carbon fiber, and other fibrous materials, but from the viewpoint of thermal expansion coefficient and thermal conductivity, ,
A fusible silica powder is preferred. Further, from the viewpoint of fluidity during molding, a spherical or a mixture of spherical and amorphous silica powder is preferable. The blending amount of the inorganic filler of the component (B) is
The total amount of the polymaleimide compound represented by the general formula (1) of the component (a) and the phenol aralkyl resin represented by the general formula (2) of the component (b) or a mixture of the resin and the phenol, or It is necessary to add 100 to 900 parts by weight, preferably 200 to 600 parts by weight, based on 100 parts by weight of the total amount of the epoxy resin of component (c). In addition, the inorganic filler is preferably used in combination with a coupling agent for the purpose of improving adhesiveness to a resin from the viewpoint of mechanical strength and heat resistance. Examples of such a coupling agent include silane-based, titanate-based, Coupling agents such as aluminates and zircoaluminates can be used.
Among them, a silane coupling agent is preferable, and in particular,
A silane coupling agent having a reactive functional group is most preferred. Examples of such a silane coupling agent include vinyltrimethoxysilane, vinyltriethoxysilane, N- (2-aminoethyl) 3-aminopropylmethyldimethoxysilane, and N- (2-aminoethyl) 3-
Aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-anilinopropyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 2- (3,4- Epoxycyclohexyl) ethyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane and the like can be mentioned, and one or more of these are used. It is preferable that these silane coupling agents are previously fixed to the surface of the inorganic filler by adsorption or reaction.

In the present invention, in curing the resin composition, it is desirable to include a curing accelerator.
As such a curing accelerator, 2-methylimidazole,
Imidazoles such as 2-methyl-4-ethylimidazole and 2-heptadecylimidazole; amines such as triethanolamine, triethylenediamine and N-methylmorpholine; organic phosphines such as tributylphosphine, triphenylphosphine and tolylphosphine. ;
Tetraphenylphosphonium tetraphenylborate,
Tetraphenylboron salts such as triethylammonium tetraphenylborate; and 1,8-diaza-bicyclo (5,4,0) undecene-7 and derivatives thereof. These curing accelerators may be used alone or in combination of two or more, and if necessary, an organic peroxide or an azo compound may be used in combination. The content of these curing accelerators is such that the polymaleimide compound represented by the general formula (1) of the component (a) and the phenol aralkyl resin represented by the general formula (2) of the component (b) or the resin and the phenol With respect to the total amount of the mixture with (a) or the total amount of the epoxy resin of the component (c) added thereto.

[0015] The resin composition of the present invention may contain various components and, if necessary, an imide resin such as diallyl phthalate, triallyl isocyanurate, or o, o'-diallylbisphenol A. Diluents; various silicone oils; release agents such as fatty acids, fatty acid salts, and waxes; flame retardants such as bromo compounds, antimony, and phosphorus; coloring agents such as carbon black; and the like, mixed and kneaded to form molding materials. be able to.

[0016]

The present invention will be described below in more detail with reference to examples. In addition, in the Example, the test method of the performance of a composition is as follows.・ Glass transition temperature: TMA method ・ Bending strength and flexural modulus: JIS K-6911 ・ Water absorption: Using a test specimen for bending test, after standing in a constant temperature and humidity bath at 65 ° C and 95% for 168 hours Measure weight gain. -VPS test: After leaving the test semiconductor device in a constant temperature and humidity bath at 65 ° C and 95% for 168 hours, immediately put it in a molten solder bath at 260 ° C and count the number of semiconductor devices with cracks in the package resin. I counted. (The numerator is the number of semiconductor devices having cracks, and the denominator is the total number of semiconductor devices subjected to the test.)

