JP2962865B2 - Electronic component mounting method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting method for an electronic component mounting machine, and more particularly to an electronic component mounting method for an electronic component mounting machine having a component supply unit for supplying electronic components in the order of mounting on a substrate. It is about the method.

[0002]

2. Description of the Related Art In a conventional electronic component mounter, a component supply unit supplies electronic components in the order of mounting on a substrate.
An example of a method of mounting the electronic component mounting head at a predetermined position on the substrate will be described with reference to FIGS.

In FIG. 6, an electronic component mounter 5 includes a component supply unit 1 and an electronic component mounting head 12, and mounts electronic components on a substrate 2.

FIG. 7 shows an example of the order in which the electronic components 11 are set in the component supply unit 1, and the electronic components 11 are held in the order of A, B, and C.

In the conventional electronic component mounting method, when the electronic components 11 set in the component supply unit 1 are mounted on the board 2 in that order as shown in FIG. Electronic component 1 to be mounted on the first point of substrate 2
1 A is supplied first from the component supply unit 1,
It is manually set in the component supply unit 1.

When mounting the electronic component mounting apparatus, the electronic component mounting head 12 of the electronic component mounting machine 5 takes out the electronic components 11 from the component supply unit 1 in the order in which the electronic components 11 are set in the component supply unit 1 and places them at predetermined positions on the board 2. Implement. At this time, the electronic component 11 to be mounted next is sequentially supplied by the component supply unit 1, the electronic component 11 is sequentially mounted on the substrate 2 by the electronic component mounting head 12, and the electronic component 11 is mounted on all predetermined positions on the substrate 2. Implementation is complete.

[0007] In order to set the electronic components 11 set in the component supply unit 1 so as to be supplied from the component supply unit 1, as shown in FIG. Row of ABC of electronic component 11 and next AB
Tooth missing position 2 where electronic component 11 does not exist between row C
0 is provided.

By detecting the tooth missing position 20, it is determined whether or not the setting order of the electronic components 11 supplied from the component supply unit 1 is correct.

In other words, conventionally, when the tooth missing position 20 is detected before all the electronic components 11 to be mounted on the substrate 2 are mounted, or when the electronic component 1 to be mounted on the substrate 2 is
If the tooth missing position 20 is not detected after all the components 1 are mounted, it is determined that the electronic component 11 is not set correctly in the component supply unit 1 and that the electronic component 11 is not correctly supplied from the component supply unit 1. Then, the electronic component mounter 5 is stopped to correct the mistake so that the incorrectly set electronic component 11 is not mounted on the board 2 after the detection, or the incorrectly mounted board 2 is The electronic components 11 are supplied in the correct order from the component supply unit 1 by implementing safety measures to prevent the
1 was mounted on the substrate 2.

[0010]

However, in the above-mentioned conventional technique, when the electronic component 11 is set in the component supply unit 1 of the electronic component mounting machine 5, the mounting is started from the wrong electronic component 11. If you set it to
During the mounting on the upper side, the tooth missing position 20 is detected, and only at that time, it is found that the setting of the electronic component 11 in the component supply unit 1 is wrong. At this point in time, some wrong electronic components 11 have already been mounted on the board 2, and the electronic component mounter 5 is stopped and corrected manually.

In the recent surface mounting process, there is a process of applying cream solder and an adhesive to the substrate 2 before the mounting process. If the electronic component 11 is erroneously mounted on the substrate 2, the process returns to the previous process to correct the electronic component. And there is a problem that it is very troublesome.

If the electronic component mounting head 12 of the electronic component mounting machine 5 takes out the electronic component 11 from the component supply unit 1 or makes a mistake in mounting the electronic component mounting head 12, the cause is as follows. Since it is not possible to determine whether the tooth missing position 20 is set incorrectly or due to another cause and automatic processing cannot be performed, mounting on the board 2 is stopped halfway,
It has to be corrected manually, and in the case of surface mounting, it takes time to start over from the previous process, and all the electronic components 11 mounted on the board 2 that has been mounted halfway must be lost. There was a point.

Further, when the mounting error of the electronic component mounting head 12 is caused by an incorrect setting of the tooth missing position 20, the electronic component mounting machine 5 cannot determine how the setting error was made. It has to be stopped and processed manually, and there has been a problem that unmanned operation greatly hinders securing a high operation rate.

