JP2972580B2 - Guide structure of integrated circuit package - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a guide structure for an integrated circuit package, and more particularly to a guide structure for an integrated circuit package using a connector which moves at right angles to an axis.

[0002]

2. Description of the Related Art A conventional guide structure of an integrated circuit package will be described in detail with reference to the drawings.

FIGS. 3 and 4 are side views showing a first conventional example. 3 shows the state before the connector is inserted, and FIG. 4 shows the state after the connector is inserted. The package 2 is inserted into the guide rails 8c and 8d, moved in the direction of arrow A, and the guide pins 11 are inserted into the guide holes 12c.
Then, in the direction of arrow A, the pins 7c of the package 2 are inserted into the contacts 7d of the connectors 7 on the motherboard 5, and the electrical connection is made.

The connector 7 requires a large force when inserting or removing a connector having a very large number of pins, such as an IC of a pin grid array type. As a measure against this,
A zero insertion / extraction force connector or a connector that moves perpendicular to the axis has been developed.

FIGS. 5A and 5B are a perspective view and an enlarged partial perspective view showing a second conventional example. IC on circuit board 10
When connecting the IC 20, the cover insulator 60 having the guide hole 50 formed therethrough is slidably combined with the base insulator 40 incorporating the socket contact 30, and the pin contact 70 of the IC 20 is inserted into the guide hole 50 (moving in the axial direction). ), Is moved together with the cover insulator 60 in the direction of the arrow 80 (movement in the direction perpendicular to the axis) to make contact with the socket contact 30. (See, for example,
FIG. 6 is a cross-sectional view showing a mounting method of the connector that moves at right angles to the axis. The LSI 18 is fitted into a movable frame 26 incorporated in a fixed frame 25 fixed to a printed circuit board 24, and the movable frame 26 is
By moving in one direction or the other,
As shown in (b), the pin contact 70 is inserted into an empty space, then moved at a right angle, and the pin contact 70 is pushed in from the lateral direction of the socket contact 30 to make an electrical connection.

[0006]

Guide structure of the invention is to solve the above conventional integrated circuit package described above, mounting the printed circuit board to the motherboard in the axial <br/> right angles connector mounted on the motherboard
There is a disadvantage that it is difficult to mount the connector pins .

A guide structure for an integrated circuit package according to the present invention is provided with a plurality of first mountings for axial positioning.
And a plurality of second guide pins mounted for sliding in the axial direction, wherein the first guide pin is provided on a motherboard at a position corresponding to the first guide pin. A first groove having a plurality of axial guide holes for allowing the pins to move in a direction perpendicular to the axis, and a first groove for guiding an upper side of the integrated circuit package inserted in an upright state; Guide rails,
The integrated circuit package guides the lower side of the integrated circuit package, supports a second guide pin during the axial movement, lifts the integrated circuit package from the second groove, and completes the axial movement. including a plurality of notches for in inserted position in the axis-perpendicular movement connector of moving said integrated circuit package in the axis-perpendicular direction
And a second guide rail .

[0008]

[0009]

Next, the present invention will be described in detail with reference to the drawings.

FIG. 1 and FIG. 2 are side views showing an embodiment of the present invention. 1 shows a state before the connector is inserted, and FIG. 2 shows a state after the connector is inserted. The guide structure of the integrated circuit package shown in FIGS. 1 and 2 has a plurality of guide pins 111 and 112 mounted for axial positioning and a plurality of guide pins 113 and 114 mounted for axial slide.
In the guide structure of the integrated circuit package 2 having:
A guide having a plurality of axial guide holes 12 provided at positions corresponding to the guide pins 111 and 112 on the motherboard 5, and a groove 8a for guiding the upper side of the integrated circuit package 2 inserted vertically. The rail 3a guides the lower side of the integrated circuit package 2 and, when moving in the axial direction, supports the guide pins 113 and 114 so that the integrated circuit package 2 is lifted from the groove 8b and the axial movement is completed. A plurality of cutouts 9 for moving the integrated circuit package 2 in a direction perpendicular to the axis (submerged in the groove 8b) at a position where the integrated circuit package 2 is inserted into the connector for perpendicularly moving the axis of the motherboard 5.

First, the integrated circuit package 2 in the axial direction A
When the insertion in this direction is completed, the integrated circuit package 2 is moved in the direction B perpendicular to the axis.

When the integrated circuit package 2 is moved in the direction B perpendicular to the axis, the notches 9 guide the guide pins 113 and 114.
Provided to miss out. The guide holes of the axial guide holes 12 are elongated holes to allow the guide pins 111 and 112 to escape when the integrated circuit package 2 is moved in the direction B perpendicular to the axis.

[0013]

The guide structure of the integrated circuit package according to the present invention is such that a connector pin mounted on a printed circuit board is mounted on a connector mounted on a printed circuit board on a base insulator of a connector mounted on a mother board mounted on a connector mounted on a printed circuit board.
There is an effect that can be easily be.

[Brief description of the drawings]

FIG. 1 is a side view (before insertion) showing an embodiment of the present invention.

FIG. 2 is a side view (after insertion) showing an embodiment of the present invention.

FIG. 3 is a side view showing a first conventional example (before insertion).

FIG. 4 is a side view showing the first conventional example (after insertion).

FIGS. 5A and 5B are perspective views showing a second conventional example.

FIG. 6 is a sectional view showing an example of use of FIG. 5;

[Explanation of symbols]

 2 Integrated Circuit Package 3 Guide Rail 5 Motherboard 6 Axis Right Angle Moving Connector 8 Groove 9 Notch 12 Axial Guide 111, 112 Guide Pin 113, 114 Guide Pin

Claims (1)

(57) [Claims] 1. A guide structure for an integrated circuit package having a plurality of first guide pins mounted for axial positioning and a plurality of second guide pins mounted for axial slide, comprising: A plurality of axial guide holes provided at positions corresponding to the first guide pins and permitting the first guide pins to move in a direction perpendicular to the axis; and the integrated circuit inserted vertically. A first guide rail having a first groove for guiding an upper side of the package; a first guide rail for guiding a lower side of the integrated circuit package; The integrated circuit package is vertically moved at a position where the floating in the axial direction is completed from the second groove and the integrated circuit package is inserted into the connector for vertically moving the axis of the motherboard. Including a plurality of notches for moving angularly
And a second guide rail .