JP2950596B2 - Flux composition for soldering - Google Patents
Flux composition for solderingInfo
- Publication number
- JP2950596B2 JP2950596B2 JP27058590A JP27058590A JP2950596B2 JP 2950596 B2 JP2950596 B2 JP 2950596B2 JP 27058590 A JP27058590 A JP 27058590A JP 27058590 A JP27058590 A JP 27058590A JP 2950596 B2 JP2950596 B2 JP 2950596B2
- Authority
- JP
- Japan
- Prior art keywords
- acid
- soldering
- flux composition
- flux
- activator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000004907 flux Effects 0.000 title claims description 22
- 238000005476 soldering Methods 0.000 title claims description 14
- 239000000203 mixture Substances 0.000 title claims description 12
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 13
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 12
- 150000001875 compounds Chemical class 0.000 claims description 9
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 claims description 8
- 239000012190 activator Substances 0.000 claims description 8
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 6
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims description 6
- 239000011975 tartaric acid Substances 0.000 claims description 6
- 235000002906 tartaric acid Nutrition 0.000 claims description 6
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 claims description 3
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 claims description 3
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims description 3
- 239000001361 adipic acid Substances 0.000 claims description 3
- 235000011037 adipic acid Nutrition 0.000 claims description 3
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 claims description 3
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 claims description 3
- 125000004432 carbon atom Chemical group C* 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 claims description 3
- 239000011976 maleic acid Substances 0.000 claims description 3
- 150000007524 organic acids Chemical class 0.000 claims description 3
- 150000007519 polyprotic acids Polymers 0.000 claims description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims description 3
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 claims description 2
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 claims description 2
- 125000001183 hydrocarbyl group Chemical group 0.000 claims description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 15
- 229910000679 solder Inorganic materials 0.000 description 9
- 239000003960 organic solvent Substances 0.000 description 5
- 238000012360 testing method Methods 0.000 description 4
- 238000009736 wetting Methods 0.000 description 4
- 150000007513 acids Chemical class 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 238000007598 dipping method Methods 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 229920001515 polyalkylene glycol Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- AJDIZQLSFPQPEY-UHFFFAOYSA-N 1,1,2-Trichlorotrifluoroethane Chemical compound FC(F)(Cl)C(F)(Cl)Cl AJDIZQLSFPQPEY-UHFFFAOYSA-N 0.000 description 2
- 125000002947 alkylene group Chemical group 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 150000007522 mineralic acids Chemical class 0.000 description 2
- 230000002087 whitening effect Effects 0.000 description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 102220474387 PDZ and LIM domain protein 7_H63A_mutation Human genes 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002529 flux (metallurgy) Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910000480 nickel oxide Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000010802 sludge Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は、プリント配線板等の、はんだ付けの際に用
いるフラックスに関し、更に詳しくは、プリント配線基
板、集積回路あるいは電子回路用部品等の、はんだ付け
をする際に用いる室温で液状のはんだ付け用フラックス
組成物に関する。Description: FIELD OF THE INVENTION The present invention relates to a flux used for soldering a printed wiring board or the like, and more particularly to a flux used for a printed wiring board, an integrated circuit or a component for an electronic circuit. The present invention relates to a room temperature liquid soldering flux composition used for soldering.
（従来の技術） 従来使用されているこの種のはんだ付け用フラックス
の多くは、ロジン変性樹脂系であって、有機溶剤に溶解
したものが使用された。(Prior Art) Most of this type of soldering flux conventionally used is a rosin-modified resin-based flux dissolved in an organic solvent.
更に、これらのロジン変性樹脂系の有機溶剤型のフラ
ックスの変りに無機酸を主成分とする水洗性のフラック
スも使用された。Further, instead of these rosin-modified resin type organic solvent type fluxes, a water-washable flux containing an inorganic acid as a main component was also used.
（発明の解決しようとする課題） しかしながら、一般にロジン変性樹脂系のものは有機
溶剤洗浄型のフラックスであり、かかるフラックスによ
るときには、はんだ付け後のフラックス残渣を除去する
ためにフロン113を主成分とし、低級アルコールを含む
有機溶剤を用いて洗浄しなければならない。(Problems to be Solved by the Invention) However, a rosin-modified resin-based flux is generally an organic solvent-cleaning flux. When such flux is used, Freon 113 is used as a main component in order to remove a flux residue after soldering. It must be washed with an organic solvent containing a lower alcohol.
