JP2970040B2 - Solid-state imaging device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid-state imaging device, and more particularly to a solid-state imaging device packaging.

[0002]

2. Description of the Related Art In packaging a solid-state imaging device, since an optical image must be accurately formed on a chip as an input, a chip provided with a signal terminal 3 requiring an imaging chip 2 as shown in FIG. A transparent cap 4 having a light incident surface, usually made of a glass flat plate having optical flatness, adhered to the storage container 1 is fixed by a sealing resin 5. Reference numeral 6 denotes a bonding wire.

[0003] In such packaging for a solid-state imaging device, not only is it inexpensive as much as possible, but also high reliability for moisture resistance is required.

This is because, as shown in FIG. 3, the image pickup device chip 2 is located in a sealed space, so that when the temperature of the storage container is rapidly reduced while moisture is taken in from the outside, the water vapor inside the image pickup device chip 2 is reduced. Is condensed and adheres as water droplets on the inner surface of the cap 4 or on the image sensor chip 2, causing serious trouble in imaging.

[0005] Therefore, recently, packaging having a structure as shown in FIG. 4 which is excellent in terms of price and reliability of moisture resistance is becoming mainstream. In the structure of FIG. 4, the sealing portion is made the uppermost flat portion of the chip storage container which is easy to obtain a flatness, thereby making it possible to make the sealing resin important for securing moisture resistance thin and uniform. In addition, a low price is realized by making the storage container very simple and easy to make.

[0006]

However, in such a structure, the transparent cap 4 made of a glass plate having relatively low strength is located at the uppermost portion, and the side end thereof is exposed. In order to easily damage the side end and to reduce the damage to the side end, expensive chamfering and polishing are used as shown in FIG. There is a disadvantage that the surface is easily scratched by fine glass pieces separated from the side ends of the transparent cap 4 in the surface cleaning operation after the transparent cap 4 is sealed and fixed to the chip storage container. .

SUMMARY OF THE INVENTION An object of the present invention is to provide a solid-state image pickup device which does not require polishing and finishing for side edges of a transparent cap.

[0008]

In order to achieve the above object, a solid-state imaging device according to the present invention comprises a transparent cap adhered to the uppermost flat portion of a chip storage container with a sealing resin to form an imaging chip in the container. Wherein the transparent cap has a lower peripheral portion, a side surface portion, and an upper surface.
The periphery of the surface is covered and protected with resin. Again before
Around the lower surface, the side surface and the upper surface of the transparent cap
The resin that is covered and protected is the sealing resin. Also
Resin that covers and protects the periphery of the lower surface of the transparent cap
Is the sealing resin, and a side portion of the transparent cap
The resin that covers and protects the periphery of the upper surface is the sealing resin
Is a different resin.

[0009]

The structure is such that the side end of the transparent cap is protected by coating with a resin.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings.

(Embodiment 1) FIG. 1 is a sectional view showing Embodiment 1 of the present invention.

In FIG. 1, an image pickup chip 2 is, for example, a two-dimensional image pickup element chip using a charge transfer function, and the back surface is bonded and fixed to a chip storage container 1 with an adhesive such as a silver paste. Each signal electrode of the imaging chip 2 is connected to the signal terminal 3 of the chip housing 1 by a bonding wire 6.

In the chip container 1, a lead frame for forming the signal terminals 3 and upper and lower ceramic plates formed in advance by sintering are welded with low-temperature glass 8. Since the chip storage container 1 uses a plate which has been formed by sintering in advance, the uppermost flat portion of the chip storage container 1 is maintained at a flatness of about 10 μm including a warp.

On the other hand, the transparent cap 4 is cut and formed from a 0.7 mm-thick glass plate polished on both sides to obtain optical flatness. All side edges of the transparent cap 4 are covered with the sealing resin 5 in advance to a thickness of about 0.2 mm including the peripheral portion of the upper surface on the light incident surface side.
These side edges can easily and simultaneously cover the 0.7 mm thick side edges by forming sealing resin portions on both sides.

Further, since the transparent cap 4 of the present embodiment is covered with a resin at its side end, chamfering and polishing and finishing are not required, and the transparent cap 4 can be manufactured at a lower cost than before.

The transparent cap 4 is fixed to the chip container 1 by a sealing resin 5 which is uniform and as thin as 10 to 20 μm, and maintains high moisture resistance by the same fixing and sealing means by heat as in the past. To form a structure.

The side end of the transparent cap 4 covered with such a sealing resin is free from chipping or the like even by a mechanical force, and is scratched on the surface during the surface cleaning due to chipping off of glass fragments. It can be prevented from being attached.

(Embodiment 2) FIG. 2 is a sectional view showing Embodiment 2 of the present invention.

The transparent cap 4 in the present embodiment is a glass flat cap without chamfering and polishing as in the first embodiment, and the sealing resin 5 is previously applied only to portions necessary for sealing and fixing as in the prior art. The transparent cap 4 is formed so as to have a thickness of 0.1 μm. The transparent cap 4 is also uniformly and thinly fixed to the chip storage container 1 as in the first embodiment.

On the other hand, the side end protection resin 7 is an acrylic resin, and after the transparent cap 4 is sealed and fixed, 1
The transparent cap 4 is coated and formed to a thickness of about 00 μm and cured at a temperature of about 120 ° C. The side end of the transparent cap 4 is protected from mechanical force, and the glass fragments fall off and become scratched during surface cleaning. Prevent from attaching.

[0021]

As described above, the present invention realizes packaging with good moisture resistance by sealing and fixing the transparent cap to the uppermost flat portion of the chip storage container, and at the same time the transparent cap side end which has been a problem. Prevents damage caused by mechanical force of the part and damage caused by fine glass fragments falling from the side end during surface cleaning by protecting the cap side end with sealing resin or other resin to protect it can do.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a first embodiment of the present invention.

FIG. 2 is a sectional view showing a second embodiment of the present invention.

FIG. 3 is a sectional view showing a conventional example.

FIG. 4 is a sectional view showing a conventional example.

FIG. 5 is a partially enlarged cross-sectional view showing a side end of a transparent cap in a conventional solid-state imaging device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Chip storage container 2 Imaging chip 3 Signal terminal 4 Transparent cap 5 Sealing resin 6 Bonding wire 7 Side end protection resin

Claims (3)

(57) [Claims] The method according to claim 1 transparent cap top flat portion of the chip container by bonding with a sealing resin, a solid-state imaging device hermetically sealed imaging chip within said vessel, said transparent cap, the lower surface near Section, side section and top circumference
A solid-state imaging device, wherein a side portion is covered and protected by a resin. 2. A peripheral portion and a side portion of a lower surface of the transparent cap.
Resin that covers and protects
The solid-state imaging device according to claim 1, wherein the imaging device is a fat.
Child. 3. A cover around a lower surface of the transparent cap.
The resin being protected is the sealing resin, and the transparent
Resin that covers and protects the side and top periphery
Is a resin different from the sealing resin,
The solid-state imaging device according to claim 1.