JP2964720B2 - Method for producing polishing liquid for electroless nickel plating film - Google Patents
Method for producing polishing liquid for electroless nickel plating filmInfo
- Publication number
- JP2964720B2 JP2964720B2 JP3224943A JP22494391A JP2964720B2 JP 2964720 B2 JP2964720 B2 JP 2964720B2 JP 3224943 A JP3224943 A JP 3224943A JP 22494391 A JP22494391 A JP 22494391A JP 2964720 B2 JP2964720 B2 JP 2964720B2
- Authority
- JP
- Japan
- Prior art keywords
- alumina
- polishing
- dispersion
- polishing liquid
- plating film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005498 polishing Methods 0.000 title claims description 42
- 239000007788 liquid Substances 0.000 title claims description 22
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title claims description 20
- 238000007747 plating Methods 0.000 title claims description 12
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 229910052759 nickel Inorganic materials 0.000 title claims description 10
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 35
- 239000006185 dispersion Substances 0.000 claims description 31
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 30
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 20
- 239000008119 colloidal silica Substances 0.000 claims description 19
- 229910000008 nickel(II) carbonate Inorganic materials 0.000 claims description 11
- ZULUUIKRFGGGTL-UHFFFAOYSA-L nickel(ii) carbonate Chemical compound [Ni+2].[O-]C([O-])=O ZULUUIKRFGGGTL-UHFFFAOYSA-L 0.000 claims description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- 230000000694 effects Effects 0.000 description 14
- 238000003860 storage Methods 0.000 description 9
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 8
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 8
- 230000002378 acidificating effect Effects 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 230000007774 longterm Effects 0.000 description 5
- 239000000377 silicon dioxide Substances 0.000 description 5
- 238000004220 aggregation Methods 0.000 description 4
- 230000002776 aggregation Effects 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 3
- 229910018104 Ni-P Inorganic materials 0.000 description 3
- 229910018536 Ni—P Inorganic materials 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000004062 sedimentation Methods 0.000 description 3
- 229910002012 Aerosil® Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910002016 Aerosil® 200 Inorganic materials 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 230000003472 neutralizing effect Effects 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000006228 supernatant Substances 0.000 description 1
- 239000008399 tap water Substances 0.000 description 1
- 235000020679 tap water Nutrition 0.000 description 1
Landscapes
- Chemically Coating (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ハードディスクなどに
形成される無電解ニッケルめっき皮膜表面を研磨するた
めに用いる研磨液の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a polishing liquid for polishing the surface of an electroless nickel plating film formed on a hard disk or the like.
【０００２】[0002]
【従来の技術及び発明が解決しようとする課題】従来、
無電解ニッケルめっき皮膜表面を研磨するための研磨液
として、アルミナを水に分散させると共に、硫酸ニッケ
ルを添加溶解したものが知られているが、従来のこの種
のアルミナ及び硫酸ニッケルを含む研磨液は、アルミナ
の分散安全性に劣り、このため経時とともに研磨力が低
下し、保存性が悪いものであった。2. Description of the Related Art
As a polishing solution for polishing the surface of an electroless nickel plating film, a solution in which alumina is dispersed in water and nickel sulfate is added and dissolved is known, but a conventional polishing solution containing this type of alumina and nickel sulfate is known. Was inferior in the dispersion safety of alumina, and as a result, the polishing power decreased with time, and the storage stability was poor.
【０００３】本発明は上記事情に鑑みなされたもので、
アルミナの分散安全性に優れ、長期間保存後でも良好な
研磨効果を発揮する無電解ニッケルめっき皮膜用研磨液
の製造方法を提供することを目的とする。[0003] The present invention has been made in view of the above circumstances,
An object of the present invention is to provide a method for producing a polishing liquid for an electroless nickel plating film, which has excellent dispersion stability of alumina and exhibits a good polishing effect even after long-term storage.
【０００４】[0004]
【課題を解決するための手段及び作用】本発明者は上記
目的を達成するため鋭意検討を行った結果、アルミナを
水中に分散し、このアルミナ分散液のｐＨを硫酸で２．
８以下に調整すると共に、この分散液にコロイダルシリ
カを添加した後、炭酸ニッケルを添加してｐＨを５〜７
に調整することにより、得られた分散液はアルミナの分
散安安定性に優れていると共に、ｐＨ２．８以下の硫酸
酸性分散液に炭酸ニッケルを添加することで、硫酸と炭
酸ニッケルが反応して硫酸ニッケルが生成し（なお、炭
酸分は炭酸ガスとして系外に飛散する）、無電解ニッケ
ルめっき皮膜用研磨液として良好な研磨効果を有する
上、かかる研磨効果は長期間保存後でも保持されること
を見い出し、本発明をなすに至ったものである。The present inventors have conducted intensive studies to achieve the above object, and as a result, dispersed alumina in water, and adjusted the pH of this alumina dispersion with sulfuric acid.
