JP2949539B2 - Manufacturing method of chip type piezoelectric component - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a chip-type piezoelectric component utilizing energy confinement type thickness vibration by piezoelectric ceramics, for example, by forming a vibration space on the surface of a vibration electrode utilizing thickness longitudinal vibration. The present invention relates to a method for manufacturing a chip-type piezoelectric component to which an adhesive is applied.

[0002]

2. Description of the Related Art Heretofore, there has been known a chip type piezoelectric component utilizing energy confinement type thickness longitudinal vibration using piezoelectric ceramics such as PZT type and lead titanate type. As shown in FIG. 3, this chip-type piezoelectric component has a piezoelectric element 21, adhesive layers 22, 22, sealing substrates 23, 23, and external electrodes 24 on the surface of a block body in which these are laminated and adhered and integrated. , 24 are formed. The method of manufacturing the chip-type piezoelectric component includes a vibration electrode 26, an extraction electrode 27, and a lead electrode 2 for connecting the oscillation electrode 26 and the extraction electrode 27 on the front and back surfaces of the plate-like piezoelectric substrate 25.
8 to form the piezoelectric element 21 (FIG. 4). Then, adhesives 22 are applied so as to form spaces 29 in the vibrating portions on the surface of each of the vibrating electrodes 26 on the front surface and the back surface of the piezoelectric element 21 except for the vibrating portions, and are preheated and defoamed. The sealing substrates 23, 23 are respectively laminated on the adhesive surfaces on the front and back surfaces, adhered and integrated to form a block body, and are electrically connected to the vibrating electrodes 26, 26 on the surface of the block body, respectively, so that a predetermined external surface is formed. Electrodes 24,
24 are formed.

[0003]

In the above-mentioned conventional method of manufacturing a chip-type piezoelectric component, a space is formed on the surface of a vibration electrode of a piezoelectric element, an adhesive is applied, and preheating is performed to remove bubbles.
At this time, if an epoxy adhesive is used and excess heat is applied, the viscosity of the adhesive decreases, flows out, and adheres to the surface of the vibrating electrode, causing a problem in that the electrical characteristics vary. Therefore, if the amount of the adhesive is reduced in order to avoid this, there is a problem in that the sealability is deteriorated due to thinning and insufficient wraparound of the adhesive.

The present invention has been made in view of the above-mentioned problems of the prior art, and prevents the adhesive from flowing out and adhering to the surface of the vibrating electrode, thereby preventing the electrical characteristics from being varied and the sealing property. An object of the present invention is to provide a method of manufacturing a chip-type piezoelectric component that prevents deterioration.

[0005]

According to a method of manufacturing a chip-type piezoelectric component according to the present invention, a piezoelectric element having a vibration electrode and a lead electrode connected to the electrode is formed on the front and back surfaces of a piezoelectric substrate. Then, a vibration space is formed on the surface of each vibration electrode on the front and back surfaces of the piezoelectric element, an adhesive is applied, and a predetermined substrate is laminated and bonded on the front and back surfaces to form external electrodes that are electrically connected to the extraction electrodes. In the method of manufacturing a chip-type piezoelectric component to be, on the surface of each vibration electrode on the front and back of the piezoelectric element,
It is characterized in that a vibrating space having radially uneven portions formed in the radial direction is provided around each vibrating electrode, and an adhesive is applied. As a method of applying the adhesive, an unnecessary portion is masked, and an epoxy adhesive is applied by squeegee printing.

[0006]

According to the method of manufacturing a chip-type piezoelectric component according to the present invention, as described above, a vibrating space in which irregular portions are formed radially around each vibrating electrode is formed and an adhesive is applied. When an epoxy-based adhesive is applied and preheated for defoaming, even if the adhesive flows out, it fills the radially formed adhesive-free recesses and flows out to the surface of the vibrating electrode, preventing it from adhering. It is possible to reduce the occurrence of variations in the electrical characteristics stably.