An object of the present invention is to provide an electronic component mounting method capable of solving the above-mentioned problems, preventing a supply error, automatically correcting a supply error, and ensuring a high operation rate by unmanned operation. Is the subject.

[0015]

According to the electronic component mounting method of the present invention, in order to solve the above-mentioned problems, a component supply unit of an electronic component mounter holds electronic components in an order of mounting on a substrate. In an electronic component mounting method in which an electronic component mounting head of an electronic component mounting machine takes out and holds the electronic component from the component supply unit and mounts the electronic component at a predetermined position on a substrate, a storage display step includes: The supplied electronic component names are stored in the order in which they are to be mounted on the board, and before the electronic component mounting head takes out the electronic components, the stored contents are stored in a mounting control of an electronic component mounting machine. Transmitted or displayed in the unit, in the calculation step, the mounting control unit of the electronic component mounting machine, the mounting electronic component name, in the order in which the electronic component mounting machine should be mounted, to calculate from the data stored in itself, reading In step (a), the mounting control unit reads the supplied electronic component name from the storage / display unit. A name is compared with the mounted electronic component name.

[0016]

According to the electronic component mounting method of the present invention, the electronic component name supplied from the component supply unit and the mounted electronic component name calculated by the mounting control unit of the electronic component mounting machine are transmitted from the component supply unit. Before taking out the electronic components, the comparison is made.Before mounting, a supply error of the component supply unit is detected,
The measures can be taken beforehand.

[0017]

FIG. 1 shows an embodiment of an electronic component mounting method according to the present invention.
Explanation will be made based on FIG.

In FIG. 1, the component supply unit 1 includes a storage and display unit 3 and a supply control unit 7.

In FIG. 1, the electronic component mounter 5 includes a mounting control section 9 having mounting transmitting / receiving means 8 and actuators 10. Each actuator 10 has
There are an electronic component mounting head, an XY table, and the like.

Next, the operation of this embodiment will be described.

In the storage and display step, the storage and display means 3 stores the names of the electronic components as supply electronic component names in the order in which the electronic components are mounted on the board. Then, prior to the electronic component supply from the component supply unit, the supply electronic component name stored in the storage display unit 3 is displayed or transmitted by the mounting transmitting / receiving unit 8 of the electronic component mounter 5.

In the calculation step, the mounting controller 9 is caused to calculate the name of the mounted electronic component to be mounted by the electronic component mounting machine 5 from the mounted NC data stored therein.

In the reading step, the mounting transmitting / receiving means 8 of the mounting control section 9 reads the name of the supplied electronic component from the storage / display means 3.

In the comparing step, the mounting control section 9 causes the supplied electronic component name to be compared with the mounted electronic component name before the mounting operation of the electronic component mounting head 12.

In FIGS. 2 and 3, the electronic component 11 is held on a tape 14 as shown in FIG. The order of mounting the electronic components 11 on the tape 15 in FIG.
They are held in C order. The tape 16 holds only the electronic component A. The tape 17 holds only the electronic component B. The tape 18 holds only the electronic component C.

In FIG. 4, the component supply unit 1 holds the tapes 15, 16, 17, and 18. Although not shown in FIG. 4, the storage and display means 3 and the supply control means 7 are attached to the side surface of the holding member of the tape 15. The storage display means 3 faces the mounting transmission / reception means 8 of the electronic component mounting machine 5.

In FIG. 4, the electronic component mounting machine 5 includes an electronic component mounting head 12 and an XY table 13 which holds the substrate 2 and moves in the XY directions.

FIG. 5 shows a component supply unit 1 and an electronic component mounting machine 5.
6 is a flowchart showing the operation of the above.

In step # 1, the storage and display means 3 of the component supply unit 1 stores the component names of the electronic components 11 as supply electronic component names in the order in which the electronic components 11 are mounted on the board 2.

In step # 2, the supply control means 7
, The name of the first electronic component to be supplied (A) is designated.

In step # 3, the supply control means 7
Then, the name of the currently supplied electronic component (A) is transmitted to the mounting transmitting / receiving means 8 of the electronic component mounting machine 5 to the storage / display means 3, or a number indicating the type of the supplied electronic component,
Symbols, codes, and marks are displayed on the mounting transmission / reception means 8 of the electronic component mounting machine 5 and the component supply unit 1 is instructed to start supplying from the electronic component (A).

In step # 4, the electronic component mounter 5
Of the electronic component 11 to be mounted by the electronic component mounter 5 from the mounting NC data stored therein.