しかし、フロン113を主成分とする洗浄剤は、地球環
境保護の立場からそれの使用が禁止される方向にある。
また、有機溶剤が高価格であり、そのうえ、有機溶剤に
よる洗浄では、イオン性物質の除去が困難であり、絶縁
抵抗や誘電性などの電気的な特性を低下させるという欠
点がある。However, the use of a cleaning agent containing Freon 113 as a main component is being banned from the standpoint of protecting the global environment.
Further, the organic solvent is expensive, and furthermore, it is difficult to remove ionic substances by washing with the organic solvent, and there is a drawback that electrical characteristics such as insulation resistance and dielectric properties are reduced.
更に、無機酸を用いた水洗性タイプのフラックスは、
プリント配線基板上に塗布するソルダーレジスト膜に対
して、はんだ付け時に化学的な変化を及ぼし、ソルダー
レジスト膜のふくれや表面の白化が発生しやすい。ま
た、絶縁抵抗や誘電率などの電気的な特性を低下させる
ことにより信頼性に欠ける。Furthermore, the flush type flux using an inorganic acid,
The solder resist film applied on the printed wiring board undergoes a chemical change at the time of soldering, so that blistering of the solder resist film and whitening of the surface are likely to occur. In addition, reliability is deteriorated by lowering electrical characteristics such as insulation resistance and dielectric constant.
本発明は、上記のような欠点のないフラックス、すな
わち、水で洗浄可能で電気的な特性の低下が少なく、ソ
ルダーレジスト膜のふくれや白化のない、はんだ付け用
フラックス組成物を提供することを目的とする。An object of the present invention is to provide a flux composition for soldering which does not have the above-mentioned disadvantages, that is, which can be washed with water, has a small decrease in electrical properties, does not cause blistering or whitening of a solder resist film, and has a soldering flux composition. Aim.
（課題を解決するための手段） 本発明者等は、これらの目的を解決するため、種々検
討の結果、はんだ付け用フラックス組成物において、グ
リコール酸、酒石酸などのオキシカルボン酸、マロン
酸、コハク酸、グルタル酸、アジピン酸、マレイン酸、
クエン酸などの多塩基酸から選ばれた少なくとも１種の
有機酸を活性剤とし、一般式 RnN｛（C2H4O）ａ（C3H6O）bH｝3-n ただし、Ｒは炭素数１〜９の炭化水素基、ｎは０また
は１の整数、a,bは平均付加モル数であり、それぞれ３
≦ａ≦50,0≦ｂ≦20かつa:bのモル比が100:0〜70:30で
示されるＮ含有アルキレンオキシド誘導体化合物をベー
ス剤とすることを特徴とするはんだ付け用フラックス組
成物により解決した。(Means for Solving the Problems) In order to solve these objects, the present inventors have made various investigations and found that, in a soldering flux composition, oxycarboxylic acids such as glycolic acid and tartaric acid, malonic acid, succinic acid, and the like. Acid, glutaric acid, adipic acid, maleic acid,
At least one organic acid selected from polybasic acids such as citric acid is used as an activator, and the general formula R n N ｛(C 2 H 4 O) a (C 3 H 6 O) b H｝ 3-n , R is a hydrocarbon group having 1 to 9 carbon atoms, n is an integer of 0 or 1, a and b are average addition mole numbers,
≦ a ≦ 50, 0 ≦ b ≦ 20 and a flux composition for soldering, characterized by using an N-containing alkylene oxide derivative compound having a molar ratio of a: b of 100: 0 to 70:30 as a base agent. Solved by.
本発明に使用される活性剤としては、オキシカルボン
酸としては、グリコール酸、酒石酸などであり、二塩基
酸としては、マロン酸、コハク酸、グルタル酸、アジピ
ン酸、マレイン酸などであり、多塩基酸としては、クエ
ン酸などである。The activator used in the present invention includes oxycarboxylic acids such as glycolic acid and tartaric acid, and the dibasic acids include malonic acid, succinic acid, glutaric acid, adipic acid and maleic acid. Examples of the basic acid include citric acid.
そしてこれらの有機酸の活性剤から選ばれた少なくと
も１種もしくは二種以上併用して使用される。Then, at least one selected from these organic acid activators or two or more of them are used in combination.
