JP2971124B2 - Electronic components - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to an electronic component in which a plurality of conductors are buried inside a sintered body to form a plurality of circuit elements inside the sintered body.

<Conventional technology> As a multilayer capacitor, a multilayer inductor, a multilayer LC composite component, or a hybrid integrated circuit component incorporating an integrated circuit portion or a resistor in each of these components, a sintered body made of a dielectric or magnetic material is used. An electronic component in which a plurality of conductors constituting a circuit element are embedded has been proposed. FIG. 13 is a sectional view schematically showing the structure of this type of electronic part, and FIG. 14 is a plan view thereof. In the figure, 1 is a sintered body, 201 to 211
Denotes conductors constituting circuit elements such as capacitors and inductors, and 301 to 320 denote terminal electrodes.

As the sintered body 1, a dielectric ceramic is used when forming a capacitor, and a magnetic sintered body such as ferrite is used when forming an inductor such as a coil or a transformer.

The patterns and numbers of the conductors 201 to 211 are selected according to a required capacitor network or inductor, and are connected to the terminal electrodes 301 to 320 according to the circuit configuration.

The terminal electrodes 301 to 320 are arranged at a predetermined distance d1 on the side end face of the sintered body 1.
Is formed.

<Problems to be Solved by the Invention> As described above, this type of conventional electronic component has a structure in which the terminal electrodes 301 to 320 are provided only on the side end surfaces of the sintered body 1, and thus the following problems occur. was there.

(A) The number and types of circuit elements buried in the sintered body 1 increase, the conductors 201 to 211 increase, and the terminal electrodes 301
As the number of .about.320 increases, the distance d1 between the terminal electrodes 301 to 320 becomes narrower, and the distributed capacitance Co between the terminal electrodes 301 to 320 increases.
An increase in the distributed capacitance Co degrades circuit characteristics.

(B) To avoid an increase in the distributed capacitance, the terminal electrodes 301 to 320
If the interval d1 is increased, the required number of terminal electrodes 301 to 320 cannot be formed, resulting in a shortage of the number of terminal electrodes.

(C) Since the positions of the terminal electrodes 301 to 320 are fixed to the side end surfaces of the sintered body 1, depending on the positions of the conductors 201 to 211, the wiring pattern length becomes longer, the lead inductance increases, and the avoidance characteristics due to this increase. Causes deterioration.

Accordingly, an object of the present invention is to solve the above-mentioned conventional problems and to provide an electronic component having substantially negligible distributed capacitance between terminal electrodes, a short wiring pattern length, and excellent circuit characteristics. is there.

<Means for Solving the Problems> In order to solve the above-described problems, the electronic component according to the present invention includes:
It includes a sintered body, a plurality of conductors, at least one connection conductor, and a conductor pattern. The plurality of conductors are embedded in the sintered body to form a circuit element.

The connection conductor includes a plurality of continuous connection conductor pieces,
It is embedded inside the sintered body, is connected to at least a part of the conductor constituting the circuit element, and has one end led out to at least one surface in the thickness direction of the sintered body.

Each of the plurality of connection conductor pieces is sequentially arranged in the thickness direction of the sintered body, and has a planar shape formed at a lateral or vertical end perpendicular to the thickness direction of the sintered body. At the connecting portion, they are sequentially connected in a zigzag manner.

The conductor pattern is provided on the one surface of the sintered body, and the one end of the connection conductor is conductive.

<Operation> At least a part of the circuit element is connected to a connection conductor whose conductor passes through the inside of the sintered body in the thickness direction, and the connection conductor is led out to at least one surface in the thickness direction of the sintered body. Since the conductive pattern is electrically connected to the conductor pattern provided on one surface of the sintered body, the distributed capacitance between the terminal electrodes, which has been a problem when the terminal electrodes are provided on the side end faces of the sintered body, hardly occurs.

In addition, the one surface side of the sintered body has a larger area than the side end surface, and the degree of freedom in selecting the number, shape, and the like of the conductor patterns for conducting the connection conductors is increased. Therefore, by selecting the conductor pattern, the distance between the conductor pattern and the connection conductor can be reduced, the lead inductance can be reduced, and the circuit characteristics can be improved.

Furthermore, the one surface side of the sintered body has a larger area than the side end surface, so the number of conductor patterns for conducting the connection conductor is
It is easy to secure as much as you need.

The connection conductor includes a plurality of continuous connection conductor pieces, and each of the plurality of connection conductor pieces is sequentially arranged in the thickness direction of the sintered body, and is horizontally or vertically orthogonal to the thickness direction of the sintered body. In the planar connecting portions formed at the ends in the directions, the connecting portions are sequentially connected in a zigzag manner, so that the reliability of interlayer connection is significantly higher than that of a straight through-hole conductor.

