JP2962610B2 - Method of manufacturing composite thin film magnetic head - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a composite (combination) thin-film magnetic head in which a recording head and a reproducing head are integrated, and more particularly to simplification of the manufacturing method.

[0002]

2. Description of the Related Art With the spread of audio equipment such as a DAT, there has been a demand for a low-cost magnetic head for recording and reproduction. In audio equipment such as DAT and DCC, a combination head in which a recording head and a reproducing head are integrated is used in order to reduce the size of the head.

A method of manufacturing a conventional thin-film magnetic head will be described with reference to FIG.

In a conventional thin film magnetic head, after a pattern is formed on a substrate, a protective plate is bonded thereon, and the protective plates are bonded together to form a combination (combination). A general combination type head uses an MR type thin film magnetic head as a reproducing head and an IH type thin film magnetic head as a recording head. Since the formed thin-film magnetic head pattern has irregularities, it is necessary to smoothen it and attach a protective plate. Since the IH head has high heat resistance, it is possible to use a glass welding method in which a protective plate is adhered while filling unevenness with frit glass. On the other hand, since the MR head has low heat resistance, the glass welding method cannot be used, and SiO ₂ is further formed on the passivation film which is the uppermost layer of the head pattern.
After a film or the like is formed and polished and smoothed, a protective film is bonded to a resin.

FIGS. 3A and 3A are perspective views showing a state in which strip-shaped protective plates 2 and 2 'are bonded on a recording head wafer 1 and a reproducing head wafer 1' on which patterns are formed, respectively. It is. The bonding of the protective plate is performed by the above method. Next, as shown in FIGS. 7B and 7B, the rows are separated by dicing or the like. After the row-divided wafers were separately subjected to cylindrical polishing and tape polishing (FIGS. (C) and (c ')), the row heads were cut to separate individual recording head chips (d) and reproduction head chips ( d '). After that, the protection plate is polished, and they are bonded back to back to complete the combination type magnetic head (FIG. (E)).

FIG. 4 is an enlarged sectional view of a conventional combination type magnetic head manufactured as described above. Between the recording head 1 and the protection plate 2 is formed a glass layer 3 having both functions of bonding and filling irregularities. Further, 'the resin layer 4 and for adhesion' SiO ₂ layer 3 for smoothing on the circuit patterns are formed between the 'protective plate 2 and' reproducing head 1.

[0007]

As described above, in the conventional method of manufacturing the combination type thin film magnetic head, various flattening processes and the like are performed to secure the accuracy and reliability of the gap interval between the recording head and the reproducing head. It was necessary to bond the protective plate. That is, first, flattening polishing is performed to eliminate the step of the passivation film which is generated by reflecting the front core of the reproducing head. The purpose of this is to make the thickness of the resin film thin and uniform when bonding the protective plate, to suppress chipping of the protective plate during cylindrical polishing, and to improve the reliability of the head when sliding the medium. In addition, the protection plate is polished after the chip is divided to ensure the parallelism of the protection plate surface with respect to the wafer surface. Furthermore, in order to cover the step of the passivation film of the upper core, a low-melting thick glass film is formed on the protective plate, and the recording head is bonded to the wafer by glass welding in a vacuum. As described above, the recording head and the reproducing head both require separate attachment of the protective plate, cylindrical polishing, and tape polishing. As a result, the manufacturing process becomes complicated and a large number of man-hours are required. Further, the process yield is deteriorated, leading to an increase in processing cost and material cost.

The present invention has been made in view of the above-described drawbacks, and has as its object to provide a method of manufacturing a thin-film magnetic head capable of obtaining a combination type thin-film magnetic head having a small number of steps and a high yield.

[0009]

According to the present invention, a thin-film magnetic head pattern for reproduction is formed on one substrate and a thin-film magnetic head pattern for recording is formed on the other substrate. The reproduction thin-film magnetic head pattern was processed into a concavo-convex pattern opposite to the concavo-convex pattern, and the other surface was processed into a concavo-convex pattern opposite to the recording-film thin-film magnetic head pattern. The recording thin film magnetic heads are fitted and adhered to each other.