8 or less, and after adding colloidal silica to the dispersion, adding nickel carbonate to adjust the pH to 5-7.
The resulting dispersion is excellent in dispersion stability of alumina, and by adding nickel carbonate to a sulfuric acid acidic dispersion having a pH of 2.8 or less, sulfuric acid and nickel carbonate react with each other. Nickel sulfate is generated (carbonic acid is scattered out of the system as carbon dioxide gas), has a good polishing effect as a polishing liquid for electroless nickel plating film, and such a polishing effect is maintained even after long-term storage. This has led to the achievement of the present invention.
【０００５】従って、本発明は、アルミナを水に分散
し、硫酸でｐＨ２．８以下に調整したアルミナ分散液に
コロイダルシリカを添加し、次いで炭酸ニッケルを添加
してｐＨ５〜７に調整することを特徴とする無電解ニッ
ケルめっき皮膜用研磨液の製造方法を提供する。Accordingly, the present invention provides a method of dispersing alumina in water, adding colloidal silica to an alumina dispersion adjusted to pH 2.8 or less with sulfuric acid, and then adjusting the pH to 5 to 7 by adding nickel carbonate. Disclosed is a method for producing a polishing liquid for an electroless nickel plating film.
【０００６】以下、本発明につき更に詳しく説明する
と、本発明の無電解ニッケルめっき皮膜用研磨液の製造
方法は、まずアルミナの酸性水分散液を調製する。この
場合、アルミナとしては、平均粒径０．１〜５μｍ、特
に０．２〜２μｍのα−アルミナが好ましく、またアル
ミナ分散量は、最終研磨液全体の１〜３０％（重量％、
以下同じ）、特に１５〜２５％となるようにすることが
好ましい。更に、上記アルミナの酸性水分散液のｐＨは
２．８以下であり、特にｐＨ１．０以下であることが好
ましいが、このｐＨ調整は硫酸を用いて行うものであ
る。Hereinafter, the present invention will be described in more detail. In the method for producing a polishing liquid for an electroless nickel plating film of the present invention, first, an acidic aqueous dispersion of alumina is prepared. In this case, the alumina is preferably α-alumina having an average particle size of 0.1 to 5 μm, particularly 0.2 to 2 μm, and the alumina dispersion amount is 1 to 30% (% by weight,
The same applies hereinafter), particularly preferably 15 to 25%. Further, the pH of the acidic aqueous dispersion of alumina is 2.8 or less, particularly preferably 1.0 or less. The pH is adjusted using sulfuric acid.
【０００７】次に、本発明においては、上記アルミナの
酸性水分散液にコロイダルシリカを添加する。このコロ
イダルシリカとしては、粉体でも水に分散させたコロイ
ダルシリカでも使用可能であるが、いずれの場合でも平
均粒径０．００２〜０．２μｍ、特に０．００５〜０．
０５μｍのものが好ましく、市販品として例えば日本ア
エロジル（株）製ＡＥＲＯＳＩＬ ２００等が使用でき
る。またコロイダルシリカの添加量は、研磨液全体の
０．５〜３％、特に０．５〜１％とすることが好まし
く、０．５％より少ないとアルミナの分散安定性向上へ
の効果が不十分であり、３％より多いと均一分散性が保
てなくなり、かつ、スラリー粘度が過大となって取扱が
困難となる場合がある。[0007] Next, in the present invention, colloidal silica is added to the acidic aqueous dispersion of alumina. As the colloidal silica, either powder or colloidal silica dispersed in water can be used, but in any case, the average particle size is 0.002 to 0.2 μm, particularly 0.005 to 0.
The thickness is preferably 05 μm, and commercially available products such as AEROSIL 200 manufactured by Nippon Aerosil Co., Ltd. can be used. Further, the amount of colloidal silica to be added is preferably 0.5 to 3%, especially 0.5 to 1% of the whole polishing liquid, and if less than 0.5%, the effect of improving the dispersion stability of alumina is not sufficient. If it is more than 3%, uniform dispersibility may not be maintained, and the viscosity of the slurry may be too large to make handling difficult.