[0007]

Embodiments of the present invention will be described below with reference to the drawings. FIGS. 1 and 2 are views for explaining a manufacturing process of a chip-type piezoelectric component according to an embodiment of the present invention, for example, a chip-type piezoelectric component 1 having an energy trapping type thickness longitudinal vibration. The chip-type piezoelectric component includes a piezoelectric element 2 in which a vibration electrode 6, an extraction electrode 7, and a lead electrode 8 are formed on the front and back surfaces of a piezoelectric substrate 5, and a recess formed radially around each vibration electrode 6 in the radial direction. An adhesive 11 is formed by forming an uneven portion with the adhesive 12, and sealing substrates 3 and 3 are laminated and adhered on the surface of each adhesive 11.

Next, the steps of manufacturing the chip-type piezoelectric component will be described. First, a vibrating electrode 6, an extraction electrode 7, and a lead electrode 8 were respectively formed on the front and back surfaces of the piezoelectric substrate 5 by sputtering,
The piezoelectric element is formed by vacuum deposition, application and baking of a conductive paste, or the like. Then, for example, FIG.
As shown in (1), a vibration space 10 having an uneven portion is formed by forming a concave portion 12 radially around each of the vibrating electrodes 6 on the front and back surfaces of the piezoelectric element 2, and an adhesive 11 is applied. Next, the bubbles entrained in the adhesive are preheated to remove bubbles, and the sealing substrates 3 are laminated and adhered to the surfaces of the adhesives 11 on the front and back surfaces of the piezoelectric element 2, respectively, to form an integrated block. Next, after exposing each extraction electrode 7 to the end face by lapping or the like, the external electrodes 4 and 4 are made conductive by being connected to each extraction electrode 7 and formed by sputtering, vacuum deposition, application and baking of a conductive paste, and the like. . Since the chip-type piezoelectric component is manufactured as described above, an epoxy resin adhesive is applied to the surface of the vibration electrode with a space,
Even if the adhesive flows out when heated thereafter, it fills the space of the concave portion without the adhesive, so that it can be prevented from adhering to the vibration electrode surface.

[0009]

As described above, according to the method of manufacturing a chip-type piezoelectric component according to the present invention, the adhesive is applied by providing a vibrating space having a concave and convex portion on the surface of the vibrating electrode. Even if the adhesive flows out, it can fill the recesses of the space and prevent it from adhering to the surface of the vibrating electrode, preventing the electrical characteristics from varying, and reducing the amount of the adhesive, Deterioration of sealing performance can be prevented.

[Brief description of the drawings]

FIG. 1 is a perspective view illustrating a manufacturing process of a chip-type piezoelectric component according to the present invention.

FIG. 2 is a plan view showing an example of an application shape of an adhesive.

FIG. 3 is a perspective view illustrating a manufacturing process of a conventional chip-type piezoelectric component.

FIG. 4 is a plan view of a piezoelectric element.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 chip-type piezoelectric component 2 piezoelectric element 3 sealing substrate 11 adhesive 12 recess

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int. Cl. ⁶ , DB name) H03H 3/007-3/04 H03H 9/00-9/135 H03H 9/15-9/215

Claims (1)

(57) [Claims] A piezoelectric element having a vibration electrode and a lead electrode connected to the electrode is formed on the front and back surfaces of a piezoelectric substrate, and a vibration space is formed on the surface of each vibration electrode on the front and back surfaces of the piezoelectric element. And applying an adhesive, laminating and bonding a predetermined substrate on the front and back surfaces, in a method of manufacturing a chip-type piezoelectric component for forming an external electrode that is electrically connected to the extraction electrode,
A chip-type piezoelectric component, characterized in that a vibration space having radially uneven portions formed radially around each vibration electrode is provided on the surface of each vibration electrode on the front and back surfaces of the piezoelectric element, and an adhesive is applied thereto. Production method.