[0010]

According to the present invention, the pattern of the thin-film magnetic head for reproduction is formed on both sides of a protective plate having on both sides irregularities following the irregularities of the step of the passivation film reflecting the shape of the upper core of the wafer of the reproducing head and the recording head. In addition, a concavo-convex pattern opposite to the concavo-convex pattern of the recording thin-film magnetic head was formed. The unevenness can be created, for example, by applying a pattern to a photosensitive glass with a photoresist and performing exposure and development processing. The thin-film magnetic head for reproduction and the thin-film magnetic head for recording are bonded to each other with an intermediate portion. Since the reverse unevenness of the pattern has already been formed on the protective plate, a smoothing step is not required, and the resin can be bonded to both surfaces with a uniform thickness. Furthermore, the thin-film magnetic head for reproduction and the thin-film magnetic head for recording can be bonded by a common protective plate, and the conventional steps of polishing and bonding the protective plate can be omitted.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for manufacturing a combination type head according to an embodiment of the present invention will be described with reference to FIGS. First, the recording head wafer 11 and the reproducing head wafer 11 '
A thin-film magnetic head pattern is formed on the upper surface, and a concave / convex pattern corresponding to (reverse to) the thin-film magnetic head pattern for recording and the thin-film magnetic head pattern for reproduction is formed on both surfaces of the protective plate 12, respectively. Protection plate 1
Reference numeral 2 is made of photosensitive glass, and the concavo-convex pattern is formed by photochemical processing. It should be noted that the wafer (substrate) 1 should be used in order to prevent loss due to wear due to use.
It is preferable that 1, 11 'is also a glass substrate.

First, as shown in FIG. 1A, a strip-shaped protective plate 12 is bonded onto a recording head wafer 11 by a resin bonding method. As described above, the unevenness corresponding to the pattern is formed on the protective plate 12, so that the resin layer has a uniform thickness.

Next, as shown in FIGS. 1 (b) and 1 (b '), the recording head wafer 11 and the reproducing head wafer 11' to which the protective plate 12 is adhered are divided into rows by dicing or the like.

Further, as shown in FIG. 2C, the recording head row wafer and the reproducing head row wafer are bonded by a resin bonding method via the protective plate 12, and the combination is performed row by row. Since the protection plate 12 and the read head row wafer 11 'are fitted in a corresponding uneven pattern, the resin layer becomes uniform.

Then, the combined row head is subjected to cylindrical polishing and tape polishing for each row to obtain a combined row head shown in FIG. Further, the combination row head is divided into chips by dicing or the like to obtain a combination head chip shown in FIG.

FIG. 2 is an enlarged sectional view of the combination type thin film magnetic head manufactured as described above. As shown in the drawing, the protection plate 12 is formed with unevenness corresponding to the unevenness pattern of the recording head wafer 11 and the reproducing head wafer 11 '. Therefore, the protective plate 12 and the recording head wafer 11 and the reproducing head wafer 11 'are bonded via the resin layers 14, 14' without performing any smoothing processing.

[0017]

As described above, according to the present invention, the steps of flattening and polishing the reproducing thin-film magnetic head and bonding the protective plates to each other, which are performed in the conventional manufacturing process of the composite type thin-film magnetic head, are omitted. In addition, since the glass welding process of the recording thin film magnetic head can be changed to a resin bonding process, the working process is extremely simplified, the manufacturing cost can be reduced, and the manufacturing yield can be improved. Will be possible.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating a method of manufacturing a combination type head according to an embodiment of the present invention.

FIG. 2 is an enlarged cross-sectional view of a combination type head manufactured by the above manufacturing method.

FIG. 3 is a view for explaining a conventional method of manufacturing a combination type head.

FIG. 4 is an enlarged sectional view of a combination type head manufactured by a conventional manufacturing method.

[Explanation of symbols]

11-recording head (wafer), 11'-reproducing head (wafer), 12-protection plate, 14,14'-resin adhesive layer

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-61-13414 (JP, A) JP-A-5-89436 (JP, A) JP-A 52-27227 (JP, U) (58) Survey Field (Int.Cl. ⁶ , DB name) G11B 5/31

Claims (1)

(57) [Claims] 1. A reproducing thin-film magnetic head pattern is formed on one substrate, and a recording thin-film magnetic head pattern is formed on the other substrate. While processing into a concavo-convex pattern reverse to the concavo-convex pattern, the other surface is processed into a concavo-convex pattern reverse to the concavo-convex pattern of the recording thin-film magnetic head pattern. A method of manufacturing a composite type thin-film magnetic head, wherein the heads are fitted and bonded.