In step # 5, the electronic component mounting machine 5
Then, the user is caused to receive the supplied electronic component name in step # 3 via the mounting transmission / reception means 8, or to read a number, symbol, code, or mark indicating the type of supplied electronic component indicated by the storage / display means 3.

In step # 6, the electronic component mounter 5
Is made to compare the supplied electronic component name with the mounted electronic component name to confirm a product name mistake. If there is no product name error, the process proceeds to step # 7, and if there is a product name error, the process returns to step # 2.

In step # 7, the electronic component mounter 5
The electronic component mounting head 12 is controlled to control the electronic component mounting head 12, and the electronic component (A) supplied from the component supply unit 1 in step # 3 is attracted to the electronic component mounting head 12.

In step # 8, the electronic component mounter 5
Of the electronic component (A) picked up by the electronic component mounting head 12 (presence / absence of the electronic component (A)). If there is no suction error, the process proceeds to step # 9. If so, proceed to step # 10.

In step # 9, the electronic component mounter 5
The electronic component (A) is mounted on the electronic component mounting head 12 at a predetermined position on the substrate 2 by returning to the step # 4. Repeat implementation.

In step # 10, the mounting control section 9 of the electronic component mounting machine 5 is caused to compare the supplied electronic component name with the mounted electronic component name to determine which electronic component 11 has been sucked incorrectly.

In step # 11, the mounting controller 9 of the electronic component mounting machine 5 controls the electronic component mounting machine 5,
Also, a control signal is transmitted to the component supply unit 1 so that the
Is supplied to the electronic component mounting head 12, and the process returns to step # 8.

The electronic component mounter 5 mounts the electronic component 11 on the substrate 2
During the mounting, the component supply unit 1 performs step # 3, and the electronic component mounter 5 executes step # 4 and step # 3.
Get ready with 7.

The present invention is not limited to the above-described embodiment, and various embodiments are possible. For example, the supply control unit and the mounting control unit can be integrated. The mounting transmitting / receiving means and the mounting control unit can be integrated. The mounting position of the storage display means can be freely designed. The transmission / reception method between the storage display means and the mounted transmission / reception means can be freely designed.

[0042]

According to the electronic component mounting method of the present invention, by comparing the supplied electronic component name with the mounted electronic component name, a component supply error is detected before the electronic component mounting head suction operation, and the supply error is detected. It is possible to prevent the occurrence beforehand, and if there is a suction error in the electronic component mounting head, it is possible to perform operations such as being able to correct the suction error by re-adsorbing without stopping the electronic component mounting machine, This has the effect of improving the operating rate of the electronic component mounter.

[Brief description of the drawings]

FIG. 1 is a block diagram of one embodiment of the present invention.

FIG. 2 is a perspective view of the electronic component holding tape of FIG. 1;

FIG. 3 is a plan view of the electronic component holding tape of FIG. 1;

FIG. 4 is a perspective view of one embodiment of FIG. 1;

FIG. 5 is a flowchart of the operation in FIG. 1;

FIG. 6 is a perspective view of a conventional example.

FIG. 7 is a plan view of a conventional electronic component holding tape.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Component supply part 3 Storage display means 5 Electronic component mounting machine 7 Supply control means 8 Mounting transmission / reception means 9 Mounting control part 10 Each actuator

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H05K 13/00-13/04

Claims (1)

(57) [Claims] 1. A component supply unit of an electronic component mounting machine holds electronic components in the order in which they are mounted on a substrate, and an electronic component mounting head of the electronic component mounter takes out and holds the electronic component from the component supply unit. In the electronic component mounting method of mounting at a predetermined position on the board, in the storage display step, the storage display means of the component supply unit stores the name of the supplied electronic component in the order in which it is to be mounted on the board, and Prior to the electronic component mounting head taking out the electronic component, the stored content is transmitted or displayed on a mounting control unit of the electronic component mounting machine, and in a calculation process, the mounting control unit of the electronic component mounting machine is
The name of the mounted electronic component is calculated from the data stored therein in the order in which the electronic component mounter is to be mounted, and in the reading step, the mounting control unit causes the mounting electronic unit to supply the supplied electronic component name from the storage display unit. An electronic component mounting method, wherein in the reading and comparing step, the mounting control unit causes the mounting electronic component name to be compared with the supplied electronic component name before the mounting operation of the electronic component mounting head.