本発明に使用されるベース剤としてのＮ含有アルキレ
ンオキシド誘導体化合物は、本質的には水溶性であり、
耐熱性に優れかつ洗浄性に優れた化合物であり、 一般式 RnN｛（C2H4O）ａ（C3H6O）bH｝3-n ただし、Ｒは炭素数１〜９の炭化水素基、ｎは０また
は１の整数、a,bは平均付加モル数であり、それぞれ３
≦ａ≦50,0≦ｂ≦20かつa:bのモル比が100:0〜70:30で
示される。The N-containing alkylene oxide derivative compound as the base agent used in the present invention is essentially water-soluble,
Is a compound having excellent excellent and detergency heat resistance, the general formula R n N {(C 2 H 4 O) a (C 3 H 6 O) b H} 3-n wherein, R 1 to 9 carbon atoms N is an integer of 0 or 1, a and b are average number of moles added, and each is 3
≦ a ≦ 50, 0 ≦ b ≦ 20 and the molar ratio of a: b is 100: 0 to 70:30.
ここでエチレンオキシド（以下EOと略す）プロピレン
オキシド（以下POと略す）が共存するときの結合はラン
ダムでもブロックでもよい。Here, when ethylene oxide (hereinafter abbreviated as EO) and propylene oxide (hereinafter abbreviated as PO) coexist, the bond may be random or block.
Ｒの鎖長が限定されるのは請求範囲以外であると起泡
性が高くなりかつ水に難溶となり洗浄性が保たれない。If the chain length of R is out of the range specified in the claims, the foaming property becomes high, and it becomes hardly soluble in water, so that the washing property cannot be maintained.
アルカノールアミン構造とすることにより金属表面の
酸化劣化を防ぎ金属表面に光沢を与えることができ、か
つポリエーテル耐熱性向上に効果を発揮する。By having an alkanolamine structure, oxidation deterioration of the metal surface can be prevented, and the metal surface can be given a gloss, and it is effective in improving the heat resistance of polyether.
EOの付加モル数が限定されるのは、請求範囲以外であ
ると水洗性に乏しくスラッジが残り良好な電気特性が得
られないためである。The reason why the number of moles of EO added is limited is that if the amount is outside the scope of the claims, the washing property is poor, sludge remains, and good electrical properties cannot be obtained.
POの付加モル数が限定されるのは、請求範囲以外であ
ると耐熱性に劣り、かつ水に不溶となり良好な洗浄性が
得られないためである。The reason why the number of moles of added PO is limited is that if the amount is outside the range of the claims, the heat resistance is inferior, and it becomes insoluble in water, so that good cleaning properties cannot be obtained.
EO、POの比率が限定されるもう一つの理由は、良好な
濡れ特性を得るためであり、請求の範囲内が特に望まし
い。Another reason that the ratio of EO and PO is limited is to obtain good wetting properties, and it is particularly desirable to fall within the scope of the claims.
（実施例） 本発明を実施例に基づいて詳細に説明する。(Examples) The present invention will be described in detail based on examples.
本発明に使用する化合物は第１表に示す。 The compounds used in the present invention are shown in Table 1.
RnN｛（C2H4O）ａ（C3H6O）bH｝3-n 上記化合物を下記の配合処方により配合した。R n N ｛(C 2 H 4 O) a (C 3 H 6 O) b H｝ 3-n The above compound was compounded according to the following compounding recipe.
実施例１〜８ 上記の化合物15gをそれぞれ酒石酸6gとイソプロピル
アルコール79gを配合溶解したものを使用した。Examples 1 to 8 A mixture of 15 g of the above compound and 6 g of tartaric acid and 79 g of isopropyl alcohol was used.
実施例９〜12 化合物９を15gで一定とし、活性剤として実施例９は
マロン酸4.2g、実施例10は酒石酸6g、実施例11はクエン
酸4.2g、実施例12はグリコール酸6.1gを使用し、全量10
0gになるように残部をイソプロピルアルコールを使用し
た。Examples 9 to 12 Compound 9 was fixed at 15 g, and as an activator, Example 9 was 4.2 g of malonic acid, Example 10 was 6 g of tartaric acid, Example 11 was 4.2 g of citric acid, and Example 12 was 6.1 g of glycolic acid. Use, total amount 10
Isopropyl alcohol was used for the remainder so that the amount became 0 g.
実施例13 化合物10、15gを使用し、活性剤成分は酒石酸6gを使
用し、全量100gになるように残部をイソプロピルアルコ
ールを使用した。Example 13 Compounds 10 and 15 g were used, and 6 g of tartaric acid was used as an activator component, and the remainder was isopropyl alcohol so that the total amount was 100 g.
