JP2949252B2 - Chip type electronic components - Google Patents
Chip type electronic componentsInfo
- Publication number
- JP2949252B2 JP2949252B2 JP7006318A JP631895A JP2949252B2 JP 2949252 B2 JP2949252 B2 JP 2949252B2 JP 7006318 A JP7006318 A JP 7006318A JP 631895 A JP631895 A JP 631895A JP 2949252 B2 JP2949252 B2 JP 2949252B2
- Authority
- JP
- Japan
- Prior art keywords
- type electronic
- chip
- electronic component
- wiring board
- external electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明はチップ形電子部品にかか
り、詳しくは、その外部構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip-type electronic component, and more particularly, to an external structure thereof.
【０００２】[0002]
【従来の技術】セラミック発振子やセラミックフィルタ
などのようなチップ形電子部品にあっては、部品本体の
長手方向に沿う所定位置ごと、例えば、図３の外観斜視
図で示すように、誘電体素材を用いて作製された部品本
体１の両端部に外部電極２を形成することが行われてい
る。そして、これらの外部電極２は部品本体１の横断面
方向における外周囲を取り巻いた状態で被着して形成さ
れており、各外部電極２の下側表面が配線基板３上の導
体パターン４の各々に対して半田付けなどで接続される
ことによってチップ形電子部品は配線基板３上に表面実
装されるのが一般的となっている。2. Description of the Related Art In chip-type electronic components such as a ceramic oscillator and a ceramic filter, for example, as shown in the external perspective view of FIG. External electrodes 2 are formed at both ends of a component body 1 made of a material. These external electrodes 2 are formed so as to cover the outer periphery in the cross-sectional direction of the component body 1, and the lower surface of each external electrode 2 is formed on the conductor pattern 4 on the wiring board 3. Generally, chip-type electronic components are surface-mounted on the wiring board 3 by being connected to each other by soldering or the like.
【０００３】[0003]
【発明が解決しようとする課題】ところで、近年におい
ては、各種電子部品の小型化及び低背化が進み、これら
電子部品の組み合わせによって構成される電子機器ユニ
ットに対する小型化の要望が強まってきた。そこで、チ
ップ形電子部品が実装された配線基板３上に他の配線基
板（図示していない）を更に積み重ねることによって要
望に対処することが行われている。しかしながら、表裏
両面に導体パターンが形成された他の両面配線基板を上
側に積み重ねた際には、下側の配線基板３上に実装され
たチップ形電子部品の外部電極２に対して積み重ねられ
た両面配線基板の導体パターンが接触したり、この両面
配線基板上に表面実装されたチップ形電子部品（図示し
ていない）の外部電極が接触したりすることが起こりか
ねず、このような接触が生じた場合には、チップ形電子
部品の外部電極２を通じて上側及び下側に配置された配
線基板同士が導通して短絡することが起こってしまう。By the way, in recent years, various electronic components have been reduced in size and height, and there has been an increasing demand for downsizing of electronic equipment units formed by combining these electronic components. Therefore, it has been practiced to meet the demand by further stacking another wiring board (not shown) on the wiring board 3 on which the chip-type electronic components are mounted. However, when another double-sided wiring board having conductor patterns formed on both front and back surfaces is stacked on the upper side, the other double-sided wiring board is stacked on the external electrode 2 of the chip-type electronic component mounted on the lower wiring board 3. The conductor patterns of the double-sided wiring board may come into contact with each other, or the external electrodes of chip-type electronic components (not shown) surface-mounted on the double-sided wiring board may come into contact with each other. If this occurs, the upper and lower wiring boards are electrically connected to each other through the external electrodes 2 of the chip-type electronic component, causing a short circuit.
【０００４】本発明は、このような不都合を解消すべく
創案されたものであって、高密度実装が可能で信頼性の
向上を図ることができるチップ形電子部品の提供を目的
としている。The present invention has been made in order to solve such inconveniences, and an object of the present invention is to provide a chip-type electronic component capable of high-density mounting and improving reliability.
【０００５】[0005]
【課題を解決するための手段】本発明にかかるチップ形
電子部品は、部品本体の横断面方向における外周囲を取
り巻いた状態で外部電極が形成されており、かつ、この
外部電極の下側表面が配線基板上の導体パターンに対し
て接続されるものであって、上記目的を達成するため、
部品本体の上側表面上には、少なくとも外部電極の上側
表面を全面的に覆う状態で被着して形成された絶縁被膜
が設けられていることを特徴とする。In a chip-type electronic component according to the present invention, an external electrode is formed so as to surround an outer periphery in a cross-sectional direction of the component body, and a lower surface of the external electrode is formed. Is connected to the conductor pattern on the wiring board, in order to achieve the above object,
An insulating coating is formed on the upper surface of the component body so as to cover at least the entire upper surface of the external electrode.