Synthesis Example 1 (o-phenylphenol aralkyl resin) A reactor equipped with a stirrer, a thermometer, a Dean-Stark azeotropic trap, and a condenser was charged with α, α'-dimethoxy-
Charge 332 g (2.0 mol) of p-xylene, 550 g (3.0 mol) of o-phenylphenol, and 2.1 g (0.25%) of methanesulfonic acid, and carry out a reaction at 150 to 160 ° C. for 4 hours while stirring. went. The generated methanol was sequentially trapped and removed out of the system. After completion of the reaction, unreacted o-phenylphenol and methanesulfonic acid were removed by distillation under reduced pressure, and 595 g of
An o-phenylphenol aralkyl resin was obtained. The composition of the resin by high performance liquid chromatography was 20.1% for n = 0
, N = 1 is 16.9%, n = 2 is 13.3%, n = 3 is 10.8%, n ≧ 4
Was 38.9%. The hydroxy equivalent of this resin is 283.
8 g / eq. The softening point was 94 ° C.

Synthesis Example 2 (p-phenylphenol aralkyl resin) In the same reactor as in Synthesis Example 1, α, α'-dihydroxy-p-xylene: 207.3 g (1.5 mol) and p-phenylphenol: 510 g ( 3.0 mol), methanesulfonic acid 0.35 g (0.05
%) And reacted at 150 to 160 ° C. for 4 hours while stirring. The generated water was sequentially trapped and removed out of the system. After completion of the reaction, unreacted p-phenylphenol and methanesulfonic acid were removed by distillation under reduced pressure to obtain 395 g of p-phenylphenol aralkyl resin. The composition of the resin by high performance liquid chromatography was n = 22.3%, n = 1
Is 18.3%, n = 2 is 15.4%, n = 3 is 11.7%, n ≧ 4 is 32.3
%,Met. The hydroxy equivalent of this resin is 299.0 g / eq
Met. The softening point was 105 ° C.

Synthesis Example 3 (α-naphthol aralkyl resin) In the same reactor as in Synthesis Example 1, α, α'-dimethoxy-
p-Xylene: 249 g (1.5 mol) and α-naphthol: 1,08
0 g (7.5 mol) and 4.65 g (0.05%) of methanesulfonic acid were charged, and the mixture was reacted at 150 to 160 ° C. for 4 hours while stirring. The generated methanol was sequentially trapped and removed out of the system. After completion of the reaction, unreacted naphthol was removed by distillation under reduced pressure to obtain 470 g of α-naphthol aralkyl resin. The composition of the resin by high performance liquid chromatography is n =
0 is 61.5%, n = 1 18.2%, n = 2 is 8.7%, n ≧ 3 is 11.
6%. The hydroxy equivalent of this resin is 207.2 g / eq
Met. The softening point was 72 ° C.

Synthesis Example 4 (β-naphthol aralkyl resin) In the same reactor as in Synthesis Example 1, α, α'-dihydroxy-p-xylene: 207.3 g (1.5 mol) and β-naphthol:
2,160 g (15 mol) and 1.18 g (0.05%) of methanesulfonic acid were charged and reacted at 150 to 160 ° C. for 4 hours while stirring. The generated water was sequentially trapped and removed out of the system. After the reaction, unreacted naphthol was removed by distillation under reduced pressure to obtain 438 g of β-naphthol aralkyl resin. The composition of the resin determined by high performance liquid chromatography is n = 8
3.4%, n = 1 was 9.2%, n = 2 was 4.6%, and n ≧ 3 was 2.8%. The hydroxy equivalent of this resin was 202.6 g / eq. The softening point was 42 ° C.

Examples 1 to 16 and Comparative Examples 1 to 4 The compositions (parts by weight) shown in Tables 1 and 2 were mixed with a Henschel mixer, and further melted with a hot roll at 100 to 130 ° C. for 3 minutes. Kneaded. This mixture was cooled, pulverized, and tableted to obtain a molding resin composition. The following raw materials were used in Table 1 except for the raw materials used in Synthesis Examples 1 to 4. Phenol compound: Novolak type phenol resin (PN-80, manufactured by Nippon Kayaku Co., Ltd.) Epoxy resin: o-cresol novolak type epoxy resin (EOCN-1020, manufactured by Nippon Kayaku Co., Ltd.)・ Inorganic filler; spherical fused silica (Halimic S-CO,
A mixture of 50 parts by weight of Micron Corporation and 50 parts by weight of amorphous fused silica (Hughes Rex RD-8 manufactured by Tatsumori Corporation). • Silane coupling agent (SZ-6083, manufactured by Toray Dow Corning Silicone Co., Ltd.) Using the resin composition for molding obtained as described above, transfer molding (180 ° C., 30 kg / cm ² , 3 minutes) A test piece for measuring physical properties was formed. In addition, after mounting the test element (10 mm × 10 mm square) on the element mounting part of the flat package type semiconductor device lead frame, the test semiconductor device is formed by transfer molding (180 ° C, 30 kg / cm ² , 3 minutes). Obtained. These test moldings were post-cured at 180 ° C. for 6 hours before each test.