【０００８】更に、本発明の製造方法では、このように
コロイダルシリカを添加したアルミナ酸性水分散液に炭
酸ニッケル、特にＮｉＣＯ3・２Ｎｉ（ＯＨ）2・４Ｈ2
Ｏなる組成を有する炭酸ニッケルを添加して、上記分散
液のｐＨを５〜７に調整するもので、これにより、炭酸
ニッケルが硫酸と反応して硫酸ニッケルが生成すると共
に、アルミナの水に対する分散安定性が顕著に向上する
ものである。この場合、炭酸ニッケルの添加量は硫酸を
中和し、分散液のｐＨを５〜７に調整する量であるが、
研磨液中に硫酸ニッケルが１〜１０％、特に１〜３％存
在し得るような量で添加することが好ましい。Further, in the production method of the present invention, nickel carbonate, particularly NiCO 3 .2Ni (OH) 2 .4H 2, is added to the aqueous acidic alumina dispersion containing colloidal silica.
Nickel carbonate having a composition of O is added to adjust the pH of the dispersion to 5 to 7, whereby nickel carbonate reacts with sulfuric acid to form nickel sulfate and disperse alumina in water. The stability is remarkably improved. In this case, the addition amount of nickel carbonate is an amount for neutralizing sulfuric acid and adjusting the pH of the dispersion to 5 to 7,
It is preferable to add nickel sulfate in an amount such that 1 to 10%, particularly 1 to 3% can be present in the polishing liquid.
【０００９】本発明の方法で得られた研磨組成物が、ア
ルミナの分散安定性に優れ、長期間保存後でも良好な研
磨効果を発揮することの詳細は不明であるが、コロイダ
ルシリカの存在及びｐＨ変化がアルミナ及びシリカの分
散・凝集状態に何等かの影響を及ぼし、かかる分散・凝
集状態がアルミナの分散安定性に有利に作用すると思わ
れる。The details of the fact that the polishing composition obtained by the method of the present invention is excellent in the dispersion stability of alumina and exhibits a good polishing effect even after long-term storage are unknown, but the presence of colloidal silica and the presence of colloidal silica are unknown. It is considered that the pH change has some influence on the dispersion / aggregation state of alumina and silica, and such dispersion / aggregation state is considered to have an advantageous effect on the dispersion stability of alumina.
【００１０】即ち、前述のアルミナ粒子は等電点がｐＨ
＝９．１〜９．２であるため、水に分散させるとｐＨが
７以下の中性から酸性の領域においては常にプラスに帯
電している。これに対してコロイダルシリカの等電点は
ｐＨ＝１．０〜２．８であるため、等電点以下ではプラ
スに帯電し、等電点以上ではマイナスに帯電している。
このため、最終製品のｐＨの領域５〜７においては、ア
ルミナはプラスに、シリカはマイナスに帯電した状態と
なり、両者は電気的な引力によって凝集状態となる。That is, the above-mentioned alumina particles have an isoelectric point of pH
= 9.1 to 9.2, it is always positively charged in a neutral to acidic pH range of 7 or less when dispersed in water. On the other hand, since the isoelectric point of colloidal silica is pH = 1.0 to 2.8, it is positively charged below the isoelectric point and negatively charged above the isoelectric point.
For this reason, in the pH range 5 to 7 of the final product, alumina is positively charged and silica is negatively charged, and both are aggregated by electric attraction.
【００１１】本発明の研磨液の製造工程においては、ま
ずアルミナを水中に分散し、このアルミナ分散液のｐＨ
を硫酸で２．８以下に調整すると共に、この分散液にコ
ロイダルシリカを添加する。この時点においてはアルミ
ナ、シリカ共にプラスに帯電しているため、電気的な斥
力によって両者は反発しあって分散状態となる。次に炭
酸ニッケルを添加してｐＨを５〜７に調整するが、この
時点ではアルミナはプラスに帯電したままであるのに対
し、シリカは等電点を越えるため電荷は逆転してマイナ
スとなり、アルミナとシリカは電気的な引力によって凝
集状態となる。本発明においては、上記のごとく、一度
分散状態にした後に凝集状態とすることによって、より
均一な凝集状態が得られるものと思われる。In the polishing liquid manufacturing process of the present invention, first, alumina is dispersed in water, and the pH of the alumina dispersion is adjusted.
Is adjusted to 2.8 or less with sulfuric acid, and colloidal silica is added to the dispersion. At this time, since both alumina and silica are positively charged, they repel each other due to an electric repulsion and are in a dispersed state. Next, nickel carbonate is added to adjust the pH to 5 to 7. At this point, alumina remains positively charged, whereas silica exceeds its isoelectric point, so the charge is reversed and becomes negative, Alumina and silica are aggregated by electric attraction. In the present invention, as described above, it is considered that a more uniform aggregated state can be obtained by once forming a dispersed state and then forming an aggregated state.