【０００６】[0006]
【作用】上記構成によれば、チップ形電子部品における
外部電極の上側表面は絶縁被膜によって全面的に覆われ
ているのであるから、積み重ねて配置された配線基板の
導体パターンとチップ形電子部品の外部電極との間には
絶縁被膜が介在していることになり、これらの外部電極
を通じて上側及び下側に配置された配線基板同士が導通
することは起こり得ない。According to the above construction, since the upper surface of the external electrode in the chip-type electronic component is entirely covered with the insulating film, the conductor pattern of the stacked wiring boards and the chip-type electronic component can be used. Since the insulating film is interposed between the external electrodes and the external electrodes, it is unlikely that the upper and lower wiring boards are electrically connected to each other through these external electrodes.
【０００７】[0007]
【実施例】以下、本発明の実施例を図面に基づいて説明
する。Embodiments of the present invention will be described below with reference to the drawings.
【０００８】図１は本実施例にかかるチップ形電子部品
の外部構造を簡略化して示す外観斜視図であり、図２は
その変形例にかかるチップ形電子部品の外部構造を簡略
化して示す外観斜視図である。なお、本実施例にかかる
チップ形電子部品の全体構成は従来例と基本的に異なら
ないから、図１及び図２において従来例を示す図３と互
いに同一となる部品、部分には同一符号を付している。FIG. 1 is a perspective view schematically showing an external structure of a chip-type electronic component according to the present embodiment, and FIG. 2 is a view schematically showing an external structure of a chip-type electronic component according to a modification. It is a perspective view. Since the overall configuration of the chip-type electronic component according to the present embodiment is not fundamentally different from that of the conventional example, parts and parts in FIGS. 1 and 2 that are the same as those in FIG. It is attached.
【０００９】本実施例にかかるチップ形電子部品はセラ
ミック発振子やセラミックフィルタなどであり、図１で
示すように、誘電体素材を用いたうえでの直方体形状と
して作製された部品本体１の両端部には部品本体１の横
断面方向における外周囲を取り巻いた状態で外部電極２
が被着して形成されている。そして、このチップ形電子
部品は配線基板３上に表面実装されるものであり、表面
実装時には、各外部電極２の下側表面が配線基板３上に
形成された導体パターン４の各々に対して半田付けなど
でもって接続されるようになっている。なお、外部電極
２の形成位置が部品本体１の両端部のみに限定されるこ
とはなく、部品本体１の長手方向に沿う所定位置ごと、
例えば、部品本体１の両端部のみならず中央部にも外部
電極２が形成された容量付きのチップ形電子部品であっ
てもよいことは勿論である。The chip-type electronic component according to the present embodiment is a ceramic oscillator, a ceramic filter, or the like. As shown in FIG. 1, both ends of a component main body 1 formed as a rectangular parallelepiped using a dielectric material. In the part, the external electrode 2 is placed in a state surrounding the outer periphery in the cross-sectional direction of the component body 1.
Are formed. The chip-type electronic component is surface-mounted on the wiring board 3, and at the time of surface mounting, the lower surface of each external electrode 2 is applied to each of the conductor patterns 4 formed on the wiring board 3. The connection is made by soldering or the like. In addition, the formation position of the external electrode 2 is not limited to only both end portions of the component main body 1, but at predetermined positions along the longitudinal direction of the component main body 1.
For example, it is a matter of course that a chip-type electronic component with a capacitor in which the external electrodes 2 are formed not only at both ends but also at the center of the component body 1 may be used.
【００１０】さらに、部品本体１の上側表面上には、各
外部電極２の上側表面を全面的に覆う状態で被着して形
成された所定厚みの絶縁被膜５が設けられており、これ
ら絶縁被膜５のそれぞれはエポキシ系樹脂などのような
絶縁性材料を用いたうえでの印刷焼き付け硬化によって
形成されたものとなっている。なお、これらの絶縁被膜
５が、スプレー塗布や紫外線硬化などの手法を採用して
形成されたものであってもよい。また、図１において
は、各外部電極２の上側表面上にのみ絶縁被膜５を設け
ているが、このような構成に限られることはなく、図２
の変形例で示すように、外部電極２を含む部品本体１の
上側表面上を絶縁被膜５によって全面的に覆うことも可
能である。すなわち、本発明は、少なくとも外部電極２
それぞれの上側表面を全面的に覆う絶縁被膜５を部品本
体１の上側表面上に設けたことを趣旨とするものであ
る。Further, on the upper surface of the component body 1, there is provided an insulating film 5 having a predetermined thickness formed by being applied so as to cover the entire upper surface of each external electrode 2. Each of the coatings 5 is formed by printing and curing after using an insulating material such as an epoxy resin. Note that these insulating films 5 may be formed by employing a technique such as spray coating or ultraviolet curing. Further, in FIG. 1, the insulating coating 5 is provided only on the upper surface of each external electrode 2. However, the configuration is not limited to such a configuration.