The test results are shown in Tables 3 and 4.

[Table 1]

[Table 2]

[Table 3]

[Table 4]

As is clear from the examples and comparative examples, the resin composition according to the present invention can efficiently impart the heat resistance of the imide resin without impairing the water absorption.
Therefore, when a surface-mount type semiconductor device to which the reflow and flow soldering method is applied is sealed with this resin composition, an excellent solder crack resistance is exhibited and a highly reliable resin-sealed semiconductor device is obtained. This is an industrially useful invention.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁶ Identification symbol FI H01L 23/29 H01L 23/30 R 23/31 (72) Inventor Motoyuki Torikai 1190 Kasama-cho, Sakae-ku, Yokohama-shi, Kanagawa Mitsui Toatsu Within Chemical Co., Ltd. (72) Inventor Kotaro Asahina 1190 Kasama-cho, Sakae-ku, Yokohama City, Kanagawa Prefecture Inside Mitsui Toatsu Chemical Co., Ltd. (72) Inventor Akihiro Yamaguchi 1190 Kasama-cho, Sakae-ku, Yokohama-shi, Kanagawa Prefecture Inside Mitsui Toatsu Chemicals Co., Ltd. (56) References JP-A 64-45426 (JP, A) JP-A 1-213335 (JP, A) JP-A-2-45554 (JP, A) JP-A-2-138330 (JP, A) JP-A-2-41353 (JP, A) (58) Fields investigated (Int. Cl. ⁶ , DB name) C08L 65/00-65/04 C08G 59 / 40-59/64 C08K 3 / 00,5 / 13 H01L 23/30

Claims (7)

(57) [Claims] (1) As the component (A), (a) a general formula (1) (Wherein, R ₁ represents an m-valent organic group having at least 2 carbon atoms, and m represents an integer of 2 or more), and (b) a general formula (2); Embedded image (Wherein X is Embedded image Phenylphenol aralkyl resin or naphthine represented by the following formula:
A resin composition comprising an organic component containing a aralkyl resin or a mixture of these resins and phenols and an inorganic filler as the component (B). 2. The component (A) includes (a) a compound represented by the general formula (1): (Wherein, R ₁ represents an m-valent organic group having at least 2 carbon atoms, and m represents an integer of 2 or more), and (b) a general formula (2); Embedded image (Where X is Embedded image Phenylphenol aralkyl resin or naphthine represented by the following formula:
A resin composition comprising: an organic component containing a aralkyl resin or a mixture of these resins and phenols; an organic component containing (c) an epoxy resin; and an inorganic filler as component (B). 3. A phenol aralkyl resin represented by the general formula (2)
-A) 3. A phenylphenol aralkyl resin represented by the formula: wherein n is an integer of 0 to 100.
The resin composition as described in the above. 4. A phenol aralkyl resin represented by the general formula (2)
-B) The resin composition according to claim 1, wherein the resin composition is a naphthol aralkyl resin represented by the following formula (where n represents an integer of 0 to 100). 5. A phenol which forms a mixture with the phenol aralkyl resin in the component (b) is a reaction product of a phenol and / or a substituted phenol with an aldehyde. Wherein R ₂ represents a hydrogen atom, a hydroxyl group or an alkyl group having 1 to 9 carbon atoms, and r is an integer of 1 or more. 5. The resin composition according to 4. 6. The epoxy resin (C) is derived from a phenol and a novolak-type phenol resin which is a reaction product of a substituted phenol and an aldehyde; a general formula (4): (Wherein, R ₂ represents a hydrogen atom or an alkyl group having 1 to 9 carbon atoms, p is an integer of 1 or more) resin composition according to claim 2 is an epoxy resin represented by. 7. A semiconductor encapsulating composition consisting essentially of the resin composition according to claim 1.