【００１２】これに対して、アルミナを水に分散させる
と共に、硫酸ニッケルを添加溶解した従来の研磨液に、
単にコロイダルシリカを添加しても、分散状態を経るこ
となく凝集状態となるため、この凝集は不均一なものと
なり、コロイダルシリカの添加効果が十分に発揮できな
いものと思われる。On the other hand, a conventional polishing liquid in which alumina is dispersed in water and nickel sulfate is added and dissolved,
Even if colloidal silica is simply added, the state of aggregation is obtained without passing through a dispersion state, and thus the aggregation is not uniform, and it is considered that the effect of adding colloidal silica cannot be sufficiently exerted.
【００１３】なお、コロイダルシリカは従来からその粘
度の高さを利用して、分散液の沈降抑制剤として使用さ
れる一方、超微粉であることを利用して、研磨面の平滑
度を向上させる研磨砥粒としても使用されてきたが、た
だ単に添加しただけでは上述のごとくコロイダルシリカ
の添加効果が十分に発揮できないものである。しかし、
本発明の製造方法によれば、少量のコロイダルシリカの
添加にて、十分な沈降抑制効果を得ることができ、結果
としてアルミナの分散安定性に優れ、長期間保存後でも
良好な研磨効果を発揮し、かつ研磨面の平滑度の高い無
電解ニッケルめっき皮膜用研磨液を製造することが可能
となるものである。[0013] Colloidal silica is conventionally used as a sedimentation inhibitor of a dispersion by utilizing its high viscosity, while it is used as an ultrafine powder to improve the smoothness of a polished surface. Although it has also been used as a polishing abrasive, the effect of adding colloidal silica cannot be sufficiently exerted as described above simply by adding it. But,
According to the production method of the present invention, by adding a small amount of colloidal silica, a sufficient effect of suppressing sedimentation can be obtained, and as a result, the dispersion stability of alumina is excellent, and a good polishing effect is exhibited even after long-term storage. In addition, it is possible to produce a polishing liquid for an electroless nickel plating film having a high smoothness on a polished surface.
【００１４】[0014]
【発明の効果】本発明の研磨液の製造方法によれば、ア
ルミナの分散安全性に優れ、長期間保存後においても良
好な研磨効果を有する研磨液を得ることができるもので
あり、この研磨液はハードディスクなどに形成した無電
解ニッケルめっき皮膜、特にＮｉ−Ｐ皮膜の研磨に使用
されるものである。According to the method for producing a polishing liquid of the present invention, it is possible to obtain a polishing liquid which is excellent in dispersion stability of alumina and has a good polishing effect even after long-term storage. The liquid is used for polishing an electroless nickel plating film formed on a hard disk or the like, particularly a Ni-P film.
【００１５】[0015]
【実施例】以下、実施例と比較例を示して本発明を具体
的に説明するが、本発明は下記の実施例に制限されるも
のではない。EXAMPLES Hereinafter, the present invention will be described specifically with reference to Examples and Comparative Examples, but the present invention is not limited to the following Examples.
【００１６】〔実施例〕アルミナ（平均粒径０．４μ
ｍ）を２２％分散した水分散液のｐＨを硫酸で１．０に
調整し、これにコロイダルシリカ（ＡＥＲＯＳＩＬ２０
０、平均粒径０．０１６μｍ、日本アエロジル社製）を
分散液中に０．５〜３．０％となるように添加した後、
炭酸ニッケルを添加して、分散液のｐＨを６．５〜６．
９に調整した。得られた分散液中の硫酸ニッケル量は２
％であった。（表１Ｎｏ．１〜５） 〔比較例〕アルミナ（平均粒径０．４μｍ）を２２％分
散した水分散液に実施例と同様のコロイダルシリカを０
〜３．０％、硫酸ニッケルを２％添加して、研磨液を製
造した。（表１Ｎｏ．６〜１１） 次に、実施例、比較例の研磨液の安定性及び調製直後と
保存後の研磨効果を下記方法で調べた。結果を表１に示
す。Example: Alumina (average particle size 0.4 μm)
m) was adjusted to 1.0 with sulfuric acid, and then added to colloidal silica (AEROSIL20).
0, average particle size 0.016 μm, manufactured by Nippon Aerosil Co., Ltd.) to the dispersion to be 0.5 to 3.0%.
Nickel carbonate was added to adjust the pH of the dispersion to 6.5-6.
Adjusted to 9. The amount of nickel sulfate in the obtained dispersion is 2
%Met. (Table 1 Nos. 1 to 5) [Comparative Example] The same colloidal silica as in Example was added to an aqueous dispersion in which 22% of alumina (average particle size: 0.4 μm) was dispersed.