比較例１ 活性剤成分の多塩基酸を使用しないでポリアルキレン
グリコール（特公昭59−22632号公報に記載のポリアル
キレングリコールでEO/POの比率が50/50のもの）15％残
りをイソプロピルアルコールを使用した。Comparative Example 1 Polyalkylene glycol (polyalkylene glycol having an EO / PO ratio of 50/50 as disclosed in JP-B-59-22632) was used without using the polybasic acid as the activator component, and the remaining 15% was isopropyl alcohol. It was used.
比較例２ 活性剤成分としてマロン酸4.2gを使用して上記ポリア
ルキレングリコール15％残りをイソプロピルアルコール
を使用した。Comparative Example 2 Using 4.2 g of malonic acid as an activator component, the remaining 15% of the above polyalkylene glycol was used with isopropyl alcohol.
上記の配合物をはんだ付け性の評価試験を行なった。 The above composition was subjected to an evaluation test for solderability.
結果は第２表に示す。 The results are shown in Table 2.
本発明のフラックス組成物のはんだ付け性の評価は下
記の評価試験を行なった。 The following evaluation test was performed to evaluate the solderability of the flux composition of the present invention.
評価方法 測定装置 レスカ製ソルダーチェッカーSAT−2000 測定方法 １）酸化銅（130℃×30分熱処理）および酸化ニッケル
（130℃×10分熱処理）のテストピース（0.3×５×30m
m）にフラックスを塗布 ２）ソルダーチェッカーを用い、以下の条件ではんだ付
けを行なう はんだ ；日本ゲンマ製 H63A はんだ温度;230℃ 浸漬温度 ;16mm/sec 浸漬深さ ;2mm 浸漬時間 ;4sec ３）結果を以下の条件で記録し、濡れ時間（Ｔ）と濡れ
力（Ｌ）を求める。Evaluation method Measuring device Solder checker SAT-2000 manufactured by Resca Measuring method 1) Test piece (0.3 × 5 × 30m) of copper oxide (heat treatment at 130 ° C. × 30 minutes) and nickel oxide (heat treatment at 130 ° C. × 10 minutes)
m) Apply flux 2) Solder using a solder checker under the following conditions Solder: H63A made by Nippon Genma Soldering temperature: 230 ° C Dipping temperature; 16mm / sec Dipping depth; 2mm Dipping time; 4sec 3) Result Is recorded under the following conditions, and the wetting time (T) and the wetting force (L) are obtained.
測定感度 ;25cm チャートスピード;60cm/min 濡れ時間（Ｔ） テストピースがはんだ浴に接してから、はんだが接触
角90度で濡れるまでの時間（sec）をメニスコグラフか
ら読み取る。Ｔが小さいほど濡れ性が良好なことを示
す。Measurement sensitivity: 25 cm Chart speed; 60 cm / min Wetting time (T) The time (sec) from the contact of the test piece to the solder bath until the solder is wet at a contact angle of 90 degrees is read from a meniscograph. The smaller the T, the better the wettability.
（発明の効果） 本発明のはんだ付け性フラックス組成物は、従来の製
品に比べて、水溶性で、洗浄性に優れ、はんだ付け性も
良好である。(Effect of the Invention) The solderable flux composition of the present invention is more water-soluble, has better cleaning properties, and has better solderability than conventional products.