<Example> FIG. 1 is a sectional view schematically showing the structure of an electronic component according to the present invention. In the figure, the same reference numerals as those in FIG. 13 indicate the same components. 41 and 42 are connection conductors,
51 and 52 are conductor patterns. The connection conductors 41 and 42 are conductors
Sintered body 1 so as to connect at least a part of 201 to 211
Is embedded so as to pass through the inside in the thickness direction. In the figure, the connection conductor 41 is connected to conductors 201 to 206 embedded inside the sintered body 1 to constitute a circuit element.
Is connected to the conductor pattern 51 formed on the surface 1A of the first substrate. The connection conductor 42 is connected to the conductors 207 to 211 inside the sintered body 1, and the conductor pattern 52 formed on the back surface 1 </ b> B of the sintered body 1 is formed.
It is connected to the.

Since the conductor patterns 51 and 52 for connecting the connection conductors 41 and 42 are provided on both surfaces 1A and 1B of the sintered body 1, the terminal has been a problem when the terminal electrodes are provided on the side end surfaces of the sintered body. Almost no distributed capacitance between electrodes is generated.

Moreover, since both surfaces 1A and 1B of the sintered body 1 have a larger area than the side end surfaces, and the degree of freedom in selecting the number and shape of the conductor patterns 51 and 52 increases, the selection of the conductor patterns 51 and 52 allows
The distance between the connection conductors 41 and 42 can be reduced, the lead inductance can be reduced, and the circuit characteristics can be improved.

Further, both surfaces 1A and 1B of the sintered body 1 are
Since the area is large, the number of conductor patterns 51 and 52 can be easily secured by the required amount.

FIG. 2 is an enlarged sectional view of a portion of the connection conductors 41 and 42, and FIG. 3 is a perspective view of the connection conductors 41 and 42. Normal,
This type of electronic component is configured as a laminated component. Since the connection conductors 41 and 42 are sequentially laminated for each layer in the laminating step, they are formed in a zigzag manner in the thickness direction corresponding to the lamination direction of the sintered body 1. As shown in FIGS. 2 and 3, the connection conductors 41 and 42 are connection conductor pieces formed for each layer.
411 and 421 are connected in a zigzag manner in the stacking direction. The connection conductor pieces 411 and 421 are sequentially coupled at a planar connection portion formed at an end in a horizontal direction (or a vertical direction) perpendicular to the thickness direction of the sintered body 1, so that reliability of interlayer connection is improved. Is improved.

FIG. 4 is a sectional view showing another embodiment of the connection conductors 41 and 42,
FIG. 5 shows a perspective view of the same. The connection conductors 41 and 42 shown in this embodiment have a conductor horizontal dimension W1 and a conductor vertical dimension W2.
When the plane area SI, SI = W1 × W2, is determined, the conductor area is sufficiently smaller than the plane area SI. The conductor area is the conductor width d1, d2 and the conductor lateral dimension W1
And the conductor vertical dimension W2. Connection conductor pieces 411, 4
Reference numeral 21 denotes a ring having holes 412 and 422 in the center. In addition to the ring shape, modifications such as providing a cut in a part of the ring-shaped conductor portion, providing a short-circuiting piece between two opposing pieces, or forming an H-shaped pattern are possible.

The connection conductors 41 and 42 having the structure shown in FIGS. 4 and 5 have a remarkably reduced connection conductor amount per unit volume of the sintered body 1 in comparison with FIGS. 2 and 3. For this reason, generation of cracks and reduction in mechanical strength due to a difference in firing shrinkage between the sintered body and the connection conductor are prevented.

The connection conductors 41 and 42 can be formed by using a screen printing process, a high-precision pattern forming technique mainly based on photolithography, a film forming technique such as sputtering or vapor deposition, or the like. Sixth
FIGS. 10 (a) and 10 (b) to FIGS. 10 (a) and 10 (b) show connecting conductors 4;
It is a figure which shows the process at the time of forming 1 and 42 by a screen printing process. First, as shown in FIGS. 6A and 6B, connection conductors 411 and 421 are printed on the surface of the conductor layer 200 printed on the sheet-shaped sinterable paste 101. The sinterable paste 101 is formed by screen printing a dielectric porcelain paste or a magnetic paste,
The conductor layer 200 and the connection conductor pieces 411 and 421 are formed by screen-printing a conductive paste. Conductive layer 200
Are conductors 200 to 211 constituting a circuit element.