Polishing liquid was produced by adding about 3.0% and 2% of nickel sulfate. (Table 1 Nos. 6 to 11) Next, the stability of the polishing liquids of Examples and Comparative Examples and the polishing effects immediately after preparation and after storage were examined by the following methods. Table 1 shows the results.
【００１７】研磨液の安定性 研磨液を容積１００ｍｌ，高さ約２０５ｍｍの沈降管に
入れ、３０日経過後の沈殿物の容積を測定し、全容積に
対する沈殿物の容積割合（表１中、沈降容積率と記す）
を算出した。 Stability of the polishing liquid The polishing liquid was put into a sedimentation tube having a volume of 100 ml and a height of about 205 mm, and the volume of the precipitate after 30 days was measured. Volume ratio)
Was calculated.
【００１８】研磨効果 アルミニウムにＮｉ−Ｐめっきを施したサブストレート
を用いて、製造直後及び３０日経過後、一定条件にて軽
度に撹拌した後の上澄み液による研磨試験を以下の条件
にて実施した。なお、研磨液は水道水にて３倍に希釈し
て使用した。 （研磨条件）サブストレート：３．５インチハードディ
スク用アルミニウムにＮｉ−Ｐめっきを施したもの 研磨機 ：両面研磨機（５枚／バッチ） パッド ：ポリウレタン系パッド 研磨時間 ：５分 研磨時面圧 ：１００ｇ／ｃｍ2 研磨剤供給量 ：３０ｍｌ／分 Polishing Effect Using a substrate obtained by subjecting aluminum to Ni-P plating, a polishing test was carried out under the following conditions immediately after the production and after 30 days, after light stirring under constant conditions, with the supernatant liquid. . The polishing liquid was diluted three times with tap water before use. (Polishing condition) Substrate: 3.5-inch aluminum for hard disk with Ni-P plating Polisher: Double-sided polishing machine (5 / batch) Pad: Polyurethane pad Polishing time: 5 minutes Surface pressure during polishing: 100 g / cm 2 abrasive supply amount: 30 ml / min
【００１９】表１から明らかなように、実施例は比較例
に比べて研磨液の保存安定性、保存後の研磨効果ともに
優れている。As is clear from Table 1, the examples are superior to the comparative examples in both the storage stability of the polishing liquid and the polishing effect after storage.
【００２０】[0020]
【表１】 [Table 1]
フロントページの続き (72)発明者 敷田 暢三 大阪府枚方市出口１丁目５番１号 上村 工業株式会社 中央研究所内 (58)調査した分野(Int.Cl.6，ＤＢ名) C09K 3/14 550 B24B 37/00 Continuation of the front page (72) Inventor Junzo Shikita 1-5-1, Hirakata Exit, Hirakata City, Osaka Prefecture Uemura Industries Co., Ltd. Central Research Laboratory (58) Field surveyed (Int.Cl. 6 , DB name) C09K 3/14 550 B24B 37/00
Claims (1)
８以下に調整したアルミナ分散液にコロイダルシリカを
添加し、次いで炭酸ニッケルを添加してｐＨ５〜７に調
整することを特徴とする無電解ニッケルめっき皮膜用研
磨液の製造方法。1. Disperse alumina in water and add sulfuric acid to pH 2.
A method for producing a polishing liquid for an electroless nickel plating film, comprising adding colloidal silica to an alumina dispersion adjusted to 8 or less, and then adding nickel carbonate to adjust the pH to 5 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3224943A JP2964720B2 (en) | 1991-08-09 | 1991-08-09 | Method for producing polishing liquid for electroless nickel plating film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3224943A JP2964720B2 (en) | 1991-08-09 | 1991-08-09 | Method for producing polishing liquid for electroless nickel plating film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0543868A JPH0543868A (en) | 1993-02-23 |
| JP2964720B2 true JP2964720B2 (en) | 1999-10-18 |
Family
ID=16821628
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3224943A Expired - Fee Related JP2964720B2 (en) | 1991-08-09 | 1991-08-09 | Method for producing polishing liquid for electroless nickel plating film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2964720B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6078864B2 (en) * | 2011-11-01 | 2017-02-15 | 株式会社クリスタル光学 | Abrasive |
| CN108699396B (en) * | 2015-12-29 | 2021-01-26 | 嘉柏微电子材料股份公司 | Chemical mechanical polishing processing compositions comprising alkylamines and cyclodextrins |
-
1991
- 1991-08-09 JP JP3224943A patent/JP2964720B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0543868A (en) | 1993-02-23 |
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