フロントページの続き (72)発明者 大場 洋一 東京都八王子市諏訪町251番地 株式会 社アサヒ化学研究所内 (72)発明者 岩佐 山大 東京都八王子市諏訪町251番地 株式会 社アサヒ化学研究所内 (56)参考文献 特開 昭62−6796（ＪＰ，Ａ) 特開 昭62−16899（ＪＰ，Ａ) 特開 昭64−57999（ＪＰ，Ａ) 特開 平４−228289（ＪＰ，Ａ) (58)調査した分野(Int.Cl.6，ＤＢ名) B23K 35/363 Continuing from the front page (72) Inventor Yoichi Oba 251 Suwa-cho, Hachioji-shi, Tokyo Asahi Chemical Laboratory Co., Ltd. (72) Inventor Yamada Iwata 251 Suwa-cho, Hachioji-shi Tokyo References JP-A-62-6796 (JP, A) JP-A-62-16899 (JP, A) JP-A-64-57999 (JP, A) JP-A-4-228289 (JP, A) (58) Field surveyed (Int. Cl. 6 , DB name) B23K 35/363
Claims (1)
グリコール酸、酒石酸などのオキシカルボン酸、マロン
酸、コハク酸、グルタル酸、アジピン酸、マレイン酸、
クエン酸などの多塩基酸から選ばれた少なくとも１種の
有機酸を活性剤とし、一般式 RnN｛（C2H4O）ａ（C3H6O）bH｝3-n ただし、Ｒは炭素数１〜９の炭化水素基、ｎは０または
１の整数、a,bは平均付加モル数であり、それぞれ３≦
ａ≦50,0≦ｂ≦20かつa:bのモル比が100:0〜70:30で示
され、エチレンオキシドとプロピレンオキシドが共存す
るときの結合はランダムでもブロック結合でも良い窒素
含有アルキレンオキシド誘導体化合物をベース剤とする
ことを特徴とするはんだ付け用フラックス組成物。1. A soldering flux composition comprising:
Glycolic acid, oxycarboxylic acid such as tartaric acid, malonic acid, succinic acid, glutaric acid, adipic acid, maleic acid,
At least one organic acid selected from polybasic acids such as citric acid is used as an activator, and the general formula R n N ｛(C 2 H 4 O) a (C 3 H 6 O) b H｝ 3-n , R is a hydrocarbon group having 1 to 9 carbon atoms, n is an integer of 0 or 1, a and b are average addition mole numbers, and 3 ≦
a ≦ 50, 0 ≦ b ≦ 20 and the molar ratio of a: b is 100: 0 to 70:30, and the bond when ethylene oxide and propylene oxide coexist is a nitrogen-containing alkylene oxide derivative that may be random or block. A flux composition for soldering, comprising a compound as a base agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27058590A JP2950596B2 (en) | 1990-10-11 | 1990-10-11 | Flux composition for soldering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27058590A JP2950596B2 (en) | 1990-10-11 | 1990-10-11 | Flux composition for soldering |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04147792A JPH04147792A (en) | 1992-05-21 |
| JP2950596B2 true JP2950596B2 (en) | 1999-09-20 |
Family
ID=17488176
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27058590A Expired - Lifetime JP2950596B2 (en) | 1990-10-11 | 1990-10-11 | Flux composition for soldering |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2950596B2 (en) |
-
1990
- 1990-10-11 JP JP27058590A patent/JP2950596B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04147792A (en) | 1992-05-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4342607A (en) | Solder flux | |
| EP0668808B1 (en) | No-clean soldering flux and method using the same | |
| KR100258289B1 (en) | Solder paste | |
| EP1295935B1 (en) | Detergent composition | |
| EP0464652B1 (en) | Agent and method for removing rosin-base solder flux | |
| KR0160126B1 (en) | Method for cleaning rosin-base solder flux | |
| JP4186184B2 (en) | Circuit board soldering flux and solder paste | |
| CN116033975A (en) | Cleaning agent composition for soldering flux | |
| US5330582A (en) | Method for cleaning rosin-base solder flux | |
| JPH03165999A (en) | Water soluble flux for soldering | |
| JP2950596B2 (en) | Flux composition for soldering | |
| JP4399709B2 (en) | Cleaning composition for tin-containing alloy parts and cleaning method | |
| JPH04147791A (en) | Flux composition for soldering | |
| JP2024112297A (en) | Flux cleaning composition | |
| JPH03106594A (en) | Flux composition for soldering | |
| JPH10195487A (en) | Cleaner composition | |
| JPH05228689A (en) | Flux composition | |
| JP7810845B2 (en) | Flux cleaning composition | |
| JP7673303B2 (en) | Cleaning composition for removing flux residue | |
| JPH03268891A (en) | Water-soluble flux | |
| JPH04313487A (en) | Water-soluble cream solder | |
| JPH06192694A (en) | Cleaning agent for solder flux removal | |
| JPS63286292A (en) | Alkylene oxide addition product as flux and remelting liquid in manufacture of conductor board | |
| SU1551503A1 (en) | Flux for low-temperature soldering | |
| TW202611280A (en) | Cleaning agent composition for removing flux residues |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080709 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 10 Free format text: PAYMENT UNTIL: 20090709 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 10 Free format text: PAYMENT UNTIL: 20090709 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 11 Free format text: PAYMENT UNTIL: 20100709 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110709 Year of fee payment: 12 |
|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110709 Year of fee payment: 12 |