Next, as shown in FIGS. 7A and 7B, a sinterable pace 102 is applied so as to cover substantially half of the right side (in the figure) of the connection conductor pieces 411 and 421. Connection conductor pieces 411, 421
A window region 6 where the sinterable paste 102 is not applied is left around the left half of the window.

Next, as shown in FIGS. 8A and 8B, connection conductor pieces 411 and 421 not covered with the sintering paste 102.
The connection conductor pieces 411 and 421 are printed so as to overlap with half of.

Next, as shown in FIGS. 9A and 9B, the sintering paste 103 is applied so as to cover half of the left side (in the figure) of the connection conductor pieces 411 and 421.

Next, as shown in FIGS. 10A and 10B, the connection conductor pieces 411 and 421 are printed so as to overlap with half of the connection conductor pieces 411 and 421 not covered by the sintering paste 103.

7 (a), (b) to 10 (a), (b) above
By repeating the above process a predetermined number of times, an electronic component having the connection conductors 41 and 42 having the structure shown in FIGS. 1 to 3 can be obtained. The electronic component having the connection conductor shown in FIGS. 4 and 5 can be manufactured by the same process.

The present invention relates to multilayer capacitors, multilayer inductors, multilayer LCs.
The present invention can be widely applied to a composite component or a hybrid integrated circuit component in which an integrated circuit component or a resistor is incorporated in each of these components. No.
FIGS. 11 and 12 show an example in which the present invention is applied to a hybrid integrated circuit component. In the figure, reference numeral 7 denotes an integrated circuit component. The integrated circuit component 7 is mounted on the surface 1A of the sintered body 1 and its lead terminals 71
To 74 are connected to the conductor patterns 51 to 54. Each of the conductor patterns 51 to 54 is connected to one end of a connection conductor 41 to 44 that is electrically connected to a conductor embedded in the sintered body.
Inside the sintered body 1, four circuit elements serving as capacitors C1 to C4 are embedded. In the capacitors C1 to C4, conductors serving as capacitor electrodes are conductively connected to conductor patterns 51 to 54 via connection conductors 41 to 44, respectively. Further, a part of the conductor serving as the capacitor electrode is also connected to terminal electrodes 301 to 305 formed on the side end surfaces of the sintered body 1 respectively.
Since the intervals between the terminal electrodes 301 to 305 are different from those in the related art, the distance between the electrode terminals can be substantially ignored.

<Effects of the Invention> As described above, according to the present invention, it is possible to provide an electronic component having substantially negligible distributed capacitance between terminal electrodes, a short wiring pattern length, and excellent circuit characteristics. .

[Brief description of the drawings]

FIG. 1 is a sectional view schematically showing the structure of an electronic component according to the present invention, FIG. 2 is an enlarged sectional view of a portion of a connecting conductor, FIG. 3 is a perspective view of the same connecting conductor, and FIG. FIG. 5 is a perspective view thereof, and FIGS. 6 (a), (b) to 10 (a), (b) show connection conductors formed by a screen printing process. 6 (a) to 10 (a) are plan views, and FIGS. 6 (b) to 10 (b) are FIGS. 6 (a) to 10 ( a) Each cross-sectional view along the line (A1-A1) to (A5-A5), FIG. 11 is a plan cross-sectional view of a hybrid integrated circuit component included in the electronic component according to the present invention, and FIG. FIG. 13 is a sectional view schematically showing the structure of a conventional electronic component, and FIG. 14 is a plan view thereof. DESCRIPTION OF SYMBOLS 1 ... Sintered body, 201 to 211 ... Conductor 41, 42 ... Connection conductor 411, 421 ... Connection conductor piece

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H01G 4/00-4/40

Claims (3)

(57) [Claims] An electronic component including a sintered body, a plurality of conductors, at least one connection conductor, and a conductor pattern, wherein the plurality of conductors are embedded in the sintered body, and a circuit is provided. An element, the connection conductor includes a plurality of continuous connection conductor pieces, is embedded in the sintered body, is connected to at least a part of the conductor forming the circuit element, and has one end. Each of the plurality of connection conductor pieces is sequentially arranged in the thickness direction of the sintered body, and is led out to at least one surface in the thickness direction of the sintered body. At a horizontal connecting portion formed at an end portion in a horizontal direction or a vertical direction perpendicular to the connecting portion, the connecting portions are sequentially connected in a zigzag manner, and the conductor pattern is provided on the one surface of the sintered body, and the connection conductor Said one end is conductive Electronic components. 2. The electronic component according to claim 1, wherein the circuit element includes at least one of a capacitor and an inductor. 3. The electronic component according to claim 1, wherein the sintered body has a resistor or an integrated circuit component mounted on the one surface.