As shown in the modification, the upper surface of the component body 1 including the external electrodes 2 can be entirely covered with the insulating coating 5. That is, the present invention provides at least the external electrode 2
It is intended that an insulating coating 5 covering the entire upper surface is provided on the upper surface of the component body 1.
【００１１】[0011]
【発明の効果】以上説明したように、本発明にかかるチ
ップ形電子部品においては、少なくとも外部電極の上側
表面を全面的に覆う絶縁被膜が設けられている。そこ
で、本発明のチップ形電子部品が表面実装された配線基
板上に他の配線基板を更に積み重ねて配置した場合に
は、チップ形電子部品における外部電極と上側に積み重
ねられた配線基板の導体パターンもしくは該配線基板上
に表面実装されたチップ形電子部品の外部電極との間に
絶縁被膜が介在しており、これら間の導通は確実に阻止
されることになる。その結果、チップ形電子部品の外部
電極を通じて上側及び下側に配置された配線基板同士が
導通して短絡することは起こり得ず、高密度実装が可能
で信頼性の向上を図ることができるという効果が得られ
る。As described above, the chip-type electronic component according to the present invention is provided with the insulating coating that covers at least the entire upper surface of the external electrode. Therefore, when another wiring board is further stacked and arranged on a wiring board on which the chip-type electronic component of the present invention is surface-mounted, the external electrodes of the chip-type electronic component and the conductor pattern of the wiring board stacked on the upper side are arranged. Alternatively, an insulating coating is interposed between the chip-type electronic component surface-mounted on the wiring board and the external electrode, and conduction between them is reliably prevented. As a result, the upper and lower wiring boards disposed through the external electrodes of the chip-type electronic component are not electrically connected to each other, and a short circuit cannot occur. Therefore, high-density mounting is possible and reliability can be improved. The effect is obtained.
【図１】本実施例にかかるチップ形電子部品の外部構造
を簡略化して示す外観斜視図である。FIG. 1 is an external perspective view showing a simplified external structure of a chip-type electronic component according to the present embodiment.
【図２】その変形例にかかるチップ形電子部品の外部構
造を簡略化して示す外観斜視図である。FIG. 2 is an external perspective view showing a simplified external structure of a chip-type electronic component according to a modification.
【図３】従来例にかかるチップ形電子部品の外部構造を
簡略化して示す外観斜視図である。FIG. 3 is an external perspective view showing a simplified external structure of a chip-type electronic component according to a conventional example.
１ 部品本体 ２ 外部電極 ３ 配線基板 ４ 導体パターン ５ 絶縁被膜 DESCRIPTION OF SYMBOLS 1 Component main body 2 External electrode 3 Wiring board 4 Conductor pattern 5 Insulation coating
Claims (1)
周囲を取り巻いた状態で外部電極（２）が形成されてお
り、かつ、この外部電極（２）の下側表面が配線基板
（３）上の導体パターン（４）に対して接続されるチッ
プ形電子部品であって、 部品本体（１）の上側表面上には、少なくとも外部電極
（２）の上側表面を全面的に覆う状態で被着して形成さ
れた絶縁被膜（５）が設けられていることを特徴とする
チップ形電子部品。An external electrode (2) is formed so as to surround an outer periphery of the component body (1) in a cross sectional direction, and a lower surface of the external electrode (2) is formed on a wiring board (3). A) a chip-type electronic component connected to the upper conductor pattern (4), wherein at least the upper surface of the external electrode (2) is entirely covered on the upper surface of the component body (1). A chip-type electronic component comprising an insulating film (5) formed by being applied.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7006318A JP2949252B2 (en) | 1995-01-19 | 1995-01-19 | Chip type electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7006318A JP2949252B2 (en) | 1995-01-19 | 1995-01-19 | Chip type electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08195447A JPH08195447A (en) | 1996-07-30 |
| JP2949252B2 true JP2949252B2 (en) | 1999-09-13 |
Family
ID=11635024
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7006318A Expired - Lifetime JP2949252B2 (en) | 1995-01-19 | 1995-01-19 | Chip type electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2949252B2 (en) |
-
1995
- 1995-01-19 JP JP7006318A patent/JP2949252B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH08195447A (en) | 1996-07-30 |
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